CN113630962B

CN113630962B - Printed circuit board manufacturing method based on four-side gold-clad process and printed circuit board

Info

Publication number: CN113630962B
Application number: CN202110746059.5A
Authority: CN
Inventors: 贺吉; 刘湘龙; 黄贵福; 林楚涛
Original assignee: Shenzhen Fastprint Circuit Tech Co Ltd; Guangzhou Fastprint Circuit Technology Co Ltd; Yixing Silicon Valley Electronic Technology Co Ltd
Current assignee: Shenzhen Fastprint Circuit Tech Co Ltd; Guangzhou Fastprint Circuit Technology Co Ltd; Yixing Silicon Valley Electronic Technology Co Ltd
Priority date: 2021-07-01
Filing date: 2021-07-01
Publication date: 2023-03-28
Anticipated expiration: 2041-07-01
Also published as: CN113630962A

Abstract

The application discloses a printed circuit board manufacturing method based on a four-side gold-coated process and the printed circuit board, and the method comprises the following steps: transferring a first pattern on a PCB to be manufactured to obtain an etched lead, a first gold-clad pattern area to be electroplated and a second gold-clad pattern area without electric property; transferring the second pattern of the PCB to obtain a first outer layer pattern of the nickel-gold to be electroplated and a lead wire with a film; electroplating nickel and gold on the first outer layer pattern through a lead; transferring the third pattern of the PCB to obtain a second outer layer pattern of the hard gold to be electroplated and a lead wire with a film; electroplating hard gold on the second outer layer pattern through a lead; and sequentially carrying out film stripping treatment and etching treatment on the PCB to obtain the PCB. The printed circuit board is manufactured by the method; through the lead, the first gold-clad pattern area and the second gold-clad pattern area are conducted, the application range of the four-side gold-clad process can be effectively expanded, and the problem that an outer bonding pad of a PCB is defective is solved.

Description

Printed circuit board manufacturing method based on four-side gold-clad process and printed circuit board

Technical Field

The application relates to the technical field of printed circuit boards, in particular to a manufacturing method of a printed circuit board based on a four-side gold-clad process.

Background

The surface treatment process of the PCB (printed circuit board) manufacturing industry is various, and the surface of the pad of the water-hardened gold surface treatment process has the advantages of low contact resistivity, high hardness, good wear resistance and the like and is widely applied to the PCB manufacturing field. And the outer layer of the water-hardened gold technology is etched to cause the defect problem of the bonding pad due to the nickel-gold suspension. The current ENCAP (four-side gold coating process) process can solve the problem of outer layer pad defect, but the ENCAP process has a plurality of limiting conditions: the ENCAP process can not be used in the pattern (bonding pad/wire, etc.) area without the electrical performance network connection surface on the PCB; the small spacing between the two patterns also does not allow the ENCAP process to be used.

Disclosure of Invention

The method for manufacturing the printed circuit board based on the four-side gold-clad process is capable of effectively expanding the application range of the ENCAP process and further effectively solving the problem that an outer layer bonding pad of the PCB is defective.

According to the embodiment of the application, the manufacturing method of the printed circuit board based on the four-side gold-clad process comprises the following steps:

carrying out first pattern transfer on a PCB to be manufactured to obtain etched leads, a first gold-clad pattern area to be electroplated and a second gold-clad pattern area; the first gold-clad graphic area has electric performance, and the second gold-clad graphic area has no electric performance; the lead is used for electrically conducting the second gold-coated pattern region and the first gold-coated pattern region;

transferring a second pattern on the PCB to obtain a first outer layer pattern to be plated with nickel and gold and the lead wire with the remained film;

carrying out nickel-gold electroplating treatment on the first outer layer pattern through the lead;

transferring a third pattern on the PCB to obtain a second outer layer pattern of the hard gold to be electroplated and the lead wire with the remained film;

electroplating hard gold treatment on the second outer layer pattern through the lead;

and sequentially carrying out film stripping treatment and etching treatment on the PCB to obtain the manufactured PCB.

In a second aspect of the application, a printed circuit board manufactured by the manufacturing method of the four-side gold-clad process based on any one of the first aspect is also provided.

According to the above embodiments of the present application, at least the following advantages are provided: through the lead wire that the etching was gone out for first alclad figure region and the regional electric conduction of second alclad figure, thereby make the second alclad figure region of no electric property network connection also can carry out electroplating treatment through four sides alclad technology, simultaneously, cover the pad pasting with the lead wire before electroplating, can be after electroplating is accomplished, etch lead wire and unnecessary copper, thereby can effectively expand the range of application of four sides alclad technology, and then solve the defective problem of PCB board outer layer pad.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic flow chart of a manufacturing method of a printed wiring board based on a four-side gold-clad process according to an embodiment of the present application;

fig. 2 is a schematic diagram of a second pattern transfer manufacturing process of a printed wiring board manufacturing method based on a four-side gold-clad process according to an embodiment of the present application;

fig. 3 is a third schematic diagram transfer flow diagram of a printed wiring board manufacturing method based on a four-side gold-clad process according to an embodiment of the present application;

fig. 4 is a schematic cross-sectional view of a printed wiring board according to another embodiment of the present application.

Detailed Description

Reference will now be made in detail to the embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it is to be understood that the positional descriptions, such as the directions of up, down, front, rear, left, right, etc., referred to herein are based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, and do not indicate or imply that the referred device or element must have a specific direction, be constructed and operated in a specific direction, and thus, should not be construed as limiting the present application.

In the description of the present application, if there are first and second described only for the purpose of distinguishing technical features, it is not understood that relative importance is indicated or implied or that the number of indicated technical features or the precedence of the indicated technical features is implicitly indicated or implied.

In the description of the present application, unless otherwise expressly limited, terms such as set, mounted, connected and the like should be construed broadly, and those skilled in the art can reasonably determine the specific meaning of the terms in the present application by combining the detailed contents of the technical solutions. The embodiments of the present application have been described in detail with reference to the drawings, but the present application is not limited to the embodiments, and various changes can be made without departing from the spirit of the present application within the knowledge of those skilled in the art.

In a first aspect, the application provides a printed circuit board manufacturing method based on a four-side gold-clad process. Referring to fig. 1, a method for manufacturing a printed wiring board based on a four-side gold-clad process according to an embodiment of the present application includes:

s100, carrying out first pattern transfer on the PCB 100 to be manufactured to obtain an etched lead 130, a first gold-clad pattern area to be electroplated and a second gold-clad pattern area; the first gold-clad graphic area has electric performance, and the second gold-clad graphic area has no electric performance; the lead 130 is used to electrically connect the second gold-clad pattern region with the first gold-clad pattern region.

It should be noted that the first gold-clad pattern region includes a plurality of patterns, some of which are used for electroplating nickel gold, some of which are used for electroplating hard gold, and some of which are used for electroplating nickel gold and hard gold. The same applies to the second gold-clad graphic region.

Step S200, performing a second pattern transfer on the PCB 100 to obtain a first outer layer pattern to be plated with nickel and gold and the lead 130 with the remaining film.

It should be noted that the first outer layer pattern includes a part of the first gold-clad pattern region and the second gold-clad pattern region, and after the second pattern is transferred, the region not to be plated is covered by the adhesive film, so as to protect the region not to be plated.

It should be noted that, the lead 130 is subjected to a film-attaching process, so that it can be avoided that the lead 130 is covered with metal during a subsequent electroplating process, which results in that the lead cannot be removed subsequently.

Step S300, the first outer layer pattern is processed by nickel and gold electroplating through the lead 130.

It is noted that the pattern of the electroless plated second over-clad pattern region in the first outer pattern may be plated through the wire 130. When the pattern itself in the first outer layer pattern has an electric property, the electroplating can be directly performed.

Step S400, the PCB 100 is subjected to third pattern transfer to obtain a second outer layer pattern of the hard gold to be electroplated and the lead 130 with the remained film.

It should be noted that the second outer layer pattern includes a pattern including a portion of the first gold-clad pattern region and the second gold-clad pattern region.

It should be noted that, patterns that only need to be plated with nickel gold, only need to be plated with hard gold, or need to be plated with nickel gold, and only need to be plated with hard gold exist on the PCB 100, so that the required PCB 100 can be obtained by performing the respective processing through three pattern transfers, where the second outer layer pattern is a pattern that needs to be plated with hard gold, and the remaining areas on the PCB 100 are covered with a film to protect areas that do not need to be plated with hard gold. After the electroplating is finished, the first outer layer graph and the second outer layer graph are both wrapped by metal, so that a compensation space generated by electroplating copper on the PCB 100 can be saved.

Step S500, the second outer layer pattern is subjected to hard gold electroplating treatment through the lead 130.

Step S600, sequentially performing film stripping and etching on the PCB 100 to obtain the manufactured PCB 100.

Therefore, the first gold-clad pattern area and the second gold-clad pattern area are electrically conducted through the etched lead 130, so that the second gold-clad pattern area without electric performance network connection can be electroplated through a four-side gold-clad process, meanwhile, the lead 130 is covered with a film before electroplating, the lead 130 and redundant copper can be etched after electroplating is completed, the application range of the four-side gold-clad process can be effectively expanded, and the problem that an outer-layer bonding pad of the PCB 100 is defective is solved.

It is understood that, referring to fig. 2, step S200 further includes:

step S210, a film pasting process is performed on the PCB 100.

Step S220, exposing the areas of the PCB 100 except the first outer layer pattern; wherein the region other than the first outer layer pattern includes the position of the lead 130.

After the exposure process, the adhesive film in the pattern region to be left and the adhesive film on the lead 130 are hardened, so that the desired outer layer pattern is obtained in the subsequent process. At this time, the lead 130 does not need to be separately coated to improve efficiency.

Step S230, a first developing process is performed on the exposed PCB 100 to expose the first outer layer pattern and the leads 130 with the remaining film.

It should be noted that the film of the lead 130 is remained, so as to prevent the lead 130 from being affected when the first outer layer pattern is electroplated subsequently.

Correspondingly, the steps S300 to S400 further include:

and (4) performing film stripping treatment on the PCB 100 after the nickel-gold electroplating treatment.

At this time, the plated first outer layer pattern, the leads 130, and other areas to be processed are exposed on the PCB 100.

It is understood that, referring to fig. 3, step S400 includes:

step S410, the PCB 100 is subjected to a film-attaching process.

Step S420, exposing the areas of the PCB 100 except the second outer layer graph; wherein the region other than the second outer pattern includes the position where the lead 130 is located.

Step S430, performing a second developing process on the exposed PCB 100 to expose the second outer layer pattern and the leads 130 with the remaining film.

After the second development treatment, the cured adhesive film remains after the exposure, and the uncured region (i.e., the second outer pattern) is exposed by the developer.

It is understood that step S500 includes:

the PCB 100 after the hard gold plating is finished is subjected to a film stripping process to expose the copper surface and the leads 130 outside the second outer pattern.

After the film removal process, the adhesive film covering the region other than the second outer layer pattern is removed, and the copper surface other than the second outer layer pattern and the lead 130 are exposed.

The copper surface and the leads 130 are removed by etching, and the completed PCB panel 100 is obtained.

The adhesive film is understood to be a dry film or a wet film.

It is understood that the PCB board 100 is provided with the through holes 150, and before the step S100, the through holes further include: the via 150 is metallized: the inner wall of the via hole 150 is plated with copper of a predetermined thickness so that the via hole 150 is completely copper thick.

It can be understood that, in the second aspect, the present application also provides a printed wiring board manufactured by applying the printed wiring board manufacturing method based on the four-side gold-clad process of the first aspect.

It should be noted that, since the printed wiring board is manufactured by the method for manufacturing a printed wiring board by the four-side gold-clad process of the first aspect, all the beneficial effects of the method of the first aspect are achieved.

A method for manufacturing a printed wiring board based on a four-sided gold-clad process according to an embodiment of the present application is described in detail with reference to fig. 1 to 4. It is to be understood that the following description is illustrative only and is not intended as a specific limitation on the present application.

Referring to the PCB 100 shown in fig. 4, the PCB 100 is provided with a through hole 150, and the through hole 150 is first metalized to complete a copper thickness.

As shown in fig. 1, in S100, a lead 130, a first gold-clad pattern region to be plated, and a second gold-clad pattern region are etched on a PCB 100 to be manufactured.

As shown in fig. 4, the first gold-clad pattern region includes the first pattern 110, wherein the first pattern 110 is a region around the through hole 150. The second gold-wrapped pattern region includes the second pattern 120, and the second pattern 120 is an isolated pattern region in fig. 4, without electrical properties.

Next, as shown in fig. 1 and 2, referring to step S200, step S210 to step S230, and step S300, the first pattern plated with nickel and gold and the lead 130 are obtained.

Further, as shown in fig. 3 and 4, referring to step S400, step S410 to step S430, and step S500, a second outer layer pattern is obtained, wherein the first pattern 110 and the second pattern 120 are shown in fig. 4 after hard gold is electroplated.

Specifically, referring to step S600 and the sub-steps thereof, the manufactured PCB 100 is obtained, and at this time, the excess copper and the lead 130 on the PCB 100 are removed. The first graphic 110 and the second graphic 120 are surrounded by the hard gold 140.

The embodiments of the present application have been described in detail with reference to the drawings, but the present application is not limited to the embodiments, and various changes can be made without departing from the spirit of the present application within the knowledge of those skilled in the art.

The foregoing description has been directed to specific embodiments of this disclosure. Other embodiments are within the scope of the following claims. In some cases, the actions or steps recited in the claims may be performed in a different order than in the embodiments and still achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some embodiments, multitasking and parallel processing may also be possible or may be advantageous.

It should be noted that, for the sake of simplicity, the above-mentioned method embodiments are described as a series of acts or combinations, but those skilled in the art should understand that the present application is not limited by the described order of acts, as some steps may be performed in other orders or simultaneously according to the present application. Further, those skilled in the art should also appreciate that the embodiments described in the specification are preferred embodiments and that the acts and modules referred to are not necessarily required in this application.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

Claims

1. A printed circuit board manufacturing method based on a four-side gold-clad process is characterized by comprising the following steps:

carrying out first pattern transfer on a PCB to be manufactured to obtain an etched lead, a first gold-clad pattern area to be electroplated and a second gold-clad pattern area; the first metal-clad graphic area has electrical performance, and the second metal-clad graphic area has no electrical performance; the lead is used for electrically conducting the second gold-coated pattern region and the first gold-coated pattern region;

carrying out film stripping treatment on the PCB subjected to nickel-gold electroplating treatment;

carrying out third pattern transfer on the PCB to obtain a second outer layer pattern of the hard gold to be electroplated and the lead wire with the remained film;

sequentially carrying out film stripping treatment and etching treatment on the PCB to obtain the manufactured PCB;

the second pattern transfer is carried out on the PCB to obtain a first outer layer pattern of the nickel-gold to be electroplated and the lead wire with the film remained, and the method comprises the following steps:

carrying out film pasting treatment on the PCB;

exposing the areas of the PCB except the first outer layer pattern; wherein the region outside the first outer layer pattern includes the position of the lead;

carrying out first development treatment on the PCB subjected to exposure treatment to expose the first outer layer pattern and the lead wires with the remained film;

the third pattern transfer is carried out on the PCB to obtain a second outer layer pattern of the hard gold to be electroplated and the lead wire with the remained film, and the method comprises the following steps:

carrying out film pasting treatment on the PCB;

exposing the areas of the PCB except the second outer layer pattern; wherein the region other than the second outer layer pattern includes a position where the lead is located;

and carrying out second development treatment on the PCB after exposure treatment to expose the second outer layer graph and the lead wires with the remained film.

2. The method for manufacturing a printed wiring board based on the four-side gold-clad process according to claim 1,

the right PCB board is orderly processed by film stripping and etching to obtain the manufactured PCB board, which comprises:

removing the film of the PCB after the hard gold electroplating is finished, and exposing the copper surface and the lead wire outside the second outer layer pattern;

and removing the copper surface and the lead by etching to obtain the manufactured PCB.

3. The method for manufacturing a printed wiring board based on the four-side gold-clad process according to claim 1,

the pad pasting is a dry film or a wet film.

4. The method for manufacturing a printed wiring board based on the four-side gold-clad process according to claim 1,

the PCB is provided with a through hole, and the manufacturing method of the printed circuit board based on the four-side gold-clad process further comprises the following steps:

carrying out metallization treatment on the through hole: and copper with preset thickness is plated on the inner wall of the through hole, so that the through hole is thick in finished copper.

5. A printed wiring board characterized by comprising a printed wiring board manufactured by applying the printed wiring board manufacturing method based on the four-sided gold-clad process according to any one of claims 1 to 4.