CN105228359B - Printed wiring board and preparation method thereof - Google Patents
Printed wiring board and preparation method thereof Download PDFInfo
- Publication number
- CN105228359B CN105228359B CN201510727255.2A CN201510727255A CN105228359B CN 105228359 B CN105228359 B CN 105228359B CN 201510727255 A CN201510727255 A CN 201510727255A CN 105228359 B CN105228359 B CN 105228359B
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- gold
- nickel
- pcb
- printed wiring
- making sheet
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a kind of printed wiring board and preparation method thereof, the production method of the printed wiring board includes the following steps：Prepare PCB in making sheet；The processing of figure plating nickel gold：Electronickelling gold graphics field electroless nickel layer and layer gold successively are needed in making sheet in the PCB, forms nickel gold headkerchief；First time pattern transfer：The outer rim width of graphics field is wider than the outer rim width of the nickel gold headkerchief on figure plating nickel gold treated PCB pastes in making sheet the first outer layer dry film, the first outer layer dry film；Outer layer etches：Etching obtains whole plate line pattern.The production method of the printed wiring board is suitable for whole plate line pattern, can ensure pad and circuit without outstanding nickel or outstanding nickel amount it is small, improve pad and circuit deletion problem.Pad and circuit are small without outstanding nickel or outstanding nickel amount on the printed wiring board, landless and circuit defect, and performance is stable during use, safety.
Description
Technical field
The present invention relates to printed wiring board fields more particularly to a kind of printed wiring board and preparation method thereof.
Background technology
Printed wiring board (Printed Circuit Board, PCB), also known as printed circuit board, are that electronic component is electrical
The supplier of connection.During PCB is manufactured, Graphics Application plating (figure plating) cupro-nickel gold+hard metal working of plating is generally required
Skill (abbreviation hydraulic gold process).But nickel-gold layer is resist layer in etching, can be existed after conventional hydraulic gold process outer layer etching
Lateral erosion and erosion phenomenon is crossed, cross that erosion amount is big, crosses and can lead to the problem of outstanding nickel when losing serious, when the nickel-gold layer poised uses or fortune follow-up
It, can there are risks short-circuit in pad/line appearance defect, test process during defeated when collapsing, coming off.Traditional, generally
Improve outstanding nickel problem from both direction：Bottom copper thickness is controlled, control etching line stability controls etching with making first plate, but
Only for control above, it is difficult to ensure that N/D on pad appearance, outstanding nickel problem can not still avoid.
Invention content
Based on this, the defects of the invention reside in the prior art is overcome, providing one kind can ensure pad and circuit without outstanding nickel
Or outstanding nickel amount it is small, improve printed wiring board of pad and circuit deletion problem and preparation method thereof.
Its technical solution is as follows：
A kind of production method of printed wiring board, includes the following steps：
Prepare PCB in making sheet；
The processing of figure plating nickel gold：Electronickelling gold graphics field electroless nickel layer and layer gold successively are needed in making sheet in the PCB, is formed
Nickel gold headkerchief；
First time pattern transfer：Outside figure plating nickel gold treated PCB pastes in making sheet the first outer layer dry film, described first
The outer rim width of graphics field is wider than the outer rim width of the nickel gold headkerchief on layer dry film；
Outer layer etches：Outer layer etching is carried out in making sheet to the PCB after first time pattern transfer, with the first outer layer dry film
For resist layer, etching obtains whole plate line pattern.
The step of figure plating nickel gold processing includes in one of the embodiments,：
Negative film is electroplated：The hole copper and face copper of whole plate are thickeied；
Second of pattern transfer：PCB after negative film plating pastes the second outer layer dry film in making sheet, exposes PCB and is making
Electronickelling gold graphics field is needed on plate；
Electronickelling gold：PCB after second outer graphics shift electroless nickel layer and layer gold successively in making sheet, make described
It needs to form nickel gold headkerchief on the figure of electronickelling gold graphics field.
The unilateral outer rim width of graphics field is golden than the nickel on the first outer layer dry film in one of the embodiments,
The unilateral loose 0.5-2mil of outer rim width (mil, i.e. mil) of headkerchief.
In one of the embodiments, after the figure plating nickel gold processing step, before first time pattern transfer step, also wrap
Include step：
Third time pattern transfer：Through figure plating nickel gold treated PCB pastes in making sheet resistance to gold-plated dry film, hard golden figure is plated
Region dry film windowing；
The hard gold of plating：To plating, hard golden graphics field carries out that hard gold processing is electroplated and moves back film.
It is alkaline etching liquid for etching solution for etching in one of the embodiments, in the outer layer etching step.
The preparation PCB includes in the step of making sheet in one of the embodiments,：Prepare to make PCB in the more of making sheet
Block core plate, inner figure make, lamination polylith core plate, POFV (Plating Over Filled Via, on through-hole consent metapore
Plating) technique and drilling.
In one of the embodiments, in the whole plate line pattern each conductor conductor spacing >=6mil.
A kind of prepared printed wiring board of production method by printed wiring board described above
The beneficial effects of the present invention are：
Figure plating nickel gold processing first is carried out in making sheet to PCB, nickel gold headkerchief is produced needing electronickelling gold graphics field；Then
First time pattern transfer is carried out, the first outer layer that the nickel gold headkerchief outer rim width is wider than using graphics field outer rim width is done
Film makes the first outer layer dry film coat nickel gold headkerchief completely；Finally outer layer erosion is carried out by resist layer of the first outer layer dry film
It carves.At this point, the first outer layer dry film plays a protective role to nickel gold headkerchief, it can ensure the etching integrality of pad, circuit.It is described
The production method of printed wiring board, suitable for whole plate line pattern, can ensure pad and circuit without outstanding nickel or outstanding nickel amount it is small, change
Kind pad and circuit deletion problem.
The printed wiring board is made to obtain by the production method of above-mentioned printed wiring board, has the printed wiring board
The technique effect of production method, pad and circuit are small without outstanding nickel or outstanding nickel amount on the printed wiring board, and landless and circuit lack
Damage, performance is stable during use, safety.
Description of the drawings
Fig. 1 is the flow chart one of the production method of the printed wiring board described in the embodiment of the present invention；
Fig. 2 is the flowchart 2 of the production method of the printed wiring board described in the embodiment of the present invention；
Fig. 3 is to prepare cut-away views of the PCB in making sheet rear board described in the embodiment of the present invention；
Fig. 4 is the cut-away view of the figure plating nickel gold processing rear board described in the embodiment of the present invention；
Fig. 5 is the cut-away view of the first time pattern transfer rear board described in the embodiment of the present invention；
Fig. 6 is the cut-away view of the outer layer etching rear board described in the embodiment of the present invention.
Reference sign：
10th, layers of copper, 20, nickel layer, 30, layer gold, the 40, first outer layer dry film.
Specific embodiment
The embodiment of the present invention is described in detail below：
As shown in Figure 1 and Figure 2, a kind of production method of printed wiring board, includes the following steps：
S110 prepares PCB in making sheet；
Specifically, the preparation PCB includes in the step of making sheet：
S111 prepares to make polylith core plates of the PCB in making sheet；
S112 inner figures make：Shifted by inner figure, internal layer etching etc. flows carry out inner figure making；
S113 is laminated polylith core plate：Polylith core plate is overlapped, the polylith core plate after overlapping is moved into pressure stove and uses hot pressing
Technique is pressed, and forms multi-layer board；
S114POFV techniques and drilling：Hole is made according to design requirement；
Above-mentioned flow is taken, PCB is ready in making sheet, prepares the diagrammatic cross-section of wiring boards of the PCB after making sheet such as
Shown in Fig. 3.
Fig. 4 shows the diagrammatic cross-section of the wiring board after S120 figure plating nickel gold processing steps, with reference to Fig. 4,
The processing of S120 figures plating nickel gold：In the PCB electronickelling gold graphics field electroless nickel layer 20 and gold successively are needed in making sheet
Layer 30 forms nickel gold headkerchief；
Specifically, the step of figure plating nickel gold processing, includes：
S121 negative films are electroplated：To whole plate copper electroplating layer 10, thicken whole plate hole copper and face copper.Preferably, using pulse electricity
The mode of plating thickeies hole copper and face copper, and plating passband is high, and obtained face copper thickness is thin, can realize all promising policy hole copper and face copper
It is required that it is simple for process, it is easy to operate.Negative film plating is carried out to whole plate in advance, drop can be reduced, is second of figure of next step
Shape transfer is prepared, and makes the second outer layer dry film more easy to attach.
Second of pattern transfer of S122：PCB after negative film plating pastes the second outer layer dry film in making sheet, exposes PCB
Electronickelling gold graphics field is needed in making sheet.The second outer layer dry film is pasted in making sheet in PCB, is put into exposure device and is exposed
Light processing, then development treatment, so as to which electronickelling gold graphics field will be needed to develop out.Further, Exposure mode uses LDI
(Laser direct imaging, laser direct imaging) exposes, and paints the film without advance light, aligning accuracy is high, easy to operate.
S123 electronickellings gold：PCB after second outer graphics shift electroless nickel layer 20 and layer gold successively in making sheet
30, make to form nickel gold headkerchief on the figure for needing electronickelling gold graphics field.
By step S121, S122, S123, nickel layer 20 and layer gold can be plated out electronickelling gold graphics field is needed to power on
30, nickel gold headkerchief is formed on the disk and line for needing electronickelling gold graphics field, obtains structure as shown in Figure 4.
Further, after S120 figure plating nickel gold processing steps, before first time pattern transfer step, step is further included：
S130 third time pattern transfers：Through figure plating nickel gold treated PCB pastes in making sheet resistance to gold-plated dry film, hard gold is plated
Graphics field dry film windowing forms dry film plating resist layer on the region other than the hard golden regional graphics of plating.
The hard gold of S140 plating：To plating, hard golden graphics field carries out that hard gold processing is electroplated and moves back film.Utilize the dry film plating resist
Layer carries out that hard gold processing is electroplated, and obtains Gold plated Layer 30, and return resistance to gold-plated dry film using alkaline solution.
, can be by layer gold thickening to required value using above-mentioned S130, S140 step, the processing for reaching partially plating gold surface will
It asks, technological process is simple.
Fig. 5 shows the diagrammatic cross-section of the wiring board after S150 first time pattern transfer steps, with reference to Fig. 5,
S150 first time pattern transfers：In figure plating nickel gold, treated that PCB pastes the first outer layer dry film 40 in making sheet, described
The outer rim width of graphics field is wider than the outer rim width of the nickel gold headkerchief on first outer layer dry film 40.It is pre-designed the first outer layer
Dry film 40 makes the disk of graphics field and the outer rim width of line on the first outer layer dry film 40 be wider than the outer rim width of nickel gold headkerchief.
The PCB obtained in the step s 120 pastes the first outer layer dry film 40 in making sheet, is put into exposure device to the first outer layer dry film 40
Processing, then development treatment are exposed, nickel gold headkerchief is made to be coated completely by the first outer layer dry film 40, so as to be etched in follow-up outer layer
In shield to nickel gold headkerchief.Further, Exposure mode is exposed using LDI, and the film, aligning accuracy are painted without advance light
Height, it is easy to operate.
Preferably, the unilateral outer rim width of graphics field is more unilateral than the nickel gold headkerchief on the first outer layer dry film 40
The wide 0.5-2mil of outer rim width.This numerical value is by considering determined by actual process ability, specifically, being according to copper thickness control
System, LDI etch the control ability of parameters such as stability and etching control amount, dry film windowing compensation rate and determine to capability.It should
Numberical range can ensure the first outer layer dry film 40 cladding nickel gold headkerchief completely, and nickel gold headkerchief is risen in the etching of follow-up outer layer and is protected
Shield acts on.Further, on the first outer layer dry film 40 graphics field unilateral outer rim width than the nickel gold headkerchief list
The side wide 1.5-2mil of outer rim width.In the numberical range, the first outer layer dry film 40 can coat nickel gold headkerchief completely, follow-up
It shields, and process conditions is required not harsh to nickel gold headkerchief in outer layer etching, it is easier to control, can effectively reduce life
Cost is produced, improves production efficiency.
Fig. 6 shows the diagrammatic cross-section of the wiring board after S160 outer layer etching steps, with reference to Fig. 5, Fig. 6,
S160 outer layers etch：Outer layer etching is carried out in making sheet to the PCB after first time pattern transfer, with first outer layer
Dry film 40 is resist layer, and etching obtains whole plate line pattern.When outer layer etches, the graphics field cladding on the first outer layer dry film 40
When nickel gold headkerchief on line and disk with the first outer layer dry film 40 is resist layer, the first outer layer dry film 40 can be to nickel gold headkerchief
It shields, outstanding nickel problem can be effectively improved, ensure that pad and circuit are small without outstanding nickel or outstanding nickel amount.Further, it uses
Alkaline etching liquid carries out outer layer etching, can avoid corrosion nickel layer 20 and layer gold 30, and the first outer layer dry film 40 particularly is occurring
It when contraposition does not precisely wait unexpected, can ensure that erosion did not occurred, and then the etching integrality of guarantee outer graphics.
The production method of printed wiring board of the present invention carries out figure plating nickel gold processing to PCB in making sheet first, is needing
Produce nickel gold headkerchief in electronickelling gold graphics field；Then first time pattern transfer is carried out, it is wide using graphics field outer rim width
In the first outer layer dry film 40 of the nickel gold headkerchief outer rim width, the first outer layer dry film 40 is made to coat nickel gold headkerchief completely
Come；Outer layer etching is finally carried out for resist layer with the first outer layer dry film 40.At this point, the first outer layer dry film 40 plays nickel gold headkerchief
Protective effect can ensure the etching integrality of pad, circuit.According to capability, etching stability to the control of copper thickness, LDI
The making side of the printed wiring board can be used in the control ability for the parameters such as compensation rate that open a window with etching control amount, dry film, setting
The condition of method is：The conductor spacing of each conductor should meet >=6mil in the line pattern, under this condition, production cost, life
Production efficiency and application range can reach best.The production method of printed wiring board described in the present embodiment is applicable to whole plate line
Road figure, can ensure the etching integrality of pad and circuit, ensure pad and circuit without outstanding nickel or outstanding nickel amount it is small, improve weldering
Disk and circuit deletion problem, and application range is wide in range, greatlys save production cost, improves production efficiency.
A kind of prepared printed wiring board of production method by printed wiring board described above.The printed wiring
Plate is made to obtain by the production method of above-mentioned printed wiring board, therefore has the technology effect of the production method of the printed wiring board
Fruit, pad and circuit are small without outstanding nickel or outstanding nickel amount on the printed wiring board, landless and circuit defect, and performance is steady during use
Fixed, safety.
It should be noted that unless otherwise indicated, otherwise the term in specification " first ", " second ", " third " etc. are retouched
Various components, element, step being used only in differentiation specification etc. is stated, without being intended to indicate that various components, element, step
Between logical relation or ordinal relation etc..
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Embodiment described above only expresses the several embodiments of the present invention, and description is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that those of ordinary skill in the art are come
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (6)
1. a kind of production method of printed wiring board, which is characterized in that include the following steps：
Prepare PCB in making sheet；
The processing of figure plating nickel gold：Electronickelling gold graphics field electroless nickel layer and layer gold successively are needed in making sheet in the PCB, forms nickel gold
Headkerchief；
First time pattern transfer：In figure plating nickel gold, treated that PCB pastes the first outer layer dry film in making sheet, and first outer layer is done
The unilateral outer rim width of graphics field is looser 0.5-2mil than the unilateral outer rim width of the nickel gold headkerchief on film；
Outer layer etches：Outer layer etching is carried out in making sheet to the PCB after first time pattern transfer, is anti-using the first outer layer dry film
Layer is lost, etching obtains whole plate line pattern, is alkaline etching liquid for etching solution for etching.
2. the production method of printed wiring board according to claim 1, which is characterized in that the step of the figure plating nickel gold processing
Suddenly include：
Negative film is electroplated：The hole copper and face copper of whole plate are thickeied；
Second of pattern transfer：PCB after negative film plating pastes the second outer layer dry film in making sheet, exposes PCB in making sheet
Need electronickelling gold graphics field；
Electronickelling gold：PCB after second outer graphics shift electroless nickel layer and layer gold successively in making sheet make described to need electricity
Nickel gold headkerchief is formed on the figure of plating nickel gold graphics field.
3. the production method of printed wiring board according to claim 2, which is characterized in that walked in figure plating nickel gold processing
After rapid, before first time pattern transfer step, step is further included：
Third time pattern transfer：Through figure plating nickel gold treated PCB pastes in making sheet resistance to gold-plated dry film, hard golden graphics field is plated
Dry film opens a window；
The hard gold of plating：To plating, hard golden graphics field carries out that hard gold processing is electroplated and moves back film.
4. according to the production method of claim 1-3 any one of them printed wiring boards, which is characterized in that the preparation PCB
Include in the step of making sheet：Prepare to make PCB in the polylith core plate of making sheet, inner figure making, lamination polylith core plate, POFV works
Skill and drilling.
5. according to the production method of claim 1-3 any one of them printed wiring boards, which is characterized in that the whole plate circuit
Conductor spacing >=6mil of each conductor in figure.
6. a kind of prepared printed wiring board of production method by claim 1-5 any one of them printed wiring boards.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510727255.2A CN105228359B (en) | 2015-10-29 | 2015-10-29 | Printed wiring board and preparation method thereof |
| PCT/CN2016/096901 WO2017071394A1 (en) | 2015-10-29 | 2016-08-26 | Printed circuit board and fabrication method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510727255.2A CN105228359B (en) | 2015-10-29 | 2015-10-29 | Printed wiring board and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105228359A CN105228359A (en) | 2016-01-06 |
| CN105228359B true CN105228359B (en) | 2018-06-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510727255.2A Active CN105228359B (en) | 2015-10-29 | 2015-10-29 | Printed wiring board and preparation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105228359B (en) |
| WO (1) | WO2017071394A1 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105228359B (en) * | 2015-10-29 | 2018-06-22 | 广州兴森快捷电路科技有限公司 | Printed wiring board and preparation method thereof |
| CN107222975B (en) * | 2017-05-26 | 2019-05-14 | 安徽四创电子股份有限公司 | A kind of gradation etches the pattern-producing method of thick metal plated micro-strip plate |
| CN107506842B (en) * | 2017-06-29 | 2021-01-05 | 广州兴森快捷电路科技有限公司 | PCB order throwing rate prediction method and device |
| CN108235605B (en) * | 2018-02-08 | 2024-03-19 | 深圳市通为信电路科技有限公司 | PCB manufacturing method and PCB |
| CN109688712A (en) * | 2019-01-29 | 2019-04-26 | 深圳市迅捷兴科技股份有限公司 | The production method of the thick copper sheet of the thick gold of plating |
| CN111669905B (en) * | 2020-05-12 | 2024-03-22 | 江门崇达电路技术有限公司 | Core plate, manufacturing method thereof and method for preventing bending plate of laminated plate from warping |
| CN113194635B (en) * | 2021-03-15 | 2023-05-26 | 江西宇睿电子科技有限公司 | Impedance line manufacturing method, impedance line and circuit board |
| CN113630962B (en) * | 2021-07-01 | 2023-03-28 | 广州兴森快捷电路科技有限公司 | Printed circuit board manufacturing method based on four-side gold-clad process and printed circuit board |
| CN113597118B (en) * | 2021-09-28 | 2021-12-31 | 深圳和美精艺半导体科技股份有限公司 | Electroless plating lead gold plating process method |
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| CN103281870A (en) * | 2013-05-13 | 2013-09-04 | 四川省华兴宇电子科技有限公司 | Local electrogilding circuit board manufacturing method capable of avoiding nickel layer suspended falling |
| CN104105350A (en) * | 2013-04-02 | 2014-10-15 | 深南电路有限公司 | Selective nickel and gold plating method, PCB and device |
| CN104812178A (en) * | 2015-03-27 | 2015-07-29 | 深圳市五株科技股份有限公司 | Manufacturing method for circuit board with segmented metal pin |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0817105B2 (en) * | 1989-11-30 | 1996-02-21 | 日本黒鉛工業株式会社 | Vertical striped heat seal connector member and its manufacturing method |
| KR100957418B1 (en) * | 2009-06-26 | 2010-05-11 | 손경애 | Method for maanufacturig pcb and pcb manufactured using the same |
| JP5724232B2 (en) * | 2010-07-09 | 2015-05-27 | 大日本印刷株式会社 | Suspension substrate, method for manufacturing suspension substrate, suspension, suspension with element, and hard disk drive |
| CN105228359B (en) * | 2015-10-29 | 2018-06-22 | 广州兴森快捷电路科技有限公司 | Printed wiring board and preparation method thereof |
-
2015
- 2015-10-29 CN CN201510727255.2A patent/CN105228359B/en active Active
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2016
- 2016-08-26 WO PCT/CN2016/096901 patent/WO2017071394A1/en active Application Filing
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104105350A (en) * | 2013-04-02 | 2014-10-15 | 深南电路有限公司 | Selective nickel and gold plating method, PCB and device |
| CN103281870A (en) * | 2013-05-13 | 2013-09-04 | 四川省华兴宇电子科技有限公司 | Local electrogilding circuit board manufacturing method capable of avoiding nickel layer suspended falling |
| CN104812178A (en) * | 2015-03-27 | 2015-07-29 | 深圳市五株科技股份有限公司 | Manufacturing method for circuit board with segmented metal pin |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105228359A (en) | 2016-01-06 |
| WO2017071394A1 (en) | 2017-05-04 |
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