CN108882507A - Thick copper heat dissipation PCB processing technology - Google Patents
Thick copper heat dissipation PCB processing technology Download PDFInfo
- Publication number
- CN108882507A CN108882507A CN201810876881.1A CN201810876881A CN108882507A CN 108882507 A CN108882507 A CN 108882507A CN 201810876881 A CN201810876881 A CN 201810876881A CN 108882507 A CN108882507 A CN 108882507A
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- CN
- China
- Prior art keywords
- copper foil
- gum
- substrate
- piece
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a kind of thick copper heat dissipation PCB processing technology, one step press carries out back-to-back folded method using gum copper foil, forms double-sided symmetrical structure；After inner figure etching, in gap after resin to be filled in etched figure, so that resin and copper face are in the same plane, carry out second pressing again at this time and form six laminates, the glue of bonding sheet is no longer needed to for filling etched gap, it is ensured that after pressing without starved, the problems such as filler is bad and copper face is recessed；Then scoreboard is carried out, is divided into two Zhang San's laminates, one times of improving productivity.The thickness copper radiates PCB processing technology using back-to-back folded method, solves threeply copper sheet warpage issues；Resin is first filled in after thick copper etching to press again, solves pressing starved, copper face depression problem；The printing of single side resin is printed in two times, and control single resin prints wet-film thickness, improves warpage caused by resin shrinkage；Meet properties of product requirement, improves product processing efficiency.
Description
Technical field
The present invention relates to a kind of PCB processing technology more particularly to a kind of thick copper heat dissipation PCB processing technologys.
Background technique
Continuous with smart mobile phone application is popularized, and demand of the people to mobile phone photograph is also constantly promoted, and mobile phone supplies
Quotient is answered also to publicize using camera function as an attraction outstanding.The flash lamp of mobile phone photograph is mainly with ceramics envelope at present
Dress when if necessary to be compensated with sheen or changes in temperature light, needs to use more flash lamps, and needs to carry out every flash lamp
Independent control.Thick copper heat dissipation flash lamp is a kind of novel flash light techniques, has fully considered the cooling requirements of flash of light lamp chip,
Thick copper design is used inside assist side, can increase the heat-sinking capability of PCB.
Thick copper heat dissipation product is three ply board, and internal using thick copper design, technological difficulties are：PCB industry often uses copper foil thick
Degree is H oz~1oz, and the copper thickness of thick copper heat dissipation interiors of products need to just can satisfy its cooling requirements greater than 4oz；In addition,
Bonding sheet commonly used in the trade is with a thickness of 30~150 μm, it is contemplated that the built-in space of mobile phone, need to the finished product plate thickness of thick copper template into
Row control, then the actual (real) thickness general control after bonding sheet pressing is at 40 μm or less；General flow is：Sawing sheet → pressing is (two-sided
Plate) → thickness copper etching → pressing (three ply board) → outer graphics etching →... ....
Wherein, the etching technique of internal thick copper is：It needs after thick copper, bonding sheet, conventional copper foil are first pressed into dual platen, then
Carry out inner-layer thick copper etching；And two sides copper thickness is asymmetric after pressing, and can have serious warpage issues；Internal thickness copper etching
Stitching problems afterwards：The presently used bonding sheet thickness of PCB industry is unable to satisfy the filler to thick copper face, will cause pressing cavity with
And copper face recess etc. is bad, seriously affects properties of product.
If two problems as above can not solve, product can not continue to produce, and there are no batch feasibilities.
Summary of the invention
In order to overcome drawbacks described above, the present invention provides a kind of thick copper heat dissipation PCB processing technologys, meet sheen or warm light is dodged
Demand of the light lamp to PCB substrate.
The present invention is to solve technical solution used by its technical problem：
A kind of thickness copper heat dissipation PCB processing technology, which is characterized in that include the following steps：
Step 1, one step press prepares：Prepare two thick copper foil, two PP pieces, two gum copper foils and auxiliary PP piece, and
It stacks and aligns according to the sequence of thick copper foil, PP piece, gum copper foil, auxiliary PP piece, gum copper foil, PP piece and thick copper foil, wherein
The gum copper foil is pressed with carrier by glue-line by the thin copper foil of 3 μm or 5 μm, and the thin copper foil is towards the PP
Piece；It is described thickness copper foil with a thickness of 4~15oz；
Step 2, one step press：By the thick copper foil aligned, PP piece, gum copper foil, auxiliary PP piece, gum copper foil, PP piece
It presses to form four layers of first substrate with thick copper foil；
Step 3, a route：Line pattern will be produced on the thick copper foil layer in two outside of the first substrate, and obtain the
Two substrates；
Step 4, resin is filled in：Resin will be filled up in the line pattern of the second substrate and on lateral surface, obtains third base
Plate；
Step 5, it grinds：By the resin ground removal outside two of the third substrate thick copper foil, tetrabasal is obtained；
Step 6, second pressing：A PP piece and a gum will be laminated respectively on two lateral surfaces of the tetrabasal again
It is pressed after copper foil, wherein the thin copper foil of the gum copper foil obtains six layers of the 5th substrate towards the PP piece；
Step 7, a scoreboard：By on the gum copper foil in two outside of the 5th substrate carrier and glue-line remove, obtain
6th substrate；
Step 8, secondary scoreboard：By the 6th substrate respectively along the thin copper foil and glue for being located in the middle two layers of gum copper foil
It is separated at layer, obtains two thick copper heat dissipation pcb boards containing three layers of copper foil.
As a further improvement of the present invention, in the step 1, the size of the thickness copper foil, PP piece and auxiliary PP piece is big
In the gum copper foil, and the thick copper foil is equipped with registration holes with respect to the peripheral region of gum copper foil.
As a further improvement of the present invention, in the step 4, first one will be carried out in the line pattern of the second substrate
Secondary plug resin, then secondary plug resin will be carried out on the lateral surface of the second substrate.
As a further improvement of the present invention, the carrier of the gum copper foil is the copper foil of H oz.
As a further improvement of the present invention, the carrier of the gum copper foil is plasticity separated type material.
The beneficial effects of the invention are as follows：The thickness copper radiates PCB processing technology using back-to-back folded method, solves threeply copper sheet
Warpage issues；Resin is first filled in after thick copper etching to press again, solves pressing starved, copper face depression problem；The printing of single side resin is divided to two
Secondary printing, control single resin print wet-film thickness, improve warpage caused by resin shrinkage；Meet properties of product requirement, improves
Product processing efficiency.
Detailed description of the invention
Fig. 1 is step 1 structural schematic diagram of the present invention；
Fig. 2 is gum copper foil structure schematic diagram of the present invention；
Fig. 3 is step 2 structural schematic diagram of the present invention；
Fig. 4 is step 3 structural schematic diagram of the present invention；
Fig. 5 is step 4 structural schematic diagram one of the present invention；
Fig. 6 is step 4 structural schematic diagram two of the present invention；
Fig. 7 is step 5 structural schematic diagram of the present invention；
Fig. 8 is step 6 structural schematic diagram of the present invention；
Fig. 9 is step 7 structural schematic diagram of the present invention；
Figure 10 is step 8 structural schematic diagram of the present invention；
Figure 11 is the thick copper heat dissipation pcb board structural schematic diagram that the secondary scoreboard of the present invention obtains；
Figure 12 is gum copper foil of the present invention and thick copper foil iterative structure schematic diagram.
In conjunction with attached drawing, make the following instructions：
1 --- thick copper foil；2 --- PP piece；
3 --- gum copper foil；4 --- auxiliary PP piece；
5 --- line graph graphic；6 --- resin；
7 --- registration holes；31 --- thin copper foil；
32 --- glue-line；33 --- carrier；
101 --- first substrate；102 --- the second substrate；
103 --- third substrate；104 --- tetrabasal；
105 --- the 5th substrate；106 --- the 6th substrate；
107 --- thick copper heat dissipation pcb board.
Specific embodiment
Below in conjunction with attached drawing, elaborate to a preferred embodiment of the invention.But protection scope of the present invention is not
Be limited to following embodiments, i.e., in every case with simple equivalence changes made by scope of the present invention patent and description with repair
Decorations, all still belong within the invention patent covering scope.
Include the following steps refering to attached drawing 1-12 for a kind of thick copper heat dissipation PCB processing technology of the present invention：
Step 1, one step press prepares：Refering to fig. 1-2, prepare the two thick gum copper foil 3 of PP piece 2, two of copper foil 1, two
It is and folded according to the sequence of thick copper foil, PP piece, gum copper foil, auxiliary PP piece, gum copper foil, PP piece and thick copper foil with auxiliary PP piece 4
It puts and aligns, wherein the gum copper foil is pressed with carrier 33 by glue-line 32 by 3 μm or 5 μm of thin copper foil 31, and institute
Thin copper foil is stated towards the PP piece；It is described thickness copper foil with a thickness of 4~15oz；
Step 2, one step press：By the thick copper foil aligned, PP piece, gum copper foil, auxiliary PP piece, gum copper foil, PP piece
It presses to form four layers of first substrate 101 (symmetrical structure) with thick copper foil, refering to Fig. 3；
Step 3, a route：Line pattern 5 will be produced on the thick copper foil layer in two outside of first substrate, refering to figure
4, obtain the second substrate 102；
Step 4, resin is filled in：Refering to Fig. 5-6, resin 6 will be filled up in the line pattern of the second substrate and on lateral surface,
Obtain third substrate 103；
Step 5, it grinds：Refering to Fig. 7, the resin ground outside two of the third substrate thick copper foils is removed, obtains the
Tetrabasal 104；
Step 6, second pressing：Refering to Fig. 8, will be laminated respectively again on two lateral surfaces of the tetrabasal PP piece and
It is pressed after one gum copper foil, wherein the thin copper foil of the gum copper foil obtains six layers of the 5th substrate towards the PP piece
105；
Step 7, a scoreboard：Refering to Fig. 9, by the gum copper foil in two outside of the 5th substrate carrier and glue-line tear
It removes, obtains the 6th substrate 106；
Step 8, secondary scoreboard：Refering to fig. 10, by the 6th substrate respectively along being located in the middle two layers of gum copper foil
It is separated at thin copper foil and glue-line, obtains two thick copper containing three layers of copper foil and radiate pcb boards 107, refering to fig. 11.
Preferably, in the step 1, the size of the thickness copper foil 1, PP piece and auxiliary PP piece is greater than the gum copper foil,
And the thick copper foil is equipped with registration holes 7 with respect to the peripheral region of gum copper foil.Because gum copper foil thin copper foil layer and carrier it
Between there are glue-lines, this glue-line is without water-proof function.Product can first practice shooting after pressing, reuse wad cutter and carry out route contraposition.If
Target position is located at gum copper foil region, and when product carries out circuit etching, liquid medicine can penetrate into the glue between thin copper foil layer and carrier
Layer, causes the separation of thin copper foil and carrier, while can also remain liquid medicine in interiors of products.Therefore, when pressing stacked board design, gum
Copper foil size is less than thick copper foil and PP chip size, and refering to fig. 12.
Preferably, in the step 4, primary plug resin will first be carried out in the line pattern of the second substrate, then by institute
It states and carries out secondary plug resin on the lateral surface of the second substrate, refering to Fig. 4-5.
Preferably, the carrier of the gum copper foil is the copper foil or plasticity separated type material of H oz.
The thickness copper radiates PCB processing technology one step press using the back-to-back folded method of gum copper foil progress, forms double-sided symmetrical
Structure；After inner figure etching, in the gap after resin to be filled in etched figure, so that resin and copper face are in the same plane,
It carries out second pressing again at this time and forms six laminates, the glue of bonding sheet is no longer needed to for filling etched gap, it is ensured that intact after pressing
The problems such as glue, filler are bad and copper face is recessed；Then scoreboard is carried out, is divided into two Zhang San's laminates, one times of improving productivity.It is main
It solves the problems, such as that the warpage that traditional handicraft generates, pressing starved, filler be bad, copper face recess, meets properties of product requirement.
It can be seen that thickness copper heat dissipation PCB processing technology uses back-to-back folded method, threeply copper sheet warpage issues are solved；
Resin is first filled in after thick copper etching to press again, solves pressing starved, copper face depression problem；The printing of single side resin is printed in two times, is controlled
Single resin processed prints wet-film thickness, improves warpage caused by resin shrinkage；Meet properties of product requirement, improves product processing effect
Rate.
Claims (5)
- The PCB processing technology 1. a kind of thickness copper radiates, which is characterized in that include the following steps：Step 1, one step press prepares：Prepare two thick copper foil (1), two PP pieces (2), two gum copper foils (3) and auxiliary PP Piece (4), and stack according to the sequence of thick copper foil, PP piece, gum copper foil, auxiliary PP piece, gum copper foil, PP piece and thick copper foil and right Position, wherein the gum copper foil is pressed with carrier (33) by glue-line (32) by 3 μm or 5 μm of thin copper foil (31), and institute Thin copper foil is stated towards the PP piece；It is described thickness copper foil with a thickness of 4~15oz；Step 2, one step press：By the thick copper foil aligned, PP piece, gum copper foil, auxiliary PP piece, gum copper foil, PP piece and thickness Copper foil presses to form four layers of first substrate (101)；Step 3, a route：Line pattern (5) will be produced on the thick copper foil layer in two outside of first substrate, obtains second Substrate (102)；Step 4, resin is filled in：Resin (6) will be filled up in the line pattern of the second substrate and on lateral surface, obtain third substrate (103)；Step 5, it grinds：By the resin ground removal outside two of the third substrate thick copper foil, tetrabasal (104) are obtained；Step 6, second pressing：A PP piece and a gum copper foil will be laminated respectively on two lateral surfaces of the tetrabasal again After press, wherein the thin copper foil of the gum copper foil obtains six layers of the 5th substrate (105) towards the PP piece；Step 7, a scoreboard：By on the gum copper foil in two outside of the 5th substrate carrier and glue-line remove, obtain the 6th Substrate (106)；Step 8, secondary scoreboard：By the 6th substrate, edge is located in the middle at the thin copper foil and glue-line of two layers of gum copper foil respectively Separation obtains two thick copper heat dissipations pcb board (107) containing three layers of copper foil.
- The PCB processing technology 2. thickness copper according to claim 1 radiates, it is characterised in that：In the step 1, the thickness copper The size of foil (1), PP piece and auxiliary PP piece is greater than the gum copper foil, and the thick copper foil is with respect to the peripheral region of gum copper foil It is equipped with registration holes (7).
- The PCB processing technology 3. thickness copper according to claim 2 radiates, it is characterised in that：It, first will be described in the step 4 Primary plug resin is carried out in the line pattern of the second substrate, then secondary plug resin will be carried out on the lateral surface of the second substrate.
- The PCB processing technology 4. thickness copper according to claim 1 radiates, it is characterised in that：The carrier of the gum copper foil is H The copper foil of oz.
- The PCB processing technology 5. thickness copper according to claim 1 radiates, it is characterised in that：The carrier of the gum copper foil is Plasticity separated type material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810876881.1A CN108882507A (en) | 2018-08-03 | 2018-08-03 | Thick copper heat dissipation PCB processing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810876881.1A CN108882507A (en) | 2018-08-03 | 2018-08-03 | Thick copper heat dissipation PCB processing technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108882507A true CN108882507A (en) | 2018-11-23 |
Family
ID=64307294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810876881.1A Pending CN108882507A (en) | 2018-08-03 | 2018-08-03 | Thick copper heat dissipation PCB processing technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108882507A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114190011A (en) * | 2021-11-11 | 2022-03-15 | 江苏普诺威电子股份有限公司 | High-heat-dissipation PCB and manufacturing process thereof |
| CN117881096A (en) * | 2024-03-13 | 2024-04-12 | 江苏普诺威电子股份有限公司 | Heat dissipation packaging substrate and processing method thereof |
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| KR20020085999A (en) * | 2001-05-10 | 2002-11-18 | 엘지전자 주식회사 | Making method of PCB |
| US20100096078A1 (en) * | 2008-10-16 | 2010-04-22 | Shinko Electric Industries Co., Ltd. | Method of manufacturing wiring substrate |
| US20140109402A1 (en) * | 2012-07-18 | 2014-04-24 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing metal core inserted printed circuit board |
| CN105517370A (en) * | 2015-11-27 | 2016-04-20 | 广州兴森快捷电路科技有限公司 | Circuit board pad machining method |
| CN106211638A (en) * | 2016-07-26 | 2016-12-07 | 上海美维科技有限公司 | A kind of processing method of ultra-thin multilayer printed circuit board |
-
2018
- 2018-08-03 CN CN201810876881.1A patent/CN108882507A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020085999A (en) * | 2001-05-10 | 2002-11-18 | 엘지전자 주식회사 | Making method of PCB |
| US20100096078A1 (en) * | 2008-10-16 | 2010-04-22 | Shinko Electric Industries Co., Ltd. | Method of manufacturing wiring substrate |
| US20140109402A1 (en) * | 2012-07-18 | 2014-04-24 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing metal core inserted printed circuit board |
| CN105517370A (en) * | 2015-11-27 | 2016-04-20 | 广州兴森快捷电路科技有限公司 | Circuit board pad machining method |
| CN106211638A (en) * | 2016-07-26 | 2016-12-07 | 上海美维科技有限公司 | A kind of processing method of ultra-thin multilayer printed circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114190011A (en) * | 2021-11-11 | 2022-03-15 | 江苏普诺威电子股份有限公司 | High-heat-dissipation PCB and manufacturing process thereof |
| CN114190011B (en) * | 2021-11-11 | 2024-02-23 | 江苏普诺威电子股份有限公司 | High-heat-dissipation PCB and manufacturing process thereof |
| CN117881096A (en) * | 2024-03-13 | 2024-04-12 | 江苏普诺威电子股份有限公司 | Heat dissipation packaging substrate and processing method thereof |
| CN117881096B (en) * | 2024-03-13 | 2024-05-24 | 江苏普诺威电子股份有限公司 | Heat dissipation packaging substrate and processing method thereof |
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| PB01 | Publication | ||
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Application publication date: 20181123 |