CN110418509A - Meet the line build-out method of PCB special etch factor requirements - Google Patents
Meet the line build-out method of PCB special etch factor requirements Download PDFInfo
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- CN110418509A CN110418509A CN201910688932.2A CN201910688932A CN110418509A CN 110418509 A CN110418509 A CN 110418509A CN 201910688932 A CN201910688932 A CN 201910688932A CN 110418509 A CN110418509 A CN 110418509A
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- copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The present invention relates to a kind of line build-out method for meeting PCB special etch factor requirements, include the following steps: to obtain the rate ratio u under the conditions of actual production environment between the first rate of lateral etches copper and the second rate of oblique etch copper；According toObtain theoretical com-pensation value X；It is compensated according to the value not less than theoretical com-pensation value X.The above-mentioned line build-out method for meeting PCB special etch factor requirements, pass through the rate ratio u under the conditions of acquisition actual production environment between the first rate of lateral etches copper and the second rate of oblique etch copper, according to client to the thickness requirement of copper, and the etching factor of demand, theoretical com-pensation value X can be obtained in real time, thickness without such as traditional a large amount of test different Cus is etched with different offsets, without the corresponding offset of product satisfactory after finally etching as theoretical com-pensation value, working efficiency can so be improved, save a large amount of etching period and production cost.
Description
Technical field
The present invention relates to a kind of line build-out methods, more particularly to a kind of line for meeting PCB special etch factor requirements
Road compensation method.
Background technique
As electronic product develops towards high speed, high frequency, characteristic impedance is required increasingly in the wiring board of high-frequency high-speed
It is high.To guarantee that characteristic impedance meets the requirements, in addition to material, dielectric thickness, Line-width precision, the copper to wiring board are thick, solder mask
It is outer Deng selection and control, it is also necessary to which that the etching factor of the line width of the wiring board of high-frequency high-speed is controlled.PCB(Printed
Circuit Board printed circuit board) in manufacturing process, to guarantee that its etching factor and line width meet the requirement of client, need
The width of route is compensated, different copper is thick and etching factor requires the width compensation value of corresponding route different.
Traditionally, various differentiation requirements are proposed to etching factor with different product, PCB is in the fabrication process, on the one hand, needs big
Width compensation value corresponding to thick, the different etching factors of examination different Cu is measured, on the other hand, as equipment uses the increasing of time
Add, equipment etch capabilities decline, corresponding width compensation value need to periodically retest adjustment.Test job amount is huge, work effect
Rate is low, greatly wastes cost of labor and Material Cost.
Summary of the invention
Based on this, it is necessary to overcome the deficiencies of existing technologies, provide a kind of route for meeting PCB special etch factor requirements
Compensation method, it can be improved working efficiency, reduce cost of labor and Material Cost.
Its technical solution is as follows: a kind of line build-out method meeting PCB special etch factor requirements, including walks as follows
It is rapid:
Under the conditions of acquisition actual production environment between the first rate of lateral etches copper and the second rate of oblique etch copper
Rate ratio u；
According toTheoretical com-pensation value X is obtained, wherein H is the thickness of pending etch copper, and Z is the erosion of demand
Carve the factor；
It is compensated according to the value not less than theoretical com-pensation value X.
The above-mentioned line build-out method for meeting PCB special etch factor requirements, by obtaining actual production environment condition
Rate ratio u between the first rate of lower lateral etches copper and the second rate of oblique etch copper, according to client to the thickness of copper
Degree requires and the etching factor of demand, theoretical com-pensation value X can be obtained in real time, without such as traditional a large amount of test different Cus
Thickness be etched with different offsets, the corresponding compensation of satisfactory product after finally being etched without such as tradition
Value is used as theoretical com-pensation value, can so improve working efficiency, save a large amount of etching period and production cost.
In one of the embodiments, it is described obtain actual production environment under the conditions of lateral etches copper first rate and tiltedly
Include: to the step of rate ratio u between the second rate of etch copper
Take the wiring board after being etched under the conditions of actual production environment；
It selects any one on the wiring board to complete etch copper as test object, obtains against corrosion in the test object
Layer have more in it is described complete etch copper part against corrosion lateral length H1 and the resist layer bottom edge with it is described complete
At the oblique distance H2 between the bottom edge of etch copper, rate ratio u is obtained according to the rate ratio u^ of H1/H2.
The test object of the same wiring board has multiple in one of the embodiments, obtains multiple detections
The corresponding multiple rate ratio u^ of object difference, using the average value of multiple rate ratio u^ as rate ratio u.
Multiple wiring boards after being etched under the conditions of actual production environment are taken in one of the embodiments,
Using the average value of the rate ratio of multiple wiring boards as rate ratio u.
The thickness with a thickness of the pending etch copper of the test object is identical in one of the embodiments,；With/
Or, between spacing and the pending etch copper between test object conducting wire adjacent thereto conducting wire adjacent thereto
Spacing is identical.
It is described in one of the embodiments, to take the wiring board after being etched under the conditions of actual production environment
Include: before step
Copper-clad plate is provided；
Dry film is pasted in the copper-clad plate；
The copper-clad plate for the dry film that is sticked is handled using pattern transfer will need the copper etched to be exposed；
Treated that copper-clad plate is put into etching solution is etched for pattern transfer.
The copper thickness in the copper-clad plate is not less than 1OZ in one of the embodiments,；Or the copper in the copper-clad plate is thick
Copper thickness in the copper-clad plate identical or described with the thickness H of the pending etch copper is slightly larger than the pending etch copper
Thickness H.
More than two resist layers are formed in pattern transfer treated copper-clad plate in one of the embodiments, it is adjacent
The distance between two resist layers L is 2mil~5mil.
Further include after copper-clad plate step is provided and before pasting dry film process step in one of the embodiments,
Step: pre-treatment removes sundries and oxide on the copper face of the copper-clad plate, and is roughened copper face.
The method that the value according to not less than theoretical com-pensation value X compensates in one of the embodiments, is, in institute
It states and increases 0mil~1mil on the basis of theoretical com-pensation value X.
Detailed description of the invention
Fig. 1 is the process for meeting the line build-out method of PCB special etch factor requirements described in one embodiment of the invention
Figure；
Fig. 2 is to cover in the line build-out method for meet described in one embodiment of the invention PCB special etch factor requirements
The structural schematic diagram of dry film is bonded on copper sheet；
Fig. 3 is to cover in the line build-out method for meet described in one embodiment of the invention PCB special etch factor requirements
The structural schematic diagram after dry film development on copper sheet；
Fig. 4 is to cover in the line build-out method for meet described in one embodiment of the invention PCB special etch factor requirements
Structural schematic diagram after copper sheet etching process.
Appended drawing reference:
10, substrate, 20, copper, 30, dry film, 40, resist layer.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing to the present invention
Specific embodiment be described in detail.Many details are explained in the following description in order to fully understand this hair
It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not
Similar improvement is done in the case where violating intension of the present invention, therefore the present invention is not limited by the specific embodiments disclosed below.
In the description of the present invention, it is to be understood that, term " first ", " second " are used for description purposes only, and cannot
It is interpreted as indication or suggestion relative importance or implicitly indicates the quantity of indicated technical characteristic.Define as a result, " the
One ", the feature of " second " can explicitly or implicitly include at least one of the features.In the description of the present invention, " multiple "
It is meant that at least two, such as two, three etc., unless otherwise specifically defined.
It in the description of the present invention, it is to be understood that, can be with when an element is considered as " connection " another element
It is directly to another element or may be simultaneously present intermediary element.On the contrary, when element be referred to as " direct " with it is another
When element connects, intermediary element is not present.
In one embodiment, referring to Fig. 1, a kind of line build-out method for meeting PCB special etch factor requirements, packet
Include following steps:
Under the conditions of acquisition actual production environment between the first rate of lateral etches copper and the second rate of oblique etch copper
Rate ratio u；
Wherein, actual production environment condition refers to that the wiring board of pending route production is ready for the life of etching process
Produce environmental condition.The production environment condition for being ready for etching process includes production equipment itself, etching solution, spray pressure etc.,
They can influence etch capabilities.Be due to acquisition the lateral etches copper under the conditions of currently practical production environment first rate with
Rate ratio u between second rate of oblique etch copper, the route that the rate ratio u of acquisition makes close to pending route
Rate ratio between the first rate of lateral etches copper when plate is etched and the second rate of oblique etch copper, such as
This, rate ratio u reference value with higher.
According toTheoretical com-pensation value X is obtained, wherein H is the thickness of pending etch copper, and Z is the erosion of demand
Carve the factor；
It is compensated according to the value not less than theoretical com-pensation value X.
Specifically, the method that the value according to not less than theoretical com-pensation value X compensates is in the theoretical com-pensation
Increase 0mil~1mil on the basis of value X.For example, the method that the value according to not less than theoretical com-pensation value X compensates is,
Increase 0.1mil, 0.2mil, 0.3mil or 0.4mil on the basis of the theoretical com-pensation value X.
The above-mentioned line build-out method for meeting PCB special etch factor requirements, by obtaining actual production environment condition
Rate ratio u between the first rate of lower lateral etches copper and the second rate of oblique etch copper, according to client to the thickness of copper
Degree requires and the etching factor of demand, theoretical com-pensation value X can be obtained in real time, without such as traditional a large amount of test different Cus
Thickness be etched with different offsets, the corresponding compensation of satisfactory product after finally being etched without such as tradition
Value is used as theoretical com-pensation value, can so improve working efficiency, save a large amount of etching period and production cost.
Further, the first rate of lateral etches copper and oblique etch copper under the conditions of the acquisition actual production environment
The step of rate ratio u between second rate includes:
Take the wiring board after being etched under the conditions of actual production environment；
Referring to Fig. 4, any one on the wiring board is selected to complete etch copper 20 as test object, the detection is obtained
Resist layer 40 on object has more in the lateral length H1 and the resist layer 40 of the part against corrosion for completing etch copper 20
Bottom edge and it is described complete etch copper 20 bottom edge between oblique distance H2, according to the rate ratio u^ of H1/H2
Obtain rate ratio u.
Wherein, etching factor Z meets formula: Z=H/ (D1-D2), D1 are that etch copper 20 surveys bottom surface line width, and D2 is etching
Copper 20 surveys top surface line width, then D1-D2=H/Z, resist layer 40 is had more in the cross of the part against corrosion for completing etch copper 20
Oblique distance to length H1=X+H/Z, between the bottom edge of resist layer 40 and the bottom edge for completing etch copper 20
Further, the test object of the same wiring board has multiple, obtains multiple test objects and distinguishes institute
Corresponding multiple rate ratio u^, using the average value of multiple rate ratio u^ as rate ratio u.In this way, according to multiple detections
The corresponding multiple rate ratio u^ averageds of object obtain rate ratio u, and rate ratio u is more accurate, have ginseng
Examine value.
Further, multiple wiring boards after being etched under the conditions of actual production environment are taken, it will be multiple described
The average value of the rate ratio of wiring board is as rate ratio u.In this way, seeking putting down according to the rate ratio of multiple wiring boards
Mean value obtains rate ratio u, and rate ratio u is more accurate, has reference value.
It can also be its after being etched under the conditions of choosing actual production environment as an optional scheme
In some on some wiring board complete etch copper 20 and be used as test object, and rate ratio is obtained according to the test object
u。
In one embodiment, the thickness with a thickness of the pending etch copper 20 of the test object is identical；With/
Or, between spacing and the pending etch copper 20 between test object conducting wire adjacent thereto conducting wire adjacent thereto
Spacing it is identical.In this way, obtained rate ratio u is more accurate, there is reference value.
In one embodiment, described take is etched under the conditions of actual production environment referring to FIG. 1 to FIG. 4,
Include: before the step of rear wiring board
20 plate of copper is covered in offer；
The plated with copper 20 namely on substrate 10.
Patch dry film 30 on 20 plate of copper is covered described；
It will be sticked and cover 20 plate of copper described in dry film 30 and the copper 20 that etches will be needed to be exposed using pattern transfer processing；
By the copper 20 for being covered described in dry film 30 and needing to etch on 20 plate of copper that is sticked namely by the way of exposure development
It is exposed.
Treated covers 20 plate of copper and be put into etching solution and be etched for pattern transfer.
Further, the copper 20 covered on 20 plate of copper is thick not less than 1OZ；Or the copper 20 covered on 20 plate of copper it is thick with
The thickness H of the pending etch copper 20 is identical or the copper 20 covered on 20 plate of copper is thick slightly larger than the pending etching
The thickness H of copper 20.Wherein, 1OZ 1.38mil.
Further, treated covers and be formed with more than two resist layers 40 on 20 plate of copper for pattern transfer, two neighboring institute
Stating the distance between resist layer 40 L is 2mil~5mil.That is, the region between two neighboring resist layer 40 is exposed
Area, etching solution start to be etched by the exposed area with the copper 20 covered on 20 plate of copper；The region of 40 lower section of resist layer is then
There is the protection of resist layer 40, avoids contact to etching solution and be etched.In addition, the distance between two neighboring resist layer 40 L simulation to
The distance between two neighboring resist layer 40 after progress development treatment, allows to carry out at etching on the wiring board of progress route production
The lateral length H1 and oblique distance H2 obtained after reason is more added with reference value.
In one embodiment, further include after 20 plate step of copper is covered in offer and before pasting 30 processing step of dry film
Step: pre-treatment covers sundries and oxide on 20 face of copper of 20 plate of copper described in removal, and is roughened 20 face of copper.In this way, can be just
In pressing dry film 30 on covering 20 plate of copper, the copper 20 for being also convenient for covering 20 plate of copper is etched.
Referring again to Fig. 1, in a specific embodiment, a kind of route benefit meeting PCB special etch factor requirements
Compensation method includes the following steps:
20 plate of copper is covered in S10, offer；
The plated with copper 20 namely on substrate 10.
S20, pre-treatment cover sundries and oxide on 20 face of copper of 20 plate of copper described in removal, and are roughened 20 face of copper.Such as
This, can be convenient for pressing dry film 30 on covering 20 plate of copper, and the copper 20 for being also convenient for covering 20 plate of copper is etched.
S30, patch dry film 30 on 20 plate of copper is covered described；
S40, it will be sticked and cover the exposure of copper 20 that 20 plate of copper is etched needs using pattern transfer processing described in dry film 30
Out；
By the copper 20 for being covered described in dry film 30 and needing to etch on 20 plate of copper that is sticked namely by the way of exposure development
It is exposed.
Treated covers 20 plate of copper and be put into etching solution and be etched for S50, pattern transfer；
S60, it obtains resist layer 40 and has more in the lateral length H1 of part against corrosion for completing etch copper 20 and described
Oblique distance H2 between the bottom edge of resist layer 40 and the bottom edge for completing etch copper 20, according to the speed of H1/H2
Rate ratio u^ obtains rate ratio u.
In this way, be namely equivalent to obtain actual production environment under the conditions of lateral etches copper 20 first rate with it is oblique
Rate ratio u between second rate of etch copper 20.
Referring to Fig. 4, wherein, etching factor Z meets formula: Z=H/ (D1-D2), D1 are that etch copper 20 surveys bottom surface line
Width, D2 are that etch copper 20 surveys top surface line width, then D1-D2=H/Z, resist layer 40, which has more, completes the anti-of etch copper 20 in described
The lateral length H1=X+H/Z of part is lost, between the bottom edge of resist layer 40 and the bottom edge for completing etch copper 20
Oblique distance
S70, basisTheoretical com-pensation value X is obtained, wherein H is the thickness of pending etch copper 20, and Z is to need
The etching factor asked；
S80, it is compensated according to the value not less than theoretical com-pensation value X.
The above-mentioned line build-out method for meeting PCB special etch factor requirements, by obtaining actual production environment condition
Rate ratio u between the first rate of lower lateral etches copper 20 and the second rate of oblique etch copper 20, according to client to copper
20 thickness requirement and the etching factor of demand can obtain theoretical com-pensation value X in real time, without such as traditional a large amount of tests
The thickness of different Cu 20 is etched with different offsets, satisfactory product pair after finally etching without such as tradition
The offset answered can so improve working efficiency as theoretical com-pensation value, save a large amount of etching period and production cost.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of line build-out method for meeting PCB special etch factor requirements, which comprises the steps of:
Speed under the conditions of acquisition actual production environment between the first rate of lateral etches copper and the second rate of oblique etch copper
Rate ratio u；
According toObtain theoretical com-pensation value X, wherein H be pending etch copper thickness, Z be demand etching because
Son；
It is compensated according to the value not less than theoretical com-pensation value X.
2. the line build-out method according to claim 1 for meeting PCB special etch factor requirements, which is characterized in that institute
State the rate under the conditions of obtaining actual production environment between the first rate of lateral etches copper and the second rate of oblique etch copper
The step of ratio u includes:
Take the wiring board after being etched under the conditions of actual production environment；
Any one on the wiring board is selected to complete etch copper as test object, the resist layer obtained in the test object is more
The bottom edge of lateral length H1 and the resist layer for the part against corrosion for completing etch copper and the completion are lost
The oblique distance H2 between the bottom edge of copper is carved, rate ratio u is obtained according to the rate ratio u^ of H1/H2.
3. the line build-out method according to claim 2 for meeting PCB special etch factor requirements, which is characterized in that same
The test object of one wiring board has multiple, the corresponding multiple rate ratio u of the multiple test objects difference of acquisition
^, using the average value of multiple rate ratio u^ as rate ratio u.
4. the line build-out method according to claim 3 for meeting PCB special etch factor requirements, which is characterized in that take
Multiple wiring boards after being etched under the conditions of actual production environment, by the flat of the rate ratio of multiple wiring boards
Mean value is as rate ratio u.
5. the line build-out method according to claim 3 for meeting PCB special etch factor requirements, which is characterized in that institute
The thickness with a thickness of the pending etch copper for stating test object is identical；And/or the conducting wire that the test object is adjacent thereto
Between spacing and the pending etch copper conducting wire adjacent thereto between spacing it is identical.
6. the line build-out method according to claim 2 for meeting PCB special etch factor requirements, which is characterized in that institute
Include: before stating the step of taking the wiring board after being etched under the conditions of actual production environment
Copper-clad plate is provided；
Dry film is pasted in the copper-clad plate；
The copper-clad plate for the dry film that is sticked is handled using pattern transfer will need the copper etched to be exposed；
Treated that copper-clad plate is put into etching solution is etched for pattern transfer.
7. the line build-out method according to claim 6 for meeting PCB special etch factor requirements, which is characterized in that institute
The copper thickness in copper-clad plate is stated not less than 1OZ；Or the thickness H phase of the copper thickness in the copper-clad plate and the pending etch copper
Copper thickness together or in the copper-clad plate is slightly larger than the thickness H of the pending etch copper.
8. the line build-out method according to claim 6 for meeting PCB special etch factor requirements, which is characterized in that figure
More than two resist layers are formed in copper-clad plate after shape transfer processing, the distance between two neighboring described resist layer L is
2mil~5mil.
9. the line build-out method according to claim 6 for meeting PCB special etch factor requirements, which is characterized in that In
Copper-clad plate step is provided to further comprise the steps of: later and before pasting dry film process step
Pre-treatment removes sundries and oxide on the copper face of the copper-clad plate, and is roughened copper face.
10. the line build-out method according to claim 1 for meeting PCB special etch factor requirements, which is characterized in that institute
Stating according to the method that the value not less than theoretical com-pensation value X compensates is to increase 0mil on the basis of the theoretical com-pensation value X
~1mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910688932.2A CN110418509B (en) | 2019-07-29 | 2019-07-29 | Circuit compensation method for meeting specific etching factor requirement of PCB |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910688932.2A CN110418509B (en) | 2019-07-29 | 2019-07-29 | Circuit compensation method for meeting specific etching factor requirement of PCB |
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| CN110418509B CN110418509B (en) | 2020-10-23 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465220A (en) * | 2020-04-23 | 2020-07-28 | 胜宏科技（惠州）股份有限公司 | Compensation method for gold finger etching |
| CN111526666A (en) * | 2020-04-30 | 2020-08-11 | 生益电子股份有限公司 | PCB manufacturing method |
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| CN1645987A (en) * | 2004-01-23 | 2005-07-27 | 卡西欧迈克罗尼克斯株式会社 | Printed circuit board, method and apparatus for fabricating the same, wiring circuit pattern, and printed wiring board |
| CN101009976A (en) * | 2007-01-26 | 2007-08-01 | 上海美维科技有限公司 | Method for improving the line precision in the etching technology |
| CN101381873A (en) * | 2007-09-04 | 2009-03-11 | Mec股份有限公司 | Etching solution and conductor pattern forming method |
| JP2010080661A (en) * | 2008-09-26 | 2010-04-08 | Hitachi Kokusai Electric Inc | Method for manufacturing printed circuit board |
| CN104411105A (en) * | 2014-11-21 | 2015-03-11 | 深圳崇达多层线路板有限公司 | Method for improving excessive circuit etching of circuit board |
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| CN1645987A (en) * | 2004-01-23 | 2005-07-27 | 卡西欧迈克罗尼克斯株式会社 | Printed circuit board, method and apparatus for fabricating the same, wiring circuit pattern, and printed wiring board |
| CN101009976A (en) * | 2007-01-26 | 2007-08-01 | 上海美维科技有限公司 | Method for improving the line precision in the etching technology |
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| JP2010080661A (en) * | 2008-09-26 | 2010-04-08 | Hitachi Kokusai Electric Inc | Method for manufacturing printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111465220A (en) * | 2020-04-23 | 2020-07-28 | 胜宏科技（惠州）股份有限公司 | Compensation method for gold finger etching |
| CN111465220B (en) * | 2020-04-23 | 2022-11-08 | 胜宏科技（惠州）股份有限公司 | Compensation method for gold finger etching |
| CN111526666A (en) * | 2020-04-30 | 2020-08-11 | 生益电子股份有限公司 | PCB manufacturing method |
| CN111526666B (en) * | 2020-04-30 | 2021-07-02 | 生益电子股份有限公司 | PCB manufacturing method |
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| Publication number | Publication date |
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| CN110418509B (en) | 2020-10-23 |
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