CN106793576B - A kind of filling perforation method of blind hole in PCB - Google Patents
A kind of filling perforation method of blind hole in PCB Download PDFInfo
- Publication number
- CN106793576B CN106793576B CN201611226820.8A CN201611226820A CN106793576B CN 106793576 B CN106793576 B CN 106793576B CN 201611226820 A CN201611226820 A CN 201611226820A CN 106793576 B CN106793576 B CN 106793576B
- Authority
- CN
- China
- Prior art keywords
- electroplate liquid
- liquid spray
- spray frequency
- current densities
- filling perforation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Abstract
The present invention relates to board production technical field, the filling perforation method of blind hole in specially a kind of PCB.The present invention is in whole plate filling perforation plating step by using different current densities in different plating stages, and cooperate corresponding electroplate liquid spray frequency, to which only need to carry out whole plate filling perforation process can be completed the filling perforation of big-diameter blind hole and the plating of face copper, and the filling perforation plumpness of big-diameter blind hole is 85% or more.The method of the present invention is not necessarily to electric plating of whole board and filling perforation plating separating progress, so as to save production plating hole pattern, take off the processes such as film and nog plate, has greatly simplified production procedure, and can reduce scrappage, has reduced production cost.
Description
Technical field
The present invention relates to a kind of filling perforation methods of blind hole in board production technical field more particularly to PCB.
Background technique
Along with electronic signal to high frequency, the development in high speed direction, support has been installed to electronic signal transmission and component
The PCB (Printed Circuit Board) of effect constantly develops to multifunction, densification direction.Therefore, integrated level is more
High HDI (High Density Interconnect) plate becomes the main product in the market PCB, is applied to more and more electricity
In sub- product.Wherein, the blind hole of 150 μm of aperture > and aspect ratio >=0.8 occupies very big ratio, mesh in industry control class HDI product
The filling perforation production procedure of preceding this type HDI plate is to paste dry film on production plate after carrying out heavy copper and electric plating of whole board, and through overexposure
The plating hole pattern to open a window at blind hole is formed with being developed on production plate, filling perforation plating is then carried out, then takes off on production plate
Film, and progress filling perforation plating is controlled by constant current since process is electroplated in filling perforation, it is also easy to produce convex plating phenomenon in orifice position, because
This filling perforation is electroplated and also needs to carry out nog plate process after taking off film.In existing filling perforation production procedure filling perforation plating plating time-consuming be
4-6 hours, and electric plating of whole board, production plate hole pattern and take off film and these processes of nog plate need to be time-consuming 5 hours or more, i.e., it is existing to fill out
For hole production procedure total time-consuming at 9 hours or more, production procedure was long, high production cost.In addition, because the aperture of blind hole is big, plating
Time is longer, thus aperture will appear serious convex plating phenomenon, though convex plating can be solved the problems, such as by nog plate, pole when nog plate
It easily causes the plate face of production plate the quality problems such as polishing scratch occur, increases so as to cause scrappage.
Summary of the invention
The present invention serious problem of long and convex plating for the filling perforation production procedure of the existing PCB with big-diameter blind hole, provides one
Kind of process flow is short and the avoidable aperture that is applied to for convex plating occur is greater than 150 μm and is less than or equal to 225 μm and aspect ratio is greater than
Or the filling perforation method of the blind hole equal to 0.8.
To achieve the above object, the present invention uses following technical scheme.
A kind of filling perforation method of blind hole in PCB, comprising the following steps:
S1 electroless copper plating: one layer of copper is deposited on multilayer production plate according to existing heavy process for copper, is made on multilayer production plate
Hole slot preliminary metal；The multilayer production plate is that core material is press-fitted together as one and is passed through with outer copper foil by prepreg
Production plate after outer layer drilling processing；It is d that the multilayer production plate, which is equipped with aperture, and aspect ratio is the big-diameter blind hole of a, 150 μm of < d
≤ 225 μm, a >=0.8.
S2 whole plate filling perforation plating: plating filling perforation is carried out to multilayer production plate using existing vertical continuous filling perforation plating line；
The concentration of copper sulphate is 180-220g/mL in electroplate liquid, and when plating is 12t minute a length of, and (numerical value t, which is equal to, is electroplated the 12 of duration
/ mono-), current density and electroplate liquid spray frequency are by control as follows:
0-1t minutes current densities are 2.2-2.6ASD, and electroplate liquid spray frequency is 46-50Hz,
1t-5t minutes current densities are 1.8-2.2ASD, and electroplate liquid spray frequency is 46-50Hz,
5t-6t minutes current densities are 2.2-2.6ASD, and electroplate liquid spray frequency is 46-50Hz,
6t-9t minutes current densities are 2.2-2.6ASD, and electroplate liquid spray frequency is 42-48Hz,
9t-12t minutes current densities are 2.2ASD, and electroplate liquid spray frequency is 25-35Hz.
Preferably, a length of 110 minutes when plating.
Preferably, the vertical continuous filling perforation plating line is equipped with the identical copper cylinder of 12 sizes, and multilayer production plate at the uniform velocity passes through
Cross each copper cylinder.
Process after S3: outer-layer circuit, production solder mask are successively made on multilayer production plate according to the prior art, at surface
Reason, molding and test.
Preferably, when the aperture d of big-diameter blind hole on multilayer production plate is 211 μm, when aspect ratio a is 0.84, whole plate filling perforation electricity
Current density and electroplate liquid spray frequency in step is plated to press control as follows:
0-1t minutes current densities are 2.6ASD, and electroplate liquid spray frequency is 48Hz,
1t-5t minutes current densities are 2.0ASD, and electroplate liquid spray frequency is 48Hz,
5t-6t minutes current densities are 2.4ASD, and electroplate liquid spray frequency is 48Hz,
6t-9t minutes current densities are 2.4ASD, and electroplate liquid spray frequency is 45Hz,
9t-12t minutes current densities are 2.2ASD, and electroplate liquid spray frequency is 30Hz.
Preferably, when the aperture d of big-diameter blind hole on multilayer production plate is 200 μm, aspect ratio a is 0.85, whole plate filling perforation plating
Current density and electroplate liquid spray frequency are by control as follows in step:
0-1t minutes current densities are 2.4ASD, and electroplate liquid spray frequency is 48Hz,
1t-5t minutes current densities are 2.0ASD, and electroplate liquid spray frequency is 48Hz,
5t-6t minutes current densities are 2.4ASD, and electroplate liquid spray frequency is 48Hz,
6t-9t minutes current densities are 2.4ASD, and electroplate liquid spray frequency is 45Hz,
9t-12t minutes current densities are 2.2ASD, and electroplate liquid spray frequency is 30Hz.
Preferably, when multilayer production plate on big-diameter blind hole aperture d be 192 μm, aspect ratio a be 0.87 when, current density with
Electroplate liquid spray frequency is by control as follows:
0-1t minutes current densities are 2.2ASD, and electroplate liquid spray frequency is 48Hz,
1t-5t minutes current densities are 1.8ASD, and electroplate liquid spray frequency is 48Hz,
5t-6t minutes current densities are 2.2ASD, and electroplate liquid spray frequency is 48Hz,
6t-9t minutes current densities are 2.2ASD, and electroplate liquid spray frequency is 45Hz,
9t-12t minutes current densities are 2.0ASD, and electroplate liquid spray frequency is 30Hz.
Compared with prior art, the beneficial effects of the present invention are: the present invention in whole plate filling perforation plating step by not
Same plating stage uses different current densities, and cooperates corresponding electroplate liquid spray frequency, fills out to need to only carry out whole plate
The filling perforation of big-diameter blind hole and the plating of face copper can be completed in hole process, and the filling perforation plumpness of big-diameter blind hole is 82% or more.The present invention
Method is not necessarily to electric plating of whole board and filling perforation plating separating progress, so as to save production plating hole pattern, take off the processes such as film and nog plate,
Production procedure greatly has been simplified, and scrappage can be reduced, has reduced production cost.
Specific embodiment
In order to more fully understand technology contents of the invention, combined with specific embodiments below to technical solution of the present invention
It is described further and illustrates.
Embodiment 1
The present embodiment provides the filling perforation methods of blind hole in the production method of PCB a kind of, especially PCB.It needs on the pcb
Production aperture is 211 μm (Jie's thickness is 165 μm), the big-diameter blind hole that aspect ratio is 0.84, and the use plating by way of filling perforation is electroplated
Copper clogs big-diameter blind hole.Specific step is as follows:
(1) process before
It, will be interior successively by sawing sheet → negative film technique production internal layer circuit → pressing → outer layer drilling according to the prior art
Layer core plate and outer copper foil are fabricated to multilayer production plate, i.e., will make the core material of internal layer circuit and outer by prepreg
Layer copper foil is press-fitted together as one and completes outer layer according to borehole data and drill to form multilayer production plate；The multilayer production plate is equipped with
Big-diameter blind hole, the aperture of big-diameter blind hole are 211 μm, aspect ratio 0.84.It is specific as follows:
A, sawing sheet: core plate is outputed by jigsaw size 520mm × 620mm.
B, internal layer circuit (negative film technique): LDI dry film stands 30min, using Full-automatic exposure machine, with 6 lattice exposure guide rules
(21 lattice exposure guide rule) completes internal layer circuit exposure, line pattern is etched after development, it is 3mil that internal layer line width, which measures,.
C, internal layer AOI: checking the defects of opening short circuit, route notch, route pin hole of internal layer, defective to scrap processing, nothing
The product of defect goes out to downstream.
D, it presses: brownification speed is selected according to plate thickness.After lamination, lamination appropriate is selected to be pressed according to plate Tg
It closes.
E, outer layer drill: using borehole data carry out drilling processing, including aperture be 211 μm, aspect ratio for 0.84 it is big
Blind hole.
(2) electroless copper plating
One layer of copper is deposited on multilayer production plate according to existing heavy process for copper, keeps the hole slot on multilayer production plate tentatively golden
Categoryization.
(3) whole plate filling perforation is electroplated
(it is equipped with the identical copper cylinder of 12 sizes, multilayer production plate at the uniform velocity passes through using existing vertical continuous filling perforation plating line
Cross each copper cylinder) plating filling perforation is carried out to multilayer production plate.The concentration for controlling copper sulphate in electroplate liquid is 180-220g/mL, electricity
A length of 110 minutes (t=9.167) when plating, current density and electroplate liquid spray frequency are by control as follows:
The current density of 0-1t minutes (when i.e. multilayer production plate passes through the 1st copper cylinder) is 2.6ASD, electroplate liquid spray frequency
Rate is 48Hz；
The current density of 1t-5t minutes (when i.e. multilayer production plate passes through the 2-5 copper cylinder) is 2.0ASD, electroplate liquid spray
Frequency is 48Hz；
The current density of 5t-6t minutes (when i.e. multilayer production plate passes through the 6th copper cylinder) is 2.4ASD, electroplate liquid spray frequency
Rate is 48Hz；
The current density of 6t-9t minutes (when i.e. multilayer production plate passes through the 7-9 copper cylinder) is 2.4ASD, electroplate liquid spray
Frequency is 45Hz；
The current density of 9t-12t minutes (when i.e. multilayer production plate passes through the 10-12 copper cylinder) is 2.2ASD, electroplate liquid
Spray frequency is 30Hz.
After completing whole plate filling perforation plating, extracts multilayer production plate and be sliced, detect filling perforation effect.Testing result shows multilayer
The filling perforation plumpness for producing big-diameter blind hole on plate is 84%.
(4) process afterwards
According to the prior art multilayer production plate on successively make outer-layer circuit, production solder mask, surface treatment, molding and
PCB finished product is made in test.
Embodiment 2
The present embodiment provides the filling perforation methods of blind hole in the production method of PCB a kind of, especially PCB.It needs on the pcb
Production aperture is 200 μm (Jie's thickness is 158 μm), the big-diameter blind hole that aspect ratio is 0.85, and the use plating by way of filling perforation is electroplated
Copper clogs big-diameter blind hole.Specific step is as follows:
(1) process before
It, will be interior successively by sawing sheet → negative film technique production internal layer circuit → pressing → outer layer drilling according to the prior art
Layer core plate and outer copper foil are fabricated to multilayer production plate, i.e., will make the core material of internal layer circuit and outer by prepreg
Layer copper foil is press-fitted together as one and completes outer layer according to borehole data and drill to form multilayer production plate；The multilayer production plate is equipped with
Big-diameter blind hole, the aperture of big-diameter blind hole are 200 μm, aspect ratio 0.85.It is specific as follows:
A, sawing sheet: core plate is outputed by jigsaw size 520mm × 620mm.
B, internal layer circuit (negative film technique): LDI dry film stands 30min, using Full-automatic exposure machine, with 6 lattice exposure guide rules
(21 lattice exposure guide rule) completes internal layer circuit exposure, line pattern is etched after development, it is 3mil that internal layer line width, which measures,.
C, internal layer AOI: checking the defects of opening short circuit, route notch, route pin hole of internal layer, defective to scrap processing, nothing
The product of defect goes out to downstream.
D, it presses: brownification speed is selected according to plate thickness.After lamination, lamination appropriate is selected to be pressed according to plate Tg
It closes.
E, outer layer drill: using borehole data carry out drilling processing, including aperture be 200 μm, aspect ratio for 0.85 it is big
Blind hole.
(2) electroless copper plating
One layer of copper is deposited on multilayer production plate according to existing heavy process for copper, keeps the hole slot on multilayer production plate tentatively golden
Categoryization.
(3) whole plate filling perforation is electroplated
(it is equipped with the identical copper cylinder of 12 sizes, multilayer production plate at the uniform velocity passes through using existing vertical continuous filling perforation plating line
Cross each copper cylinder) plating filling perforation is carried out to multilayer production plate.The concentration for controlling copper sulphate in electroplate liquid is 180-220g/mL, electricity
A length of 110 minutes (t=9.167) when plating, current density and electroplate liquid spray frequency are by control as follows:
The current density of 0-1t minutes (when i.e. multilayer production plate passes through the 1st copper cylinder) is 2.4ASD, electroplate liquid spray frequency
Rate is 48Hz；
The current density of 1t-5t minutes (when i.e. multilayer production plate passes through the 2-5 copper cylinder) is 2.0ASD, electroplate liquid spray
Frequency is 48Hz；
The current density of 5t-6t minutes (when i.e. multilayer production plate passes through the 6th copper cylinder) is 2.4ASD, electroplate liquid spray frequency
Rate is 48Hz；
The current density of 6t-9t minutes (when i.e. multilayer production plate passes through the 7-9 copper cylinder) is 2.4ASD, electroplate liquid spray
Frequency is 45Hz,
The current density of 9t-12t minutes (when i.e. multilayer production plate passes through the 10-12 copper cylinder) is 2.2ASD, electroplate liquid
Spray frequency is 30Hz.
After completing whole plate filling perforation plating, extracts multilayer production plate and be sliced, detect filling perforation effect.Testing result shows multilayer
The filling perforation plumpness for producing big-diameter blind hole on plate is 85%.
(4) process afterwards
According to the prior art multilayer production plate on successively make outer-layer circuit, production solder mask, surface treatment, molding and
PCB finished product is made in test.
Embodiment 3
The present embodiment provides the filling perforation methods of blind hole in the production method of PCB a kind of, especially PCB.It needs on the pcb
Production aperture is 192 μm (Jie's thickness is 132 μm), the big-diameter blind hole that aspect ratio is 0.87, and the use plating by way of filling perforation is electroplated
Copper clogs big-diameter blind hole.Specific step is as follows:
(1) process before
It, will be interior successively by sawing sheet → negative film technique production internal layer circuit → pressing → outer layer drilling according to the prior art
Layer core plate and outer copper foil are fabricated to multilayer production plate, i.e., will make the core material of internal layer circuit and outer by prepreg
Layer copper foil is press-fitted together as one and completes outer layer according to borehole data and drill to form multilayer production plate；The multilayer production plate is equipped with
Big-diameter blind hole, the aperture of big-diameter blind hole are 192 μm, aspect ratio 0.87.It is specific as follows:
A, sawing sheet: core plate is outputed by jigsaw size 520mm × 620mm.
B, internal layer circuit (negative film technique): LDI dry film stands 30min, using Full-automatic exposure machine, with 6 lattice exposure guide rules
(21 lattice exposure guide rule) completes internal layer circuit exposure, line pattern is etched after development, it is 3mil that internal layer line width, which measures,.
C, internal layer AOI: checking the defects of opening short circuit, route notch, route pin hole of internal layer, defective to scrap processing, nothing
The product of defect goes out to downstream.
D, it presses: brownification speed is selected according to plate thickness.After lamination, lamination appropriate is selected to be pressed according to plate Tg
It closes.
E, outer layer drill: using borehole data carry out drilling processing, including aperture be 192 μm, aspect ratio for 0.87 it is big
Blind hole.
(2) electroless copper plating
One layer of copper is deposited on multilayer production plate according to existing heavy process for copper, keeps the hole slot on multilayer production plate tentatively golden
Categoryization.
(3) whole plate filling perforation is electroplated
(it is equipped with the identical copper cylinder of 12 sizes, multilayer production plate at the uniform velocity passes through using existing vertical continuous filling perforation plating line
Cross each copper cylinder) plating filling perforation is carried out to multilayer production plate.The concentration for controlling copper sulphate in electroplate liquid is 180-220g/mL, electricity
A length of 110 minutes (t=9.167) when plating, current density and electroplate liquid spray frequency are by control as follows:
The current density of 0-1t minutes (when i.e. multilayer production plate passes through the 1st copper cylinder) is 2.2ASD, electroplate liquid spray frequency
Rate is 48Hz,
The current density of 1t-5t minutes (when i.e. multilayer production plate passes through the 2-5 copper cylinder) is 1.8ASD, electroplate liquid spray
Frequency is 48Hz,
The current density of 5t-6t minutes (when i.e. multilayer production plate passes through the 6th copper cylinder) is 2.2ASD, electroplate liquid spray frequency
Rate is 48Hz,
The current density of 6t-9t minutes (when i.e. multilayer production plate passes through the 7-9 copper cylinder) is 2.2ASD, electroplate liquid spray
Frequency is 45Hz,
The current density of 9t-12t minutes (when i.e. multilayer production plate passes through the 10-12 copper cylinder) is 2.0ASD, electroplate liquid
Spray frequency is 30Hz.
After completing whole plate filling perforation plating, extracts multilayer production plate and be sliced, detect filling perforation effect.Testing result shows multilayer
The filling perforation plumpness for producing big-diameter blind hole on plate is 82%.
(4) process afterwards
According to the prior art multilayer production plate on successively make outer-layer circuit, production solder mask, surface treatment, molding and
PCB finished product is made in test.
It is d (150 μm of d≤225 μm <) that the method for the present invention, which can also be applied to aperture, and aspect ratio is the big of a (a >=0.8)
The filling perforation of blind hole is electroplated.
It is described above that technology contents of the invention are only further illustrated with embodiment, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this
Bright protection.
Claims (6)
1. a kind of filling perforation method of blind hole in PCB, which comprises the following steps:
S1 electroless copper plating: one layer of copper is deposited on multilayer production plate according to existing heavy process for copper, makes the hole on multilayer production plate
Slot preliminary metal；The multilayer production plate is that core material and outer copper foil are press-fitted together as one and through outer layer by prepreg
Production plate after drilling processing；It is d that multilayer production plate, which is equipped with aperture, and aspect ratio is the big-diameter blind hole of a, 150 μm of < d≤
225 μm, a >=0.8；
S2 whole plate filling perforation plating: plating filling perforation is carried out to multilayer production plate using existing vertical continuous filling perforation plating line；Plating
The concentration of copper sulphate is 180-220g/mL in liquid, and when plating is 12t minute a length of, and current density and electroplate liquid spray frequency are pressed such as
Lower control:
0-1t minutes current densities are 2.2-2.6ASD, and electroplate liquid spray frequency is 46-50Hz,
1t-5t minutes current densities are 1.8-2.2ASD, and electroplate liquid spray frequency is 46-50Hz,
5t-6t minutes current densities are 2.2-2.6ASD, and electroplate liquid spray frequency is 46-50Hz,
6t-9t minutes current densities are 2.2-2.6ASD, and electroplate liquid spray frequency is 42-48Hz,
9t-12t minutes current densities are 2.2ASD, and electroplate liquid spray frequency is 25-35Hz；
Process after S3: according to the prior art multilayer production plate on successively make outer-layer circuit, production solder mask, surface treatment,
Molding and test.
2. according to claim 1 in a kind of PCB blind hole filling perforation method, which is characterized in that plating described in step S2
Shi Changwei 110 minutes.
3. according to claim 1 in a kind of PCB blind hole filling perforation method, which is characterized in that vertically connect described in step S2
Continuous filling perforation plating line is equipped with the identical copper cylinder of 12 sizes, and multilayer production plate at the uniform velocity passes through each copper cylinder.
4. according to claim 2 in a kind of PCB blind hole filling perforation method, which is characterized in that it is big on multilayer production plate
The aperture d of blind hole is 211 μm, and aspect ratio a is 0.84, and current density and electroplate liquid spray frequency are by control as follows:
0-1t minutes current densities are 2.6ASD, and electroplate liquid spray frequency is 48Hz,
1t-5t minutes current densities are 2.0ASD, and electroplate liquid spray frequency is 48Hz,
5t-6t minutes current densities are 2.4ASD, and electroplate liquid spray frequency is 48Hz,
6t-9t minutes current densities are 2.4ASD, and electroplate liquid spray frequency is 45Hz,
9t-12t minutes current densities are 2.2ASD, and electroplate liquid spray frequency is 30Hz.
5. according to claim 2 in a kind of PCB blind hole filling perforation method, which is characterized in that it is big on multilayer production plate
The aperture d of blind hole is 200 μm, and aspect ratio a is 0.85, and current density and electroplate liquid spray frequency are by control as follows:
0-1t minutes current densities are 2.4ASD, and electroplate liquid spray frequency is 48Hz,
1t-5t minutes current densities are 2.0ASD, and electroplate liquid spray frequency is 48Hz,
5t-6t minutes current densities are 2.4ASD, and electroplate liquid spray frequency is 48Hz,
6t-9t minutes current densities are 2.4ASD, and electroplate liquid spray frequency is 45Hz,
9t-12t minutes current densities are 2.2ASD, and electroplate liquid spray frequency is 30Hz.
6. according to claim 2 in a kind of PCB blind hole filling perforation method, which is characterized in that it is big on multilayer production plate
The aperture d of blind hole is 192 μm, and aspect ratio a is 0.87, and current density and electroplate liquid spray frequency are by control as follows:
0-1t minutes current densities are 2.2ASD, and electroplate liquid spray frequency is 48Hz,
1t-5t minutes current densities are 1.8ASD, and electroplate liquid spray frequency is 48Hz,
5t-6t minutes current densities are 2.2ASD, and electroplate liquid spray frequency is 48Hz,
6t-9t minutes current densities are 2.2ASD, and electroplate liquid spray frequency is 45Hz,
9t-12t minutes current densities are 2.0ASD, and electroplate liquid spray frequency is 30Hz.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611226820.8A CN106793576B (en) | 2016-12-27 | 2016-12-27 | A kind of filling perforation method of blind hole in PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611226820.8A CN106793576B (en) | 2016-12-27 | 2016-12-27 | A kind of filling perforation method of blind hole in PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106793576A CN106793576A (en) | 2017-05-31 |
| CN106793576B true CN106793576B (en) | 2019-04-02 |
Family
ID=58922052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611226820.8A Active CN106793576B (en) | 2016-12-27 | 2016-12-27 | A kind of filling perforation method of blind hole in PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106793576B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7063101B2 (en) * | 2018-05-11 | 2022-05-09 | 住友電気工業株式会社 | Manufacturing method of printed wiring board and printed wiring board |
| CN108660489B (en) * | 2018-06-07 | 2020-04-24 | 常德力元新材料有限责任公司 | Preparation method of three-dimensional porous metal material with non-deviation aperture and physical property |
| CN109609987A (en) * | 2018-12-06 | 2019-04-12 | 广东科翔电子科技有限公司 | A kind of Blind hole fills out plating system and method |
| CN114845481B (en) * | 2022-05-12 | 2023-11-17 | 信丰超淦科技有限公司 | Direct filling VCP technology with highest yield |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080023218A1 (en) * | 2006-07-28 | 2008-01-31 | Keisuke Nishu | Electrolytic plating method |
| CN102647862A (en) * | 2012-04-25 | 2012-08-22 | 博敏电子股份有限公司 | Blind via filling plating method using different current parameter combinations |
| CN104244613A (en) * | 2014-09-11 | 2014-12-24 | 深圳崇达多层线路板有限公司 | Method for manufacturing plated-through holes in HDI plate |
| CN105696043A (en) * | 2016-03-18 | 2016-06-22 | 奥士康科技股份有限公司 | Method for achieving high aspect ratio and copper plating uniformity |
-
2016
- 2016-12-27 CN CN201611226820.8A patent/CN106793576B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080023218A1 (en) * | 2006-07-28 | 2008-01-31 | Keisuke Nishu | Electrolytic plating method |
| CN102647862A (en) * | 2012-04-25 | 2012-08-22 | 博敏电子股份有限公司 | Blind via filling plating method using different current parameter combinations |
| CN104244613A (en) * | 2014-09-11 | 2014-12-24 | 深圳崇达多层线路板有限公司 | Method for manufacturing plated-through holes in HDI plate |
| CN105696043A (en) * | 2016-03-18 | 2016-06-22 | 奥士康科技股份有限公司 | Method for achieving high aspect ratio and copper plating uniformity |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106793576A (en) | 2017-05-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106793576B (en) | A kind of filling perforation method of blind hole in PCB | |
| CN106973507B (en) | A kind of production method of filling holes with resin wiring board | |
| CN104363704B (en) | A kind of thick hole copper PCB preparation method | |
| CN104717846B (en) | The preparation method of metallization slotted eye in a kind of PCB | |
| CN106982521B (en) | A kind of copper-plated production method of high thickness to diameter ratio printed circuit board through-hole | |
| CN108260303A (en) | The production method that laser drill and back drill hole are filled out in a kind of while plating | |
| CN105263274A (en) | Manufacture method of high density interconnection board | |
| CN107027245B (en) | A kind of production method of welding resistance bridge | |
| CN104284520B (en) | A kind of PCB surface processing method | |
| CN105208790B (en) | A method of making solder mask on PCB | |
| JP2013118370A (en) | Via hole plating method and printed circuit board manufactured using the same | |
| CN108601245A (en) | A kind of electro-plating method of HDI plates high thickness to diameter ratio blind hole | |
| CN108289374A (en) | A kind of production method of filling holes with resin wiring board | |
| CN106973525A (en) | A kind of preparation method of the high multilayer backboard of N+N types | |
| CN105392288A (en) | Method for manufacturing metalized blind holes on PCB | |
| CN107708316A (en) | A kind of preparation method of superfinishing fine rule road | |
| CN108055784A (en) | A kind of production method of wiring board | |
| CN107241867B (en) | Occurs the process of plating folder film when a kind of reduction alkali etching | |
| CN108449876A (en) | A kind of production method of non-VIA-IN-PAD resin plugs orifice plate | |
| CN107231764A (en) | A kind of preparation method for the ladder wiring board for improving step platform precision | |
| CN106559963A (en) | A kind of method for plugging in PCB | |
| CN108556045A (en) | A kind of method in drill straight chamfered groove hole | |
| CN104378931A (en) | Method for manufacturing metallized counterbore in PCB | |
| CN106714453B (en) | A kind of false rigid-flex combined board and preparation method thereof | |
| CN108449883A (en) | A kind of surface treatment is the production method for the wiring board that electric nickel gold adds part electricity gold |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |