CN107278036A - A kind of processing method of the circuit board of numerical-control attenuator QFN packaging ground pads - Google Patents
A kind of processing method of the circuit board of numerical-control attenuator QFN packaging ground pads Download PDFInfo
- Publication number
- CN107278036A CN107278036A CN201710665740.0A CN201710665740A CN107278036A CN 107278036 A CN107278036 A CN 107278036A CN 201710665740 A CN201710665740 A CN 201710665740A CN 107278036 A CN107278036 A CN 107278036A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- processing method
- hole
- numerical
- ground pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003672 processing method Methods 0.000 title claims abstract description 27
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 25
- 238000012545 processing Methods 0.000 claims abstract description 13
- 238000005530 etching Methods 0.000 claims abstract description 10
- 239000011248 coating agent Substances 0.000 claims abstract description 9
- 238000000576 coating method Methods 0.000 claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 24
- 229910052802 copper Inorganic materials 0.000 claims description 24
- 239000010949 copper Substances 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 18
- 239000003822 epoxy resin Substances 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 238000005498 polishing Methods 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 7
- 230000008595 infiltration Effects 0.000 abstract description 6
- 238000001764 infiltration Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 description 12
- 238000013461 design Methods 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000011990 functional testing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
Abstract
The invention discloses a kind of processing method of the circuit board of numerical-control attenuator QFN packaging ground pads, the processing method includes：Step 1：Drill on circuit boards；Step 2：Copper-coating is carried out to the hole processed in step 1 and obtains plated through-hole；Step 3：Plated through-hole is clogged；Step 4：Circuit patterns etching processing is carried out to the circuit board after filling；Step 5：Each figure layer coating processing is carried out to the circuit board after etching processing and obtains finished product, secondary infiltration can be hindered by this method by realizing, and improve the technique effect of attenuator Project Product yield.
Description
Technical field
The present invention relates to circuit board manufacture field, in particular it relates to a kind of numerical-control attenuator QFN packaging ground pads
Circuit board processing method.
Background technology
In the prior art, existing processing method is：Blanking → drilling → hole metallization → circuit diagram etching → each figure
Each figure layer coating → profile (punching/milling) → test-based examination of layer etc..
And there is following technical problem in method of the prior art：Finished metal hole and circuit board element face, ground connection
Face insertion, without any welding resistance measure, is welded again after causing circuit board mounting related components, and attenuator project QFN will be caused to encapsulate
Class device ground pads scolding tin melts again, secondary infiltration, so as to cause the open circuit or poor short circuit of higher proportion, Denso process
Technology controlling and process is difficult, and attenuator Project Product yield is low.
The content of the invention
The invention provides a kind of processing method of the circuit board of numerical-control attenuator QFN packaging ground pads, solve
Existing processing method has that the control of Denso process is difficult, and attenuator Project Product yield relatively low technical problem is real
Secondary infiltration can be hindered by this method by having showed, and improve the technique effect of attenuator Project Product yield.
For achieving the above object, this application provides a kind of electricity of numerical-control attenuator QFN packaging ground pads
The processing method of road plate, the processing method includes：
Step 1：Drill on circuit boards；
Step 2：Copper-coating is carried out to the hole processed in step 1 and obtains plated through-hole；
Step 3：Plated through-hole is clogged；
Step 4：Circuit patterns etching processing is carried out to the circuit board after filling；
Step 5：Each figure layer coating processing is carried out to the circuit board after etching processing and obtains finished product.
Wherein, the principle of the application is：After technique obtains plated through-hole, plated through-hole is clogged, to metallization
Hole is separated, it is to avoid ground pad scolding tin carries out secondary infiltration after melting again, and circuit board is protected, product is improved
Yield.
Further, step A is also included between step 3 and step 4：Circuit board after filling is carried out at secondary heavy copper
Reason, then carries out surface polishing.Whole plate is sunk after copper again, and filling position is visually invisible, and whole QFN ground pads are visual
For non-porous pad, it is easy to the design of follow-up solder(ing) paste printed steel mesh opening or preforming land pattern；After polishing, in hole both sides shape
Into flat end face, while ensureing that uniformity, specification of whole plate copper thickness etc. meets design requirement.
Further, it is characterised in that choke material is packed in the middle part of plated through-hole so that plated through-hole top and bottom
Cut-off.There is objective difference in one side packing material, less amount of use can reduce high/low temperature operating mode with covering copper product characteristic
Under structure profit；On the other hand secondary heavy copper is needed after filling, filling can ensure that the equal of the secondary heavy copper thickness in both sides at middle part
Even degree.
Further, categoryization hole choke material is epoxy resin.
Further, epoxy resin is low stress, i.e., potting resin should select what the thermal coefficient of expansion with copper was closer to
Material, will not cause pad plane excessively to protrude or be recessed in high temperature, low-temperature condition.Specifically should be according to circuit board substrate thickness
(hole depth, filling amount) and copper clad layers design thickness (secondary heavy copper layer thickness) are calculated.Described circuit board and filling perforation resin material,
The selection of the packing material thermal coefficient of expansion, it is related to board substrate thickness (filling thickness), aperture, in 1.0mm thickness bases
Plate, 0.018mm apply copper,Plated through-hole, during filling thickness 0.5mm~0.8mm, the thermal expansion system of optional resin material
Number approximate range is 40ppm/K~80ppm/K.Calculating logic is：Work in product, store, assemble full temperature section, circuit board base
Plate, deposited copper, the thermal boundary shrinkage size difference of packing material are no more than 0.05mm (planarity requirements).
Further, categoryization hole choke material is silver paste.
Further, categoryization hole choke material is starched for copper.Plated through-hole clogs process：Use low-strees epoxy resin
The stage casing position of plated through-hole is clogged, passage is infiltrated to scolding tin in barrier metal hole, while ensureing the electric of plated through-hole
Connection performance is unaffected.In addition to low-strees epoxy resin, the choke materials such as silver paste, copper slurry are also can select, to meet low resistance
Or low thermal resistance requirement.
Further, the technique of the filling is " filling holes with resin ".It can disposably be injected using mould, customize fixture
The various ways such as guarantor's type, preformed particles bonding filling are injected, to adapt to the circuit base material and design requirement of different size.
Further, the circuit board is the grounded part that class device bonding pad is encapsulated for QFN.
One or more technical schemes that the application is provided, have at least the following technical effects or advantages：
The present invention uses new circuit board processing method, is internally formed scolding tin infiltration blocking face in plated through-hole, it is ensured that dress
Secondary it can not infiltrated again with process, QFN device assembling is bad caused by preventing therefore, improves attenuator Project Product yield
Technique effect.
Brief description of the drawings
Accompanying drawing described herein is used for providing further understanding the embodiment of the present invention, constitutes one of the application
Point, do not constitute the restriction to the embodiment of the present invention；
Fig. 1 is the work flow schematic diagram of circuit board in the prior art；
Fig. 2 is plated through-hole filling schematic diagram in the application；
Fig. 3 is the processing method schematic diagram of the circuit board of numerical-control attenuator in the application.
Embodiment
The invention provides a kind of processing method of the circuit board of numerical-control attenuator QFN packaging ground pads, solve
Existing processing method has that the control of Denso process is difficult, and attenuator Project Product yield relatively low technical problem is real
Secondary infiltration can be hindered by this method by having showed, and improve the technique effect of attenuator Project Product yield.
It is below in conjunction with the accompanying drawings and specific real in order to be more clearly understood that the above objects, features and advantages of the present invention
Mode is applied the present invention is further described in detail.It should be noted that in the case where not conflicting mutually, the application's
Feature in embodiment and embodiment can be mutually combined.
Many details are elaborated in the following description to facilitate a thorough understanding of the present invention, still, the present invention may be used also
Implemented with the other modes in the range of being different from being described herein using other, therefore, protection scope of the present invention is not by under
The limitation of specific embodiment disclosed in face.
Fig. 1-Fig. 3 is refer to, this application provides a kind of circuit board of numerical-control attenuator QFN packaging ground pads
Processing method, the processing method includes：
Step 1：Drill on circuit boards；
Step 2：Copper-coating is carried out to the hole processed in step 1 and obtains plated through-hole；
Step 3：Plated through-hole is clogged；
Step 4：Circuit patterns etching processing is carried out to the circuit board after filling；
Step 5：Each figure layer working process is carried out to the circuit board after etching processing and obtains finished product.
Wherein, drill existing all using accurate NC multi-head drilling machine, worked by the formula finished in advance, essence can be carried out
True positioning, hole metallization is PTH (plating through hole), is to carry out electroless copper plating to whole layout, so as to allow
Originally the thin copper of last layer is also deposited on the borehole wall without copper.The purpose of etching is exactly to remove unnecessary copper, with needed for obtaining
The circuitous pattern wanted.Top level circuit diagram shape, bottom circuitous pattern, welding resistance figure, word are contained in usual board design file
Multiple figure layers such as silk-screen figure are accorded with, are completed after circuitous pattern processing, routinely technique the processing of other graph layers can be completed.
In attenuator project circuit board processing method, after " plated through-hole sink copper " process, " plated through-hole is filled out for increase
Plug ", " heavy copper is simultaneously polished " process.
Plated through-hole clogs process：The stage casing position of plated through-hole is clogged using low-strees epoxy resin, to obstruct gold
Scolding tin infiltrates passage in categoryization hole, while ensureing that the Electric connection characteristic of plated through-hole is unaffected.Except low-strees epoxy resin
Outside, the choke materials such as silver paste, copper slurry are also can select, to meet low resistance or low thermal resistance requirement.
Heavy copper and polishing process：Whole plate heavy copper and polishing again, forms flat end face, while ensureing whole plate copper in hole both sides
Uniformity, specification of paper tinsel thickness etc. meet design requirement.Subsequent handling is identical with background technology constant.
After by the checking of authentic specimen number, statistics, analysis, the technology of the present invention effect is as follows：
Circuit board supplied materials, its QFN device pad position is for background technology product, and plated through-hole is invisible, can
It is considered as overall pad, pore size distribution is no longer considered when designing solder printing steel mesh, steel mesh design can be simplified；
PCBA finished products do not find that QFN device has outward appearance, structure, function aspects Indexes Abnormality, meet design through functional test
It is required that；
Circuit board carries out secondary welding with box body, is performed by existing Product Process scheme, any change is not done.Process finished product
After testing, outward appearance, structure, function aspects Indexes Abnormality are not found；
Carrying out every reliability test by attenuator Project Technical agreement, (high/low-temperature impact, high and low temperature environment work, at random
Vibration etc.) after, index still meets design requirement.
Implemented by the checking of the present invention, effect of the attenuator Project Product during industrialization production can be effectively improved
Rate, yield, while ensureing the uniformity of product complex art requirement.
, but those skilled in the art once know basic creation although preferred embodiments of the present invention have been described
Property concept, then can make other change and modification to these embodiments.So, appended claims are intended to be construed to include excellent
Select embodiment and fall into having altered and changing for the scope of the invention.
Obviously, those skilled in the art can carry out the essence of various changes and modification without departing from the present invention to the present invention
God and scope.So, if these modifications and variations of the present invention belong to the scope of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to comprising including these changes and modification.
Claims (9)
1. a kind of processing method of the circuit board QFN packaging ground pads of numerical-control attenuator, it is characterised in that the processing
Method includes：
Step 1：Drill on circuit boards；
Step 2：Copper-coating is carried out to the hole processed in step 1 and obtains plated through-hole；
Step 3：Plated through-hole is clogged；
Step 4：Circuit patterns etching processing is carried out to the circuit board after filling；
Step 5：Each figure layer coating processing is carried out to the circuit board after etching processing and obtains finished product.
2. the processing method of the circuit board of numerical-control attenuator QFN packaging ground pads according to claim 1, it is special
Levy and be, step A is also included between step 3 and step 4：Secondary copper-coating is carried out to the circuit board after filling, then carried out
Surface polishing.
3. the processing method of the circuit board of numerical-control attenuator QFN packaging ground pads according to claim 1, it is special
Levy and be, choke material is packed in the middle part of plated through-hole so that plated through-hole top separates with bottom.
4. the processing method of the circuit board of numerical-control attenuator QFN packaging ground pads according to claim 1, it is special
Levy and be, categoryization hole choke material is epoxy resin.
5. the processing method of the circuit board of numerical-control attenuator QFN packaging ground pads according to claim 4, it is special
Levy and be, epoxy resin thermal coefficient of expansion causes scope to be 40ppm/K~80ppm/K.
6. the processing method of the circuit board of numerical-control attenuator QFN packaging ground pads according to claim 1, it is special
Levy and be, categoryization hole choke material is silver paste.
7. the processing method of the circuit board of numerical-control attenuator QFN packaging ground pads according to claim 1, it is special
Levy and be, categoryization hole choke material is starched for copper.
8. the processing method of the circuit board of numerical-control attenuator QFN packaging ground pads according to claim 1, it is special
Levy and be, the technique of the filling is filling holes with resin technique.
9. the processing method of the circuit board of numerical-control attenuator QFN packaging ground pads according to claim 1, it is special
Levy and be, the circuit board is that the circuit board in class device is encapsulated for QFN.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710665740.0A CN107278036A (en) | 2017-08-07 | 2017-08-07 | A kind of processing method of the circuit board of numerical-control attenuator QFN packaging ground pads |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710665740.0A CN107278036A (en) | 2017-08-07 | 2017-08-07 | A kind of processing method of the circuit board of numerical-control attenuator QFN packaging ground pads |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107278036A true CN107278036A (en) | 2017-10-20 |
Family
ID=60079997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710665740.0A Pending CN107278036A (en) | 2017-08-07 | 2017-08-07 | A kind of processing method of the circuit board of numerical-control attenuator QFN packaging ground pads |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107278036A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6426011B1 (en) * | 1999-04-02 | 2002-07-30 | International Business Machines Corporation | Method of making a printed circuit board |
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| US20100170088A1 (en) * | 2007-06-21 | 2010-07-08 | Chien-Wei Chang | Method Of Fabricating Board Having High Density Core Layer And Structure Thereof |
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| CN104717845A (en) * | 2013-12-13 | 2015-06-17 | 深圳崇达多层线路板有限公司 | Technological method for outer layer circuit board resin hole plugging of multi-layer circuit board |
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-
2017
- 2017-08-07 CN CN201710665740.0A patent/CN107278036A/en active Pending
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|---|---|---|---|---|
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171020 |
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| RJ01 | Rejection of invention patent application after publication |