CN105489504B - A kind of production method of package substrate - Google Patents
A kind of production method of package substrate Download PDFInfo
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- CN105489504B CN105489504B CN201410478859.3A CN201410478859A CN105489504B CN 105489504 B CN105489504 B CN 105489504B CN 201410478859 A CN201410478859 A CN 201410478859A CN 105489504 B CN105489504 B CN 105489504B
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- package substrate
- etchant resist
- metal layer
- plating
- region
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Abstract
The invention discloses a kind of production method of package substrate, the method includes：The outer graphics of package substrate are produced, the outer graphics include at least the first figure, second graph, and the isolation recesses between first figure and the second graph；It metallizes to the package substrate whole plate so that the surface of the package substrate forms metal layer；Etchant resist is set on the package substrate, and the etchant resist covers the region other than the routing region of first figure and the second graph；The metal layer in the routing region is removed, and in the routing region nickel plating layer gold；In the surface plating of the nickel-gold layer；Remove the etchant resist and the metal layer；Solder mask is set on the package substrate, then removes the protective layer, completes the making of the package substrate.The embodiment of the present invention generates Jafani effect in the prior art for solving the problems, such as.
Description
Technical field
The present invention relates to circuit board technology fields, and in particular to a kind of production method of package substrate.
Background technology
As electronic product constantly develops towards the direction of miniaturization, slimming, multifunction, thus it requires integrated circuit
Encapsulation also develops towards slimming, high density direction, as the carrier of integrated antenna package, the wiring line density of package substrate
It is continuously improved.
Many integrated antenna packages use wire bonding technique at present, it is desirable that substrate routing finger uses electronickelling gold surface
Processing, due to the raising of wiring density, individually designed electric gold wire is removed in no space to many substrates, it is therefore desirable to use nothing
Lead electricity gold process, no lead electricity gold process are typically the electronickelling gold processing that routing finger is carried out before welding resistance.
In the research and practice process to the prior art, it was found by the inventors of the present invention that the above manufacture craft have it is following
Defect：
Before subsequently removal metal copper layer and welding resistance in super coarsening process, it is easy to generate copper wire in some acid solutions
By fast erosion, that is, Jafani effect, the metal that Jafani effect specifically refers to two kinds of Different electrodes current potentials exists together one
When in acidic electrolyte solution, due to the reason of potential difference, electrode potential is high to capture electronics from the low metal of current potential, to
The dissolving metal for keeping current potential low in an acidic solution, and then makes the low metal of current potential generate fast erosion.
Invention content
The embodiment of the present invention provides a kind of production method of package substrate, and Jia Fanni effects are generated in the prior art for solving
The problem of answering.
First aspect present invention provides a kind of production method of package substrate, including：Produce the outer layer figure of package substrate
Shape, the outer graphics include at least the first figure, second graph, and between first figure and the second graph it
Between isolation recesses；It metallizes to the package substrate whole plate so that the surface of the package substrate forms metal layer；Institute
It states and etchant resist is set on package substrate, the etchant resist covers other than the routing region of first figure and the second graph
Region；The metal layer in the routing region is removed, and in the routing region nickel plating layer gold；In the nickel-gold layer
Surface plating；Remove the etchant resist and the metal layer；Solder mask is set on the package substrate, then removes institute
Protective layer is stated, the making of the package substrate is completed.
Therefore the embodiment of the present invention is using producing the outer graphics of package substrate, outer graphics include at least the
One figure, second graph, and the isolation recesses between the first figure and second graph；To package substrate whole plate metal
Change so that the surface of package substrate forms metal layer；Etchant resist is set on package substrate, etchant resist cover the first figure and
Region other than the routing region of second graph；The metal layer in routing region is removed, and in routing region nickel plating layer gold；In nickel
The surface plating of layer gold；Remove etchant resist and metal layer；Solder mask is set on package substrate, then removes protective layer,
The technical solution for completing the making of package substrate, achieves following technique effect：Due to after routing region nickel plating layer gold not
Have and directly carries out welding resistance, but in the further plating in the surface of nickel-gold layer, to achieve the purpose that protect metal layer,
That is the junction of nickel-gold layer and metal layer is not in chemical reaction, rotten into the copper wire without causing to be covered by nickel gold
Erosion, prevents the generation of Jafani effect, after solder mask is arranged on package substrate, then removes the protective layer, completes encapsulation base
The making of plate solves the problems, such as to generate Jafani effect in the prior art.
Description of the drawings
Technical solution in order to illustrate the embodiments of the present invention more clearly, below will be to institute in embodiment and description of the prior art
Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the present invention
Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 is one embodiment schematic diagram of the production method of package substrate in the embodiment of the present invention；
Fig. 2 is the sectional view that outer graphics are made in the embodiment of the present invention；
Fig. 3 is the sectional view to metallize to package substrate in the embodiment of the present invention；
Fig. 4 is the sectional view that etchant resist is arranged in the embodiment of the present invention；
Fig. 5 is a sectional view of nickel plating layer gold in the embodiment of the present invention；
Fig. 6 is another sectional view that etchant resist is arranged in the embodiment of the present invention；
Fig. 7 is the sectional view that conductive layer is plated in the embodiment of the present invention；
Fig. 8 is that a sectional view after etchant resist is removed in the embodiment of the present invention；
Fig. 9 is that a sectional view after metal layer is removed in the embodiment of the present invention；
Figure 10 is the sectional view that solder mask is arranged in the embodiment of the present invention.
Specific implementation mode
The embodiment of the present invention provides a kind of production method of package substrate, and Jia Fanni effects are generated in the prior art for solving
The problem of answering.
In order to enable those skilled in the art to better understand the solution of the present invention, below in conjunction in the embodiment of the present invention
Attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is only
The embodiment of a part of the invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill people
The every other embodiment that member is obtained without making creative work should all belong to the model that the present invention protects
It encloses.
Below by specific embodiment, it is described in detail respectively.
Embodiment one,
Referring to FIG. 1, the embodiment of the present invention provides a kind of production method of package substrate, it may include：
101, the outer graphics of package substrate are produced, outer graphics include at least the first figure, second graph, Yi Jijie
Isolation recesses between the first figure and second graph；
Referring to FIG. 2, producing the outer graphics of package substrate, which is attached on base material 100, the outer layer figure
Shape includes at least the first figure 110, second graph 111, and the insulation between the first figure 110 and second graph 111
Groove 112.
It should be noted that the base material can tie up the base material formed by resin glass fiber, it is not specifically limited herein.
102, it metallizes to package substrate whole plate so that the surface of package substrate forms metal layer；
Referring to FIG. 3, after producing the outer graphics of package substrate, metallize to package substrate whole plate so that encapsulation
The surface of substrate forms metal layer 120.
Optionally, it metallizes to package substrate whole plate so that the surface of package substrate forms metal layer 120 and includes：
It is metallized to package substrate whole plate using the method for electroless plating or physical sputtering so that the surface of package substrate
Metal layer 120 is formed, the thickness of metal layer 120 is between 0.2um~1um.
103, etchant resist is set on package substrate, etchant resist covers other than the routing region of the first figure and second graph
Region；
Referring to FIG. 4, after metallizing to package substrate whole plate, etchant resist 130, etchant resist are set on package substrate
Region other than the routing region 113 of 130 the first figures 110 of covering and second graph 111.
Optionally, etchant resist 130 is set on package substrate, and etchant resist 130 covers the first figure 110 and second graph
Region other than 111 routing region 113 includes：
Etchant resist 130 is pasted to package substrate, and pattern transfer is carried out by exposure imaging so that the covering of etchant resist 130 the
Region other than the routing region 113 of one figure 110 and second graph 111.
104, the metal layer in removal routing region, and in routing region nickel plating layer gold；
Referring to FIG. 5, be arranged after etchant resist 130 on package substrate, the metal layer 120 in removal routing region 113,
And in 113 nickel plating layer gold 140 of routing region.
Optionally, include after the metal layer 120 in removal routing region 113：
Remove etchant resist 130；
Referring to Fig. 6, etchant resist 130 is arranged on package substrate again, etchant resist 130 covers the first figure 110 and the
Region other than the routing region 113 of two figures 111.
Optionally, removal etchant resist 130 includes：
Etchant resist 130 is removed using sodium hydroxide solution.
105, in the surface plating of nickel-gold layer；
7 are please referred to, after 113 nickel plating layer gold 140 of routing region, in the surface plating 150 of nickel-gold layer 140.
Optionally, include in the surface plating 150 of plating nickel gold 140：
It is higher than copper in the surface plated with copper or chemism of plating nickel gold 140 by the method that either physical sputtering plating is electroplated
Metal.
It should be noted that the activity metal higher than copper can be tin, it can also be iron, be not specifically limited herein.
It is understood that when the protective layer is coat of metal, due to the coat of metal chemical activity not
Less than copper, so that when routing region is in acid solution, the coat of metal can be dissolved first, to protect copper wire
Road.
It should be noted that being gone back in the plating metal on surface of plating nickel gold except through the method for plating or physical sputtering plating
It can be other methods, be not specifically limited herein.
Optionally, include in the surface plating 150 of plating nickel gold 140：
By the method for silk-screen or sputtering plating non-metallic layer is plated on the surface of plating nickel gold 140.
It is understood that when the protective layer is non-metallic layer, non-metallic layer, which covers nickel-gold layer, to insulate so that copper wire
Contact acid solution is not removed on road, to form Jafani effect with copper.
It should be noted that except through silk-screen or sputtering plating method plating nickel gold surface plating non-metallic layer it
Outside, other methods be can also be, be not specifically limited herein.
It is understood that in the surface plating of plating nickel gold, which can be copper or chemical activity ratio
The high metal of copper, can also be non-metallic layer, when protective layer is metal layer, since the activity of the metal layer is not less than copper,
It is preferentially dissolved in an acidic solution by reaction, to achieve the purpose that protect metal layer copper, i.e. nickel-gold layer and metal layer
Junction be not in chemical reaction, into without causing the copper wire covered by nickel gold to be corroded, Jia Fanni is prevented to imitate
The generation answered；When the protective layer is non-metallic layer, non-metallic layer, which covers nickel-gold layer, to insulate so that copper wire does not remove contact acid
Property solution, to and copper will not form Jafani effect..
106, etchant resist and metal layer are removed；
Fig. 8 and Fig. 9 are please referred to, is removal etchant resist 130 respectively, removes cuing open for the package substrate after metal layer 120
Face schematic diagram still remains conductive layer 150 in the routing region 113 of package substrate.
Optionally, which is layers of copper.
Optionally, which is dry film.
107, solder mask on package substrate is set, then remove protective layer, completes the making of package substrate.
Referring to FIG. 10, after removal etchant resist 130 and metal layer 120, solder mask 160 is set on package substrate,
Protective layer 150 is removed again, completes the making of package substrate.
In conclusion the embodiment of the present invention is using producing the outer graphics of package substrate, outer graphics include at least the
One figure, second graph, and the isolation recesses between the first figure and second graph；To package substrate whole plate metal
Change so that the surface of package substrate forms metal layer；Etchant resist is set on package substrate, etchant resist cover the first figure and
Region other than the routing region of second graph；The metal layer in routing region is removed, and in routing region nickel plating layer gold；In nickel
The surface plating of layer gold；Remove etchant resist and metal layer；Solder mask is set on package substrate, then removes protective layer,
The technical solution for completing the making of package substrate, achieves following technique effect：Due to after routing region nickel plating layer gold not
Have and directly carries out welding resistance, but in the further plating in the surface of nickel-gold layer to achieve the purpose that protect metal layer,
That is the junction of nickel-gold layer and metal layer is not in chemical reaction, rotten into the copper wire without causing to be covered by nickel gold
Erosion, prevents the generation of Jafani effect, after solder mask is arranged on package substrate, then removes the protective layer, completes encapsulation base
The making of plate solves the problems, such as to generate Jafani effect in the prior art.
A kind of production method of package substrate is provided for the embodiments of the invention above to be described in detail, but more than
The explanation of embodiment is merely used to help understand the method and its core concept of the present invention, should not be construed as the limit to the present invention
System.Those skilled in the art in the technical scope disclosed by the present invention, can readily occur according to the thought of the present invention
Change or replacement, should be covered by the protection scope of the present invention.
Claims (10)
1. a kind of production method of package substrate, which is characterized in that including：
Produce the outer graphics of package substrate, the outer graphics include at least the first figure, second graph, and between institute
State the isolation recesses between the first figure and the second graph；
It metallizes to the package substrate whole plate so that the surface of the package substrate forms metal layer；
Etchant resist is set on the package substrate, and the etchant resist covers the routing of first figure and the second graph
Region other than region；
The metal layer in the routing region is removed, and in the routing region nickel plating layer gold；
It is described protective layer used in protection copper wire in the surface plating of the nickel-gold layer；
Remove the metal layer of the etchant resist and etchant resist covering；
Solder mask is set on the package substrate, then removes the protective layer, completes the making of the package substrate.
2. according to the method described in claim 1, it is characterized in that, described metallize to the package substrate whole plate so that institute
State package substrate surface formed metal layer include：
It is metallized to the package substrate whole plate using the method for electroless plating or physical sputtering so that the package substrate
Surface forms metal layer, and the thickness of the metal layer is between 0.2um~1um.
3. described according to the method described in claim 1, it is characterized in that, described be arranged etchant resist on the package substrate
The region that etchant resist covers other than the routing region of first figure and the second graph includes：
Etchant resist is pasted to the package substrate, and pattern transfer is carried out by exposure imaging so that described in the etchant resist covering
Region other than the routing region of first figure and the second graph.
4. according to the method described in claim 1, it is characterized in that, the metal layer packet in the removal routing region
It includes：
The metal layer in the routing region is removed using the method for microetch.
5. according to the method described in claim 1, it is characterized in that, the metal layer in the removal routing region it
After include：
Remove the etchant resist；
Etchant resist is set on the package substrate again, and the etchant resist covers first figure and the second graph
Region other than routing region.
6. according to the method described in claim 5, it is characterized in that, the removal etchant resist includes：
The etchant resist is removed using sodium hydroxide solution.
7. according to the method described in claim 1, it is characterized in that, the surface plating in the plating nickel gold includes：
It is higher than copper in the surface plated with copper or chemism of the plating nickel gold by the method that either physical sputtering plating is electroplated
Metal.
8. according to the method described in claim 1, it is characterized in that, the surface plating in the plating nickel gold includes：
By the method for silk-screen or sputtering plating non-metallic layer is plated on the surface of the plating nickel gold.
9. method according to any one of claim 1 to 8, which is characterized in that
The metal layer is layers of copper.
10. method according to any one of claim 1 to 8, which is characterized in that
The etchant resist is dry film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410478859.3A CN105489504B (en) | 2014-09-18 | 2014-09-18 | A kind of production method of package substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410478859.3A CN105489504B (en) | 2014-09-18 | 2014-09-18 | A kind of production method of package substrate |
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| CN105489504A CN105489504A (en) | 2016-04-13 |
| CN105489504B true CN105489504B (en) | 2018-08-07 |
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| CN201410478859.3A Active CN105489504B (en) | 2014-09-18 | 2014-09-18 | A kind of production method of package substrate |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106887468B (en) * | 2016-10-25 | 2021-01-15 | 京东方科技集团股份有限公司 | Thin film transistor, array substrate, manufacturing method of array substrate and display panel |
| CN110911287B (en) * | 2018-09-17 | 2021-09-14 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor structure and forming method thereof |
| CN114206024B (en) * | 2021-11-04 | 2024-02-02 | 江苏普诺威电子股份有限公司 | Manufacturing method of MEMS (micro-electromechanical systems) packaging carrier plate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102510675A (en) * | 2011-10-25 | 2012-06-20 | 深南电路有限公司 | Method for electroplating surface of substrate |
| CN102548231A (en) * | 2010-12-23 | 2012-07-04 | 北大方正集团有限公司 | Method for manufacturing PCB (Printed Circuit Board) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4346541B2 (en) * | 2004-11-26 | 2009-10-21 | 日東電工株式会社 | Wiring circuit board and manufacturing method thereof |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548231A (en) * | 2010-12-23 | 2012-07-04 | 北大方正集团有限公司 | Method for manufacturing PCB (Printed Circuit Board) |
| CN102510675A (en) * | 2011-10-25 | 2012-06-20 | 深南电路有限公司 | Method for electroplating surface of substrate |
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| CN105489504A (en) | 2016-04-13 |
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Address after: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Shennan Circuits Co., Ltd. |