CN105517370B - Board pads processing method - Google Patents
Board pads processing method Download PDFInfo
- Publication number
- CN105517370B CN105517370B CN201510854492.5A CN201510854492A CN105517370B CN 105517370 B CN105517370 B CN 105517370B CN 201510854492 A CN201510854492 A CN 201510854492A CN 105517370 B CN105517370 B CN 105517370B
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- China
- Prior art keywords
- trepanning
- plating
- processing method
- resin
- outer layer
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The present invention relates to a kind of board pads processing method, including step：Resin drills, and drills through trepanning on circuit boards, and the trepanning is located in welding disking area, and the periphery of the opening of the trepanning is outer layer pad；Filling holes with resin fills the trepanning using filler；Filling plating, is electroplated the recess of filler, and electroplated layer is relative to outer layer pad protrusion；Detail sanding polishes to electroplated layer, makes it concordant with outer layer pad.So make that entire pad is smooth, is not recessed；It is electroplated before detail sanding, and electroplated layer polishes to the part of protrusion, do not damage the original state of circuit board higher than outer layer pad.
Description
Technical field
The invention belongs to circuit, electronic fields, and in particular to a kind of board pads processing method.
Background technology
When needing that POFV (Plated over filled via, the hole after consent on be electroplated) technique is carried out to pcb board
When, it is high to pad (abbreviation POFV pads) flatness requirement is electroplated on the hole after consent.But traditional pcb board making side
Method is often recessed after filling holes with resin, makes the flatness of plating pad reduce, and is recessed and easily leads to loose contact, signal not
The problems such as good.Particularly in the production of ATE (abbreviation of AUTOMATIC TEST EQUIPMENT) plate, ATE plates are made
For one kind of semiconductor test board, manufacture difficulty is big, quality requirements are high.But traditional ineffective meeting of jack process consent
There is consent recess (5-25um), especially for aperture 0.15-0.25mm, radius-thickness ratio is more than 20:1 plate is more easy to occur
Recess, using high thickness to diameter ratio as row, general radius-thickness ratio is more than 20：1 consent qualification rate of plate is 90%-95% or so, is had
The recess plate needs of 5%-10% return plug and nog plate processing, and the plate that is recessed is difficult qualification of once doing over again, it will usually do over again
3-5 times etc., the nog plate that so repeats to do over again, which easily leads to base copper and is damaged dew base material, to be scrapped, plate face copper thickness lack of homogeneity, and etching is easy
Generated lose or etch it is not cleaning scrap, scrappage about 0.5%-2%.On the other hand, it does over again to scrap and means that needs again
Sawing sheet benefit, which is thrown, to be made, and entire throwing technique production process of mending is long, delays manufacturing schedule.
Invention content
Based on this, the defects of the invention reside in the prior art is overcome, a kind of board pads processing method, plating weldering are provided
Disk is not recessed and flatness is high, improves circuit board qualification rate.
Its technical solution is as follows：
A kind of board pads processing method, which is characterized in that including step：Resin drills, and drills through out on circuit boards
Hole, the trepanning are located in welding disking area, and the periphery of the opening of the trepanning is outer layer pad；Filling holes with resin is filled out using filler
Fill the trepanning；Filling plating, is electroplated the recess of filler, and electroplated layer is relative to outer layer pad protrusion；Part
Polishing, polishes to electroplated layer, makes it concordant with outer layer pad.
Board pads processing method further includes in one of the embodiments,：After filling holes with resin, fill plating
Before, dry film is pasted, and open a window on dry film with reference to the aperture position of the trepanning to circuit board, the opening of the trepanning is located at
It in windowed regions, when carrying out the filling plating, is electroplated in the windowed regions, dry film is moved back after filling plating
Film.
The radius of the windowed regions is more than the radius 0.1524mm of the trepanning extremely in one of the embodiments,
0.2032mm。
In one of the embodiments, when resin drills, make CAM file and supply drill hole of drilling machine, have in the CAM file
There are location information, the radius information of trepanning；When opening a window to the dry film, according to the size modification of windowed regions radius institute
The radius information of trepanning in CAM file is stated, is opened a window using modified CAM file.
The position of opening of recess is filtered out in one of the embodiments, changes the position of trepanning in the CAM file
Information only opens a window to the trepanning for having recess.
In one of the embodiments, during filling plating, electroplated layer protrudes 5 μm to 10 μm relative to the outer layer pad.
In one of the embodiments, in filling plating, the material of plating is copper or copper alloy.
In one of the embodiments, the resin drilling after, before the filling holes with resin, further include step：For the first time
De-smear, for the first time heavy copper, the plating of first time plate, plated hole dry film, plated hole.
In one of the embodiments, after the filling holes with resin, before the filling plating, step is further included：Resin is ground
Plate, plasma, second of de-smear, second of heavy copper, second of plate plating, makes outer layer pad figure at drilling.
In one of the embodiments, after the detail sanding, step is further included：Make outer circuit figure, figure
Plating.
The beneficial effects of the present invention are：
Trepanning is drilled through in the welding disking area of circuit board, fills the trepanning using filler, filler is relative to electricity after filling
The neighboring area of the opening of trepanning occurs what is be recessed on the plate of road, and the recess of filler is electroplated, and electroplated layer is made to be higher than outer layer
Pad, is recessed is filled at this time, and the region after plating is carried out detail sanding, makes it concordant with outer layer pad, so makes entire
Pad is smooth, is not recessed, in this way, be not just recessed on the pad of the circuit board of final molding, overall leveling, circuit board performance
It is good；It is electroplated before detail sanding, and electroplated layer is polished to the part of protrusion, do not damaged higher than outer layer pad
The original state of circuit board.
Description of the drawings
Fig. 1 is the sectional view on circuit board after resin drilling at pad in the embodiment of the present invention；
Fig. 2 is the pad structure figure with recess of conventional method manufacture；
Fig. 3 is the structure chart one on circuit board at pad in the embodiment of the present invention；
Fig. 4 is the structure chart two on circuit board at pad in the embodiment of the present invention；
Fig. 5 is the structure chart three on circuit board at pad in the embodiment of the present invention.
Reference sign：
100th, substrate, 110, trepanning, 120, recess, 200, filler, 300, conductive layer, 400, pad, 410, outer layer pad,
500th, electroplated layer.
Specific embodiment
The present invention is described in further detail below, but the implementation of the present invention is not limited to this.
As shown in Figure 1, to carry out the structure chart after resin drilling on circuit boards, resin drilling is the substrate in circuit board
Trepanning 110 is drilled through on 100.Traditional circuit board fabrication mode is that filling holes with resin, heavy is carried out on the basis of structure shown in Fig. 1
The techniques such as copper, plate plating, finally form the required layers of copper of pad, due to filling holes with resin work at the surface of substrate and trepanning 110
Skill is susceptible to recess, is recessed and cannot eliminate after finished circuit board is made, forms structure as shown in Figure 2, the appearance of substrate 100
Face has pad 400, is filled in trepanning 110 by resin, pad 400 includes the open area of trepanning 110, and pad 400 is surrounded on
The part of the open circumferential of trepanning 110 is outer layer pad 410.There is recess 120 in the position that trepanning 110 is open, be recessed 120 shadows
The flatness of pad 400 is rung, and recess 120 causes bonding area to reduce, and then lead to loose contact, poor signal, seriously
Restrict the performance of circuit board.
As shown in Fig. 3 to 5, for the present embodiment board pads processing method is used to make the step point in circuit boards
Xie Tu.After carrying out resin drilling, first time de-smear, first time heavy copper, the plating of first time plate, plated hole dry film, plated hole successively, substrate
There is conductive layer 300 on 100 surface and the inner wall of trepanning 110；Then carry out filling holes with resin, resin nog plate, drilling, etc. from
Son, second of heavy copper, second of plate plating, makes the techniques such as outer layer pad figure at second of de-smear, forms knot as shown in Figure 3
Structure；Wherein, filling holes with resin be with filler 200 (using epoxy resin in the present embodiment, but not limited to this) filling trepanning 110, and
Filler 200 is solidificated in trepanning 110, but often results in filler 200 and recess 120 occurs in the opening of trepanning 110.
On the basis of structure shown in Fig. 3, dry film is pasted to circuit board, occurs the trepanning of recess 120 on screening circuit plate
110, and open a window on dry film with reference to the position of the trepanning 110 with recess 120, the opening of trepanning 110 is located at windowing area
In domain, plating is filled in the region of windowing, other without recess 120 trepanning 110 due to not opening a window, not by shadow
It rings.Drill hole of drilling machine is supplied due in aforementioned resin drill process, making CAM file, there is the position of trepanning 110 in CAM file
Information, radius information.So in dry film windowing-process, existing CAM file can be utilized, i.e., according to appearance recess 120
The size of position, windowed regions radius where trepanning 110 is screened the trepanning 110 with recess 120 in CAM file and is changed
The radius information of these trepannings 110 in CAM file, is opened a window using modified CAM file, in this way, utilizing existing CAM
File can reduce the workload of windowing, improve efficiency.Wherein, the radius in the region of windowing is more than the radius of trepanning 110
(i.e. 6mil is extremely for 0.1524mm to 0.2032mm by 0.1524mm to 0.2032mm (i.e. 6mil to 8mil), i.e., α as shown in Figure 4
8mil).Preferably, the radius in the region of windowing be more than trepanning 110 radius can be 6mil, 6.5mil, 7mil, 7.5mil or
8mil.Filling plating when, electroplated layer 500 relative to outer layer pad 410 protrude 5 μm to 10 μm, i.e., β as shown in Figure 4 for 5 μm extremely
10μm.Preferably, electroplated layer 500 protrudes 5 μm, 6 μm, 7 μm, 8 μm, 9 μm or 10 μm relative to outer layer pad 410.Filling plating
Used plated material is copper or copper alloy, improves the performance of pad 400, dry film is carried out after plating to move back film.
On the basis of structure shown in Fig. 4, detail sanding is carried out to electroplated layer 500, makes it concordant with outer layer pad 410,
Structure as shown in Figure 5 is obtained, then in the technique for carrying out making outer circuit figure, graphic plating to circuit board.In this way, most
Just without recess 120 on the pad 400 of the circuit board of final shaping unit, pad is smooth, and circuit board performance is good；On the other hand, using this
Invention board pads production method, each pad is all smooth on circuit board, can be done over again to avoid circuit board because of pad recess,
Also it therefore avoids circuit board to scrap when doing over again so that the scrappage done over again due to pad be recessed is 0, compared with traditional consent
The scrappage of technique 0.5%-2%, greatly improves product qualification rate, has saved production cost, has improved production efficiency.
In foregoing circuit plate pad processing method, resin drilling is carried out to circuit board, first time de-smear, is sunk for the first time
After copper, the plating of first time plate, plated hole dry film, plated hole, filling holes with resin, resin nog plate, drilling, plasma, second of de-smear, second
Secondary heavy copper, second of plate plating after making the techniques such as outer layer pad figure, just carry out smooth processing to there is the trepanning of recess 120,
Circuit board other production processes are not influenced.
Each technical characteristic of above example can be combined arbitrarily, to make description succinct, not to above-described embodiment
In each technical characteristic it is all possible combination be all described, as long as however, the combination of these technical characteristics be not present lance
Shield is all considered to be the range of this specification record.
Above example only expresses the several embodiments of the present invention, and description is more specific and detailed, but can not
Therefore it is construed as limiting the scope of the patent.It should be pointed out that for those of ordinary skill in the art,
Under the premise of not departing from present inventive concept, various modifications and improvements can be made, these belong to protection scope of the present invention.
Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (9)
1. a kind of board pads processing method, which is characterized in that including step：
Resin drills, and drills through trepanning on circuit boards, the trepanning is located in welding disking area, and the periphery of the opening of the trepanning is
Outer layer pad；
Filling holes with resin fills the trepanning, and filler is solidificated in the trepanning using filler；
Filling plating, is electroplated the recess of filler, and electroplated layer is relative to outer layer pad protrusion, the filling plating
The specific steps are paste dry film to circuit board, occur the trepanning being recessed on screening circuit plate, and with reference to the trepanning with recess
Position opens a window on dry film, and the opening of trepanning is located in windowed regions, and plating is filled in the region of windowing；
Detail sanding polishes to electroplated layer, makes it concordant with outer layer pad.
2. board pads processing method according to claim 1, which is characterized in that the radius of the windowed regions is more than
The radius 0.1524mm to 0.2032mm of the trepanning.
3. board pads processing method according to claim 1, which is characterized in that when resin drills, make CAM texts
Part supplies drill hole of drilling machine, has location information, the radius information of trepanning in the CAM file；When opening a window to the dry film,
According to the radius information of trepanning in CAM file described in the size modification of windowed regions radius, carried out using modified CAM file
Windowing.
4. board pads processing method according to claim 3, which is characterized in that filter out the trepanning position of recess
It puts, changes the location information of trepanning in the CAM file, only open a window to the trepanning for having recess.
5. board pads processing method according to claim 1, which is characterized in that during filling plating, electroplated layer is opposite
5 μm to 10 μm are protruded in the outer layer pad.
6. board pads processing method according to claim 1, which is characterized in that in filling plating, the material of plating
For copper or copper alloy.
7. board pads processing method according to any one of claims 1 to 6, which is characterized in that in the resin diamond
Before Kong Hou, the filling holes with resin, step is further included：First time de-smear, for the first time heavy copper, the plating of first time plate, plated hole dry film, plating
Hole.
8. board pads processing method according to any one of claims 1 to 6, which is characterized in that in the resin plug
Before Kong Hou, the filling plating, step is further included：Resin nog plate, drilling, plasma, second of de-smear, second heavy copper,
Second of plate plating makes outer layer pad figure.
9. board pads processing method according to any one of claims 1 to 6, which is characterized in that beaten in the part
After mill, step is further included：Make outer circuit figure, graphic plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510854492.5A CN105517370B (en) | 2015-11-27 | 2015-11-27 | Board pads processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510854492.5A CN105517370B (en) | 2015-11-27 | 2015-11-27 | Board pads processing method |
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| Publication Number | Publication Date |
|---|---|
| CN105517370A CN105517370A (en) | 2016-04-20 |
| CN105517370B true CN105517370B (en) | 2018-06-22 |
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| CN201510854492.5A Active CN105517370B (en) | 2015-11-27 | 2015-11-27 | Board pads processing method |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455363A (en) * | 2016-08-09 | 2017-02-22 | 华进半导体封装先导技术研发中心有限公司 | Printed circuit board manufacturing method and printed circuit board |
| CN107278036A (en) * | 2017-08-07 | 2017-10-20 | 四川九立微波有限公司 | A kind of processing method of the circuit board of numerical-control attenuator QFN packaging ground pads |
| CN107567200B (en) * | 2017-09-22 | 2019-09-06 | 广州兴森快捷电路科技有限公司 | Board pads restorative procedure |
| CN109673112B (en) * | 2017-10-13 | 2021-08-20 | 鹏鼎控股(深圳)股份有限公司 | Flexible circuit board and manufacturing method thereof |
| CN107949174A (en) * | 2017-12-04 | 2018-04-20 | 广州兴森快捷电路科技有限公司 | The production method for burying copper billet circuit board |
| CN108235579B (en) * | 2018-01-08 | 2020-04-24 | 昆山首源电子科技有限公司 | 5G communication high-frequency signal board sliding resistance performance improving process |
| CN108882507A (en) * | 2018-08-03 | 2018-11-23 | 江苏普诺威电子股份有限公司 | Thick copper heat dissipation PCB processing technology |
| CN110785017B (en) * | 2019-11-08 | 2021-06-25 | 深南电路股份有限公司 | Method for preparing printed circuit board |
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| CN103391681A (en) * | 2013-08-06 | 2013-11-13 | 上海美维电子有限公司 | Printed circuit board and manufacturing method thereof |
| CN103813655A (en) * | 2012-11-09 | 2014-05-21 | 镇江华扬信息科技有限公司 | Manufacturing method for improving reliability of printed circuit board (PCB) including bonding pad structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0688195B2 (en) * | 1988-10-31 | 1994-11-09 | ソマール株式会社 | Resin polishing method |
| JPH0645734A (en) * | 1991-03-27 | 1994-02-18 | Nec Corp | Printed-wiring board and manufacturing method thereof |
| JP3674662B2 (en) * | 1998-04-30 | 2005-07-20 | 日本特殊陶業株式会社 | Wiring board manufacturing method |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103813655A (en) * | 2012-11-09 | 2014-05-21 | 镇江华扬信息科技有限公司 | Manufacturing method for improving reliability of printed circuit board (PCB) including bonding pad structure |
| CN103391681A (en) * | 2013-08-06 | 2013-11-13 | 上海美维电子有限公司 | Printed circuit board and manufacturing method thereof |
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