CN106239623B - A kind of punching molding method of circuit substrate - Google Patents
A kind of punching molding method of circuit substrate Download PDFInfo
- Publication number
- CN106239623B CN106239623B CN201610622587.9A CN201610622587A CN106239623B CN 106239623 B CN106239623 B CN 106239623B CN 201610622587 A CN201610622587 A CN 201610622587A CN 106239623 B CN106239623 B CN 106239623B
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- China
- Prior art keywords
- die
- jigsaw
- substrate
- die cutting
- cutting die
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- 239000000758 substrate Substances 0.000 title claims abstract description 81
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000004080 punching Methods 0.000 title claims abstract description 31
- 238000000465 moulding Methods 0.000 title claims abstract description 15
- 238000005520 cutting process Methods 0.000 claims abstract description 82
- 239000000178 monomer Substances 0.000 claims abstract description 66
- 238000000926 separation method Methods 0.000 claims description 3
- 210000003205 muscle Anatomy 0.000 claims 1
- 239000002994 raw material Substances 0.000 abstract description 8
- 238000003754 machining Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 238000001149 thermolysis Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
- B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0271—Mechanical force other than pressure, e.g. shearing or pulling
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention provides a kind of punching molding method of circuit substrate, there is provided substrate to be punched is overall and has the die cutting die of die cutting die jigsaw；The die cutting die jigsaw includes：One has outside plate monomer, at least one the inner panel monomer and dowel being arranged in the hollow region of the outside plate monomer of hollow region, is fixedly connected between the outside plate monomer and inner panel monomer by dowel；This method can be by multiple circuit substrate monomers of different shapes while punching molding as template by the use of above-mentioned die cutting die jigsaw.The present invention have the characteristics that typesetting it is simple, it is high in machining efficiency, can make full use of raw material area, saving cost.
Description
Technical field
The present invention relates to circuit substrate to be punched field, and in particular to a kind of typesetting is simple, it is high in machining efficiency, can make full use of
The die cutting die jigsaw of raw material area and the side that multiple circuit substrates while punching molding are carried out using the die cutting die jigsaw
Method.
Background technology
Circuit substrate is used to lay circuit and connecting circuit part forms a complete functional module, and circuit substrate plays support
And thermolysis, common circuit substrate have aluminium base etc., in different field, different operating environment, different customers have
Different requirements.Because assembling needs, product has more different demands, such as automobile in manufacturing process for product design
The LED tail-lights of annular.Such light fixture has a kind of common characteristic in use, and product has irregular shape, Er Qieduo
The product of individual shape need to be used separately.
Generally such as Chinese utility model patent Application No. is being used in the circuit substrate of punching respective shapes：
A kind of flexible PCB layout structure and die cutting die disclosed in 201420019111.2, the patent document is by multiple substrate monomers
It is arranged on same mould jigsaw.But if there is larger hollow region such as the circuit substrate monomer 10 ' as shown in Fig. 1 (a)
Loop configuration, if individually carrying out typesetting with the circuit substrate monomer, most of raw material can be wasted, to solve asking for waste of material
Topic, it will usually be punched into corresponding again shown in Fig. 1 (b) such as the raw material of the hollow region of the circuit substrate monomer in Fig. 1 (a)
The less solid circuit substrate monomer 20 ' of area, although solving the problems, such as to waste raw material, processing is, it is necessary to two kinds at twice
Different jigsaw, the auxiliary material cost of production is virtually added, then come, two products are punched respectively, in punching hollow out
Later product surface is easily caused in handling process again to scratch, reveal the abnormal conditions such as copper.
The content of the invention
Therefore, the present invention provides a kind of typesetting die cutting die that is simple, high in machining efficiency, can making full use of raw material area
Jigsaw and the method that multiple circuit substrates while punching molding are carried out using the die cutting die jigsaw.
To reach above-mentioned purpose, a kind of die cutting die provided by the invention, including：One has the outside plate list of hollow region
Body, at least one the inner panel monomer and dowel being arranged in the hollow region of the outside plate monomer, the outside plate monomer and inner panel
It is fixedly connected between monomer by dowel.
Further, the inner panel monomer is provided with multiple, is fixedly connected between adjacent inner panel monomer by dowel.
Further, the outside plate monomer, inner panel monomer and dowel are formed in one structure.
The present invention also provides a kind of punching molding method of circuit substrate, comprises the following steps：
S1, there is provided substrate to be punched is overall and has the die cutting die of die cutting die jigsaw as described above；
S2, the region that substrate is integrally corresponded to the dowel position on die cutting die jigsaw carry out advance cutoff process；
S3, by substrate entirety fixed placement on die cutting die jigsaw, it is cut off the part of processing and corresponds to die cutting die
The position of the dowel of jigsaw；
S4, the substrate entirety fixed and die cutting die jigsaw are put into die cutting die and is punched out, you can be disposable
By multiple circuit substrate punching separations of the outside plate monomer of corresponding die cutting die jigsaw and inner panel monomer.
Further, in step S2, the region that substrate is integrally corresponded to the dowel position on die cutting die jigsaw is carried out
The concrete mode of cutoff process is in advance：Substrate is integrally placed at offer it is corresponding with the dowel position of die cutting die jigsaw
Hole punching blanking units on cut off.
Further, in step S2, also include before substrate integrally is carried out into advance cutoff process：Substrate is integrally entered
Row is fixed.
Further, mode substrate being integrally fixed is：Determined by the cooperation of alignment pin and positioning hole
Position.
Further, the die cutting die is provided with alignment pin, and the substrate is provided with positioning hole on the whole, and the substrate is whole
It is fixedly connected between body and die cutting die by alignment pin with cooperatively forming for positioning hole.
By technical scheme provided by the invention, have the advantages that：
Outside plate monomer and at least one inner panel monomer are fixedly connected by dowel, typesetting is compact, and vacant area reduces,
Save raw material；The shaping of product is achieved that using a set of die cutting die, and then saves corresponding mould expense, and reduces production
The process time of product, improve the production efficiency of product；The reduction of manufacturing procedure, damaged probability of the product in transportation just subtract
It is small, and then lift the quality of product.
Brief description of the drawings
Fig. 1 (a) is the circuit substrate monomer structure of the first type in the prior art；
Fig. 1 (b) is the circuit substrate monomer structure of second of type in the prior art；
Fig. 2 (a) show a kind of structural representation of die cutting die jigsaw provided by the invention；
Fig. 2 (b) is shown after the structure for Fig. 2 (a) die cutting die jigsaw integrally carries out pre-cutting processing to substrate
Schematic appearance；
Fig. 2 (c) show the circuit substrate list after the completion of being punched out using the structure of Fig. 2 (a) die cutting die jigsaw
Body schematic diagram；
Fig. 3 (a) show the structural representation of another die cutting die jigsaw provided by the invention；
Fig. 3 (b) is shown after the structure for Fig. 3 (a) die cutting die jigsaw integrally carries out pre-cutting processing to substrate
Schematic appearance；
Fig. 3 (c) show the circuit substrate list after the completion of being punched out using the structure of Fig. 3 (a) die cutting die jigsaw
Body schematic diagram；
Fig. 4 (a) show the structural representation of another die cutting die jigsaw provided by the invention；
Fig. 4 (b) is shown after the structure for Fig. 4 (a) die cutting die jigsaw integrally carries out pre-cutting processing to substrate
Schematic appearance；
Fig. 4 (c) show the circuit substrate list after the completion of being punched out using the structure of Fig. 4 (a) die cutting die jigsaw
Body schematic diagram；
Fig. 5 (a) show the structural representation of another die cutting die jigsaw provided by the invention；
Fig. 5 (b) is shown after the structure for Fig. 5 (a) die cutting die jigsaw integrally carries out pre-cutting processing to substrate
Schematic appearance；
Fig. 5 (c) show the circuit substrate list after the completion of being punched out using the structure of Fig. 5 (a) die cutting die jigsaw
Body schematic diagram.
Embodiment
To further illustrate each embodiment, the present invention is provided with accompanying drawing.These accompanying drawings are the invention discloses the one of content
Point, it can coordinate the associated description of specification to explain the operation principles of embodiment mainly to illustrate embodiment.Coordinate ginseng
These contents are examined, those of ordinary skill in the art will be understood that other possible embodiments and advantages of the present invention.In figure
Component be not necessarily to scale, and similar element numbers are conventionally used to indicate similar component.
In conjunction with the drawings and specific embodiments, the present invention is further described.
Shown in reference picture 2 (a), a kind of die cutting die jigsaw provided by the invention, including：One has the annular of hollow region
Outside plate monomer 10, a solid circles inner panel monomer 20 being arranged in the hollow region of the outside plate monomer 10 and two dowels
30, it is fixedly connected respectively by dowel 30 between the medial extremity and the outboard end of inner panel monomer 20 of the outside plate monomer 10.Outside
Plate monomer 10 and the surface of inner panel monomer 20 are equipped with multiple positioning holes 40.
Shown in reference picture 2 (a), Fig. 2 (b) and Fig. 2 (c), the present invention also provides a kind of punching molding method of circuit substrate,
Comprise the following steps：
S1, prepare substrate to be punched overall 50 and the die cutting die with die cutting die jigsaw as described above；
S2, the region of the position of dowel 30 on the overall 50 corresponding die cutting die jigsaw of substrate is subjected to advance cut-off part
Reason, as shown in Fig. 2 (b), the outboard end phase of cut-out correspondence dowel 30 medial extremity with outside plate monomer 10, inner panel monomer 20 respectively
The position of connection forms cut-off port 501；
S3, by overall 50 fixed placements of substrate on the die cutting die jigsaw of die cutting die, it is cut off the cut-out of processing
The position of the dowel 30 of 501 corresponding die cutting die jigsaw of mouth；
S4, die cutting die are punched out to substrate overall 50, because in step s 2 in advance by the corresponding position of dowel 30
Substrate overall 50 is cut off, can be disposably by the outside plate monomer and inner panel monomer of corresponding die cutting die jigsaw after this punching
Two circuit substrates (511,512) punching separation such as Fig. 2 (c) shown in.
In the present embodiment, the outside plate monomer 10, inner panel monomer 20 and dowel 30 are formed in one structure.It can specifically lead to
Cross die casting to form, easily realize.
In the present embodiment, the die cutting die in step S1 is in addition to die cutting die jigsaw, other structures, the correspondence of each structure
Relation and operating procedure are common in the art, such as upper die and lower die and are arranged on the punching cutter of mould, die cutting die
Jigsaw is arranged on lower mould and corresponding punching cutter.
In the present embodiment, in step S2, by the area of the position of dowel 30 on the overall 50 corresponding die cutting die jigsaw of substrate
Domain carries out advance cutoff process, and the purpose is to because having dowel 30 in die cutting die jigsaw, the stop of dowel 30 causes nothing
Method departs from overall 50 one-step punchings of substrate, so needing in advance by the partial cut with the correspondence position of dowel 30.It cuts off
Concrete mode be：Substrate overall 50 is placed in and offers the punching cutter corresponding with the position of the dowel of die cutting die jigsaw 30
Blanking units on cut off.The blanking units, can be with above-mentioned punching to carry the equipment of punching tool in the prior art
Mould identical structure, simply by with the die cutting die jigsaw shown in Fig. 2 (a) be replaced with the dowel in Fig. 2 (a)
The corresponding hole punching template in 30 positions substrate overall 50 is punched out, and reaches the purpose of advance cutoff process, small model
The cut-out enclosed easily operates.And it is initially switched off cutting off corresponding dowel 30 medial extremity with outside plate monomer 10, inner panel monomer respectively in advance
The position that 20 outboard end is connected, otch will not be caused exposed and influence cut surface and scratch, reveal the abnormal conditions such as copper.At it
In his embodiment, can also directly be punched with the size identical region of dowel 30, but can so make otch exposed.The step
In rapid, need that substrate overall 50 is fixed before cutoff process, its fixed form is：Substrate overall 50 is provided with multiple positioning
Hole 513, blanking units are provided with alignment pin, and substrate overall 50 is fixed by the cooperation of positioning hole 513 and alignment pin.
In the present embodiment, in step S3, by overall 50 fixed placements of substrate on the die cutting die jigsaw of die cutting die, its
Concrete mode is：The die cutting die body is provided with alignment pin, is equipped with the die cutting die jigsaw and substrate overall 50
Positioning hole (40,513), after the die cutting die jigsaw is corresponding with substrate integral position respectively by alignment pin and positioning hole (40,
513) cooperation is positioned.This mode is a kind of conventional technological means of the prior art.
In the present embodiment, in step S4, the punching mode of die cutting die is also prior art, is technology in the art
What personnel can realize easily.
In the present embodiment, there is provided there is the die cutting die jigsaw knot of single outside plate monomer 10 and single inner panel monomer 20
Structure, in other embodiments, multiple inner panel monomers 20 can also be set while be arranged in the hollow region of outside plate monomer 10.Such as
Shown in Fig. 3 (a), it is arranged on for two solid semicircular inner panel monomers 20 in the hollow region of outside plate monomer 10, two inner panel lists
Body 20 is fixedly connected by a dowel 30 with outside plate monomer 10 respectively, is formed between two inner panel monomers 20 by a dowel 30
It is fixedly connected, substrate overall 50 is carried out shown in outside drawing such as Fig. 3 (b) of pre-cutting processing using method provided by the invention,
Shown in product such as Fig. 3 (c) after excision forming.It can pass through dowel 30 between the same inner panel monomer 20 of more than two is adjacent
It is fixedly connected sequentially, as shown in Fig. 4 (a), the outer of pre-cutting processing is carried out to substrate overall 50 using method provided by the invention
Figure is seen as shown in Fig. 4 (b), shown in product such as Fig. 4 (c) after excision forming.The shape of outside plate monomer 10 and inner panel monomer 20
Can be various, the monomer that Fig. 1 (a) and Fig. 1 (b) is shown such as Fig. 5 (a) rushes through what technical scheme was combined
The schematic diagram of mould jigsaw is cut, the outside drawing of pre-cutting processing is carried out as schemed to substrate overall 50 using method provided by the invention
Shown in 5 (b), shown in product such as Fig. 5 (c) after excision forming, two of Fig. 1 (a) and Fig. 1 (b) in background technology are as formed
Monomer.
By technical scheme provided by the invention, outside plate monomer 10 and at least one inner panel monomer 20 are passed through into dowel 30
It is fixedly connected, typesetting is compact, and the overall vacant area of substrate reduces, and saves raw material；Production is achieved that using a set of die cutting die
The shaping of product, and then corresponding mould expense is saved, and reduce the process time of product, improve the production efficiency of product；Add
The reduction of work process, damaged probability of the product in transportation are reduced by, and then lift the quality of product.
Although specifically showing and describing the present invention with reference to preferred embodiment, those skilled in the art should be bright
In vain, do not departing from the spirit and scope of the present invention that appended claims are limited, in the form and details can be right
The present invention makes a variety of changes, and is protection scope of the present invention.
Claims (7)
1. a kind of punching molding method of circuit substrate, it is characterised in that comprise the following steps：
S1, there is provided substrate to be punched is overall and has the die cutting die of die cutting die jigsaw；The die cutting die jigsaw includes：
One has the outside plate monomer of hollow region, at least one inner panel monomer and the connection being arranged in the hollow region of the outside plate monomer
Muscle, it is fixedly connected between the outside plate monomer and inner panel monomer by dowel；
S2, the region that substrate is integrally corresponded to the dowel position on die cutting die jigsaw carry out advance cutoff process；
S3, by substrate entirety fixed placement on the die cutting die jigsaw of die cutting die, it is cut off, and the part of processing is corresponding to be rushed
Cut the position of the dowel of mould jigsaw；
S4, die cutting die are integrally punched out to substrate, you can disposably by the outside plate monomer of corresponding die cutting die jigsaw and interior
Multiple circuit substrate punching separations of plate monomer.
2. the punching molding method of circuit substrate according to claim 1, it is characterised in that：It is in step S2, substrate is whole
The region that body corresponds to the dowel position on die cutting die jigsaw carries out the concrete mode of advance cutoff process and is：Substrate is overall
It is placed on the blanking units for offering the hole punching corresponding with the dowel position of die cutting die jigsaw and is cut off.
3. the punching molding method of circuit substrate according to claim 1, it is characterised in that：In step S2, by substrate
It is overall also include before advance cutoff process：Substrate is integrally fixed.
4. the punching molding method of circuit substrate according to claim 3, it is characterised in that：Substrate is integrally fixed
Mode be：Positioned by the cooperation of alignment pin and positioning hole.
5. the punching molding method of circuit substrate according to claim 1, it is characterised in that：It is in step S3, substrate is whole
On the die cutting die jigsaw of die cutting die, its concrete mode is body fixed placement：The die cutting die body is provided with positioning
Pin, the die cutting die jigsaw and substrate are equipped with positioning hole, the die cutting die jigsaw and substrate integral position pair on the whole
Should after positioned respectively by the cooperation of alignment pin and positioning hole.
6. the punching molding method of circuit substrate according to claim 1, it is characterised in that：The inner panel monomer is provided with more
It is individual, it is fixedly connected between adjacent inner panel monomer by dowel.
7. the punching molding method of circuit substrate according to claim 1, it is characterised in that：The outside plate monomer, inner panel
Monomer and dowel are formed in one structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610622587.9A CN106239623B (en) | 2016-08-02 | 2016-08-02 | A kind of punching molding method of circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610622587.9A CN106239623B (en) | 2016-08-02 | 2016-08-02 | A kind of punching molding method of circuit substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106239623A CN106239623A (en) | 2016-12-21 |
| CN106239623B true CN106239623B (en) | 2018-01-26 |
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| CN201610622587.9A Active CN106239623B (en) | 2016-08-02 | 2016-08-02 | A kind of punching molding method of circuit substrate |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106851995A (en) * | 2017-04-10 | 2017-06-13 | 昆山苏杭电路板有限公司 | The high-accuracy multi-joint removable processing method for filling unit printed board |
| CN110509346B (en) * | 2019-08-29 | 2021-04-27 | 信丰星润电子有限公司 | Forming process system and forming process method of high-precision PCB |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070137886A1 (en) * | 2005-12-21 | 2007-06-21 | Chen-Hsiang Yen | Method for partial replacement of a circuit board |
| US7578046B2 (en) * | 2006-03-08 | 2009-08-25 | Seagate Technology Llc | Small form factor PCBA process carrier |
| CN201369875Y (en) * | 2009-03-17 | 2009-12-23 | 苏州大展电路工业有限公司 | Complete distribution structure of printed circuit board |
| CN201440755U (en) * | 2009-07-15 | 2010-04-21 | 东莞康源电子有限公司 | Array circuit board |
| CN202873189U (en) * | 2012-10-18 | 2013-04-10 | 上海欣丰卓群电路板有限公司 | Pieced board of heterotype circuit board |
| CN203661417U (en) * | 2014-01-14 | 2014-06-18 | 厦门爱谱生电子科技有限公司 | Flexible circuit board spliced board structure and punching mould |
| CN205179527U (en) * | 2015-12-02 | 2016-04-20 | 重庆蓝岸通讯技术有限公司 | PCB spliced board |
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Effective date of registration: 20220921 Address after: 361022 No. 662, Shanmei Road, Guankou Town, Jimei District, Xiamen City, Fujian Province Patentee after: XIAMEN LED BOARD ELECTRON-TECH CO.,LTD. Address before: No. 1 Factory Building, Baosheng Road, Longchi Industrial Park, Jiaomei Town, Taiwanese Investment Zone, Zhangzhou City, Fujian Province 363000 Patentee before: FUJIAN LED BOARD ELECTRONICS CO.,LTD. |
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Denomination of invention: A Punching and Forming Method for Circuit Substrates Granted publication date: 20180126 Pledgee: Industrial Bank Limited by Share Ltd. Xiamen branch Pledgor: XIAMEN LED BOARD ELECTRON-TECH CO.,LTD. Registration number: Y2024980013746 |