CN102510675A - Method for electroplating surface of substrate - Google Patents
Method for electroplating surface of substrate Download PDFInfo
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- CN102510675A CN102510675A CN2011103277328A CN201110327732A CN102510675A CN 102510675 A CN102510675 A CN 102510675A CN 2011103277328 A CN2011103277328 A CN 2011103277328A CN 201110327732 A CN201110327732 A CN 201110327732A CN 102510675 A CN102510675 A CN 102510675A
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- support plate
- surface metal
- plating
- circuit
- electronplate
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Abstract
The embodiment of the invention discloses a method for electroplating the surface of a substrate. The method comprises the following steps of: covering an anti-plated dry film on a non-surface metal electroplated object electroplating area of the substrate on which a line is formed, wherein the non-surface metal electroplated object electroplating area of the substrate has a metalized bottom layer; electroplating a surface metal electroplated object on the substrate of which the non-surface metal electroplated object electroplating area is covered by the anti-plated dry film; removing the anti-plated dry film which is covered on the non-surface metal electroplated object electroplating area of the substrate on which the surface metal electroplated object is electroplated; and etching the metalized bottom layer of the non-surface metal electroplated object electroplating area of the substrate to form the line on which the surface metal electroplated object is electroplated and the line on which the surface metal electroplated object is not electroplated on the substrate. By adoption of the method provided by the embodiment of the invention, the complexity of line design is not increased, and the cost of electroplating of the surface metal electroplated object can be reduced.
Description
Technical field
The present invention relates to circuit board manufacturing technology field, be specifically related to a kind of method that is used to carry support plate (Substrate) electroplating surface of electronic devices and components.
Background technology
At present, the local line on the support plate (being also referred to as base plate for packaging) needs plate surface metal plating thing layer to come protection circuit.
Need on the machining cell of each support plate plate surface metal plating thing (for example nickel gold etc.) circuit must and machining cell on auxiliary frame form complete conductive path.
General plate surface metal plating thing technology in the industry has two kinds at present.
The lead-in wire technology of subtractive process:
Each becomes circuit on article unit normally isolated, can not extend to the support plate limit, therefore on becoming article unit except that the circuit with electric function of needs, additional designs electroplate lead wire also; This electroplate lead wire one end links to each other with the circuit that needs plate surface metal plating thing, and the other end extends to the auxiliary limit of machining cell, forms complete conductive path through the auxiliary limit on the machining cell, thereby makes the respective lines can plate surface metal plating thing.This arts demand additional designs electroplate lead wire, and the electroplate lead wire of additional designs occupies into the wiring space of article unit has reduced the density of function circuit and has been unfavorable for the circuit densification; And the additional designs electroplate lead wire has also increased the line design complexity virtually.
The full plate craft of gilding of semi-additive process:
Earlier on the logicalnot circuit zone of the end of support plate copper face, cover dry film, then do not have dry film in the circuit zone and cover; Re-plating surface metal electronplate behind the circuit zone that the no dry film of graphic plating thickening covers; Remove dry film then and etch away the copper that no surface metal electronplate is protected, and then on support plate, be formed with the circuit of surface metal electronplate protection.So all circuits all have surface metal electronplate layer to cover, and processing cost is higher; And the part circuit possibly need to cover resistance weldering green oil, and green oil and surface metal plating object plane adhesion are relatively poor, so can reduce the reliability of finished product.
Summary of the invention
The embodiment of the invention provides the method for support plate electroplating surface, in the hope of not only can not extra increase line design complexity but also can reduce plate surface metal plating thing cost.
The embodiment of the invention provides a kind of method of support plate plate surface metal plating thing, comprising:
Cover anti-plating dry film in the non-surface metal electronplate plating area of the support plate that forms circuit, wherein, the non-surface metal electronplate electroplating region of said support plate has the metallization bottom;
Non-surface metal electronplate plating area has been covered the said support plate plate surface metal plating thing of anti-plating dry film;
Remove the anti-plating dry film that the non-surface metal electronplate plating area of the said support plate behind the plate surface metal plating thing covers;
Etch away the metallization bottom of the non-surface metal electronplate of said support plate plating area, with the circuit that on said support plate, forms plate surface metal plating thing and the circuit of plate surface metal plating thing not
Therefore the embodiment of the invention covers anti-plating dry film in the non-surface metal electronplate plating area of the support plate that forms circuit, and wherein, the non-surface metal electronplate electroplating region of this support plate has the metallization bottom; Non-surface metal electronplate plating area has been covered this support plate plate surface metal plating thing of anti-plating dry film; Remove the anti-plating dry film that the non-surface metal electronplate plating area of this support plate behind the plate surface metal plating thing covers; Etch away the metallization bottom of the non-surface metal electronplate of this support plate plating area; With the circuit that on this support plate, forms plate surface metal plating thing and the circuit of plate surface metal plating thing not; Realized the subregion surface metal plating thing plating of support plate; Therefore both can not extra increase line design complexity and guarantee the reliability of support plate can reduce support plate plate surface metal plating thing cost again relatively; Owing to the circuit top and the sidepiece that need plate surface metal plating thing can be exposed fully, the surface metal electronplate layer of plating can wrap top and the sidepiece of being electroplated circuit fully, and reliability is very high.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art; To do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below; Obviously, the accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills; Under the prerequisite of not paying creative work property, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the schematic flow sheet of the method for a kind of support plate electroplating surface of providing of the embodiment of the invention;
A kind of generalized section of waiting to make the support plate of circuit that Fig. 2-a is that the embodiment of the invention provides;
Fig. 2-b is that a kind of logicalnot circuit zone that the embodiment of the invention provides covers anti-generalized section of plating the support plate of dry film;
Fig. 2-c is the generalized section of the support plate after a kind of electro-coppering of providing of the embodiment of the invention;
Fig. 2-d is that a kind of that the embodiment of the invention provides removing the generalized section that resists the support plate after plating dry film;
Fig. 2-e is a kind of generalized section of producing the support plate of circuit that the embodiment of the invention provides;
Fig. 2-f is the generalized section of the support plate of a kind of whole sheetmetalization of providing of the embodiment of the invention;
Fig. 2-g is a kind of generalized section that has covered the support plate of anti-plating dry film that the embodiment of the invention provides;
The generalized section of the support plate of Fig. 2-h is that the embodiment of the invention provides a kind of metallization bottom that etches away surface metal electronplate plating area;
The schematic top plan view of the support plate of Fig. 2-i is that the embodiment of the invention provides a kind of metallization bottom that etches away surface metal electronplate plating area;
The generalized section of the support plate of Fig. 2-j is a kind of parcel plating of providing of embodiment of the invention surface metal electronplate layer;
The schematic top plan view of the support plate of Fig. 2-k is a kind of parcel plating of providing of embodiment of the invention surface metal electronplate layer;
Fig. 2-L is a kind of generalized section of removing the support plate of anti-plating dry film that the embodiment of the invention provides;
A kind of circuit of plate surface metal plating thing and generalized section of the support plate of the circuit of plate surface metal plating thing not of forming that Fig. 2-m is that the embodiment of the invention provides;
A kind of circuit of plate surface metal plating thing and schematic top plan view of the support plate of the circuit of plate surface metal plating thing not of forming that Fig. 2-n is that the embodiment of the invention provides.
Embodiment
The embodiment of the invention provides the method for support plate electroplating surface, not only can not extra increase line design complexity but also can reduce plate surface metal plating thing cost.
To combine the accompanying drawing in the embodiment of the invention below, the technical scheme in the embodiment of the invention is carried out clear, intactly description, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the present invention's protection.
Below be elaborated respectively through embodiment.
The present invention provides an embodiment of the method for support plate electroplating surface, can comprise:
Cover anti-plating dry film in the non-surface metal electronplate plating area of the support plate that forms circuit, wherein, the non-surface metal electronplate electroplating region of this support plate has the metallization bottom; Non-surface metal electronplate plating area has been covered this support plate plate surface metal plating thing of anti-plating dry film; Remove the anti-plating dry film that the non-surface metal electronplate plating area of this support plate behind the plate surface metal plating thing covers; Etch away the metallization bottom of the non-surface metal electronplate of this support plate plating area, with the circuit that on this support plate, forms plate surface metal plating thing and the circuit of plate surface metal plating thing not.
Referring to Fig. 1, the method for a kind of support plate electroplating surface that the embodiment of the invention provides can comprise:
101, the logicalnot circuit of copper zone covers anti-plating dry film at the bottom of support plate;
Wherein, support plate can be the individual layer support plate, also can be the multilayer support plate.With the multilayer support plate is example; Suppose that this moment, support plate was machined to skin; Also possibly be processed with metallization via (the metallization via can be regarded the part of circuit as) on the support plate; The end copper thickness of support plate lamina rara externa face can approach (end copper thickness for example can less than 4 microns or other suitable depth) as far as possible, if there is the metallization via, the copper on the via hole wall that then metallizes can approach as far as possible.
Wherein, the circuit zone of copper does not cover anti-plating dry film at the bottom of the support plate, and the metallization via does not cover anti-plating dry film certainly yet.
Please in the lump referring to Fig. 2-a～Fig. 2-n, Fig. 2-a～Fig. 2-n shows a kind of enforcement scene of on support plate, electroplating the surface metal electronplate for example.
For example shown in Fig. 2-a, Fig. 2-a shows a kind of support plate 10 of waiting to make circuit for example, and support plate 10 surface coverage have end copper 11.
For example shown in Fig. 2-b, Fig. 2-b shows the support plate 10 that a kind of logicalnot circuit zone covers anti-plating dry film 12 for example.
102, the logicalnot circuit zone is coated with the copper of the support plate electro-coppering of anti-plating dry film with thickening circuit zone;
Wherein, Because anti-plating dry film has the anti-plate effect; Therefore, the logicalnot circuit zone that is coated with anti-plating dry film on the support plate can't electric plated with copper, and the circuit zone that is not coated with anti-plating dry film then can be through electroplating the copper that thicken the circuit zone; Certainly, the copper on the hole wall of metallization via is also thickeied.So, the difference in height of the thick existence of copper of the whole plate face of support plate, the copper in circuit zone is thicker; The logicalnot circuit zone has only end copper, so copper is thinner.
For example shown in Fig. 2-c, Fig. 2-c shows the support plate 10 after a kind of electro-coppering 13 for example.
103, remove the anti-plating dry film that the logicalnot circuit zone of the support plate after the electro-coppering covers;
For example shown in Fig. 2-d, Fig. 2-d shows a kind of support plate of removing behind the anti-plating dry film 10 for example.
104, the end copper that etches away support plate logicalnot circuit zone is to form circuit;
Wherein, through controlling suitable etch quantity, when can etch away at thin end copper with support plate logicalnot circuit zone; The part copper that only etches away the circuit zone is thick; Because the copper in circuit zone is thick in electroplating the end copper that is thicker than the logicalnot circuit zone, therefore, the copper that etching can only reduce the circuit zone is thick; And retain certain thickness copper, and then on support plate, form circuit.
Need to prove that step 101～104th is that example is introduced with the flow process of on support plate, making circuit through semi-additive process, also can on support plate, make circuit through fully-additive process or subtractive process certainly.
A kind of process of wherein, on support plate, making circuit through subtractive process for example can comprise:
The circuit of copper zone covers anti-etching dry film at the bottom of support plate; The end copper that etches away support plate logicalnot circuit zone is to form circuit.At this moment, at the bottom of the support plate thickness of copper (for example greater than 4 microns or thicker) can be thicker than through semi-additive process make on the support plate under the circuit scene copper thickness at the bottom of the support plate.Wherein, Because anti-etching dry film has anti-etching effect, therefore, the end copper that is coated with the circuit zone of anti-etching dry film on the support plate remains because of being etched; The end copper that does not cover the logicalnot circuit zone of anti-etching dry film is etched, and then on support plate, forms circuit.
Other method of on support plate, making circuit is given unnecessary details here no longer one by one.
For example shown in Fig. 2-e, Fig. 2-e shows a kind of support plate 10 of producing circuit for example.
105, the support plate that forms circuit is put in order the sheetmetal processing;
In practical application, can on the support plate that forms circuit, form the metallization bottom through chemical deposition (or vapour deposition or alternate manner), the thickness of this metallization bottom can approach as far as possible, for example can be less than 2 microns or other thickness.Wherein, through support plate being put in order the sheetmetal processing, the circuit of support plate is regional, logicalnot circuit is regional, and the conductive metallization bottom of one deck all can be adhered in the auxiliary limit of machining cell.
For example shown in Fig. 2-f, Fig. 2-f shows a kind of support plate 10 of whole sheetmetalization for example, is attached with metallization bottom 14 on the support plate 10.
106, cover anti-plating dry film in the non-surface metal electronplate plating area of the support plate that forms circuit;
In practical application; For improving reliability; Support plate surface metal electronplate plating area can that is to say that zone bigger around can the circuit that need plate surface metal plating thing on the support plate being reached is as surface metal electronplate plating area greater than the zone of actual needs plate surface metal plating thing; Surface metal electronplate plating area does not have dry film and covers, and all the other zones have dry film to cover.
For example shown in Fig. 2-g, Fig. 2-g shows a kind of support plate 10 that has covered anti-plating dry film 15 for example.
107, etch away the metallization bottom of support plate surface metal electronplate plating area;
Wherein, through controlling suitable etch quantity, can etch away the metallization bottom of the surface metal electronplate plating area that is not coated with anti-plating dry film, the circuit of retention surface metal plating thing plating area.
Because the thick thickness that far is thicker than the metallization bottom of the copper of the circuit of surface metal electronplate plating area, therefore, only the copper that reduces circuit of trace is thick during the etching metal bottom.Final result is, the non-surface metal electronplate electroplating region of support plate has the metallization bottom, the surface metal electronplate electroplating region of the support plate bottom that do not metallize.
For example shown in Fig. 2-h and Fig. 2-i, Fig. 2-h and Fig. 2-i show a kind of support plate 10 that etches away the metallization bottom of surface metal electronplate plating area for example.
108, non-surface metal electronplate plating area has been covered the support plate plate surface metal plating thing of anti-plating dry film;
Wherein, During to support plate plate surface metal plating thing; Non-surface metal electronplate plating area has covered anti-plating dry film, therefore can not electroplated upper surface metal plating thing, but not the metallization bottom of surface metal electronplate plating area can be done the usefulness of conduction when plate surface metal plating thing; And last layer surface metal electronplate, can be electroplated because cover anti-plating dry film in surface metal electronplate plating area therefore on the circuit of surface metal electronplate plating area, forms surface metal electronplate layer.Owing to the circuit top and the sidepiece that need plate surface metal plating thing can be exposed fully, the surface metal electronplate layer of plating can wrap top and the sidepiece of being electroplated circuit fully, and reliability is very high.
Wherein, the electroplating thickness of surface metal electronplate layer can be controlled according to actual needs.
In the embodiment of the invention, to the purpose of support plate plate surface metal plating thing mainly contain following purpose wherein one or more:
The first utilizes surface metal electronplate layer to come protection circuit, in case the principal vertical line road is oxidized and/or the resistance to wear of enhancing line; It two is to guarantee in the follow-up assembling process, is electroplate with good electrical communication binding ability between circuit and other circuit (for example chip bonding pad) of surface metal electronplate.
In the embodiment of the invention; The surface metal electronplate for example comprises: nickel gold (can at electronickelling gold layer on the support plate), gold (can support plate power on Gold plated Layer), NiPdAu (can on support plate electronickelling porpezite layer), silver (can electroplate the support plate silver coating that powers on) or tin (can electroplate the support plate tin coating that powers on) or other can prevent that circuit is oxidized; And/or the resistance to wear of enhancing line, and/or can guarantee that the circuit good electrical is communicated with other metal or alloy of binding ability.
For example shown in Fig. 2-j and the 2-k, Fig. 2-j and 2-k show a kind of support plate 10 of electroplating surface metal electronplate layer 16 for example.
Owing to only need at surface metal electronplate plating area plate surface metal plating thing; Rather than whole plate plate surface metal plating thing; So the consumption of minimizing surface metal electronplate that can be bigger has improved surface metal electronplate effective rate of utilization, has reduced electroplating cost.
109, remove the anti-plating dry film that the non-surface metal electronplate plating area of the support plate behind the plate surface metal plating thing covers;
For example shown in Fig. 2-L, Fig. 2-L shows a kind of support plate 10 of removing anti-plating dry film 15 for example.
110, etch away the metallization bottom of the non-surface metal electronplate of support plate plating area, with the circuit that on support plate, forms plate surface metal plating thing and the circuit of plate surface metal plating thing not.
Wherein, Through controlling suitable etch quantity; Can be worth the metallization bottom that etches away the non-surface metal electronplate of support plate plating area, the circuit on the support plate then can be retained, and then on support plate, forms the circuit of plate surface metal plating thing and the circuit of plate surface metal plating thing not.
For example shown in Fig. 2-m and the 2-n, Fig. 2-m and 2-n show a kind of circuit of plate surface metal plating thing and support plate 10 of the circuit of plate surface metal plating thing not of forming for example.
Therefore the embodiment of the invention is owing to be to cover anti-plating dry film in the non-surface metal electronplate plating area of the support plate that forms circuit, and wherein, the non-surface metal electronplate electroplating region of this support plate has the metallization bottom; Non-surface metal electronplate plating area has been covered this support plate plate surface metal plating thing of anti-plating dry film; Remove the anti-plating dry film that the non-surface metal electronplate plating area of this support plate behind the plate surface metal plating thing covers; Etch away the metallization bottom of the non-surface metal electronplate of this support plate plating area; With the circuit that on this support plate, forms plate surface metal plating thing and the circuit of plate surface metal plating thing not; Realized the subregion surface metal plating thing plating of support plate; Therefore both can not extra increase line design complexity and guarantee the reliability of support plate can reduce support plate plate surface metal plating thing cost again relatively.Owing to the circuit top and the sidepiece that need plate surface metal plating thing can be exposed fully, the surface metal electronplate layer of plating can wrap top and the sidepiece of being electroplated circuit fully, and reliability is very high.
Need to prove; For aforesaid method embodiment, for simple description, so it all is expressed as a series of combination of actions; But those skilled in the art should know; The present invention does not receive the restriction of described sequence of movement, because according to the present invention, some step can adopt other orders or carry out simultaneously.Secondly, those skilled in the art also should know, the embodiment described in the specification all belongs to preferred embodiment, and related action and module might not be that the present invention is necessary.
More than the method for the support plate electroplating surface that the embodiment of the invention provided has been carried out detailed introduction; Used concrete example among this paper principle of the present invention and execution mode are set forth, the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that on embodiment and range of application, all can change, to sum up, this description should not be construed as limitation of the present invention.
Claims (10)
1. the method for a support plate electroplating surface is characterized in that, comprising:
Cover anti-plating dry film in the non-surface metal electronplate plating area of the support plate that forms circuit, the non-surface metal electronplate electroplating region of said support plate has the metallization bottom;
Non-surface metal electronplate plating area has been covered the said support plate plate surface metal plating thing of anti-plating dry film;
Remove the anti-plating dry film that the non-surface metal electronplate plating area of the said support plate behind the plate surface metal plating thing covers;
Etch away the metallization bottom of the non-surface metal electronplate of said support plate plating area, with the circuit that on said support plate, forms plate surface metal plating thing and the circuit of plate surface metal plating thing not.
2. method according to claim 1 is characterized in that,
Said non-surface metal electronplate plating area at the support plate that forms circuit also comprises before covering anti-plating dry film:
The support plate that forms circuit is put in order the sheetmetal processing;
Saidly before having been covered the said support plate plate surface metal plating thing of anti-plating dry film, non-surface metal electronplate plating area also comprises:
Etch away the metallization bottom of said support plate surface metal electronplate plating area.
3. method according to claim 2 is characterized in that,
Said the support plate that forms circuit is put in order the sheetmetal processing, comprising:
On the support plate that forms circuit, form the metallization bottom through chemical deposition.
4. method according to claim 3 is characterized in that,
On the support plate that forms circuit, form the metallization bottom through chemical deposition, comprising:
On the support plate that forms circuit, form thickness less than 2 microns metallization bottom through chemical deposition.
5. method according to claim 2 is characterized in that,
The surface metal electronplate plating area of said support plate is greater than the zone of actual needs plate surface metal plating thing.
6. according to the described method of claim 1 to 5, it is characterized in that,
Said surface metal electronplate comprises: gold, golden, the NiPdAu of nickel, silver or tin.
7. according to each described method of claim 1 to 5, it is characterized in that,
On said support plate, forming circuit comprises:
The logicalnot circuit of copper zone covers anti-plating dry film at the bottom of support plate;
The logicalnot circuit zone is coated with the copper of the said support plate electro-coppering of anti-plating dry film with thickening circuit zone;
Remove the anti-plating dry film that the logicalnot circuit zone of the said support plate after the electro-coppering covers;
The end copper that etches away said support plate logicalnot circuit zone is to form circuit.
8. method according to claim 7 is characterized in that,
The thickness of the end copper of said support plate is less than 4 microns.
9. according to each described method of claim 1 to 5, it is characterized in that,
On said support plate, forming circuit comprises:
The circuit of copper zone covers anti-etching dry film at the bottom of support plate;
The end copper that etches away said support plate logicalnot circuit zone is to form circuit.
10. method according to claim 9 is characterized in that,
The thickness of the end copper of said support plate is greater than 4 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103277328A CN102510675A (en) | 2011-10-25 | 2011-10-25 | Method for electroplating surface of substrate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103277328A CN102510675A (en) | 2011-10-25 | 2011-10-25 | Method for electroplating surface of substrate |
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| CN102510675A true CN102510675A (en) | 2012-06-20 |
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| CN2011103277328A Pending CN102510675A (en) | 2011-10-25 | 2011-10-25 | Method for electroplating surface of substrate |
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| CN105472900A (en) * | 2014-09-05 | 2016-04-06 | 深南电路有限公司 | Processing method of circuit board |
| CN105489504A (en) * | 2014-09-18 | 2016-04-13 | 深南电路有限公司 | Method for producing package substrate |
| WO2018000431A1 (en) * | 2016-07-01 | 2018-01-04 | 吴孟锠 | Method for forming conductive pattern on flexible substrate |
| CN107567207A (en) * | 2017-08-28 | 2018-01-09 | 东莞市卡小二智能卡有限公司 | The manufacture craft of Contact Type Ic Card PCB support plates |
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| CN101193502A (en) * | 2006-11-22 | 2008-06-04 | 全懋精密科技股份有限公司 | Circuit board structure and its making method |
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| US20050017058A1 (en) * | 2003-07-21 | 2005-01-27 | Kwun-Yao Ho | [method of fabricating circuit substrate] |
| CN1808701A (en) * | 2005-01-17 | 2006-07-26 | 南亚电路板股份有限公司 | Manufacturing method of package base plate |
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| CN105472900A (en) * | 2014-09-05 | 2016-04-06 | 深南电路有限公司 | Processing method of circuit board |
| CN105489504A (en) * | 2014-09-18 | 2016-04-13 | 深南电路有限公司 | Method for producing package substrate |
| CN105489504B (en) * | 2014-09-18 | 2018-08-07 | 深南电路有限公司 | A kind of production method of package substrate |
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| CN107567207A (en) * | 2017-08-28 | 2018-01-09 | 东莞市卡小二智能卡有限公司 | The manufacture craft of Contact Type Ic Card PCB support plates |
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Application publication date: 20120620 |