CN104602464A - Manufacturing method of copper-cladded ladder hole of circuit board ladder surface and application of manufacturing method - Google Patents
Manufacturing method of copper-cladded ladder hole of circuit board ladder surface and application of manufacturing method Download PDFInfo
- Publication number
- CN104602464A CN104602464A CN201510037191.3A CN201510037191A CN104602464A CN 104602464 A CN104602464 A CN 104602464A CN 201510037191 A CN201510037191 A CN 201510037191A CN 104602464 A CN104602464 A CN 104602464A
- Authority
- CN
- China
- Prior art keywords
- copper
- hole
- central layer
- covers
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention discloses a manufacturing method of a copper-cladded ladder hole of a ladder surface and application of the manufacturing method and belongs to the field of production and manufacturing of a circuit board. The manufacturing method of the copper-cladded ladder hole of the circuit board ladder surface comprises the following steps: before manufacturing an outer-layer circuit, sealing the ladder hole in the circuit board; and after finishing the outer-layer circuit, opening a core plate and leaking the ladder hole. The phenomenon that an etching solution is filled into the ladder hole when the outer-layer circuit is produced by a post-procedure is avoided and the problem that copper of a ladder position is corroded by the etching solution is solved.
Description
Technical field
The invention belongs to wiring board and manufacture field, particularly relate to a kind of wiring board cascaded surface and cover the manufacture method of the shoulder hole of copper and the wiring board of application thereof.
Background technology
Along with the development of wiring board manufacturing technology, the wiring board containing shoulder hole gets more and more.For the wiring board containing shoulder hole, traditional manufacture method is: first by wiring board and prepreg pressing, and then directly gong goes out step, then plates conducting metal in shoulder hole.Although technique is simple, in the process of gong step, the bad control of the degree of depth of step, and also can all adhere to upper conducting metal in its shoulder hole during plating, the outer graphics making of rear operation can cause corrosion to conducting metal in shoulder hole.
Summary of the invention
For solving the problem, the invention provides a kind of wiring board cascaded surface and cover the manufacture method of the shoulder hole of copper and the wiring board of application thereof, concrete scheme is as follows:
Wiring board cascaded surface covers a manufacture method for the shoulder hole of copper, and described manufacture method comprises the following steps successively:
S1: the first central layer covering copper at one side gets out the first through hole;
S2: complete circuit in the one side of the second central layer of double-sided copper-clad and make, covers the circuit surface that copper face and the second central layer make and is pressed into pressing central layer by a PP sheet by the first central layer non-; A described PP sheet is provided with the first window of corresponding first through hole;
S3: by the first heavy copper coin plating of pressing central layer, then copper plate and tin layers successively in the first through hole;
S4: make the first central layer on pressing central layer and cover copper face line pattern, then strip tin layers in the first through hole;
S5: the non-copper face gong that covers covering the 3rd central layer of copper at one side goes out cannelure, and cannelure is corresponding with the position of the first through hole on the first central layer;
S6: the non-copper face that covers of the line pattern face of the first central layer in pressing central layer and the 3rd central layer is pressed into wiring board by the 2nd PP sheet; The 2nd described PP sheet is provided with the Second Window of corresponding cannelure; After pressing, the first through hole, cannelure are positioned at the inside of wiring board;
S7: the region gong covering the corresponding cannelure of copper face at the 3rd central layer goes out the second through hole, exposes the first through hole, forms shoulder hole;
S8: blasting treatment is carried out to layers of copper surface in shoulder hole, then microetch is carried out to layers of copper surface, more heavy nickel, gold successively.
Preferably, the aperture of the second described through hole is greater than the aperture of the first through hole.
Preferably, a described PP sheet and the fluidity of the 2nd PP sheet are less than 0.06mm; First window 0.2mm larger than the aperture of the first through hole on a described PP sheet; Second Window 0.2mm larger than the aperture of the second through hole on described 2nd PP sheet.
Further, in described step S3, it is thick in 2-4 μm that pressing central layer sinks the copper of copper coin plating; In first through hole, the technological process of copper plate and tin layers comprises subsides dry film, exposure imaging, pattern plating copper, graphic plating tin successively, moves back dry film, described dry film has the fenestra of corresponding first through hole, the aperture 0.150mm less of the aperture of the first through hole of fenestra; In the first described through hole successively after copper plate and tin layers, copper layer thickness is 20-30 μm, and tin thickness is 5-8 μm.
Further, in described step S4, make technological process that the first central layer on pressing central layer covers copper face line pattern to comprise successively and paste dry film, exposure imaging, etch, move back dry film, described dry film is provided with the dry film cap bore of corresponding first through hole, the little 0.2mm in aperture after the aperture of dry film cap bore is more zinc-plated than the first through hole.
Further, in described step S5, annular groove depth is 0.4 ± 0.05mm, and width is 1.0 ± 0.05mm.
Further, in described step S8, when in shoulder hole, blasting treatment is carried out on layers of copper surface, hydrops in shoulder hole and reduce cleaning effect, by shoulder hole blasting treatment down when putting plate.
Further, in described step S8, the thickness of described microetch is 1.5-2.0 μm; The thickness of heavy nickel is 5-8 μm; The thickness of turmeric is 0.025-0.076 μm.
Cascaded surface covers a shoulder hole wiring board for copper, and described wiring board covers the shoulder hole of copper with the cascaded surface that above-mentioned manufacture method makes.
Wiring board cascaded surface of the present invention covers the manufacture method of the shoulder hole of copper, before the 3rd central layer pressing, the second through hole gong on the 3rd central layer is not opened, when can avoid that operation is produced thereafter, etching solution pours in shoulder hole, thus solves the problem that the copper of etching solution to ladder position causes corrosion.
In first through hole before copper plate and tin layers, only thinner one deck copper is plated by first heavy copper coin plating, graphic plating first through hole again, by the making of repeatedly dry film, achieve a plated hole and do not plate surface copper, reach the object of the thick uniformity of control surface copper, ensure that the consistency that in thick and the first through hole of circuit copper, copper is thick, solve the problem because of the thick inconsistent Signal transmissions exception caused of copper; In addition, utilize dry film and tin layers jointly as resist layer (being tin resist layer in shoulder hole), solve the cap bore problem of the macropore that dry film cannot realize.
3rd central layer is before pressing, and at the pre-gong cannelure of stitching surface, a gong one circumference, can ensure the rigidity of the second through hole position central layer to greatest extent, avoids this position to occur caving in rear processing procedure and causes the problem of dry film epiphragma not labor; Meanwhile, when cannelure can be used for pressing, hold the PP glue that the 2nd PP sheet pressing is overflowed, avoid the central layer region of corresponding second through hole of PP glue bond overflowed, cannot take out after causing the central layer region gong of corresponding second through hole complete.
Accompanying drawing explanation
Fig. 1 is the structure chart that embodiment of the present invention cascaded surface covers the shoulder hole wiring board of copper;
Fig. 2 is the structure chart that the embodiment of the present invention first central layer gets out the first through hole;
Fig. 3 is the pressing core plate structure figure after the embodiment of the present invention first central layer and the second central layer pressing;
Fig. 4 is that the first central layer line pattern of embodiment of the present invention pressing central layer makes, the first through hole moves back the structure chart after tin;
Fig. 5 is the structure chart after the embodiment of the present invention the 3rd central layer gong cannelure;
Fig. 6 is the structure chart after the embodiment of the present invention the 3rd central layer and the pressing of pressing central layer.
Embodiment
In order to more fully understand technology contents of the present invention, below in conjunction with specific embodiment technical scheme of the present invention being introduced further and illustrating.
Embodiment
Cascaded surface as shown in Figure 1 covers the shoulder hole wiring board of copper, comprises the first central layer 1, second central layer 2, the 3rd central layer 3, a PP sheet 4, the 2nd PP sheet 5; Wiring board is provided with shoulder hole 6.The line layer of this wiring board is false 6 layers, internal layer live width spacing: min 8/8miL, outer live width spacing: min8/8miL, plate Tg:150 DEG C, external copper layer thickness 1OZ.First central layer 1, second central layer 2, the 3rd central layer 3 thickness are 2.0mm; The fluidity of the one PP sheet and the 2nd PP sheet is less than 0.06mm.
The manufacture method that cascaded surface covers the shoulder hole wiring board of copper comprises the following steps successively:
Output the first central layer 1, second central layer 2, the 3rd central layer 3 substrate; Use same borehole data get out three central layers peripheral positioning holes and by a PP sheet 4 of laminated construction design, the peripheral positioning holes of the 2nd PP sheet 5.The first window on a PP sheet 4 is gone out, the Second Window on the 2nd PP sheet 5 with the peripheral positioning holes gong got out; First window on the PP sheet 4 got out 0.2mm larger than the aperture of design first through hole, the 0.2mm larger than the aperture of the second through hole of the Second Window on the 2nd PP sheet 5.
The one side layers of copper of the first central layer 1 of double-sided copper-clad is etched away, the first central layer gets out the first through hole 11, as shown in Figure 2.
Complete circuit in the one side of the second central layer 2 of double-sided copper-clad to make, become the second central layer circuit surface 21, the etching face of the first core 1 and the second central layer circuit surface 21 are pressed into pressing central layer by a PP sheet 4, and as shown in Figure 3, the first window on a PP sheet 4 is corresponding with the first through hole 11.
It is 2-4 μm that the copper coin that sunk by pressing central layer is plating to copper thick; Then through pasting dry film, exposure imaging, pattern plating copper, graphic plating tin, moving back dry film process, make copper layer thickness in the first through hole 11 be 20-30 μm, tin thickness is 5-8 μm.It should be noted that the aperture 0.150mm less of the aperture of the first through hole 11 of the fenestra of corresponding first through hole 11 of dry film.
Then the first central layer is covered copper face 12 by subsides dry film, exposure imaging, etch, move back dry film process and make line pattern, it should be noted that the aperture of the dry film cap bore need guaranteeing corresponding first through hole 11 of dry film more zinc-plated than the first through hole 11 after the little 0.2mm in aperture.Then the tin layers of the first through hole 11 is stripped, as shown in Figure 4.
The one side of the 3rd central layer 3 is etched away layers of copper, goes out cannelure 32 (gong one week) at the gong etching away layers of copper, as shown in Figure 5.The external diameter of cannelure 32 and the external diameter of required second through hole just as, the degree of depth is 0.4 ± 0.05mm, and width is 1.0 ± 0.05mm, and the diameter of cannelure 32 is greater than the aperture of the first through hole 11.
The etching face first central layer in pressing central layer being covered copper face 12 and the 3rd central layer 3 is pressed into wiring board by the 2nd PP sheet 5,2nd PP sheet 5 is provided with the Second Window of corresponding cannelure 32, after pressing, the inside first logical 11, cannelure 32 is positioned at wiring board, the position of cannelure 32, Second Window, the first through hole 11 is corresponding, as shown in Figure 6.
Make other outer layer metal holes on wiring board, then make outer second central layer and cover the line pattern that copper face 22 and the 3rd central layer 3 cover copper face 31, after moving back film, welding resistance makes.
After completing welding resistance making, go out the second through hole at the region gong of the corresponding cannelure 32 of the 3rd central layer 3 of wiring board, expose the first through hole, form shoulder hole 6.
By the shoulder hole of wiring board down, layers of copper surface in blasting treatment shoulder hole, then microetch layers of copper surface 1.5-2.0 μm, more heavy nickel 5-8 μm, turmeric 0.025-0.076 μm, obtain the shoulder hole wiring board that cascaded surface covers copper.
The above only further illustrates technology contents of the present invention with embodiment, so that reader is easier to understand, but does not represent embodiments of the present invention and is only limitted to this, and any technology done according to the present invention extends or recreation, all by protection of the present invention.
Claims (10)
1. wiring board cascaded surface covers a manufacture method for the shoulder hole of copper, it is characterized in that, described manufacture method comprises the following steps successively:
S1: the first central layer covering copper at one side gets out the first through hole;
S2: complete circuit in the one side of the second central layer of double-sided copper-clad and make, covers the circuit surface that copper face and the second central layer make and is pressed into pressing central layer by a PP sheet by the first central layer non-; A described PP sheet is provided with the first window of corresponding first through hole;
S3: by the first heavy copper coin plating of pressing central layer, then copper plate and tin layers successively in the first through hole;
S4: make the first central layer on pressing central layer and cover copper face line pattern, then strip tin layers in the first through hole;
S5: the non-copper face gong that covers covering the 3rd central layer of copper at one side goes out cannelure, and cannelure is corresponding with the position of the first through hole on the first central layer;
S6: the non-copper face that covers of the line pattern face of the first central layer in pressing central layer and the 3rd central layer is pressed into wiring board by the 2nd PP sheet; The 2nd described PP sheet is provided with the Second Window of corresponding cannelure; After pressing, the first through hole, cannelure are positioned at the inside of wiring board;
S7: the region gong covering the corresponding cannelure of copper face at the 3rd central layer goes out the second through hole, exposes the first through hole, forms shoulder hole.
2. wiring board cascaded surface according to claim 1 covers the manufacture method of the shoulder hole of copper, it is characterized in that, the aperture of the second described through hole is greater than the aperture of the first through hole.
3. wiring board cascaded surface according to claim 1 covers the manufacture method of the shoulder hole of copper, it is characterized in that, a described PP sheet and the fluidity of the 2nd PP sheet are less than 0.06mm; First window 0.2mm larger than the aperture of the first through hole on a described PP sheet; Second Window 0.2mm larger than the aperture of the second through hole on described 2nd PP sheet.
4. wiring board cascaded surface according to claim 1 covers the manufacture method of the shoulder hole of copper, it is characterized in that, in described step S3, it is thick in 2-4 μm that pressing central layer sinks the copper of copper coin plating; In the first described through hole successively after copper plate and tin layers, copper layer thickness is 20-30 μm, and tin thickness is 5-8 μm.
5. wiring board cascaded surface according to claim 1 covers the manufacture method of the shoulder hole of copper, it is characterized in that, in described step S4, make technological process that the first central layer on pressing central layer covers copper face line pattern to comprise successively and paste dry film, exposure imaging, etch, move back film, described dry film is provided with the dry film cap bore of corresponding first through hole, the little 0.2mm in aperture after the aperture of dry film cap bore is more zinc-plated than the first through hole.
6. wiring board cascaded surface according to claim 1 covers the manufacture method of the shoulder hole of copper, it is characterized in that, in described step S5, annular groove depth is 0.4 ± 0.05mm, and width is 1.0 ± 0.05mm.
7. wiring board cascaded surface according to claim 1 covers the manufacture method of the shoulder hole of copper, it is characterized in that, after described step S7, also comprise step S8: blasting treatment is carried out to layers of copper surface in shoulder hole, then microetch is carried out to layers of copper surface, more heavy nickel, gold successively.
8. wiring board cascaded surface according to claim 7 covers the manufacture method of the shoulder hole of copper, it is characterized in that, in described step S8, when in shoulder hole, blasting treatment is carried out on layers of copper surface, by shoulder hole blasting treatment down when putting plate.
9. wiring board cascaded surface according to claim 7 covers the manufacture method of the shoulder hole of copper, it is characterized in that, in described step S8, the thickness of described microetch is 1.5-2.0 μm; The thickness of heavy nickel is 5-8 μm; The thickness of turmeric is 0.025-0.076 μm.
10. cascaded surface covers a shoulder hole wiring board for copper, it is characterized in that, described wiring board covers the shoulder hole of copper with the cascaded surface that manufacture method makes as claimed in claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510037191.3A CN104602464B (en) | 2015-01-23 | 2015-01-23 | A kind of wiring board cascaded surface covers preparation method and its application of the shoulder hole of copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510037191.3A CN104602464B (en) | 2015-01-23 | 2015-01-23 | A kind of wiring board cascaded surface covers preparation method and its application of the shoulder hole of copper |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104602464A true CN104602464A (en) | 2015-05-06 |
| CN104602464B CN104602464B (en) | 2018-03-13 |
Family
ID=53127839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510037191.3A Active CN104602464B (en) | 2015-01-23 | 2015-01-23 | A kind of wiring board cascaded surface covers preparation method and its application of the shoulder hole of copper |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104602464B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105657979A (en) * | 2016-04-01 | 2016-06-08 | 浪潮电子信息产业股份有限公司 | PCB (printed circuit board) and method for manufacturing same |
| CN107222972A (en) * | 2017-06-14 | 2017-09-29 | 鹤山市中富兴业电路有限公司 | A kind of PCB construction and its manufacture craft for being embedded with passive device |
| CN108161253A (en) * | 2017-11-13 | 2018-06-15 | 上海申和热磁电子有限公司 | A kind of method of trepanning on double-sided copper-clad ceramic substrate single side copper foil |
| CN108260302A (en) * | 2016-12-28 | 2018-07-06 | 中国科学院苏州纳米技术与纳米仿生研究所 | Multi-layer flexible circuit board and preparation method thereof |
| WO2018130229A1 (en) * | 2017-01-16 | 2018-07-19 | 中兴通讯股份有限公司 | Printed circuit board and method for preparing same |
| CN109168249A (en) * | 2018-10-16 | 2019-01-08 | Oppo（重庆）智能科技有限公司 | A kind of circuit board and preparation method thereof |
| CN112040674A (en) * | 2020-07-07 | 2020-12-04 | 广德三生科技有限公司 | Stepped blind slot mixed-compression high-frequency microwave printed circuit board and processing method thereof |
| CN114286507A (en) * | 2022-01-19 | 2022-04-05 | 瑞华高科技电子工业园(厦门)有限公司 | Double-sided FPC and manufacturing method thereof |
| CN116207050A (en) * | 2023-05-05 | 2023-06-02 | 成都恪赛科技有限公司 | Phased array TR chip packaging structure |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08130376A (en) * | 1994-10-31 | 1996-05-21 | Matsushita Electric Works Ltd | Manufacture of multilayer printed wiring board |
| CN101697660A (en) * | 2009-10-28 | 2010-04-21 | 深南电路有限公司 | Method for processing stepped groove bottom patterned circuit board |
| CN102438413A (en) * | 2011-10-17 | 2012-05-02 | 广州杰赛科技股份有限公司 | Second-order ladder groove bottom graphical printed board and processing method thereof |
| CN103313515A (en) * | 2012-03-15 | 2013-09-18 | 北大方正集团有限公司 | Manufacturing method of printed circuit board stepped slot and printed circuit board comprising stepped slot |
| CN103929884A (en) * | 2013-01-16 | 2014-07-16 | 深圳市牧泰莱电路技术有限公司 | Method for manufacturing printed circuit board with step slotted hole |
-
2015
- 2015-01-23 CN CN201510037191.3A patent/CN104602464B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08130376A (en) * | 1994-10-31 | 1996-05-21 | Matsushita Electric Works Ltd | Manufacture of multilayer printed wiring board |
| CN101697660A (en) * | 2009-10-28 | 2010-04-21 | 深南电路有限公司 | Method for processing stepped groove bottom patterned circuit board |
| CN102438413A (en) * | 2011-10-17 | 2012-05-02 | 广州杰赛科技股份有限公司 | Second-order ladder groove bottom graphical printed board and processing method thereof |
| CN103313515A (en) * | 2012-03-15 | 2013-09-18 | 北大方正集团有限公司 | Manufacturing method of printed circuit board stepped slot and printed circuit board comprising stepped slot |
| CN103929884A (en) * | 2013-01-16 | 2014-07-16 | 深圳市牧泰莱电路技术有限公司 | Method for manufacturing printed circuit board with step slotted hole |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105657979A (en) * | 2016-04-01 | 2016-06-08 | 浪潮电子信息产业股份有限公司 | PCB (printed circuit board) and method for manufacturing same |
| CN108260302A (en) * | 2016-12-28 | 2018-07-06 | 中国科学院苏州纳米技术与纳米仿生研究所 | Multi-layer flexible circuit board and preparation method thereof |
| WO2018130229A1 (en) * | 2017-01-16 | 2018-07-19 | 中兴通讯股份有限公司 | Printed circuit board and method for preparing same |
| CN107222972A (en) * | 2017-06-14 | 2017-09-29 | 鹤山市中富兴业电路有限公司 | A kind of PCB construction and its manufacture craft for being embedded with passive device |
| CN108161253A (en) * | 2017-11-13 | 2018-06-15 | 上海申和热磁电子有限公司 | A kind of method of trepanning on double-sided copper-clad ceramic substrate single side copper foil |
| CN108161253B (en) * | 2017-11-13 | 2019-10-15 | 上海申和热磁电子有限公司 | A kind of method of aperture on double-sided copper-clad ceramic substrate single side copper foil |
| CN109168249A (en) * | 2018-10-16 | 2019-01-08 | Oppo（重庆）智能科技有限公司 | A kind of circuit board and preparation method thereof |
| CN112040674A (en) * | 2020-07-07 | 2020-12-04 | 广德三生科技有限公司 | Stepped blind slot mixed-compression high-frequency microwave printed circuit board and processing method thereof |
| CN114286507A (en) * | 2022-01-19 | 2022-04-05 | 瑞华高科技电子工业园(厦门)有限公司 | Double-sided FPC and manufacturing method thereof |
| CN114286507B (en) * | 2022-01-19 | 2024-03-29 | 瑞华高科技电子工业园(厦门)有限公司 | Double-sided FPC and manufacturing method thereof |
| CN116207050A (en) * | 2023-05-05 | 2023-06-02 | 成都恪赛科技有限公司 | Phased array TR chip packaging structure |
| CN116207050B (en) * | 2023-05-05 | 2023-07-07 | 成都恪赛科技有限公司 | Phased array TR chip packaging structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104602464B (en) | 2018-03-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104602464A (en) | Manufacturing method of copper-cladded ladder hole of circuit board ladder surface and application of manufacturing method | |
| CN103298267B (en) | The method for manufacturing circuit board of the thick gold surface process of parcel plating | |
| CN106231816A (en) | A kind of manufacture method of golden fingerboard without lead wire | |
| CN105357892B (en) | Printed wiring board and preparation method thereof | |
| WO2015085933A1 (en) | Method for manufacturing leadless printed circuit board locally plated with hard gold | |
| CN105228359B (en) | Printed wiring board and preparation method thereof | |
| CN102821553B (en) | Method for manufacturing key position partial electro-gold-plated PCB (printed circuit board) | |
| CN105338754A (en) | Production method of local-thick copper PCB | |
| CN103985647B (en) | Method for preparing copper pillar bump | |
| TWI615071B (en) | A method for manufacturing a package substrate and a package substrate using this method | |
| CN102364999A (en) | Manufacturing method of mechanical conduction hole circuit board without holes on surface | |
| CN105682348A (en) | Fabrication method for printed circuit board (PCB) with gold finger of which three surfaces coated with gold | |
| CN104244616A (en) | Manufacturing method for thin coreless substrate | |
| CN104349587A (en) | Method for manufacturing printed circuit board and via thereof, and printed circuit board | |
| CN102638945A (en) | Method for producing goldfinger via twice electroplating | |
| CN105282983A (en) | Lead wire etching technology with gold fingers with three surfaces wrapped by gold | |
| CN105704946A (en) | Fabrication method for printed circuit board with golden finger coated with gold on four surfaces | |
| CN104378931A (en) | Method for manufacturing metallized counterbore in PCB | |
| CN111787708A (en) | Manufacturing method of high-low copper PAD circuit board | |
| CN107708335A (en) | A kind of circuit manufacturing method of multi-layer PCB board | |
| CN105722299A (en) | Interposer substrate and method of fabricating same | |
| CN105530768A (en) | Circuit board manufacturing method and circuit board | |
| CN105992458B (en) | Micro-aperture conductive through hole structure of flexible circuit board and manufacturing method thereof | |
| CN105489504B (en) | A kind of production method of package substrate | |
| CN203523145U (en) | Pcb |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |