CN105101640B - A kind of processing method of polytetrafluoroethylene (PTFE) step groove circuit board - Google Patents
A kind of processing method of polytetrafluoroethylene (PTFE) step groove circuit board Download PDFInfo
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- CN105101640B CN105101640B CN201410219478.3A CN201410219478A CN105101640B CN 105101640 B CN105101640 B CN 105101640B CN 201410219478 A CN201410219478 A CN 201410219478A CN 105101640 B CN105101640 B CN 105101640B
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Abstract
The invention discloses a kind of processing method of polytetrafluoroethylene (PTFE) step groove circuit board, the technical problem for producing PTFE step groove circuit boards to solve prior art to be difficult to.Method includes：The first laminate is provided, the first face of first laminate has step groove circuit；The second laminate is provided, the first face of second laminate has the auxiliary circuit corresponding with the step groove circuit position；High-temperaure coating is formed on the surface of the step groove circuit and auxiliary circuit；High-temperature laminating is carried out to first laminate and the second laminate, the polytetrafluoroethylene (PTFE) base material of first laminate and the second laminate is melted connection, wherein, the first face of first laminate is relative with the first face of second laminate；Correspond to the position of the auxiliary circuit, processing step groove on second laminate, the depth of step groove arrives at the faying face of the step groove circuit and the auxiliary circuit.
Description
Technical field
The present invention relates to circuit board technology field, and in particular to a kind of processing side of polytetrafluoroethylene (PTFE) step groove circuit board
Method.
Background technology
Polytetrafluoroethylene (PTFE) (Polytetrafluoroethylene, PTFE, also known as Teflon) printed circuit board (PCB)
(PrintedCircuitBoard, PCB), refer to form circuit board by the pressing of PTFE sheet materials.As needed, some PTFE circuits
Need to make step groove on plate, and step trench bottom needs to form step groove circuit.
The processing method of general step groove circuit board is：Pressing forms the laminate of non-step groove level first, is being laminated
The face to be laminated of plate forms step groove circuit and other circuitous patterns, and places pad on step groove circuit, then presses
The laminate of step groove level, required multi-layer sheet is formed, then slotted in multilayer plate surface using controlled depth milling technique, manifested
Pad, and pad is removed, forming bottom has the step groove of step groove circuit.
Compared with the circuit board of the materials such as epoxy resin, PTFE base materials are partially soft, especially in the design of microwave antenna plate, institute
In the case that the PTFE core thickness of use is very thin, and step groove depth is smaller, such as step groove depth is 3-10 mils (mil),
Because step groove is too shallow and PTFE base materials are partially soft, pad can be caused can not to fill in or easily come off, so that can not use above-mentioned
Processing technology makes the PTFE step groove circuit boards with step groove circuit.
The content of the invention
The embodiment of the present invention provides a kind of processing method of polytetrafluoroethylene (PTFE) step groove circuit board, to solve prior art hardly possible
To produce the technical problem of PTFE step groove circuit boards.
First aspect present invention provides a kind of processing method of polytetrafluoroethylene (PTFE) step groove circuit board, including：
The first laminate is provided, the first face of first laminate has step groove circuit；Second laminate, institute are provided
The first face for stating the second laminate has the auxiliary circuit corresponding with the step groove circuit position；In the step groove circuit
High-temperaure coating is formed with the surface of auxiliary circuit；High-temperature laminating is carried out to first laminate and the second laminate, makes institute
The polytetrafluoroethylene (PTFE) base material melting connection of the first laminate and the second laminate is stated, wherein, the first face of first laminate
It is relative with the first face of second laminate；Correspond to the position of the auxiliary circuit, processing on second laminate
Step groove, the depth of step groove arrive at the faying face of the step groove circuit and auxiliary circuit.
Therefore the embodiment of the present invention uses and carries out brown processing to the step groove circuit on the first and second laminates
Afterwards, pad is not pasted and does not have to prepreg, direct high-temperature laminating, is then gone out depth in formation multi-layer sheet Surface Machining and is arrived at step
The technical scheme of the step groove of groove circuit surface, achieve following technique effect：
The present invention program makes step groove, and without pasting pad, suitable for PTFE circuit boards, the step groove that is particularly suitable for use in is shallower
Situation, solve the problems, such as that prior art is difficult to produce PTFE step groove circuit boards；And directly enter for PTFE laminates
Row high-temperature laminating, not only will not be in glue and pollution more than step trench bottom residual, and need not use prepreg, thus reduces
Making programme, manufacture craft is simplified, improve the electric property of plate.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, below will be to institute in embodiment and description of the prior art
The accompanying drawing needed to use is briefly described, it should be apparent that, drawings in the following description are only some implementations of the present invention
Example, for those of ordinary skill in the art, on the premise of not paying creative work, can also be obtained according to these accompanying drawings
Obtain other accompanying drawings.
Fig. 1 is a kind of flow chart of the processing method of polytetrafluoroethylene (PTFE) step groove circuit board disclosed by the invention；
Fig. 2 a to 2e are that the processing polytetrafluoroethylregenerated step groove circuit board of the inventive method is used in one embodiment of the invention
In the schematic diagram in each stage.
Embodiment
The embodiment of the present invention provides a kind of processing method of polytetrafluoroethylene (PTFE) step groove circuit board, to solve prior art hardly possible
To produce the technical problem of PTFE step groove circuit boards.
In order that those skilled in the art more fully understand the present invention program, below in conjunction with the embodiment of the present invention
Accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only
The embodiment of a part of the invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill people
The every other embodiment that member is obtained under the premise of creative work is not made, it should all belong to the model that the present invention protects
Enclose.
Below by specific embodiment, it is described in detail respectively.
Embodiment one,
Fig. 1 is refer to, the embodiment of the present invention provides a kind of processing method of polytetrafluoroethylene (PTFE) (PTFE) step groove circuit board,
It may include：
110th, the first laminate is provided, the first face of first laminate has step groove circuit；And, there is provided second
Laminate, the first face of second laminate have the auxiliary circuit corresponding with the step groove circuit position.
In the embodiment of the present invention, it would be desirable to the PTFE step groove circuit boards of making, using its step groove bottom as interface, point
Solve as the first laminate and the second laminate, made respectively.
The first or second described laminate, can be double face copper or based on double face copper pressing and
Into multi-layer sheet, if multi-layer sheet, then before pressing, multiple-plate interior metal layer is processed as internal layer circuit layer.This
In inventive embodiments, so that the first or second laminate is all double face copper as an example.
As shown in Figure 2 a, this step uses etch process, respectively to the first face (upper table in figure of the first laminate 21
Face) and the first face (lower surface in figure) of the second laminate 22 be etched, the step groove in the face of the first laminate 21 first
Position forms step groove circuit 2101, and the step groove location in the face of the second laminate 22 first forms auxiliary circuit 2201.It is optional
, also it can form other circuitous patterns 2202 in the non-step groove location in the face of the second laminate 22 first.
Wherein, described auxiliary circuit 2201, can be the mirror image circuit of the step groove circuit, or or
Big copper face, or, other forms are can also be, this is not construed as limiting herein.
120th, high-temperaure coating is formed on the surface of the step groove circuit and auxiliary circuit.
As shown in Figure 2 b, step groove circuit 2101 and auxiliary circuit 2201 are surface-treated in this step, in step
The surface of groove circuit 2101 forms high-temperaure coating 2103, and high-temperaure coating 2203 is formed on the surface of auxiliary circuit 2201.Institute
It the surface treatment said, can be brown processing, such as can be specifically black oxidation processes or brown oxidation processes, it is now, described
High-temperaure coating 2103 or 2203 specifically refer to brown formation oxide layer.Wherein, step groove circuit 2101 and auxiliary circuit
The high-temperaure coating on 2201 surfaces, it can prevent that step groove circuit 2101 and auxiliary circuit 2201 combine excessively after subsequently pressing
Closely, prevent copper from spreading, so as to form more obvious, segregative combination in step groove circuit 2101 and auxiliary circuit 2201
Face.
In some other embodiment of the invention, described surface treatment, specifically it may also mean that：To the step groove circuit
Carry out brown or gold or silver or gold-plated processing；With brown or gold or silver or gold-plated place are carried out to the auxiliary circuit
Reason.
Wherein, auxiliary circuit from the high-temperaure coating of step groove circuit can be different, for example step groove circuit can be with
Do a layer brown, auxiliary circuit being fabricated to be golden, gold-plated, silver-plated, to change silver etc. in combination.Certainly, auxiliary circuit and step
The high-temperaure coating of groove circuit can also be identical.
130th, high-temperature laminating is carried out to first laminate and the second laminate, makes first laminate and the second layer
The polytetrafluoroethylene (PTFE) base material melting connection of pressing plate, wherein, the of the first face of first laminate and second laminate
It is simultaneously relative.
As shown in Figure 2 c, in this step, the first laminate 21 and the second laminate 22 are superimposed together, and first layer
First face of pressing plate is relative with the first face of the second laminate, i.e. makes step groove circuit 2101 and auxiliary circuit 2201 relative, tightly
Stick together；The then PTFE with the face of the first laminate 21 first of other circuitous patterns 2202 that the face of second laminate 22 first is formed
Base material is close together.
Then, high-temperature laminating is carried out, makes the melting connection of the polytetrafluoroethylene (PTFE) base material of the first laminate and the second laminate, will
First laminate 21 and the pressing of the second laminate 22 are integrated, and form multi-layer sheet 20.In some embodiments of the invention, described height
Temperature and pressure, which close, to be referred to：It is 300-400 degrees Celsius in temperature, under conditions of pressure is 400-500psi (pound/square inch), presses 5-
6 hours.
140th, the position of auxiliary circuit, processing step groove are corresponded on the second laminate, the depth of step groove arrives at institute
State the faying face of step groove circuit and auxiliary circuit.
As shown in Figure 2 d, in this step, the position of auxiliary circuit 2201, processing step are corresponded on the second laminate 22
Groove 23.Controlled depth milling technique or laser miller skill can be used, processes the step groove 23.Controlled depth milling or the depth of laser milling, are supported
Up to step groove circuit 2101 and the faying face of auxiliary circuit 2201, the high temperature resistant for manifesting step groove circuit 2101 and its surface applies
Layer 2103.
In some embodiments of the invention, it can also choose whether to remove the resistance to of the step groove circuit surface as needed
High temperature coating.
For example, if finally needs is golden for circuit board panel, step groove circuit surface can be directly golden using changing over there, and
Need not the golden high-temperaure coating formed of removal.
Formed if high-temperaure coating 2103 is brown processing, as shown in Figure 2 e, microetch technique or other can be used
Technique, high-temperaure coating 2103 is etched into removal, manifests step groove circuit 2101, form required step groove circuit board.
There is step groove 23, and the bottom of step groove 23 has step groove circuit 2101 on the step groove circuit board.
Subsequently, conventional etch process can be also used to process outer layer electricity respectively on the two sides of obtained step groove circuit board
Road figure, and, surface coating is carried out such as coating solder resist.
More than, the embodiment of the invention discloses a kind of processing method of polytetrafluoroethylene (PTFE) step groove circuit board, using to
One and after the second step groove circuit on laminate carries out brown processing, pad is not pasted and does not have to prepreg, direct high-temperature high-pressure
Close, then go out the technical scheme that depth arrives at the step groove of step groove circuit surface forming multi-layer sheet Surface Machining, achieve
Following technique effect：The present invention program makes step groove, and without pasting pad, suitable for PTFE circuit boards, be particularly suitable for use in step
The shallower situation of groove, solve the problems, such as that prior art is difficult to produce PTFE step groove circuit boards；And it is directed to PTFE laminates
High-temperature laminating is directly carried out, not only will not be in glue and pollution more than step trench bottom residual, and prepreg need not be used, thus
Reduce Making programme, simplify manufacture craft, improve the electric property of plate.
In the above-described embodiments, the description to each embodiment all emphasizes particularly on different fields, and is not described in some embodiment
Part, may refer to the associated description of other embodiments.
It should be noted that for foregoing each method embodiment, in order to be briefly described, therefore it is all expressed as a series of
Combination of actions, but those skilled in the art should know, the present invention is not limited by described sequence of movement because according to
According to the present invention, some steps can use other orders or carry out simultaneously.Secondly, those skilled in the art should also know,
Embodiment described in this description belongs to preferred embodiment, and not necessarily the present invention must for involved action and module
Must.
The processing method of the polytetrafluoroethylene (PTFE) step groove circuit board provided above the embodiment of the present invention has been carried out in detail
Introduce, but the explanation of above example is only intended to help to understand of the invention method and its core concept, should not be construed as pair
The limitation of the present invention.Those skilled in the art, according to the present invention thought, the invention discloses technical scope in,
The change or replacement that can be readily occurred in, it should all be included within the scope of the present invention.
Claims (9)
- A kind of 1. processing method of polytetrafluoroethylene (PTFE) step groove circuit board, it is characterised in that including：The first laminate is provided, the first face of first laminate has step groove circuit；The second laminate is provided, the first face of second laminate has the auxiliary corresponding with the step groove circuit position Circuit；High-temperaure coating is formed on the surface of the step groove circuit and auxiliary circuit；High-temperature laminating is carried out to first laminate and the second laminate, makes the poly- of first laminate and the second laminate Polytetrafluoroethylene substrate melting connection, wherein, the first face of first laminate is relative with the first face of second laminate；Correspond to the position of the auxiliary circuit, processing step groove on second laminate, the depth of step groove arrives at institute State the faying face of step groove circuit and the auxiliary circuit.
- 2. according to the method for claim 1, it is characterised in that the first face of second laminate, also there is auxiliary electricity Other circuitous patterns beyond road.
- 3. according to the method for claim 1, it is characterised in that described on the surface of the step groove circuit and auxiliary circuit Forming high-temperaure coating includes：Brown or gold or silver or gold-plated processing are carried out to the step groove circuit；With brown or gold or silver or gold-plated processing are carried out to the auxiliary circuit.
- 4. according to the method for claim 1, it is characterised in that described that first laminate and the second laminate are carried out High-temperature laminating includes：It is 300-400 degrees Celsius in temperature, under conditions of pressure is 400-500psi, first laminate and second is laminated Plate carries out high-temperature laminating, and pressing time is 5-6 hours.
- 5. according to the method for claim 1, it is characterised in that the processing step groove includes：Using controlled depth milling technique processing step groove.
- 6. according to the method for claim 1, it is characterised in that also include：Outer circuit figure is processed respectively on the two sides of obtained step groove circuit board.
- 7. according to the method for claim 1, it is characterised in that：Insulating medium layer in first laminate and the second laminate is polytetrafluoroethylene (PTFE) material.
- 8. according to the method for claim 1, it is characterised in that：The auxiliary circuit is the mirror image circuit of the step groove circuit, or, it is big copper face.
- 9. according to the method for claim 1, it is characterised in that also include：Remove the high-temperaure coating of the step groove circuit surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410219478.3A CN105101640B (en) | 2014-05-22 | 2014-05-22 | A kind of processing method of polytetrafluoroethylene (PTFE) step groove circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410219478.3A CN105101640B (en) | 2014-05-22 | 2014-05-22 | A kind of processing method of polytetrafluoroethylene (PTFE) step groove circuit board |
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| CN105101640A CN105101640A (en) | 2015-11-25 |
| CN105101640B true CN105101640B (en) | 2018-02-23 |
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| CN201410219478.3A Active CN105101640B (en) | 2014-05-22 | 2014-05-22 | A kind of processing method of polytetrafluoroethylene (PTFE) step groove circuit board |
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| CN109413882B (en) * | 2018-12-12 | 2021-09-21 | 东莞市若美电子科技有限公司 | PCB (printed circuit board) anti-welding manufacturing process applied to LED display screen |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101662888A (en) * | 2009-09-28 | 2010-03-03 | 深南电路有限公司 | Preparation method for PCB plate with step trough |
| CN102497749A (en) * | 2011-12-16 | 2012-06-13 | 东莞生益电子有限公司 | Method for embedding capacitor into PCB (printed circuit board) multilayer board |
| TW201349957A (en) * | 2012-05-30 | 2013-12-01 | Zhen Ding Technology Co Ltd | Multilayer printed circuit board and method for manufacturing same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11121926A (en) * | 1997-10-14 | 1999-04-30 | Ibiden Co Ltd | Multilayer printed wiring board and its manufacture |
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2014
- 2014-05-22 CN CN201410219478.3A patent/CN105101640B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101662888A (en) * | 2009-09-28 | 2010-03-03 | 深南电路有限公司 | Preparation method for PCB plate with step trough |
| CN102497749A (en) * | 2011-12-16 | 2012-06-13 | 东莞生益电子有限公司 | Method for embedding capacitor into PCB (printed circuit board) multilayer board |
| TW201349957A (en) * | 2012-05-30 | 2013-12-01 | Zhen Ding Technology Co Ltd | Multilayer printed circuit board and method for manufacturing same |
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Address after: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Shennan Circuits Co., Ltd. |