CN107072078A - A kind of solution rigid-flex combined board folds the asymmetric slab warping method caused of structure - Google Patents
A kind of solution rigid-flex combined board folds the asymmetric slab warping method caused of structure Download PDFInfo
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- CN107072078A CN107072078A CN201710266828.5A CN201710266828A CN107072078A CN 107072078 A CN107072078 A CN 107072078A CN 201710266828 A CN201710266828 A CN 201710266828A CN 107072078 A CN107072078 A CN 107072078A
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- China
- Prior art keywords
- rigid
- daughter board
- flex combined
- slab warping
- board
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The asymmetric slab warping method caused of structure is folded the invention discloses a kind of solution rigid-flex combined board, is comprised the following steps：Copper foil, first medium layer, rigid daughter board, second dielectric layer, flexible daughter board are stacked gradually into placement, stepped construction is obtained；Stitching operation is carried out to the stepped construction.The present invention accomplishes rigid daughter board thickness of two sides almost symmetry using rigid daughter board as Die Gou centers, it is to avoid because flexible daughter board is different from the harmomegathus coefficient of rigid daughter board, in the bonding processes asymmetric slab warping caused of thermal stress.
Description
Technical field
The present invention relates to rigid-flex combined board manufacture technology field, and in particular to it is asymmetric that one kind solves the folded structure of rigid-flex combined board
The slab warping method caused.
Background technology
In printed circuit board manufacturing process, existing common asymmetric rigid-flex combined board pressing structure as shown in Figure 1 is as follows：
Pressed after rigid daughter board 1, PP pieces 2, flexible daughter board 3 are stacked gradually；Above-mentioned compression method can have following defect：Due to
Flexible daughter board is different from the thickness and harmomegathus coefficient of rigid daughter board, causes flexible daughter board layer and rigid daughter board in bonding processes
The thermal stress that layer is subject to is asymmetric, and warpage occurs in pressing rear board；When the angularity of wiring board, to have exceeded IPC regulations (right
In surface mounted component printed board its distortion and bow standard) 0.75% requirement, in SMT and PCB production technologies, weldering
It can cause that the positioning of component is inaccurate and pin is irregular when connecing component, the assembling and installment work to the later stage bring tired
Difficulty, so as to influence the use of monoblock wiring board or even directly result in scrap.
The content of the invention
There is provided one kind for the problem of present invention slab warping occurs for existing asymmetric rigid-flex combined board in bonding processes
Solve rigid-flex combined board and fold the structure asymmetric slab warping method caused, it is to avoid because flexible daughter board and rigid daughter board thickness and rise
Contracting coefficient is different, the asymmetric slab warping caused of thermal stress being subject in bonding processes.
In order to solve the above-mentioned technical problem, the asymmetric plate caused of structure is folded the invention provides a kind of solution rigid-flex combined board
Warp methods, comprise the following steps：
S1, stacking：Copper foil, first medium layer, rigid daughter board, second dielectric layer, flexible daughter board are stacked gradually into placement, obtained
To stepped construction；
S2, pressing：Stitching operation is carried out to the stepped construction.
Preferably, the thickness and the second dielectric layer and the thickness sum of soft daughter board dielectric layer of the first medium layer
Difference is no more than 0.01mm.
Preferably, the first medium layer includes two panels PP pieces, and the second dielectric layer is a piece of PP pieces.
Preferably, in step S2, the technological parameter of the pressing is：Vacuum is -100-98KPa, and pressure is 1-3MPa,
Hot pressing temperature is 140-210 DEG C, and hot pressing time is 2-3h, and temperature of colding pressing is 20-50 DEG C, and the cold pressing time is 0.5-1.5h.
Compared with prior art, the present invention has the advantages that：
The present invention is in original pressing structure：On the basis of rigid daughter board, PP pieces, flexible daughter board are stacked gradually, with rigidity
Daughter board is Die Gou centers, and proper amount of PP pieces and copper foil are folded in the opposite side of rigid daughter board, makes the upper layer of rigid daughter board with
The thickness of side layer is close；The present invention accomplishes rigid daughter board thickness of two sides almost symmetry using rigid daughter board as Die Gou centers, it is to avoid
Because flexible daughter board is different from the harmomegathus coefficient of rigid daughter board, the asymmetric slab warping caused of thermal stress in bonding processes.
Brief description of the drawings
Fig. 1 is the pressing stack schematic diagram of existing rigid-flex combined board；
Fig. 2 is the pressing stack schematic diagram of rigid-flex combined board in embodiment.
Embodiment
In order to more fully understand the technology contents of the present invention, below in conjunction with accompanying drawing and specific embodiment to the present invention's
Technical scheme is described further and illustrated.
Embodiment：
As shown in Fig. 2 a kind of solution rigid-flex combined board shown in the present embodiment folds the asymmetric slab warping method caused of structure,
Comprise the following steps：
A, with existing making wiring board techniques by design requirement make flexible daughter board 3 and rigid daughter board 1, flexible daughter board 3
The thickness of dielectric layer is 0.05mm, and the thickness of the dielectric layer of rigid daughter board 1 is 0.13mm；
B, the not gummosis PP pieces 2 and copper foil 4 for cutting out suitable dimension, wherein size list of the size of PP pieces than rigid daughter board
The small 1mm in side, the size big 50mm more unilateral than the size of rigid daughter board of copper foil, the thickness of PP pieces 2 is 0.06mm, the thickness of copper foil 4
For Hoz (18 μm)；
C, copper foil 4, PP pieces 2, PP pieces 2, rigid daughter board 1, PP pieces 2, flexible daughter board 3 stacked gradually into placement, be laminated
Structure；Wherein rigid daughter board and flexible daughter board without copper face upward；
D and then pressed according to the characteristic of plate from appropriate lamination, the technological parameter of pressing is：Vacuum
Spend for -100-98KPa, pressure is 1-3MPa, hot pressing temperature is 140-210 DEG C, and hot pressing time is 2-3h, and temperature of colding pressing is 20-
50 DEG C, the cold pressing time is 0.5-1.5h；Above-mentioned stepped construction is pressed to form one；Pressure can be made using above-mentioned pressing parameter
The adhesion of flexible daughter board and rigid daughter board after conjunction is stronger, and then improves the performance of rigid-flex combined board；
E, pressed after unnecessary edges of boards and copper foil are cut off together.
In the present embodiment, rigid daughter board upper dielectric folds the thickness and rigid daughter board lower media of structure layer (PP piece+PP pieces)
The thickness difference 0.01mm of folded structure layer (PP pieces+flexibility daughter board), makes the bunch media structure layer of rigid daughter board upper and lower sides accomplish substantially right
Claim, it is to avoid because flexible daughter board is from the thickness and harmomegathus coefficient of rigid daughter board different, thermal stress is asymmetric in bonding processes makes
Into slab warping.
The technical scheme provided above the embodiment of the present invention is described in detail, specific case used herein
Principle and embodiment to the embodiment of the present invention are set forth, and the explanation of above example is only applicable to help and understands this
The principle of inventive embodiments；Simultaneously for those of ordinary skill in the art, according to the embodiment of the present invention, in specific embodiment party
It will change in formula and application, in summary, this specification content should not be construed as limiting the invention.
Claims (4)
1. a kind of solution rigid-flex combined board folds the asymmetric slab warping method caused of structure, it is characterised in that comprise the following steps：
S1, stacking：Copper foil, first medium layer, rigid daughter board, second dielectric layer, flexible daughter board are stacked gradually into placement, layer is obtained
Stack structure；
S2, pressing：Stitching operation is carried out to the stepped construction.
2. solution rigid-flex combined board according to claim 1 folds the asymmetric slab warping method caused of structure, it is characterised in that
The thickness of the first medium layer is differed with the thickness sum of the second dielectric layer and soft daughter board dielectric layer to be no more than
0.01mm, the thickness of the soft daughter board is not include the thickness of layers of copper.
3. solution rigid-flex combined board according to claim 1 or 2 folds the asymmetric slab warping method caused of structure, its feature exists
In the first medium layer includes two panels PP pieces, and the second dielectric layer is a piece of PP pieces.
4. solution rigid-flex combined board according to claim 3 folds the asymmetric slab warping method caused of structure, it is characterised in that
In step S2, the technological parameter of the pressing is：Vacuum is -100-98KPa, and pressure is 1-3MPa, and hot pressing temperature is 140-
210 DEG C, hot pressing time is 2-3h, and temperature of colding pressing is 20-50 DEG C, and the cold pressing time is 0.5-1.5h.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710266828.5A CN107072078A (en) | 2017-04-21 | 2017-04-21 | A kind of solution rigid-flex combined board folds the asymmetric slab warping method caused of structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710266828.5A CN107072078A (en) | 2017-04-21 | 2017-04-21 | A kind of solution rigid-flex combined board folds the asymmetric slab warping method caused of structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107072078A true CN107072078A (en) | 2017-08-18 |
Family
ID=59601162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710266828.5A Pending CN107072078A (en) | 2017-04-21 | 2017-04-21 | A kind of solution rigid-flex combined board folds the asymmetric slab warping method caused of structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107072078A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111712068A (en) * | 2020-06-28 | 2020-09-25 | 珠海杰赛科技有限公司 | Method for reducing pressing warpage of asymmetric rigid-flex board |
| CN115038260A (en) * | 2022-07-06 | 2022-09-09 | 诚亿电子（嘉兴）有限公司 | Method for manufacturing high-frequency PCB with asymmetric stacking design |
| CN116033678A (en) * | 2022-12-15 | 2023-04-28 | 福莱盈电子股份有限公司 | Processing method for soft and hard combined plate for improving asymmetric structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103731977A (en) * | 2013-12-24 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | Non-symmetric flex-rigid combination circuit board and manufacturing method thereof |
| CN104619131A (en) * | 2015-02-13 | 2015-05-13 | 广州杰赛科技股份有限公司 | Asymmetric flex-rigid combined circuit board and preparation method thereof |
| CN205946323U (en) * | 2016-08-10 | 2017-02-08 | 奥士康精密电路（惠州）有限公司 | Novel three -layer PCB plate voltage stay knot constructs |
-
2017
- 2017-04-21 CN CN201710266828.5A patent/CN107072078A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103731977A (en) * | 2013-12-24 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | Non-symmetric flex-rigid combination circuit board and manufacturing method thereof |
| CN104619131A (en) * | 2015-02-13 | 2015-05-13 | 广州杰赛科技股份有限公司 | Asymmetric flex-rigid combined circuit board and preparation method thereof |
| CN205946323U (en) * | 2016-08-10 | 2017-02-08 | 奥士康精密电路（惠州）有限公司 | Novel three -layer PCB plate voltage stay knot constructs |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111712068A (en) * | 2020-06-28 | 2020-09-25 | 珠海杰赛科技有限公司 | Method for reducing pressing warpage of asymmetric rigid-flex board |
| CN111712068B (en) * | 2020-06-28 | 2021-09-14 | 珠海杰赛科技有限公司 | Method for reducing pressing warpage of asymmetric rigid-flex board |
| CN115038260A (en) * | 2022-07-06 | 2022-09-09 | 诚亿电子（嘉兴）有限公司 | Method for manufacturing high-frequency PCB with asymmetric stacking design |
| CN116033678A (en) * | 2022-12-15 | 2023-04-28 | 福莱盈电子股份有限公司 | Processing method for soft and hard combined plate for improving asymmetric structure |
| CN116033678B (en) * | 2022-12-15 | 2024-03-08 | 福莱盈电子股份有限公司 | Processing method for soft and hard combined plate for improving asymmetric structure |
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Application publication date: 20170818 |
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