CN104254207A - Manufacturing method of metalized board edge of circuit board - Google Patents
Manufacturing method of metalized board edge of circuit board Download PDFInfo
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- CN104254207A CN104254207A CN201410371962.8A CN201410371962A CN104254207A CN 104254207 A CN104254207 A CN 104254207A CN 201410371962 A CN201410371962 A CN 201410371962A CN 104254207 A CN104254207 A CN 104254207A
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Abstract
The invention relates to a manufacturing method of a metalized board edge of a circuit board. The manufacturing method comprises the following steps of (1) printing a to-be-metalized area in the board edge of the circuit board; (2) fixing the circuit board on a worktable of a circuit board drilling machine, and using a milling cutter to perform the first slot milling on the to-be-metalized board edge area; (3) putting the circuit board in an electroplating slot to electroplate a metal copper layer on the board edge; (4) fixing the circuit board on the worktable of the circuit board drilling machine to perform the second slot milling; (5) positioning the cutting point of the milling cutter in the area of the metalized board edge, and feeding the milling cutter from the cutting point to the two sides. The method has the advantages that the process is simple, the short circuit of the inner layer caused by the metalizing of the board edge which originally does not need metalizing in the circuit board is avoided, the production cost is reduced, the efficiency is improved, the board edge area not needing metalizing is effectively removed, the amount of burrs is effectively reduced, the metalizing accuracy and efficiency of the board edge are improved, and the quality and qualified rate of the metalized board edge of the circuit board are effectively improved.
Description
Technical field
The invention belongs to wiring board and make field, be specifically related to a kind of manufacture method of producing circuit board metallized edges of boards.
Background technology
At present, conventional wiring board is when designing, client's General Requirements profile (edges of boards) is all with the non-metallic standard of edges of boards, does not allow edges of boards and wooden partition to have metallized phenomenon, mainly in order to avoid wiring board ectonexine affects circuit network relation due to the appearance of the metal of edges of boards.But along with the lifting day by day that maturation and the electronic product of wiring board techniques condition require wiring board, the Customer design of part has occurred going copper facing in edges of boards and panel wall portion region, and require necessary conducting, i.e. so-called copper-clad limit state between the ectonexine of wiring board.
At present, conventional wiring board copper-clad limit production technology: first will not need copper-plated region overlay one deck dry film, flow out needing the region of plating, then be placed in electroplating bath and carry out copper facing, in dry film removing after copper facing, this technique easily causes wiring board not need copper-plated region also to be caused the broken wire of wiring board inside by copper facing, cause defective products rate high, increase the input of production cost, be unfavorable for enterprise development, reduce the competitiveness of enterprise.
Summary of the invention
In view of this, the technical problem to be solved in the present invention is that a kind of technique is simple, improves the manufacture method of the producing circuit board metallized edges of boards of producing circuit board metallized edges of boards quality and conforming product rate.
In order to solve the problems of the technologies described above, the present invention adopts following scheme to realize: a kind of manufacture method of producing circuit board metallized edges of boards, comprises the steps:
(1) the metallized region of needs is printed in the edges of boards of wiring board;
(2) wiring board is fixed on circuit-board drilling trigger workbench, uses gong cutter to carry out first time gong groove to the metallized edges of boards region of needs;
(3) wiring board is put into electroplating bath and is carried out plating layer of metal copper to edges of boards;
(4) workbench wiring board being fixed on again circuit-board drilling trigger carries out second time gong groove;
(5) the lower cutter point of the gong cutter of second time gong groove is positioned at the region of metallization edges of boards, and then gong cutter is from lower cutter point to both sides feed.
As improvement of the present invention, the first gong groove zone length described in step (2) is greater than the length being printed on producing circuit board metallized region, and is extended by the both sides to wiring board edges of boards being printed on producing circuit board metallized region.
As improvement of the present invention, the described length extended to both sides is: 1 times first time gong groove gong cutter diameter and 3 times first time gong groove gong cutter diameter between.
As improvement of the present invention, the gong cutter diameter of the second time gong groove described in step (4) is less than or equal to 2/3 of the gong cutter diameter of gong groove for the first time in step (2).
As a further improvement on the present invention, the condition of work of described circuit-board drilling trigger controls: the speed of mainshaft that gong cutter rotates controls as 30Krpm ~ 40Krpm; Feed velocity controls as 0.2m/min ~ 0.6m/min; Withdrawing speeds control is 9m/min ~ 11m/min; Profile offset controls as 3-5mil.
As a further improvement on the present invention, the condition of work of described circuit-board drilling trigger controls: the speed of mainshaft that gong cutter rotates controls as 35Krpm; Feed velocity controls as 0.4m/min; Withdrawing speeds control is 10m/min; Profile offset controls as 4mil.
Further improve as of the present invention, described profile offset comprises left offset and right offset.
Compared with prior art, present invention process is simple, first carry out first time gong groove in the metallized edges of boards region of needs, then plated metal is carried out, its edges of boards are metallized, and then carries out second time gong groove, avoid in wiring board and do not need metallized edges of boards to be metallized, and edges of boards occur metal discloses phenomenon, cause internal layer to occur short circuit; Extend to both sides during first time gong groove, the cut to lengthen extended is between 1 times of first gong cutter diameter and 3 times of first gong cutter diameter, guarantee that the edges of boards of needs plating can by completely metallized, and do not need the metallization of whole piece edges of boards again to not needing metallized region to process, save production cost, improve efficiency, add the precision of metallization edges of boards; When second time gong groove, under gong cutter, cutter point is arranged in the edges of boards electroplated, and the diameter of the second gong cutter is less than 2/3 of the diameter of first time gong cutter, the problem such as effectively avoid gong cutter to be heaved out metallized metal level when gong edges of boards, metal edges of boards are caused to be destroyed, effective removal does not need the region of metallization edges of boards, reduce burr, improve the metallized precision of edges of boards and efficiency, effectively improve producing circuit board metallized edges of boards quality and conforming product rate.
Embodiment
In order to allow those skilled in the art understand technical scheme of the present invention better, below the present invention is further elaborated.
A manufacture method for producing circuit board metallized edges of boards, comprises the steps:
(1) the metallized region of needs is printed in the edges of boards of wiring board;
(2) wiring board is fixed on circuit-board drilling trigger workbench, uses gong cutter to carry out first time gong groove to the metallized edges of boards region of needs.In order to ensure to need metallized edges of boards can be metallized completely in next step electroplating process, the gong cutter of gong first gong groove after gong goes out the first gong groove and respectively to be printed on producing circuit board metallized region both sides extend, make the first gong groove zone length be greater than the length being printed on producing circuit board metallized region.In order to reduce the metal waste of plating on edges of boards, save production cost, the cut to lengthen that the both sides to wiring board edges of boards being printed on producing circuit board metallized region extend is: between 1 times of first gong cutter diameter and 3 times of first gong cutter diameter.The length wherein extended to both sides is the first gong cutter diameter best results of 1.5 times.Wherein the condition of work control of circuit-board drilling trigger is: the speed of mainshaft that gong cutter rotates controls as 30Krpm ~ 40Krpm; Feed velocity controls as 0.2m/min ~ 0.6m/min; Withdrawing speeds control is 9m/min ~ 11m/min; Profile offset controls as 3-5mil, and the control of the condition of work of circuit-board drilling trigger is: the speed of mainshaft that gong cutter rotates controls as 35Krpm; Feed velocity controls as 0.4m/min; Withdrawing speeds control is 10m/min; The effect that profile offset controls as 4mil realization is best.
(3) wiring board after first time gong groove is put into electroplating bath to electroplate, make it need region of plating to electroplate layer of metal copper uniformly at edges of boards.
(4) by after the edges of boards of wiring board plating layer of metal copper, to cleaning in the table of wiring board, dry process, the workbench then wiring board being fixed on again circuit-board drilling trigger carries out second time gong groove.By the control of the condition of work of circuit-board drilling trigger be: the speed of mainshaft that gong cutter rotates controls as 30Krpm ~ 40Krpm; Feed velocity controls as 0.2m/min ~ 0.6m/min; Withdrawing speeds control is 9m/min ~ 11m/min; Profile offset controls as 3-5mil, and the control of the condition of work of circuit-board drilling trigger is: the speed of mainshaft that gong cutter rotates controls as 35Krpm; Feed velocity controls as 0.4m/min; Withdrawing speeds control is 10m/min; The effect that profile offset controls as 4mil realization is best.In order to improve the precision needing metallization plate edge regions, the gong cutter diameter of second time gong groove selects diameter to be less than or equal to 2/3 of the gong cutter diameter of gong groove for the first time in step (2), best results when wherein the gong cutter diameter of second time gong groove is 1/2 of the diameter of gong groove for the first time.
(5) in order to the problem such as effectively avoid gong cutter to be heaved out metallized metal level when gong edges of boards, metal edges of boards are caused to be destroyed, the lower cutter point of the gong cutter of the second gong groove is positioned at the region of metallization edges of boards, then gong cutter carries out gong groove from lower cutter point respectively to the both sides feed of wiring board edges of boards, by copper-plated edges of boards and do not need copper-plated edges of boards gong to go out.
Profile offset described in the present embodiment comprises left offset and right offset, namely gong cutter when gong groove to the left offset at groove width two ends and right offset.
Above-described embodiment is only wherein specific implementation of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these apparent replacement forms all belong to protection scope of the present invention.
Claims (7)
1. a manufacture method for producing circuit board metallized edges of boards, is characterized in that, comprises the steps:
(1) the metallized region of needs is printed in the edges of boards of wiring board;
(2) wiring board is fixed on circuit-board drilling trigger workbench, uses gong cutter to carry out first time gong groove to the metallized edges of boards region of needs;
(3) wiring board is put into electroplating bath and is carried out plating layer of metal copper to edges of boards;
(4) workbench wiring board being fixed on again circuit-board drilling trigger carries out second time gong groove;
(5) the lower cutter point of the gong cutter of second time gong groove is positioned at the region of metallization edges of boards, and then gong cutter is from lower cutter point to both sides feed.
2. the manufacture method of producing circuit board metallized edges of boards according to claim 1, it is characterized in that, the first gong groove zone length described in step (2) is greater than the length being printed on producing circuit board metallized region, and is extended by the both sides to wiring board edges of boards being printed on producing circuit board metallized region.
3. the manufacture method of producing circuit board metallized edges of boards according to claim 1, is characterized in that, the described length extended to both sides is: 1 times first time gong groove gong cutter diameter and 3 times first time gong groove gong cutter diameter between.
4. the manufacture method of producing circuit board metallized edges of boards according to claim 1, is characterized in that, the gong cutter diameter of the second time gong groove described in step (4) is less than or equal to 2/3 of the gong cutter diameter of gong groove for the first time in step (2).
5. the manufacture method of the producing circuit board metallized edges of boards according to claim 3 or 4, is characterized in that, the condition of work control of described circuit-board drilling trigger is: the speed of mainshaft that gong cutter rotates controls as 30Krpm ~ 40Krpm; Feed velocity controls as 0.2m/min ~ 0.6m/min; Withdrawing speeds control is 9m/min ~ 11m/min; Profile offset controls as 3-5mil.
6. the manufacture method of producing circuit board metallized edges of boards according to claim 5, is characterized in that, the condition of work control of described circuit-board drilling trigger is: the speed of mainshaft that gong cutter rotates controls as 35Krpm; Feed velocity controls as 0.4m/min; Withdrawing speeds control is 10m/min; Profile offset controls as 4mil.
7. the manufacture method of producing circuit board metallized edges of boards according to claim 6, is characterized in that, described profile offset comprises left offset and right offset.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410371962.8A CN104254207B (en) | 2014-07-31 | 2014-07-31 | A kind of preparation method of producing circuit board metallized edges of boards |
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| CN201410371962.8A CN104254207B (en) | 2014-07-31 | 2014-07-31 | A kind of preparation method of producing circuit board metallized edges of boards |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105007683A (en) * | 2015-07-03 | 2015-10-28 | 深圳市景旺电子股份有限公司 | Method for no-glass-cloth ceramic high-frequency PCB plate edge metallization |
| CN105338745A (en) * | 2015-11-02 | 2016-02-17 | 深圳市五株科技股份有限公司 | Processing method for gold immersion of printed circuit board |
| CN105376928A (en) * | 2015-11-03 | 2016-03-02 | 江门崇达电路技术有限公司 | Easily-assembled-and-fixed PCB and manufacturing method thereof |
| CN106255321A (en) * | 2016-08-10 | 2016-12-21 | 奥士康精密电路（惠州）有限公司 | A kind of gong plate edges of boards are without dust technique |
| CN106270799A (en) * | 2016-08-30 | 2017-01-04 | 江西景旺精密电路有限公司 | A kind of prevent pcb board gong from breaking method that metal edges or metallic channel produce burr |
| CN106507592A (en) * | 2016-11-18 | 2017-03-15 | 深圳崇达多层线路板有限公司 | The technique that wiring board edges of boards are interrupted copper-clad turmeric |
| CN107072049A (en) * | 2017-03-28 | 2017-08-18 | 江门市高智电子科技有限公司 | Gong groove technique for BT plates |
| CN108040431A (en) * | 2017-12-11 | 2018-05-15 | 吉安市满坤科技有限公司 | The processing method of gong groove before a kind of heavy copper |
| CN111225496A (en) * | 2020-01-10 | 2020-06-02 | 东莞市五株电子科技有限公司 | Metal half-clad structure, manufacturing process and PCB |
| CN112351589A (en) * | 2020-11-03 | 2021-02-09 | 广东成德电子科技股份有限公司 | Method for processing Mini LED circuit board |
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| JP2008041787A (en) * | 2006-08-03 | 2008-02-21 | Nec Saitama Ltd | Printed circuit board, mobile electronic apparatus, and board manufacturing method |
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| CN103687312A (en) * | 2013-11-18 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Gold-plated circuit board manufacturing method |
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Patent Citations (3)
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| JP2008041787A (en) * | 2006-08-03 | 2008-02-21 | Nec Saitama Ltd | Printed circuit board, mobile electronic apparatus, and board manufacturing method |
| CN101951727A (en) * | 2010-09-10 | 2011-01-19 | 广东依顿电子科技股份有限公司 | Method for producing electroplated board edge of circuit board |
| CN103687312A (en) * | 2013-11-18 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Gold-plated circuit board manufacturing method |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105007683B (en) * | 2015-07-03 | 2018-04-03 | 深圳市景旺电子股份有限公司 | A kind of method of no glass cloth ceramics frequency PCB plate edges of boards metallization |
| CN105007683A (en) * | 2015-07-03 | 2015-10-28 | 深圳市景旺电子股份有限公司 | Method for no-glass-cloth ceramic high-frequency PCB plate edge metallization |
| CN105338745A (en) * | 2015-11-02 | 2016-02-17 | 深圳市五株科技股份有限公司 | Processing method for gold immersion of printed circuit board |
| CN105338745B (en) * | 2015-11-02 | 2018-08-10 | 深圳市五株科技股份有限公司 | The processing method of printed circuit board turmeric |
| CN105376928A (en) * | 2015-11-03 | 2016-03-02 | 江门崇达电路技术有限公司 | Easily-assembled-and-fixed PCB and manufacturing method thereof |
| CN106255321B (en) * | 2016-08-10 | 2018-11-13 | 奥士康精密电路（惠州）有限公司 | A kind of gong plate edges of boards are without dust technique |
| CN106255321A (en) * | 2016-08-10 | 2016-12-21 | 奥士康精密电路（惠州）有限公司 | A kind of gong plate edges of boards are without dust technique |
| CN106270799A (en) * | 2016-08-30 | 2017-01-04 | 江西景旺精密电路有限公司 | A kind of prevent pcb board gong from breaking method that metal edges or metallic channel produce burr |
| CN106507592A (en) * | 2016-11-18 | 2017-03-15 | 深圳崇达多层线路板有限公司 | The technique that wiring board edges of boards are interrupted copper-clad turmeric |
| CN107072049A (en) * | 2017-03-28 | 2017-08-18 | 江门市高智电子科技有限公司 | Gong groove technique for BT plates |
| CN108040431A (en) * | 2017-12-11 | 2018-05-15 | 吉安市满坤科技有限公司 | The processing method of gong groove before a kind of heavy copper |
| CN108040431B (en) * | 2017-12-11 | 2020-01-07 | 吉安满坤科技股份有限公司 | Machining method for copper precipitation front gong groove |
| CN111225496A (en) * | 2020-01-10 | 2020-06-02 | 东莞市五株电子科技有限公司 | Metal half-clad structure, manufacturing process and PCB |
| CN111225496B (en) * | 2020-01-10 | 2023-03-10 | 东莞市五株电子科技有限公司 | Manufacturing process of metal semi-clad structure |
| CN112351589A (en) * | 2020-11-03 | 2021-02-09 | 广东成德电子科技股份有限公司 | Method for processing Mini LED circuit board |
| CN112351589B (en) * | 2020-11-03 | 2024-02-27 | 广东成德电子科技股份有限公司 | Mini LED circuit board processing method |
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