CN104768338A - PCB edge semi-hole metallization manufacturing process - Google Patents
PCB edge semi-hole metallization manufacturing process Download PDFInfo
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- CN104768338A CN104768338A CN201510207040.8A CN201510207040A CN104768338A CN 104768338 A CN104768338 A CN 104768338A CN 201510207040 A CN201510207040 A CN 201510207040A CN 104768338 A CN104768338 A CN 104768338A
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- hole
- semi
- bore
- gong
- copper
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention discloses a PCB edge semi-hole metallization manufacturing process, and relates to the technical field of PCB manufacturing. According to the technological process, firstly, a circular hole is firstly drilled in a semi-hole board normally, copper deposition and electroplating are conducted, secondary drilling is conducted after electroplating is conducted, and a proper drill bit is selected to drill the position where the drill bit and an end-mill intersect with each other so as to drill and break copper on the edge of a semi hole edge; then etching liquid medicine is utilized to remove copper scale burrs, generated in the secondary drilling process, of a semi hole; due to the fact that in the secondary drilling process, the drilling position intersects with the end-mill, and the end-mill can mill all the uneven base materials generated in the secondary drilling process when milling the semi hole. According to the PCB edge semi-hole metallization manufacturing process, the manufacturing technological process of the semi hole is improved, so that the problems that the metallization semi-hole board edge is uneven, and copper scale burrs exist on the hole edge are solved.
Description
Technical field
What the present invention relates to is pcb board manufacture technology field, is specifically related to a kind of pcb board limit half hole metallization manufacture craft.
Background technology
Existing edges of boards half bore metallizing manufacturing method, mainly normal drill, heavy copper, plating, in order to prevent the copper sheet in half bore from being pulled off before shaping, increase by one time two boring, bore the disconnected layers of copper be connected with half bore, then directly gong becomes when half bore or beer plate to go out half bore.There is following shortcoming in it: under two drills of boring, cutter position required precision is high, is easily stretched by remaining for half bore copper sheet, and cause metallized semi-pore edges of boards evenness inadequate, and there is copper scale burr on half bore plated-through hole limit, cannot meet customer requirement.
Summary of the invention
For the deficiency that prior art exists, the present invention seeks to be to provide a kind of pcb board limit half hole metallization manufacture craft, by improving the fabrication processing of half bore, solve the out-of-flatness of metallized semi-pore edges of boards, there is copper scale burr problem on limit, hole.
To achieve these goals, the present invention realizes by the following technical solutions: a kind of pcb board limit half hole metallization manufacture craft, and its technological process is: sawing sheet → boring → heavy copper → Graphic transitions → electric two bronze medals → gong half bore → move back film → etch → move back tin → AOI → anti-welding;
The concrete steps of described manufacture craft are: half-pore plate first normally gets out circular hole, heavy copper, plating, carry out secondary drilling after plating, select suitable drill bit with gong cutter intersection under bore and the copper of half bore edges bored disconnected, the copper scale burr produced when half bore two is bored by recycling etching solution is removed; Because of two, to bore lower brill places be crossing with gong cutter, and during gong half bore, gong cutter can bore the whole gong of out-of-flatness base material formed and falls milling and put down by two.
Beneficial effect of the present invention: before secondary drilling being changed into plating after etching, the lower cutter spacing of drill can be changed, avoid and the intersection out-of-flatness of gong cutter, because of secondary drilling after etching, avoid the copper scale burr on limit, hole.
Embodiment
The technological means realized for making the present invention, creation characteristic, reaching object and effect is easy to understand, below in conjunction with embodiment, setting forth the present invention further.
This embodiment is by the following technical solutions: a kind of pcb board limit half hole metallization manufacture craft, and its technological process is: sawing sheet → boring → heavy copper → Graphic transitions → electric two bronze medals → gong half bore → move back film → etch → move back tin → AOI → anti-welding;
It should be noted that, the concrete steps of described manufacture craft are: half-pore plate first normally gets out circular hole, heavy copper, plating, carry out secondary drilling after plating, select suitable drill bit with gong cutter intersection under bore and the copper of half bore edges bored disconnected, the copper scale burr produced when half bore two is bored by recycling etching solution is removed; Because of two, to bore lower brill places be crossing with gong cutter, and during gong half bore, gong cutter can bore the whole gong of out-of-flatness base material formed and falls milling and put down by two.
Present half bore Making programme, secondary drilling is when shaping, and the lower cutter position of drill requires very high, and cannot improve half bore limit has copper scale burr, gong cutter and the out-of-flatness of drill intersection.And before secondary drilling being changed into plating after etching, the lower cutter spacing of drill can be changed, avoid and the intersection out-of-flatness of gong cutter, because of secondary drilling after etching, avoid the copper scale burr on limit, hole.
This embodiment is by improving the fabrication processing of half bore, and solve the out-of-flatness of metallized semi-pore edges of boards, there is copper scale burr problem on limit, hole.Improve the production quality of half-pore plate.
More than show and describe general principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and specification just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection range is defined by appending claims and equivalent thereof.
Claims (2)
1. a pcb board limit half hole metallization manufacture craft, is characterized in that, its technological process is: sawing sheet → boring → heavy copper → Graphic transitions → electric two bronze medals → gong half bore → move back film → etch → move back tin → AOI → anti-welding.
2. a kind of pcb board limit half according to claim 1 hole metallization manufacture craft, it is characterized in that, the concrete steps of described manufacture craft are: half-pore plate first normally gets out circular hole, heavy copper, plating, carry out secondary drilling after plating, select suitable drill bit with gong cutter intersection under bore and the copper of half bore edges bored disconnected, the copper scale burr produced when half bore two is bored by recycling etching solution is removed; Because of two, to bore lower brill places be crossing with gong cutter, and during gong half bore, gong cutter can bore the whole gong of out-of-flatness base material formed and falls milling and put down by two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510207040.8A CN104768338A (en) | 2015-04-28 | 2015-04-28 | PCB edge semi-hole metallization manufacturing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510207040.8A CN104768338A (en) | 2015-04-28 | 2015-04-28 | PCB edge semi-hole metallization manufacturing process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104768338A true CN104768338A (en) | 2015-07-08 |
Family
ID=53649845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510207040.8A Pending CN104768338A (en) | 2015-04-28 | 2015-04-28 | PCB edge semi-hole metallization manufacturing process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104768338A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455333A (en) * | 2016-11-15 | 2017-02-22 | 清远市富盈电子有限公司 | Manufacturing process of PCB metal covered edge plate with gong side and copper burr improved |
| CN107396550A (en) * | 2017-08-31 | 2017-11-24 | 惠东县建祥电子科技有限公司 | A kind of hole-drilling system and method for improving the heavy copper half bore burr of pcb board |
| CN107666774A (en) * | 2017-09-30 | 2018-02-06 | 重庆凯歌电子股份有限公司 | A kind of production method of circuit board of the edge with half bore |
| CN108112173A (en) * | 2017-12-22 | 2018-06-01 | 姜鹏 | A kind of half-pore plate burr burr improves technological process |
| CN109600923A (en) * | 2018-12-17 | 2019-04-09 | 惠州市大亚湾科翔科技电路板有限公司 | A kind of high-end PCB metallization groove processing method |
| CN110290645A (en) * | 2019-05-09 | 2019-09-27 | 惠州市联达金电子有限公司 | A kind of single-row in line two bore the preparation method of half-pore plate |
| CN111050480A (en) * | 2019-12-30 | 2020-04-21 | 惠州市永隆电路有限公司 | Drilling method for preventing half-hole copper sheet from rolling up |
| CN111093325A (en) * | 2019-12-17 | 2020-05-01 | 奥士康科技股份有限公司 | Manufacturing process of PCB with half-hole |
| CN111148354A (en) * | 2019-12-30 | 2020-05-12 | 惠州市永隆电路有限公司 | Batch cutting processing method for metallized semi-hole PCB |
| CN113133193A (en) * | 2020-01-15 | 2021-07-16 | 庆鼎精密电子（淮安）有限公司 | Circuit board with metallized half-hole and manufacturing method thereof |
| CN113395839A (en) * | 2021-06-16 | 2021-09-14 | 珠海中京电子电路有限公司 | Efficient forming method for improving half-hole burrs of printed circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002124765A (en) * | 2000-10-18 | 2002-04-26 | Nec Toyama Ltd | Manufacturing method for printed wiring board |
| CN102143660A (en) * | 2010-01-28 | 2011-08-03 | 竞陆电子(昆山)有限公司 | Half-hole machining process for printed circuit board |
-
2015
- 2015-04-28 CN CN201510207040.8A patent/CN104768338A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002124765A (en) * | 2000-10-18 | 2002-04-26 | Nec Toyama Ltd | Manufacturing method for printed wiring board |
| CN102143660A (en) * | 2010-01-28 | 2011-08-03 | 竞陆电子(昆山)有限公司 | Half-hole machining process for printed circuit board |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455333A (en) * | 2016-11-15 | 2017-02-22 | 清远市富盈电子有限公司 | Manufacturing process of PCB metal covered edge plate with gong side and copper burr improved |
| CN107396550A (en) * | 2017-08-31 | 2017-11-24 | 惠东县建祥电子科技有限公司 | A kind of hole-drilling system and method for improving the heavy copper half bore burr of pcb board |
| CN107666774A (en) * | 2017-09-30 | 2018-02-06 | 重庆凯歌电子股份有限公司 | A kind of production method of circuit board of the edge with half bore |
| CN108112173A (en) * | 2017-12-22 | 2018-06-01 | 姜鹏 | A kind of half-pore plate burr burr improves technological process |
| CN109600923A (en) * | 2018-12-17 | 2019-04-09 | 惠州市大亚湾科翔科技电路板有限公司 | A kind of high-end PCB metallization groove processing method |
| CN110290645A (en) * | 2019-05-09 | 2019-09-27 | 惠州市联达金电子有限公司 | A kind of single-row in line two bore the preparation method of half-pore plate |
| CN111093325A (en) * | 2019-12-17 | 2020-05-01 | 奥士康科技股份有限公司 | Manufacturing process of PCB with half-hole |
| CN111050480A (en) * | 2019-12-30 | 2020-04-21 | 惠州市永隆电路有限公司 | Drilling method for preventing half-hole copper sheet from rolling up |
| CN111148354A (en) * | 2019-12-30 | 2020-05-12 | 惠州市永隆电路有限公司 | Batch cutting processing method for metallized semi-hole PCB |
| CN113133193A (en) * | 2020-01-15 | 2021-07-16 | 庆鼎精密电子（淮安）有限公司 | Circuit board with metallized half-hole and manufacturing method thereof |
| CN113133193B (en) * | 2020-01-15 | 2022-08-09 | 庆鼎精密电子（淮安）有限公司 | Circuit board with metallized half-hole and manufacturing method thereof |
| CN113395839A (en) * | 2021-06-16 | 2021-09-14 | 珠海中京电子电路有限公司 | Efficient forming method for improving half-hole burrs of printed circuit board |
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Application publication date: 20150708 |
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