CN106793576A - A kind of filling perforation method of blind hole in PCB - Google Patents
A kind of filling perforation method of blind hole in PCB Download PDFInfo
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- CN106793576A CN106793576A CN201611226820.8A CN201611226820A CN106793576A CN 106793576 A CN106793576 A CN 106793576A CN 201611226820 A CN201611226820 A CN 201611226820A CN 106793576 A CN106793576 A CN 106793576A
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- current density
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
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- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention relates to board production technical field, the filling perforation method of blind hole in specially a kind of PCB.The present invention uses different current densities in whole plate filling perforation plating step by different plating stages, and coordinate corresponding electroplate liquid spray frequency, so as to only need to carry out whole plate filling perforation flow can completion big-diameter blind hole filling perforation and face copper plating, and big-diameter blind hole filling perforation plumpness more than 85%.The inventive method, so as to can save making plating hole pattern, take off the operations such as film and nog plate, has greatly simplified production procedure without electric plating of whole board is separately carried out with filling perforation plating, and can reduce scrappage, reduces production cost.
Description
Technical field
The present invention relates to a kind of filling perforation method of blind hole in board production technical field, more particularly to PCB.
Background technology
Along with electronic signal to high frequency, the development in high speed direction, support is installed to electronic signal transmission and component
The PCB (Printed Circuit Board) of effect constantly develops to multifunction, densification direction.Therefore, integrated level is more
HDI (High Density Interconnect) plate high turns into the main product in PCB markets, is applied to increasing electricity
In sub- product.Wherein, the blind hole of 150 μm of aperture ＞ and aspect ratio >=0.8 occupies very big ratio, mesh in industry control class HDI products
The filling perforation production procedure of preceding this type HDI plates to carry out after heavy copper and electric plating of whole board the patch dry film on production plate, and through overexposure
Plating hole pattern with windowing at formation blind hole on production plate is developed in, then carries out filling perforation plating, then takes off on production plate
Film, and because filling perforation plating flow carries out filling perforation plating by constant current control, convex plating phenomenon is also easy to produce in orifice position, because
This filling perforation is electroplated and also needs to carry out nog plate flow after taking off film.The plating of the filling perforation plating in existing filling perforation production procedure takes and is
4-6 hours, and electric plating of whole board, make plating hole pattern and take off film and nog plate these operations and need to take more than 5 hours, i.e., it is existing to fill out
Production procedure total time-consuming in hole is more than 9 hours, and production procedure is long, and production cost is high.In addition, because the aperture of blind hole is big, plating
Time is more long, thus aperture occurs serious convex plating phenomenon, though convex plating can be solved the problems, such as by nog plate, pole during nog plate
There are the quality problems such as polishing scratch in the plate face for easily causing production plate, so as to cause scrappage to increase.
The content of the invention
The present invention is for the filling perforation production procedure of the existing PCB with big-diameter blind hole is long and the serious problem of convex plating, there is provided one
Kind of technological process it is short and can avoid the occurrence of convex plating be applied to aperture more than 150 μm less than or equal to 225 μm and aspect ratio is more than
Or the filling perforation method of the blind hole equal to 0.8.
To achieve the above object, the present invention uses following technical scheme.
The filling perforation method of blind hole, comprises the following steps in a kind of PCB：
S1 electroless copper platings：One layer of copper is deposited on multilayer production plate according to existing heavy process for copper, multilayer is produced on plate
Hole slot preliminary metal；The multilayer production plate is that core material is integrated and is passed through with outer copper foil pressing by prepreg
Production plate after outer layer Drilling operation；The multilayer production plate is provided with aperture for d, and aspect ratio is the big-diameter blind hole of a, 150 μm of ＜ d
≤ 225 μm, a >=0.8.
The filling perforation of S2 whole plates is electroplated：Producing plate to multilayer using existing vertical continuous filling perforation plating line carries out plating filling perforation；
The concentration of copper sulphate is 180-220g/mL in electroplate liquid, and a length of 12t minutes during plating (numerical value t is equal to the 12 of plating duration
/ mono-), current density is with electroplate liquid spray frequency by following control：
The current density of 0-1t minutes is 2.2-2.6ASD, and electroplate liquid spray frequency is 46-50Hz,
The current density of 1t-5t minutes is 1.8-2.2ASD, and electroplate liquid spray frequency is 46-50Hz,
The current density of 5t-6t minutes is 2.2-2.6ASD, and electroplate liquid spray frequency is 46-50Hz,
The current density of 6t-9t minutes is 2.2-2.6ASD, and electroplate liquid spray frequency is 42-48Hz,
The current density of 9t-12t minutes is 2.2ASD, and electroplate liquid spray frequency is 25-35Hz.
Preferably, a length of 110 minutes during plating.
Preferably, the vertical continuous filling perforation plating line is provided with 12 size identical copper cylinders, and multilayer production plate is at the uniform velocity passed through
Cross each copper cylinder.
Operation after S3：According to prior art made successively on multilayer production plate outer-layer circuit, make solder mask, at surface
Reason, shaping and test.
Preferably, when the aperture d of big-diameter blind hole on multilayer production plate is 211 μm, when aspect ratio a is 0.84, whole plate filling perforation electricity
Current density is controlled with electroplate liquid spray frequency as following in plating step：
The current density of 0-1t minutes is 2.6ASD, and electroplate liquid spray frequency is 48Hz,
The current density of 1t-5t minutes is 2.0ASD, and electroplate liquid spray frequency is 48Hz,
The current density of 5t-6t minutes is 2.4ASD, and electroplate liquid spray frequency is 48Hz,
The current density of 6t-9t minutes is 2.4ASD, and electroplate liquid spray frequency is 45Hz,
The current density of 9t-12t minutes is 2.2ASD, and electroplate liquid spray frequency is 30Hz.
Preferably, when the aperture d of big-diameter blind hole on multilayer production plate is 200 μm, aspect ratio a is 0.85, whole plate filling perforation plating
Current density is controlled with electroplate liquid spray frequency as following in step：
The current density of 0-1t minutes is 2.4ASD, and electroplate liquid spray frequency is 48Hz,
The current density of 1t-5t minutes is 2.0ASD, and electroplate liquid spray frequency is 48Hz,
The current density of 5t-6t minutes is 2.4ASD, and electroplate liquid spray frequency is 48Hz,
The current density of 6t-9t minutes is 2.4ASD, and electroplate liquid spray frequency is 45Hz,
The current density of 9t-12t minutes is 2.2ASD, and electroplate liquid spray frequency is 30Hz.
Preferably, when multilayer production plate on big-diameter blind hole aperture d be 192 μm, aspect ratio a be 0.87 when, current density with
Electroplate liquid spray frequency is by following control：
The current density of 0-1t minutes is 2.2ASD, and electroplate liquid spray frequency is 48Hz,
The current density of 1t-5t minutes is 1.8ASD, and electroplate liquid spray frequency is 48Hz,
The current density of 5t-6t minutes is 2.2ASD, and electroplate liquid spray frequency is 48Hz,
The current density of 6t-9t minutes is 2.2ASD, and electroplate liquid spray frequency is 45Hz,
The current density of 9t-12t minutes is 2.0ASD, and electroplate liquid spray frequency is 30Hz.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention is in whole plate filling perforation plating step by not
Same plating stage uses different current densities, and coordinates corresponding electroplate liquid spray frequency, so as to need to only carry out whole plate fill out
Hole flow can complete big-diameter blind hole filling perforation and face copper plating, and big-diameter blind hole filling perforation plumpness more than 82%.The present invention
Method is without electric plating of whole board is separately carried out with filling perforation plating, so that making plating hole pattern can be saved, the operations such as film and nog plate are taken off,
Greatly production procedure is simplified, and scrappage can be reduced, reduced production cost.
Specific embodiment
In order to more fully understand technology contents of the invention, with reference to specific embodiment to technical scheme
It is described further and illustrates.
Embodiment 1
The present embodiment provides a kind of preparation method of PCB, especially in PCB blind hole filling perforation method.Need on the pcb
It is 211 μm (Jie's thickness is 165 μm) to make aperture, and aspect ratio is 0.84 big-diameter blind hole, and with plating by way of electroplating filling perforation
Copper clogs big-diameter blind hole.Comprise the following steps that：
(1) operation before
According to prior art, sequentially pass through sawing sheet → negative film technique and make internal layer circuit → pressing → outer layer drilling, will be interior
Layer core plate and outer copper foil are fabricated to multilayer production plate, i.e., will have been made by prepreg the core material of internal layer circuit with it is outer
Layer Copper Foil pressing is integrated and completes outer layer according to borehole data and drill to form multilayer production plate；The multilayer production plate is provided with
Big-diameter blind hole, the aperture of big-diameter blind hole is 211 μm, and aspect ratio is 0.84.It is specific as follows：
A, sawing sheet：Core plate is outputed by jigsaw size 520mm × 620mm.
B, internal layer circuit (negative film technique)：LDI dry films, stand 30min, using Full-automatic exposure machine, with 6 lattice exposure guide rules
(21 lattice exposure guide rule) completes internal layer circuit exposure, and line pattern is etched after development, and it is 3mil that internal layer line width is measured.
C, internal layer AOI：Check internal layer opens the defects such as short circuit, circuit breach, circuit pin hole, defective to scrap treatment, nothing
The product of defect goes out to downstream.
D, pressing：Brown speed is selected according to thickness of slab.After lamination, pressed from appropriate lamination according to plate Tg
Close.
E, outer layer drilling：Carry out Drilling operation using borehole data, including aperture is 211 μm, aspect ratio be 0.84 it is big
Blind hole.
(2) electroless copper plating
One layer of copper is deposited on multilayer production plate according to existing heavy process for copper, the hole slot for making multilayer produce on plate is tentatively golden
Categoryization.
(3) whole plate filling perforation plating
(12 size identical copper cylinders are provided with, multilayer production plate is at the uniform velocity passed through using existing vertical continuous filling perforation plating line
Cross each copper cylinder) plating filling perforation is carried out to multilayer production plate.The concentration of copper sulphate in electroplate liquid is controlled for 180-220g/mL, electricity
During plating a length of 110 minutes (t=9.167), current density is with electroplate liquid spray frequency by following control：
The 0-1t minutes current density of (when i.e. multilayer produces plate by the 1st copper cylinder) is 2.6ASD, electroplate liquid spray frequency
Rate is 48Hz；
The 1t-5t minutes current density of (when i.e. multilayer produces plate by the 2-5 copper cylinder) is 2.0ASD, electroplate liquid spray
Frequency is 48Hz；
The 5t-6t minutes current density of (when i.e. multilayer produces plate by the 6th copper cylinder) is 2.4ASD, electroplate liquid spray frequency
Rate is 48Hz；
The 6t-9t minutes current density of (when i.e. multilayer produces plate by the 7-9 copper cylinder) is 2.4ASD, electroplate liquid spray
Frequency is 45Hz；
The current density of (when i.e. multilayer produces plate by the 10-12 copper cylinder) is 2.2ASD, electroplate liquid within 9t-12t minutes
Spray frequency is 30Hz.
After completing whole plate filling perforation plating, extract multilayer production plate and cut into slices, detect filling perforation effect.Testing result shows multilayer
The filling perforation plumpness of big-diameter blind hole is 84% on production plate.
(4) operation afterwards
According to prior art multilayer production plate on make successively outer-layer circuit, make solder mask, surface treatment, be molded and
Test, is obtained PCB finished products.
Embodiment 2
The present embodiment provides a kind of preparation method of PCB, especially in PCB blind hole filling perforation method.Need on the pcb
It is 200 μm (Jie's thickness is 158 μm) to make aperture, and aspect ratio is 0.85 big-diameter blind hole, and with plating by way of electroplating filling perforation
Copper clogs big-diameter blind hole.Comprise the following steps that：
(1) operation before
According to prior art, sequentially pass through sawing sheet → negative film technique and make internal layer circuit → pressing → outer layer drilling, will be interior
Layer core plate and outer copper foil are fabricated to multilayer production plate, i.e., will have been made by prepreg the core material of internal layer circuit with it is outer
Layer Copper Foil pressing is integrated and completes outer layer according to borehole data and drill to form multilayer production plate；The multilayer production plate is provided with
Big-diameter blind hole, the aperture of big-diameter blind hole is 200 μm, and aspect ratio is 0.85.It is specific as follows：
A, sawing sheet：Core plate is outputed by jigsaw size 520mm × 620mm.
B, internal layer circuit (negative film technique)：LDI dry films, stand 30min, using Full-automatic exposure machine, with 6 lattice exposure guide rules
(21 lattice exposure guide rule) completes internal layer circuit exposure, and line pattern is etched after development, and it is 3mil that internal layer line width is measured.
C, internal layer AOI：Check internal layer opens the defects such as short circuit, circuit breach, circuit pin hole, defective to scrap treatment, nothing
The product of defect goes out to downstream.
D, pressing：Brown speed is selected according to thickness of slab.After lamination, pressed from appropriate lamination according to plate Tg
Close.
E, outer layer drilling：Carry out Drilling operation using borehole data, including aperture is 200 μm, aspect ratio be 0.85 it is big
Blind hole.
(2) electroless copper plating
One layer of copper is deposited on multilayer production plate according to existing heavy process for copper, the hole slot for making multilayer produce on plate is tentatively golden
Categoryization.
(3) whole plate filling perforation plating
(12 size identical copper cylinders are provided with, multilayer production plate is at the uniform velocity passed through using existing vertical continuous filling perforation plating line
Cross each copper cylinder) plating filling perforation is carried out to multilayer production plate.The concentration of copper sulphate in electroplate liquid is controlled for 180-220g/mL, electricity
During plating a length of 110 minutes (t=9.167), current density is with electroplate liquid spray frequency by following control：
The 0-1t minutes current density of (when i.e. multilayer produces plate by the 1st copper cylinder) is 2.4ASD, electroplate liquid spray frequency
Rate is 48Hz；
The 1t-5t minutes current density of (when i.e. multilayer produces plate by the 2-5 copper cylinder) is 2.0ASD, electroplate liquid spray
Frequency is 48Hz；
The 5t-6t minutes current density of (when i.e. multilayer produces plate by the 6th copper cylinder) is 2.4ASD, electroplate liquid spray frequency
Rate is 48Hz；
The 6t-9t minutes current density of (when i.e. multilayer produces plate by the 7-9 copper cylinder) is 2.4ASD, electroplate liquid spray
Frequency is 45Hz,
The current density of (when i.e. multilayer produces plate by the 10-12 copper cylinder) is 2.2ASD, electroplate liquid within 9t-12t minutes
Spray frequency is 30Hz.
After completing whole plate filling perforation plating, extract multilayer production plate and cut into slices, detect filling perforation effect.Testing result shows multilayer
The filling perforation plumpness of big-diameter blind hole is 85% on production plate.
(4) operation afterwards
According to prior art multilayer production plate on make successively outer-layer circuit, make solder mask, surface treatment, be molded and
Test, is obtained PCB finished products.
Embodiment 3
The present embodiment provides a kind of preparation method of PCB, especially in PCB blind hole filling perforation method.Need on the pcb
It is 192 μm (Jie's thickness is 132 μm) to make aperture, and aspect ratio is 0.87 big-diameter blind hole, and with plating by way of electroplating filling perforation
Copper clogs big-diameter blind hole.Comprise the following steps that：
(1) operation before
According to prior art, sequentially pass through sawing sheet → negative film technique and make internal layer circuit → pressing → outer layer drilling, will be interior
Layer core plate and outer copper foil are fabricated to multilayer production plate, i.e., will have been made by prepreg the core material of internal layer circuit with it is outer
Layer Copper Foil pressing is integrated and completes outer layer according to borehole data and drill to form multilayer production plate；The multilayer production plate is provided with
Big-diameter blind hole, the aperture of big-diameter blind hole is 192 μm, and aspect ratio is 0.87.It is specific as follows：
A, sawing sheet：Core plate is outputed by jigsaw size 520mm × 620mm.
B, internal layer circuit (negative film technique)：LDI dry films, stand 30min, using Full-automatic exposure machine, with 6 lattice exposure guide rules
(21 lattice exposure guide rule) completes internal layer circuit exposure, and line pattern is etched after development, and it is 3mil that internal layer line width is measured.
C, internal layer AOI：Check internal layer opens the defects such as short circuit, circuit breach, circuit pin hole, defective to scrap treatment, nothing
The product of defect goes out to downstream.
D, pressing：Brown speed is selected according to thickness of slab.After lamination, pressed from appropriate lamination according to plate Tg
Close.
E, outer layer drilling：Carry out Drilling operation using borehole data, including aperture is 192 μm, aspect ratio be 0.87 it is big
Blind hole.
(2) electroless copper plating
One layer of copper is deposited on multilayer production plate according to existing heavy process for copper, the hole slot for making multilayer produce on plate is tentatively golden
Categoryization.
(3) whole plate filling perforation plating
(12 size identical copper cylinders are provided with, multilayer production plate is at the uniform velocity passed through using existing vertical continuous filling perforation plating line
Cross each copper cylinder) plating filling perforation is carried out to multilayer production plate.The concentration of copper sulphate in electroplate liquid is controlled for 180-220g/mL, electricity
During plating a length of 110 minutes (t=9.167), current density is with electroplate liquid spray frequency by following control：
The 0-1t minutes current density of (when i.e. multilayer produces plate by the 1st copper cylinder) is 2.2ASD, electroplate liquid spray frequency
Rate is 48Hz,
The 1t-5t minutes current density of (when i.e. multilayer produces plate by the 2-5 copper cylinder) is 1.8ASD, electroplate liquid spray
Frequency is 48Hz,
The 5t-6t minutes current density of (when i.e. multilayer produces plate by the 6th copper cylinder) is 2.2ASD, electroplate liquid spray frequency
Rate is 48Hz,
The 6t-9t minutes current density of (when i.e. multilayer produces plate by the 7-9 copper cylinder) is 2.2ASD, electroplate liquid spray
Frequency is 45Hz,
The current density of (when i.e. multilayer produces plate by the 10-12 copper cylinder) is 2.0ASD, electroplate liquid within 9t-12t minutes
Spray frequency is 30Hz.
After completing whole plate filling perforation plating, extract multilayer production plate and cut into slices, detect filling perforation effect.Testing result shows multilayer
The filling perforation plumpness of big-diameter blind hole is 82% on production plate.
(4) operation afterwards
According to prior art multilayer production plate on make successively outer-layer circuit, make solder mask, surface treatment, be molded and
Test, is obtained PCB finished products.
The inventive method can also be applied to aperture for d (150 μm of ＜ d≤225 μm), and aspect ratio is big for a's (a >=0.8)
The filling perforation plating of blind hole.
The above only further illustrates technology contents of the invention with embodiment, is easier to understand in order to reader,
But embodiments of the present invention not being represented and being only limitted to this, any technology done according to the present invention extends or recreates, and is sent out by this
Bright protection.
Claims (6)
1. in a kind of PCB blind hole filling perforation method, it is characterised in that comprise the following steps：
S1 electroless copper platings：One layer of copper is deposited on multilayer production plate according to existing heavy process for copper, multilayer is produced the hole on plate
Groove preliminary metal；The multilayer production plate is that core material and outer copper foil pressing are integrated and through outer layer by prepreg
Production plate after Drilling operation；Multilayer production plate is provided with aperture for d, and aspect ratio is the big-diameter blind hole of a, and 150 μm of ＜ d≤
225 μm, a >=0.8；
The filling perforation of S2 whole plates is electroplated：Producing plate to multilayer using existing vertical continuous filling perforation plating line carries out plating filling perforation；Plating
The concentration of copper sulphate is 180-220g/mL in liquid, a length of 12t minutes during plating, and current density is with electroplate liquid spray frequency by such as
Lower control：
The current density of 0-1t minutes is 2.2-2.6ASD, and electroplate liquid spray frequency is 46-50Hz,
The current density of 1t-5t minutes is 1.8-2.2ASD, and electroplate liquid spray frequency is 46-50Hz,
The current density of 5t-6t minutes is 2.2-2.6ASD, and electroplate liquid spray frequency is 46-50Hz,
The current density of 6t-9t minutes is 2.2-2.6ASD, and electroplate liquid spray frequency is 42-48Hz,
The current density of 9t-12t minutes is 2.2ASD, and electroplate liquid spray frequency is 25-35Hz；
Operation after S3：According to prior art multilayer production plate on make successively outer-layer circuit, make solder mask, surface treatment,
Shaping and test.
2. according to claim 1 in a kind of PCB blind hole filling perforation method, it is characterised in that the plating described in step S2
Shi Changwei 110 minutes.
3. according to claim 1 in a kind of PCB blind hole filling perforation method, it is characterised in that vertically connect described in step S2
Continuous filling perforation plating line is provided with 12 size identical copper cylinders, and multilayer production plate at the uniform velocity passes through each copper cylinder.
4. according to claim 2 in a kind of PCB blind hole filling perforation method, it is characterised in that it is big on multilayer production plate
The aperture d of blind hole is 211 μm, and aspect ratio a is 0.84, and current density is with electroplate liquid spray frequency by following control：
The current density of 0-1t minutes is 2.6ASD, and electroplate liquid spray frequency is 48Hz,
The current density of 1t-5t minutes is 2.0ASD, and electroplate liquid spray frequency is 48Hz,
The current density of 5t-6t minutes is 2.4ASD, and electroplate liquid spray frequency is 48Hz,
The current density of 6t-9t minutes is 2.4ASD, and electroplate liquid spray frequency is 45Hz,
The current density of 9t-12t minutes is 2.2ASD, and electroplate liquid spray frequency is 30Hz.
5. according to claim 2 in a kind of PCB blind hole filling perforation method, it is characterised in that it is big on multilayer production plate
The aperture d of blind hole is 200 μm, and aspect ratio a is 0.85, and current density is with electroplate liquid spray frequency by following control：
The current density of 0-1t minutes is 2.4ASD, and electroplate liquid spray frequency is 48Hz,
The current density of 1t-5t minutes is 2.0ASD, and electroplate liquid spray frequency is 48Hz,
The current density of 5t-6t minutes is 2.4ASD, and electroplate liquid spray frequency is 48Hz,
The current density of 6t-9t minutes is 2.4ASD, and electroplate liquid spray frequency is 45Hz,
The current density of 9t-12t minutes is 2.2ASD, and electroplate liquid spray frequency is 30Hz.
6. according to claim 2 in a kind of PCB blind hole filling perforation method, it is characterised in that it is big on multilayer production plate
The aperture d of blind hole is 192 μm, and aspect ratio a is 0.87, and current density is with electroplate liquid spray frequency by following control：
The current density of 0-1t minutes is 2.2ASD, and electroplate liquid spray frequency is 48Hz,
The current density of 1t-5t minutes is 1.8ASD, and electroplate liquid spray frequency is 48Hz,
The current density of 5t-6t minutes is 2.2ASD, and electroplate liquid spray frequency is 48Hz,
The current density of 6t-9t minutes is 2.2ASD, and electroplate liquid spray frequency is 45Hz,
The current density of 9t-12t minutes is 2.0ASD, and electroplate liquid spray frequency is 30Hz.
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| CN108660489A (en) * | 2018-06-07 | 2018-10-16 | 常德力元新材料有限责任公司 | A kind of preparation method in aperture and the agonic three-dimensional porous metal material of physical property |
| CN109609987A (en) * | 2018-12-06 | 2019-04-12 | 广东科翔电子科技有限公司 | A kind of Blind hole fills out plating system and method |
| CN112106451A (en) * | 2018-05-11 | 2020-12-18 | 住友电气工业株式会社 | Printed wiring board and method for manufacturing printed wiring board |
| CN114845481A (en) * | 2022-05-12 | 2022-08-02 | 信丰超淦科技有限公司 | Direct filling VCP process with highest yield |
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