CN210868338U - FPC mould of easily even piece composing - Google Patents
FPC mould of easily even piece composing Download PDFInfo
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- CN210868338U CN210868338U CN201921604668.1U CN201921604668U CN210868338U CN 210868338 U CN210868338 U CN 210868338U CN 201921604668 U CN201921604668 U CN 201921604668U CN 210868338 U CN210868338 U CN 210868338U
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- fpc
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- resistant single
- mould
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Abstract
The utility model discloses a FPC mould of easily even piece composing, be provided with the cutting groove on the mould, FPC's back subsides and covers the one deck high temperature resistant single face and glues, at first confirms earlier the position that FPC needs to be decided, according to the position that needs were decided will paste and cover the one deck high temperature resistant single face and glue FPC places on the mould, according to the position of deciding is decided, decides the back FPC relies on the back to paste and covers high temperature resistant single face glues and links together, carries out electronic components and pastes dress welding operation again, decides the operation with the position that FPC did not decide after the welding operation is accomplished again.
Description
Technical Field
The utility model relates to the even piece of FPCA product is connected, particularly, involves an easily FPC mould even piece composing.
Background
The flexible circuit board is called FPC for short, and the surface mounting technology is needed from FPC to FPCA
And SMT, cutting to form a plurality of mutually independent FPCAs. SMT adds man-hour and is using chip mounter automatic printing, and the product needs even piece when this requires FPC shaping back printing admittedly to improve SMT paster production efficiency and yields, the even piece method of FPC now commonly used is: the product is typeset in a form of continuous pieces, but under the condition that the distance between a component and the edge of an FPC substrate is very small (or the size of the component is larger than that of the edge of the FPC), the FPC after production is finished cannot be split, and if the FPC is cut in advance, the size of the FPC is deviated.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving under the very little condition of components and parts apart from FPC base plate edge interval (perhaps components and parts size is greater than the FPC edge), FPC after the production is accomplished will unable problem of burst, provides the FPC mould of easily even piece composing, and the FPC of easily even piece composing is at components and parts apart from FPC base plate edge interval under the very little condition (or components and parts size is greater than the FPC edge), and FPC after the production is accomplished easily bursts.
In order to achieve the above object, the utility model adopts the following technical scheme:
the utility model provides a FPC mould of easily company's piece composing, the mould is including cutting the groove, it has FPC to put in the cutting groove, the FPC back is pasted and is covered one deck high temperature resistant single face and glue, FPC is in the cut-off state before pasting electronic components.
Furthermore, the FPC needs to determine the position to be cut first.
Furthermore, a high-temperature-resistant single-sided adhesive is attached to the cutting position.
Furthermore, the cut FPC is connected together by the high-temperature resistant single-sided adhesive pasted on the back surface.
Furthermore, the part of the FPC which is not cut needs to be cut after the mounting operation is finished.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is the FPC with high temperature resistant single-sided adhesive attached after cutting of the present invention;
fig. 3 is a schematic structural view of the FPC with electronic components welded thereon according to the present invention;
fig. 4 is a schematic view of a partial structure of the FPC with electronic components welded thereon according to the present invention;
wherein: 1. cutting the cut FPC; 2. high-temperature resistant single-sided adhesive; 3. cutting the FPC; 4. An electronic component; 5. parts not cut off; 6. positioning a pinhole; 7. a positioning pin hole; 8. positioning a screw hole; 9. installing a positioning hole on the mold; 10. cutting the groove; 11. and (5) molding.
Detailed Description
As shown in fig. 1, an FPC mold easy for sheet-by-sheet typesetting includes a mold 11, four corners of the mold 11 are provided with positioning holes 7 and positioning screw holes 8, the positioning screw holes 8 are located at positions where the mold 11 is close to the inside, and the positioning holes 7 are located at positions where the mold 11 is close to the outside; the middle position of the die 11 is provided with a die mounting positioning hole 9 and a cutting groove 10, the die mounting positioning hole 9 is positioned around the cutting groove 10, a positioning pinhole 6 is arranged around the cutting groove 10, and the positioning pinhole 6 is positioned on the inner side of the die mounting positioning hole 9.
As shown in fig. 1 to 4, an FPC mold for easy sheet-bonding typesetting, the FPC processing steps are:
(1) determining the cutting position: determining the position of the FPC needing to be cut according to the mounting position of the electronic component;
(2) the high-temperature-resistant single-sided adhesive 2 is attached to the back face of the FPC, and the whole back face of the FPC is attached to the high-temperature-resistant single-sided adhesive 2.
(3) Will paste and cover high temperature resistant single face is glued 2 FPC places on mould 11, high temperature resistant single face glue 2 with mould 11 contact, FPC decide position 3 with cut groove 10 and align, cover to pasting high temperature resistant single face glue 2 FPC basis decide the processing is decided to the position of deciding, decides the back FPC relies on the back to paste and cover high temperature resistant single face glue 2 links together.
(4) And mounting and welding the electronic component 4 on the FPC.
(5) And cutting the part 5 of the FPC which is not cut after the mounting operation is finished.
As shown in fig. 2, fig. 2 is the FPC who covers high temperature resistant single-sided glue for pasting after the cutting, decide position 3 including FPC1, high temperature resistant single-sided glue 2 and FPC after cutting, according position 3 is decided to FPC decides FPC, FPC1 after cutting with high temperature resistant single-sided glue 2 links together, FPC decides position 3 department and pastes and have high temperature resistant single-sided glue 2.
The common FPC connecting method at present comprises the following steps: the products are typeset in a form of a connected sheet without pretreatment. The distance between the electronic component and the edge of the FPC is too small (less than 0.20mm or 0.20 mm), or the edge of the electronic component is larger than the FPC, and the electronic component cannot be separated after the chip mounting is finished. However, if the FPC is cut in advance, the dimension of the FPC may be deviated.
The utility model discloses a paste the dress position according to electronic components, confirm the position that FPC needs decide the FPC back is pasted high temperature resistant single-sided glue, accomplish FPC processing back according the position of deciding is decided, decides the back FPC relies on the back to paste and covers high temperature resistant single-sided glue links together, carries out electronic components again and pastes dress welding operation, decides the operation with the position that FPC did not decide after the welding operation is accomplished again.
The above is only the preferred embodiment of the present invention, and the patent scope of the present invention is not limited thereby, all the equivalent structure changes made by the contents of the specification and the drawings are utilized under the inventive concept of the present invention, or the application directly or indirectly in other related technical fields are included in the patent protection scope of the present invention.
Claims (5)
1. The utility model provides a FPC mould of easily even piece composing which characterized in that: the mould includes cuts the groove, cut and put FPC in the groove, the FPC back is pasted and is covered a layer of high temperature resistant single face and glue, FPC is in the cut-off state before pasting dress electronic components.
2. An FPC mold easy to typeset in connection with pieces as claimed in claim 1, wherein: the FPC needs to determine the position needing to be cut first.
3. An FPC mold easy for set-up in one piece as claimed in claim 2, characterized in that: and the cut position is pasted with a high-temperature-resistant single-sided adhesive.
4. An FPC mold easy for set-up in sheets according to claim 1 or 2, characterized in that: the cut FPC is connected together by the high-temperature resistant single-sided adhesive pasted on the back.
5. An FPC mold easy to typeset in connection with pieces as claimed in claim 1, wherein: after the mounting operation is finished, the part of the FPC which is not cut needs to be cut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921604668.1U CN210868338U (en) | 2019-09-25 | 2019-09-25 | FPC mould of easily even piece composing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921604668.1U CN210868338U (en) | 2019-09-25 | 2019-09-25 | FPC mould of easily even piece composing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210868338U true CN210868338U (en) | 2020-06-26 |
Family
ID=71288431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921604668.1U Active CN210868338U (en) | 2019-09-25 | 2019-09-25 | FPC mould of easily even piece composing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210868338U (en) |
-
2019
- 2019-09-25 CN CN201921604668.1U patent/CN210868338U/en active Active
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