CN201491374U - Anti-flash structure for half-edge plating hole of circuit board - Google Patents
Anti-flash structure for half-edge plating hole of circuit board Download PDFInfo
- Publication number
- CN201491374U CN201491374U CN2009201933034U CN200920193303U CN201491374U CN 201491374 U CN201491374 U CN 201491374U CN 2009201933034 U CN2009201933034 U CN 2009201933034U CN 200920193303 U CN200920193303 U CN 200920193303U CN 201491374 U CN201491374 U CN 201491374U
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- China
- Prior art keywords
- circuit board
- hole
- burr
- edge plating
- plating hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model discloses an anti-flash structure for a half-edge plating hole of a circuit board, comprising the circuit board, and the circuit board is provided with a half-edge plating hole, and both ends of the half-edge plating hole are respectively provided with anti-flash holes in a drilling way. The anti-flash structure for the half-edge plating hole of the circuit board is characterized in that: the anti-flash hole penetrates the upper side, the lower side of the circuit board. The purpose of the utility model is to overcome the shortcomings in the prior art, and provides the anti-flash structure which can effectively prevent the peeling of the half-edge plating hole during the process of forming and cutting.
Description
[technical field]
The utility model relates to the anti-burr structure of the half of electroplating hole of a kind of circuit board.
[background technology]
Circuit board such as printed circuit board (PCB), flexible PCB are widely used in electronic applications.In the process of board production since the design needs, on sheet edge half-edge hole can appear sometimes, and these half-edge holes need be electroplated, electroplate the back and on the hole wall of half of electroplating hole, can form one deck copper facing, in the process of board production, according to design, circuit board on the substrate need be divided into the polylith platelet as shown in Figure 1, use the gong cutter along the dotted line excision forming, in the process of platelet moulding cutting, being easy on the half of electroplating hole hole wall rolled by moulding gong cutter and to be peeled off, and can cause pcb board to be held like this, short circuit, the copper facing of rolling also scratch the copper facing pattern of circuit board surface easily.
[utility model content]
The utility model purpose is to have overcome deficiency of the prior art, provides a kind of simple in structure, can prevent effectively that half of electroplating hole from producing the anti-burr structure of peeling off in the process of moulding cutting.
The utility model is achieved through the following technical solutions:
The anti-burr structure of the half of electroplating hole of a kind of circuit board comprises circuit board, is provided with half of electroplating hole on circuit board, is drilled with anti-burr hole on described half of electroplating hole two ends respectively.
The anti-burr structure of the half of electroplating hole of aforesaid a kind of circuit board is characterized in that described anti-burr hole connects the upper and lower both sides of circuit board.
The anti-burr structure of the half of electroplating hole of aforesaid a kind of circuit board is characterized in that described anti-burr hole is a circular port.
Compared with prior art, the utility model has following advantage:
Half of electroplating hole two ends are provided with anti-burr hole in the utility model, when the gong cutter cuts half of electroplating hole in the process of moulding cutting, because the existence in anti-burr hole, the gong cutter can not touch the inwall of half of electroplating hole, can not roll hole wall copper facing yet, thereby avoided problems such as pcb board is opened, short circuit, prevented bad order problems such as the wiping of plate face is colored, and plate upper thread road figure is fuzzy effectively.
[description of drawings]
Fig. 1 is the schematic diagram of prior art;
Fig. 2 is a schematic diagram of the present utility model.
[embodiment]
Below in conjunction with accompanying drawing the utility model is elaborated:
The anti-burr structure of the half of electroplating hole of a kind of circuit board as shown in Figure 2 comprises circuit board 1, is provided with half of electroplating hole 2 on circuit board, is drilled with anti-burr hole 3 on described half of electroplating hole 2 two ends respectively.
Claims (3)
1. the anti-burr structure of the half of electroplating hole of circuit board comprises circuit board (1), is provided with half of electroplating hole (2) on circuit board, it is characterized in that: be drilled with anti-burr hole (3) respectively on described half of electroplating hole (2) two ends.
2. the anti-burr structure of the half of electroplating hole of a kind of circuit board according to claim 1 is characterized in that described anti-burr hole (3) connects the upper and lower both sides of circuit board (1).
3. the anti-burr structure of the half of electroplating hole of a kind of circuit board according to claim 1 is characterized in that described anti-burr hole (3) is circular port.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009201933034U CN201491374U (en) | 2009-08-19 | 2009-08-19 | Anti-flash structure for half-edge plating hole of circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009201933034U CN201491374U (en) | 2009-08-19 | 2009-08-19 | Anti-flash structure for half-edge plating hole of circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201491374U true CN201491374U (en) | 2010-05-26 |
Family
ID=42430236
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009201933034U Expired - Lifetime CN201491374U (en) | 2009-08-19 | 2009-08-19 | Anti-flash structure for half-edge plating hole of circuit board |
Country Status (1)
Country | Link |
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CN (1) | CN201491374U (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103124476A (en) * | 2011-11-18 | 2013-05-29 | 北大方正集团有限公司 | Printed circuit board and machining method thereof |
CN104717847A (en) * | 2015-03-17 | 2015-06-17 | 深圳崇达多层线路板有限公司 | Manufacturing method of metallized half hole in PCB |
CN106385766A (en) * | 2016-11-02 | 2017-02-08 | 深圳市深联电路有限公司 | PCB special-shaped hole making method for removing burrs |
CN106714460A (en) * | 2017-02-06 | 2017-05-24 | 吉安市满坤科技有限公司 | Method for manufacturing special-shaped slot hole in printed circuit board |
CN111432559A (en) * | 2020-03-20 | 2020-07-17 | 江苏苏杭电子有限公司 | Method for processing semicircular copper sinking hole |
-
2009
- 2009-08-19 CN CN2009201933034U patent/CN201491374U/en not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103124476A (en) * | 2011-11-18 | 2013-05-29 | 北大方正集团有限公司 | Printed circuit board and machining method thereof |
CN104717847A (en) * | 2015-03-17 | 2015-06-17 | 深圳崇达多层线路板有限公司 | Manufacturing method of metallized half hole in PCB |
CN106385766A (en) * | 2016-11-02 | 2017-02-08 | 深圳市深联电路有限公司 | PCB special-shaped hole making method for removing burrs |
CN106385766B (en) * | 2016-11-02 | 2019-03-05 | 深圳市深联电路有限公司 | A kind of production method of PCB irregularly-shaped hole flash removed burr |
CN106714460A (en) * | 2017-02-06 | 2017-05-24 | 吉安市满坤科技有限公司 | Method for manufacturing special-shaped slot hole in printed circuit board |
CN111432559A (en) * | 2020-03-20 | 2020-07-17 | 江苏苏杭电子有限公司 | Method for processing semicircular copper sinking hole |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term |
Granted publication date: 20100526 |
|
CX01 | Expiry of patent term |