CN107623983A - The EMI fitting preparation methods of FPC - Google Patents
The EMI fitting preparation methods of FPC Download PDFInfo
- Publication number
- CN107623983A CN107623983A CN201710799985.2A CN201710799985A CN107623983A CN 107623983 A CN107623983 A CN 107623983A CN 201710799985 A CN201710799985 A CN 201710799985A CN 107623983 A CN107623983 A CN 107623983A
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- emi
- plank
- pcs
- fpc
- thimble
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Abstract
Be bonded preparation method the invention discloses a kind of EMI of FPC, including EMI blankings → EMI be die cut single PCS coiled strips → EMI boards fit on plank → EMI is pressed on plank → thimble tool jacks up EMI upper protective films → high pressure air rifle and blow off the steps such as EMI upper protective films.Because the EMI design of whole piece of the present invention is into minimum unit list PCS EMI; only onboard useful region fitting EMI; stock utilization greatly improves; EMI imports automation equipment operation; improve Anawgy accuracy and reduce operator; and separated the diaphragm on EMI with plank using the thimble on EMI thimble tools, facilitate strip operation, improve production efficiency.
Description
Technical field
The present invention relates to FPC manufacture field, and making side is bonded more particularly to a kind of EMI of FPC
Method.
Background technology
Electronic consumer products tend to be essentially high-frequency high-speed and sought development at present, and required supporting FPC also needs
Possess high-frequency high-speed performance, so primary demand fitting electromagnetic shielding film EMI（Above abbreviation EMI）, traditional EMI applying methods
For jigsaw fitting or bar shaped fitting, FPC list PCS required EMI joints are combined into a whole spelling or a whole piece during design
EMI, a kind of traditional EMI fitting preparation methods of product 10 as Figure 1-Figure 4 and as shown in figures 11-14 another produce
Traditional EMI fitting preparation methods of product 20, during the making of two kinds of products, the upper each unit EMI connections of a row are made to be designed to that one is whole
A large amount of garbage areas of relevant position on plate need to be included by bar, cause a large amount of wastings of EMI materials, and stock utilization is low, and
EMI costs are higher, and therefore, bar shaped fitting EMI mode costs remain high, as shown in Fig. 2, Fig. 4, Figure 12, Figure 14, the conventional strip
Shape EMI is bonded Making programme：EMI blankings → EMI drillings → EMI punchings → EMI segmentations（Form bar shaped EMI101 or 201）→
Peel manually fitted on plank 102 or 202 from mould release membrance and by EMI101 or 201 → and flatiron spot welding EMI101 or 201 is in plank
→ EMI101 or 201 is pressed on plank 102 or 202 → peels off EMI upper protective films, original bar shaped fitting by hand on 102 or 202
EMI101 or 201 mode flow processes are more, and time-consuming, therefore, to save cost, lift EMI stock utilization, need to be by original
There is bar shaped EMI to split and be designed to that junior unit is bonded.
In view of this, the design people improves caused many missings for not attaining on FPC EMI applying methods
Deeply conceive with inconvenient, and actively research improvement has a fling at and develops and design the present invention.
The content of the invention
It is an object of the invention to provide a kind of EMI for the FPC that stock utilization is higher, production efficiency is higher
It is bonded preparation method.
To achieve the above object, technical solution of the invention is：
The present invention is a kind of EMI fitting preparation methods of FPC, is comprised the following steps：（1）EMI blankings：By raw material
Entire volume EMI materials cut into rouleau EMI materials, and rouleau EMI material widths require according to the EMI of actual product；（2）EMI cross cuttings are single
PCS or module coiled strip：Rouleau EMI materials are fabricated to single PCS or module EMI coiled strips using the method for cross cutting；（3）EMI boards
Fit on plank：Each product being fitted in single PCS on coiled strip or module EMI successively using EMI make-up machines on plank
On；（4）EMI is pressed on plank：EMI press against using press and be fixed on plank；（5）Thimble tool jacks up to be protected on EMI
Film：One end that diaphragm on EMI is corresponded to thimble position using EMI thimbles tool is separated with plank；（6）High pressure air rifle blows off
EMI upper protective films：Blown off EMI upper protective films using high pressure air rifle, the diaphragm on EMI is completely exfoliated with plank.
It is described every PCS EMI on FPC plank are pressed be bonded per unit product demand EMI effective coverages to
It is outer on the outside of product design to open up and thimble region is set in side；Set on FPC plank and every PCS EMI thimbles area
The corresponding thimble resigning hole in domain.
The present invention is a kind of EMI fitting preparation methods of FPC, is comprised the following steps：（1）EMI blankings：By original
Material entire volume EMI materials cut into rouleau EMI materials, and rouleau EMI material widths require according to the EMI of actual product；（2）EMI moulds
Singulation PCS coiled strips：Rouleau EMI materials are fabricated to single PCS EMI coiled strips using the method for cross cutting, made per PCS EMI in cross cutting
When making, while EMI diaphragms are pulled into electromagnetic shielding membrane on a region and removed；（3）EMI boards are fitted on plank：Adopt
Single PCS EMI on coiled strip are fitted on each product on plank successively with EMI make-up machines；（4）EMI is pressed on plank：
EMI press against using press and be fixed on plank；（5）Peel off by hand or high pressure air rifle blows off sub- EMI upper protective films：It can pass through
EMI diaphragms pull position and the diaphragm on EMI are completely exfoliated with plank by hand；Or blown off using high pressure air rifle and protected on EMI
Film, the diaphragm on EMI is set to be completely exfoliated with plank.
After such scheme, because the EMI design of whole piece of the present invention is into minimum unit list PCS EMI, only onboard have
EMI is bonded with region, stock utilization greatly improves, and EMI imports automation equipment operation, improves Anawgy accuracy and reduces operation
Member, and separated the diaphragm on EMI with plank using the thimble on EMI thimble tools, facilitate strip operation, improve production
Efficiency.
The present invention is further illustrated with specific embodiment below in conjunction with the accompanying drawings.
Brief description of the drawings
Fig. 1 is the first FPC jigsaw schematic diagram；
Fig. 2 is original the first EMI bar patch Making programme figure；
Fig. 3 is the first original bar shaped EMI design schematic diagram；
Fig. 4 is original the first FPC jigsaw EMI bars patch schematic diagram；
Fig. 5 is first embodiment of the invention list PCS EMI fitting Making programme figures；
Fig. 6 is first embodiment of the invention list PCS EMI cross cutting coiled strip design diagrams；
Fig. 7 is the mono- PCS fittings schematic diagrames of first embodiment of the invention FPC jigsaw EMI；
Fig. 8 is second embodiment of the invention module EMI fitting Making programme figures；
Fig. 9 is second embodiment of the invention module EMI cross cutting coiled strip design diagrams；
Figure 10 is second embodiment of the invention FPC jigsaw module EMI fitting schematic diagrames；
Figure 11 is second of FPC jigsaw schematic diagram；
Figure 12 is original second of EMI bars patch Making programme figure；
Figure 13 is original second of bar shaped EMI design schematic diagram；
Figure 14 is original second of FPC jigsaw EMI bars patch schematic diagram；
Figure 15 is third embodiment of the invention list PCS EMI fitting Making programme figures；
Figure 16 is third embodiment of the invention list PCS EMI cross cutting coiled strip design diagrams；
Figure 17 is the mono- PCS fittings schematic diagrames of third embodiment of the invention FPC jigsaw EMI；
Figure 18 is the schematic diagram that diaphragm of the present invention separates with plank.
Embodiment
As shown in figure 5, it is a kind of technique stream of EMI fitting preparation method one embodiment of FPC of the present invention
Journey：Single PCS EMI are bonded Making programme：EMI blankings → EMI be die cut single PCS EMI coiled strips → EMI boards fit on plank →
EMI is pressed on plank → and thimble tool jacks up EMI upper protective films → high pressure air rifle and blows off EMI upper protective films.
As shown in fig. 7, be a kind of one embodiment of the EMI fitting preparation methods of FPC of the present invention, the reality
Apply example and every PCS EMI on FPC plank are bonded EMI effective coverages to outside product design by every unit product demand
Opened up outside side and thimble region is set in side, meanwhile, set on FPC plank relative with per PCS EMI thimbles region
The thimble resigning hole answered；It comprises the following steps：
（1）EMI blankings：Raw material entire volume EMI materials are cut into rouleau EMI materials 1, the width of rouleau EMI materials 1 is according to actual production
The EMI requirements of product；
（2）EMI is die cut single PCS coiled strips：Rouleau EMI materials 1 are fabricated to single PCS EMI coiled strips 11 using the method for cross cutting, such as
Shown in Fig. 6；
（3）EMI boards are fitted on plank 2：Single PCS EMI11 on coiled strip are fitted in by plank 2 using EMI make-up machines successively
On each product 3 on, as shown in Figure 7；
（4）EMI is pressed on plank 2：EMI press against using press and be fixed on plank 2；
（5）Thimble tool jacks up EMI upper protective films：It is using the thimble 30 on EMI thimble tools that the diaphragm 111 on EMI is right
One end of the position of thimble 30 is answered to be separated with plank 2, as shown in figure 18；
（6）High pressure air rifle blows off EMI upper protective films：Blown off EMI upper protective films using high pressure air rifle, make diaphragm on EMI with
Plank 2 is completely exfoliated.
As shown in figure 18, the fundamental diagram that diaphragm 111 separates with plank 2：
EMI after fitting is made up of one layer of screened film 112 and layer protecting film 111, and screened film 112 and diaphragm 111 are peelable,
EMI is by being pressed on plank（FPC）After 2, jail is affixed on plank 2 screened film 112 thereon.On EMI thimble tools
Thimble 30 diaphragm 111 is jacked up through the thimble resigning hole 21 on plank 2, diaphragm 111 is peeled off with plank 2.
The method is by the EMI design of original whole piece into minimum unit list PCS EMI, by taking the plank shown in Fig. 1 as an example, material
Utilization rate is promoted to 33% by original only 14%, stock utilization lifting 19%, is bonded using EMI make-up machine lists PCS, every
Or so plate fitting time 48s, relatively original manual bar patch time 40s/, increase 8s/, production efficiency decreases, material profit
It is specifically different and different according to actual product with rate and fitting time difference.
As shown in figure 8, it is a kind of technique stream of EMI fitting second embodiment of preparation method of FPC of the present invention
Journey：EMI blankings → EMI cross cutting module coiled strip → EMI boards are fitted on plank → and EMI is pressed on plank → thimble tool
EMI upper protective films → high pressure air rifle is jacked up to blow off EMI upper protective films.
As shown in Figure 10, the embodiment is effective by the adjacent two unit products demand fitting EMI on FPC plank
Region is designed to that connection forms a little module EMI and sets thimble region in module EMI one or both sides, meanwhile, in flexibility
The thimble resigning hole corresponding with each module EMI thimbles region is set on wiring board plank；It comprises the following steps：
（1）EMI blankings：Raw material entire volume EMI materials are cut into rouleau EMI materials 1 ', the width of rouleau EMI materials 1 ' is according to reality
The EMI requirements of product；
（2）EMI is die cut module coiled strip：Rouleau EMI materials 1 ' are fabricated to module EMI coiled strips 11 ' using the method for cross cutting, such as schemed
Shown in 9；
（3）EMI boards are fitted on plank 2 '：The module EMI on coiled strip is fitted on plank 2 ' successively using EMI make-up machines
Each product 3 ' on, as shown in Figure 10；
（4）EMI is pressed on plank 2 '：EMI press against using press and be fixed on plank 2 '；
（5）Thimble tool jacks up EMI upper protective films：Diaphragm on EMI is corresponded to the one of thimble position using EMI thimbles tool
End or both ends separate with plank 2 '；
（6）High pressure air rifle blows off EMI upper protective films：Blown off EMI upper protective films using high pressure air rifle, make diaphragm on EMI with
Plank 2 ' is completely exfoliated.
The little module that the embodiment connects the EMI design of original whole piece into adjacent Unit two, by taking Fig. 1 planks as an example, material
Material utilization rate is promoted to 21% by original only 14%, lifts stock utilization 7%, is bonded using EMI make-up machines per module, often
The plate fitting time is reduced to 24s by 48s of method one or so, relative manner one, and one times of improving productivity is relatively original every
Wrench work bar pastes time 40s, and improving productivity 40%, stock utilization and fitting time difference are specifically different according to actual product
And it is different, it can require different according to specific product cost requirement and order form delivery time and select distinct methods；
As shown in figure 15, be a kind of FPC of the present invention EMI fitting the 3rd embodiment of preparation method technological process：
Single PCS EMI are bonded Making programme：EMI blankings → EMI be die cut single PCS coiled strips → EMI boards fit on plank → EMI press against
In on plank → peel off by hand or high pressure air rifle blows off sub- EMI upper protective films.
As shown in figure 17, the embodiment presses every PCS EMI on FPC plank per the fitting of unit product demand
EMI effective coverages are opened up to outside product design outside and set EMI diaphragms to pull position in side, are made per PCS EMI in cross cutting
When, electromagnetic shielding membrane EMI diaphragms pulled on a region removes；It comprises the following steps：
（1）EMI blankings：Raw material entire volume EMI materials are cut into rouleau EMI materials 1 ", the width of rouleau EMI materials 1 " is according to reality
The EMI requirements of product；
（2）EMI is die cut single PCS coiled strips：Rouleau EMI materials 1 " are fabricated to single PCS EMI coiled strips 11 " using the method for cross cutting,
Per PCS EMI be die cut make when, while EMI diaphragms are pulled into electromagnetic shielding membrane on the region of position 12 " and removed, such as Figure 16
It is shown；
（3）EMI boards are fitted on plank 2 "：Single PCS EMI on coiled strip are fitted in by plank 2 " using EMI make-up machines successively
On each product 3 " on, as shown in figure 17；
（4）EMI is pressed on plank 2 "：EMI press against using press and be fixed on plank 2 "；
（5）Peel off by hand or high pressure air rifle blows off sub- EMI upper protective films：Position can be pulled by EMI diaphragms by hand by EMI
Diaphragm be completely exfoliated with plank；Or blown off EMI upper protective films using high pressure air rifle, make the diaphragm and plank 2 " on EMI
It is completely exfoliated；Peeling off complexity selection according to the diaphragm on EMI fitting areas and EMI, stripping or high pressure air rifle blow off by hand.
The embodiment by the EMI design of original whole piece into minimum unit list PCS EMI, by taking the plank shown in Figure 11 as an example,
Stock utilization is promoted to 60% by original only 25%, stock utilization lifting 35%, using EMI make-up machine automatic attachings, often
Or so plate fitting time 24s is opened, relatively original manual bar patch time 40s/, 16s/ is reduced and opens, improving productivity 40%, EMI materials
Expect utilization rate and be bonded that time difference is specifically different and different according to actual product, and the method according to specific product cost requirement and can be ordered
The single cross phase requires different and selected；
After such scheme, use is directly bonded for board after EMI raw material are divided into rouleau and cross cutting, it is possible to reduce system
Make process and shorten the whole EMI fitting Making programme times, the mono- PCS fittings of EMI or little module fitting can lift EMI materials profit
With rate, save EMI materials, reduce cost of manufacture, EMI imports automated machine fitting, can by original manual assembly precision ±
0.3mm is promoted to ± 0.1mm, and EMI make-up machines can be with full automatic working, man-machine proportioning 1：More than 3, operator can be greatly reduced
Member, automatic board fitting employee relatively are bonded stay in grade, not influenceed by excessive human factor manually, three of the above EMI patches
It is specifically different and different according to actual product to close stock utilization and the fitting time difference of preparation method, can be according to specific product cost
It is required that and order form delivery time require different and select distinct methods.
It is described above, only present pre-ferred embodiments, therefore the scope that the present invention is implemented can not be limited with this, i.e., according to
The equivalent changes and modifications that scope of the present invention patent and description are made, it all should still belong to the model that patent of the present invention covers
In enclosing.
Claims (3)
- A kind of 1. EMI fitting preparation methods of FPC, it is characterised in that：Comprise the following steps：（1）EMI blankings：By original Material entire volume EMI materials cut into rouleau EMI materials, and rouleau EMI material widths require according to the EMI of actual product；（2）EMI moulds Singulation PCS or module coiled strip：Rouleau EMI materials are fabricated to single PCS or module EMI coiled strips using the method for cross cutting；（3）EMI Board is fitted on plank：Each production being fitted in single PCS on coiled strip or module EMI successively using EMI make-up machines on plank On product；（4）EMI is pressed on plank：EMI press against using press and be fixed on plank；（5）Thimble tool jacks up to be protected on EMI Cuticula：One end that diaphragm on EMI is corresponded to thimble position using EMI thimbles tool is separated with plank；（6）High pressure air rifle blows From EMI upper protective films：Blown off EMI upper protective films using high pressure air rifle, the diaphragm on EMI is completely exfoliated with plank.
- 2. the EMI fitting preparation methods of FPC according to claim 1, it is characterised in that：It is described by flexibility Every PCS EMI on wiring board plank by every unit product demand be bonded EMI effective coverages opened up to outside on the outside of product design and Side sets thimble region；The thimble resigning hole corresponding with per PCS EMI thimbles region is set on FPC plank.
- 3. a kind of EMI fitting preparation methods of FPC, comprise the following steps：（1）EMI blankings：By raw material entire volume EMI Material cuts into rouleau EMI materials, and rouleau EMI material widths require according to the EMI of actual product；（2）EMI is die cut single PCS coiled strips： Rouleau EMI materials are fabricated to single PCS EMI coiled strips using the method for cross cutting, per PCS EMI when being die cut making, simultaneously will The electromagnetic shielding membrane that EMI diaphragms are pulled on a region removes；（3）EMI boards are fitted on plank：Using EMI make-up machines Single PCS EMI on coiled strip are fitted on each product on plank successively；（4）EMI is pressed on plank：Will using press EMI, which press against, to be fixed on plank；（5）Peel off by hand or high pressure air rifle blows off sub- EMI upper protective films：EMI diaphragms can be passed through Position is pulled the diaphragm on EMI is completely exfoliated with plank by hand；Or blown off EMI upper protective films using high pressure air rifle, make on EMI Diaphragm be completely exfoliated with plank.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710799985.2A CN107623983A (en) | 2017-09-07 | 2017-09-07 | The EMI fitting preparation methods of FPC |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710799985.2A CN107623983A (en) | 2017-09-07 | 2017-09-07 | The EMI fitting preparation methods of FPC |
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| CN107623983A true CN107623983A (en) | 2018-01-23 |
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| CN201710799985.2A Pending CN107623983A (en) | 2017-09-07 | 2017-09-07 | The EMI fitting preparation methods of FPC |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108419371A (en) * | 2018-05-10 | 2018-08-17 | Oppo广东移动通信有限公司 | For the auxiliary material joint tool of circuit board and the process of fitting auxiliary material |
| CN109548290A (en) * | 2018-11-30 | 2019-03-29 | 安庆华璟电子科技有限公司 | A kind of new method of the micro- mucous membrane fitting FPC flexible circuit board of PET |
| CN110602886A (en) * | 2019-09-12 | 2019-12-20 | 景旺电子科技(龙川)有限公司 | Novel method for tearing EMI (electro-magnetic interference) protective film by single PCS (Process control System) |
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| KR20050064549A (en) * | 2003-12-24 | 2005-06-29 | 한성엘컴텍 주식회사 | A flexible printed circuit board for block the electro-magnetic interference and electro-static discharge |
| CN201995207U (en) * | 2011-03-31 | 2011-09-28 | 江西鑫力华数码科技有限公司 | Flexible circuit board with tearing hand |
| CN106163248A (en) * | 2016-08-30 | 2016-11-23 | 深圳市玖联科技有限公司 | A kind of screened film and method of attaching thereof |
| CN106379034A (en) * | 2016-10-31 | 2017-02-08 | 东莞市五株电子科技有限公司 | Device for stripping protective film layer of electromagnetic film |
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- 2017-09-07 CN CN201710799985.2A patent/CN107623983A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050064549A (en) * | 2003-12-24 | 2005-06-29 | 한성엘컴텍 주식회사 | A flexible printed circuit board for block the electro-magnetic interference and electro-static discharge |
| CN201995207U (en) * | 2011-03-31 | 2011-09-28 | 江西鑫力华数码科技有限公司 | Flexible circuit board with tearing hand |
| CN106163248A (en) * | 2016-08-30 | 2016-11-23 | 深圳市玖联科技有限公司 | A kind of screened film and method of attaching thereof |
| CN106379034A (en) * | 2016-10-31 | 2017-02-08 | 东莞市五株电子科技有限公司 | Device for stripping protective film layer of electromagnetic film |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108419371A (en) * | 2018-05-10 | 2018-08-17 | Oppo广东移动通信有限公司 | For the auxiliary material joint tool of circuit board and the process of fitting auxiliary material |
| CN109548290A (en) * | 2018-11-30 | 2019-03-29 | 安庆华璟电子科技有限公司 | A kind of new method of the micro- mucous membrane fitting FPC flexible circuit board of PET |
| CN110602886A (en) * | 2019-09-12 | 2019-12-20 | 景旺电子科技(龙川)有限公司 | Novel method for tearing EMI (electro-magnetic interference) protective film by single PCS (Process control System) |
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