CN105430899B - The rigid-flex combined board of a kind of flexure region with pad and preparation method thereof - Google Patents
The rigid-flex combined board of a kind of flexure region with pad and preparation method thereof Download PDFInfo
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- CN105430899B CN105430899B CN201510776372.8A CN201510776372A CN105430899B CN 105430899 B CN105430899 B CN 105430899B CN 201510776372 A CN201510776372 A CN 201510776372A CN 105430899 B CN105430899 B CN 105430899B
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Abstract
The invention discloses the rigid-flex combined board of a kind of flexure region with pad and preparation method thereof, made including raw materials such as preceding process flex plate, PP prepregs and rigid plates, flex plate interior lines complete to covering epiphragma soon, and the laser windowing processing and the processing of fast pressure drag glue of cover layer are carried out to cover layer, flex plate with copper pad and prepreg and rigid plate are superimposed together successively from top to bottom, it is transferred to lamination pressing working procedure and carries out stagnation pressure processing, routinely technological process is handled to outer layer welding resistance process after stagnation pressure processing；Then carry out soft board region and take off lid processing and soft board frame manufacture, then copper face is cleaned using sandblasting mode, then flexure region pad turmeric synchronous with outer layer pad progress ectonexine pad is handled；CNC hardboard forming processes finally are carried out to hardboard housing and obtain the production board for meeting client's appearance and size.The rigid-flex combined board of flexure region of the present invention with pad and preparation method thereof have the advantages that streamlining, cost it is low, it is environmentally friendly can not contaminate, turmeric is without plating leakage.
Description
Technical field
The present invention relates to the manufacture technology field of rigid/flexible combined printed circuit board, specially a kind of flexure region is with pad
Rigid-flex combined board.
Background technology
Along with miniaturization of electronic products and the growth requirement of three-dimensional assembling, rigid-flex combined board had obtained swift and violent hair in recent years
Exhibition；Simultaneously in order to tackle tightened up miniaturization trend, portioned product has been attempted in flexibility bending region design pad, with
Mitigate rigid plate placement pressure.For this kind of rigid-flex combined board of the flex plate region with pad, the tradition of flexible position turmeric is done
Method is that process is handled before first completing, i.e., the process such as the sawing sheet of flexible inner cord, drilling, interior lines makes, and flex plate circuit has made
Cheng Houxu covers epiphragma soon, and completes before stagnation pressure is entered local internal layer flex plate turmeric 1 time, during the processing of this soft board turmeric, one
Aspect turmeric before processing also needs to paste dry film protection, the easy dissolution of endurance deficiency in heavy nickel, turmeric of this dry film, and has to tank liquor
Pollution, the service life of tank liquor is influenceed, on the other hand, soft board rigidity deficiency, protecting border need to be pasted in turmeric, this, which takes, takes
Power, furthermore, for soft board generally in IC or golden finger position turmeric, its load area is smaller, is easily leaked in heavy nickel, turmeric
Plating.After flex plate, prepreg and rigid plate enter stagnation pressure process completion stagnation pressure, also need to be surface-treated turmeric 1 time again, add
The local turmeric completed before stagnation pressure 1 time, totally 2 turmerics, consumptive material is more, and cost is high.The traditional method soft board turmeric flow is cumbersome, mistake
Cheng Zhongxu patches towing plate, tape, paste that protecting border etc. is many to need handwork process, its whole efficiency is low, and is unfavorable for criticizing
Amount production.
The content of the invention
The invention provides a kind of streamlining, and production efficiency is high, and cost is low, realizes that ectonexine pad synchronization turmeric is handled
Rigid-flex combined board processing method of the flexure region with pad.
The present invention can be achieved through the following technical solutions：
A kind of rigid-flex combined board of flexure region with pad, including flex plate, cover layer, PP prepregs and rigid plate,
Intermediate region is provided with pad on the flex plate, and the flex plate outer surface cladding pressing with pad has cover layer, the covering
Film is provided with the windowing being adapted with pad, and cladding presses the flex plate for having cover layer and PP prepregs and rigid plate from up to
Under set gradually and be pressed into rigid-flex combined board.
Further, the windowing compensates processing by unilateral increasing 0.1mm to 0.2mm.
Present invention also offers a kind of streamlining, and production efficiency is high, and cost is low, realizes at ectonexine pad synchronization turmeric
The preparation method of rigid-flex combined board of the flexure region of reason with pad.
A kind of preparation method of rigid-flex combined board of the flexure region with pad, it is characterised in that：Comprise the following steps：
The first step, the making of the preceding various raw materials of process, the flex plate with copper pad is completed to covering epiphragma soon,
And the laser windowing processing and the processing of fast pressure drag glue of cover layer are carried out to cover layer, then by flex plate and system with copper pad
The PP prepregs and rigid plate that work is completed are superimposed together successively from top to bottom, are then transferred to lamination pressing working procedure；
The copper pad of flexure region, the processing of cover layer curable adhesive layer are exposed in second step, stagnation pressure processing, above-mentioned cover layer windowing
Afterwards, start stagnation pressure process and stagnation pressure processing is carried out to the flex plate after lamination successively, PP prepregs and rigid plate, after stagnation pressure processing
Routinely technological process is handled to outer layer welding resistance process；
Lid processing and soft board frame manufacture are taken off in 3rd step, soft board region, it is main include controlling deep V cut with the pre- groove millings of CNC, first
The position that copper cash is preset in rigid-flexible junction carries out controlling deep V and cut, and it is the pre- groove milling stiffened plate CNC of soft board then to optimize CNC files,
The progress pre- groove milling of soft board after deep V is cut is controlled, the hardboard milling of flexure region is broken, other hardboard join domains are retained as soft board frame
Frame；Cut controlling deep V with after the completion of the pre- groove millings of CNC, the hardboard covering layer outside soft board is removed, gold need to be changed by exposing internal layer soft board
Copper pad；
4th step, flexure region pad turmeric processing synchronous with outer layer pad, is cleaned, then using sandblasting mode to copper face
Carry out the processing of ectonexine pad synchronization turmeric；
5th step, CNC hardboard forming processes, test step is carried out after the completion of turmeric processing, after the completion of test step, to hard
Plate housing carries out CNC hardboard forming processes and obtains the production board for meeting client's appearance and size.
The preparation method of rigid-flex combined board of the flexure region of the present invention with pad eliminates flex plate in conventional fabrication method
The internal layer flex plate turmeric flow before stagnation pressure, stagnation pressure processing directly is carried out with other subassembly laminations, it is taken off again after stagnation pressure
Lid exposes internal layer copper pad, and copper face is cleaned using sandblasting mode, then flexure region pad carried out together with outer layer pad
The processing of ectonexine pad synchronization turmeric, effectively reduces turmeric number, improves production efficiency, while reduce production cost；
It is synchronous also to eliminate patch towing plate, patch dry film, tape, paste protection due to eliminating internal layer flex plate turmeric flow before stagnation pressure
Many handwork processes such as frame, have effectively simplified flow, beneficial to batch production, have improved production efficiency.Flexible board area simultaneously
The control depth V that domain is taken off in lid processing and soft board frame manufacture step is cut with after the pre- groove millings of CNC, and the hardboard join domain of reservation forms soft
Plate framework, soft board is set to paste protecting border again during turmeric process processing procedure after stagnation pressure.
Enter a ground, the laser windowing processing of cover layer described in the first step, comprise the following steps, etched in flex plate interior lines
After the completion of, cover layer windowing file is made first, and pad windowing compensates processing by unilateral big 0.1mm to 0.2mm, then will
Windowing file breaks up pore-forming, is converted to laser drill file, removes unwanted cover layer by laser cutting, makes to reveal on flex plate
Go out the copper pad of flexure region.
Enter a ground, the fast pressure drag glue processing of cover layer described in the first step, comprise the following steps：First adjust fast press ginseng
Number, using the fast pressure of mould release membrance auxiliary acted on resistance glue, it is put into after fast pressure on baking sheet frame, is then placed in baking box and carries out solidification one
The section time, make the abundant curing process of cover layer glue-line, effectively avoid forming secondary excessive glue during follow-up stagnation pressure.
Enter a ground, the mould release membrance with resistance glue effect must be changed using 2 to 3 times every, effectively ensure to hinder
Glue effect.
Enter a ground, the fast press parameter is：Temperature 180 degree is fast to press pressure force as 90 tons to 100 tons to 190 degree, fast pressure
Pressing time is 90 seconds to 120 seconds, makes cover layer quick pressing to flex plate, and pressing timeliness is fast, and effect is good, preferably control
Excessive glue of the cover layer during fast pressure, effectively avoids the quality of the excessive formation of excessive glue bad.
Enter a ground, described roasting the temperature inside the box is 150 degree, and the cover layer curable adhesive layer time is 60 minutes to 120 minutes, glue-line
Solidification is abundant, effectively avoids follow-up stagnation pressure process from forming secondary excessive glue.
A kind of rigid-flex combined board of flexure region with pad of the present invention and preparation method thereof, has following beneficial effect：
Firstth, technological process is simplified, and is eliminated prior art Central Plains internal layer flex plate turmeric flow, is eliminated patch traction
Plate, tape, paste protecting border etc. and need handwork process, technological process is simplified；
Secondth, production efficiency is high, and from first point, technological process is simplified, wherein eliminate many needs in the prior art
Handwork process, it is produced in batches manufacturing process, carried significantly in addition to process is simplified and can improve production efficiency
High production efficiency；
3rd, effectively save cost, from first point, technological process, which is simplified, eliminates prior art Central Plains internal layer flexibility
Plate turmeric flow, whole process carry out the synchronization of ectonexine pad to flexure region pad after only needing stagnation pressure together with outer layer pad
Turmeric processing, effectively reduces turmeric number, improves production efficiency, while reduce and saved production cost；
4th, soft board gold need not paste protecting border, and the control in lid processing and soft board frame manufacture step is taken off in soft board region
Deep V is cut with after the pre- groove millings of CNC, and the hardboard join domain of reservation forms soft board framework, handles soft board turmeric process after stagnation pressure
Protecting border need not be pasted during process；
5th, realize that ectonexine pad synchronization turmeric is handled, carry out the windowing file of cover layer to flex plate before stagnation pressure
Make and the fast pressure drag glue of cover layer is handled, carry out solidification cover layer glue-line using baking box after fast pressure, realize omission stagnation pressure
Preceding internal layer flex plate turmeric flow, ectonexine pad synchronization turmeric is handled after realizing stagnation pressure, efficiency high, and ectonexine is synchronous
Turmeric load area is enough, is less prone to plating leakage, and turmeric effect is good.
Brief description of the drawings
Accompanying drawing 1 is a kind of structural representation of rigid-flex combined board of the flexure region with pad of the present invention；
Accompanying drawing 2 is a kind of process chart of the preparation method of rigid-flex combined board of the flexure region with pad of the present invention.
Embodiment
In order that those skilled in the art will better understand the technical solution of the present invention, with reference to embodiment and accompanying drawing
Product of the present invention is described in further detail.
Embodiment 1
As shown in figure 1, a kind of rigid-flex combined board of flexure region with pad, including flex plate 1, cover layer, PP semi-solid preparations
Piece 2 and rigid plate 3, on the flex plate 1 among be provided with pad, the outer surface of flex plate 1 with pad, which coats pressing, covering
Film, the cover layer are provided with the windowing being adapted with pad, and the windowing compensates processing by unilateral increasing 0.1mm, wrapped
Covering pressing has the flex plate 1 of cover layer and PP prepregs 2 and rigid plate 3 to set gradually be pressed into rigid-flexible combination from top to bottom
Plate.
As depicted in figs. 1 and 2, the preparation method of rigid-flex combined board of a kind of flexure region with pad, comprises the following steps：
The first step, the making of the preceding various raw materials of process, the flex plate 1 with copper pad is completed to covering lid soon
Film, and the laser windowing processing and the processing of fast pressure drag glue of cover layer are carried out to cover layer, then by the flex plate 1 with copper pad
At least it is superimposed together successively from upper with the PP prepregs 2 and rigid plate 3 to complete, is then transferred to lamination pressing work
Sequence；
The copper pad of flexure region, the processing of cover layer curable adhesive layer are exposed in second step, stagnation pressure processing, above-mentioned cover layer windowing
Afterwards, start stagnation pressure process and stagnation pressure processing is carried out to the flex plate 1 after lamination successively, PP prepregs 2 and rigid plate 3, at stagnation pressure
Routinely technological process is handled to outer layer welding resistance process after reason；
Lid processing and soft board frame manufacture are taken off in 3rd step, soft board region, it is main include controlling deep V cut with the pre- groove millings of CNC, first
The position that copper cash is preset in rigid-flexible junction carries out controlling deep V and cut, and it is the pre- groove milling stiffened plate CNC of soft board then to optimize CNC files,
The progress pre- groove milling of soft board after deep V is cut is controlled, the hardboard milling of flexure region is broken, other hardboard join domains are retained as soft board frame
Frame；Cut controlling deep V with after the completion of the pre- groove millings of CNC, the hardboard covering layer outside soft board is removed, gold need to be changed by exposing internal layer soft board
Copper pad；
4th step, flexure region pad turmeric processing synchronous with outer layer pad, is cleaned, then using sandblasting mode to copper face
Carry out the processing of ectonexine pad synchronization turmeric；
5th step, CNC hardboard forming processes, test step is carried out after the completion of turmeric processing, after the completion of test step, to hard
Plate housing carries out CNC hardboard forming processes and obtains the production board for meeting client's appearance and size.
As depicted in figs. 1 and 2, the preparation method of rigid-flex combined board of the flexure region of the present invention with pad eliminates traditional system
Make the turmeric flow of internal layer flex plate 1 before stagnation pressure of flex plate 1 in method, directly carry out stagnation pressure processing with other subassembly laminations,
It is taken off lid again after stagnation pressure and expose internal layer copper pad, using sandblasting mode to copper face clean, then to flexure region pad with
Outer layer pad carries out the processing of ectonexine pad synchronization turmeric together, effectively reduces turmeric number, improves production efficiency, simultaneously
Reduce production cost；Due to eliminating the turmeric flow of internal layer flex plate 1 before stagnation pressure, synchronous also to eliminate patch towing plate, patch dry
Film, tape, paste many handwork processes such as protecting border, effectively having simplified flow, beneficial to batch production, improved production
Efficiency.Simultaneously soft board region take off lid processing and soft board frame manufacture step in control depth V cut with after the pre- groove millings of CNC, reservation it is hard
Plate join domain forms soft board framework, soft board is pasted protecting border during turmeric process processing procedure after stagnation pressure.
As depicted in figs. 1 and 2, the laser windowing processing of cover layer described in the first step, comprises the following steps, in flex plate
After the completion of the etching of 1 interior lines, cover layer windowing file is made first, and pad windowing compensates processing by unilateral big 0.1mm, then
Windowing file is broken up into pore-forming, is converted to laser drill file, unwanted cover layer is gone by laser cutting, makes flex plate 1
On expose the copper pad of flexure region.
As depicted in figs. 1 and 2, the fast pressure drag glue processing of cover layer described in the first step, comprises the following steps：First adjust
Fast press parameter, using the fast pressure of mould release membrance auxiliary acted on resistance glue, it is put into baking sheet, is put into baking sheet roasting after fast pressure
Case carries out solidification a period of time, makes the abundant curing process of cover layer glue-line, effectively avoids forming secondary excessive glue during follow-up stagnation pressure.
As depicted in figs. 1 and 2, the mould release membrance with resistance glue effect is often changed using 2 times, effectively ensures to hinder glue
Effect.
As depicted in figs. 1 and 2, the fast press parameter is：Temperature 180 degree, it is fast to press pressure force as 90 tons, soon during pressure pressing
Between be 90 seconds, make cover layer quick pressing to flex plate 1, pressing timeliness it is fast, effect is good, preferably control cover layer pressing soon
During excessive glue, effectively avoid the quality of the excessive formation of excessive glue bad.
As depicted in figs. 1 and 2, described roasting the temperature inside the box is 150 degree, and the cover layer curable adhesive layer time is 60 minutes, glue-line
Solidification is abundant, effectively avoids follow-up stagnation pressure process from forming secondary excessive glue.
Embodiment 2
As shown in figure 1, a kind of rigid-flex combined board of flexure region with pad, including flex plate 1, cover layer, PP semi-solid preparations
Piece 2 and rigid plate 3, on the flex plate 1 among be provided with pad, the outer surface of flex plate 1 with pad, which coats pressing, covering
Film, the cover layer are provided with the windowing being adapted with pad, and the windowing compensates processing by unilateral increasing 0.2mm, wrapped
Covering pressing has the flex plate 1 of cover layer and PP prepregs 2 and rigid plate 3 to set gradually be pressed into rigid-flexible combination from top to bottom
Plate.
As depicted in figs. 1 and 2, the preparation method of rigid-flex combined board of a kind of flexure region with pad, comprises the following steps：
The first step, the making of the preceding various raw materials of process, the flex plate 1 with copper pad is completed to covering lid soon
Film, and the laser windowing processing and the processing of fast pressure drag glue of cover layer are carried out to cover layer, then by the flex plate 1 with copper pad
At least it is superimposed together successively from upper with the PP prepregs 2 and rigid plate 3 to complete, is then transferred to lamination pressing work
Sequence；
The copper pad of flexure region, the processing of cover layer curable adhesive layer are exposed in second step, stagnation pressure processing, above-mentioned cover layer windowing
Afterwards, start stagnation pressure process and stagnation pressure processing is carried out to the flex plate 1 after lamination successively, PP prepregs 2 and rigid plate 3, at stagnation pressure
Routinely technological process is handled to outer layer welding resistance process after reason；
Lid processing and soft board frame manufacture are taken off in 3rd step, soft board region, it is main include controlling deep V cut with the pre- groove millings of CNC, first
The position that copper cash is preset in rigid-flexible junction carries out controlling deep V and cut, and it is the pre- groove milling stiffened plate CNC of soft board then to optimize CNC files,
The progress pre- groove milling of soft board after deep V is cut is controlled, the hardboard milling of flexure region is broken, other hardboard join domains are retained as soft board frame
Frame；Cut controlling deep V with after the completion of the pre- groove millings of CNC, the hardboard covering layer outside soft board is removed, gold need to be changed by exposing internal layer soft board
Copper pad；
4th step, flexure region pad turmeric processing synchronous with outer layer pad, is cleaned, then using sandblasting mode to copper face
Carry out the processing of ectonexine pad synchronization turmeric；
5th step, CNC hardboard forming processes, test step is carried out after the completion of turmeric processing, after the completion of test step, to hard
Plate housing carries out CNC hardboard forming processes and obtains the production board for meeting client's appearance and size.
As depicted in figs. 1 and 2, the preparation method of rigid-flex combined board of the flexure region of the present invention with pad eliminates traditional system
Make the turmeric flow of internal layer flex plate 1 before stagnation pressure of flex plate 1 in method, directly carry out stagnation pressure processing with other subassembly laminations,
It is taken off lid again after stagnation pressure and expose internal layer copper pad, using sandblasting mode to copper face clean, then to flexure region pad with
Outer layer pad carries out the processing of ectonexine pad synchronization turmeric together, effectively reduces turmeric number, improves production efficiency, simultaneously
Reduce production cost；Due to eliminating the turmeric flow of internal layer flex plate 1 before stagnation pressure, synchronous also to eliminate patch towing plate, patch dry
Film, tape, paste many handwork processes such as protecting border, effectively having simplified flow, beneficial to batch production, improved production
Efficiency.Simultaneously soft board region take off lid processing and soft board frame manufacture step in control depth V cut with after the pre- groove millings of CNC, reservation it is hard
Plate join domain forms soft board framework, soft board is pasted protecting border during turmeric process processing procedure after stagnation pressure.
As depicted in figs. 1 and 2, the laser windowing processing of cover layer described in the first step, comprises the following steps, in flex plate
After the completion of the etching of 1 interior lines, cover layer windowing file is made first, and pad windowing compensates processing by unilateral big 0.2mm, then
Windowing file is broken up into pore-forming, is converted to laser drill file, unwanted cover layer is gone by laser cutting, makes flex plate 1
On expose the copper pad of flexure region.
As depicted in figs. 1 and 2, the fast pressure drag glue processing of cover layer described in the first step, comprises the following steps：First adjust
Fast press parameter, using the fast pressure of mould release membrance auxiliary acted on resistance glue, it is put into baking sheet, is put into baking sheet roasting after fast pressure
Case carries out solidification a period of time, makes the abundant curing process of cover layer glue-line, effectively avoids forming secondary excessive glue during follow-up stagnation pressure.
As depicted in figs. 1 and 2, the mould release membrance with resistance glue effect is often changed using 3 times, effectively ensures to hinder glue
Effect.
As depicted in figs. 1 and 2, the fast press parameter is：190 degree of temperature, fast to press pressure force as 100 tons, fast pressure pressing
Time is 120 seconds, makes cover layer quick pressing to flex plate 1, and pressing timeliness is fast, and effect is good, preferably controls cover layer to exist
Excessive glue during fast pressure, effectively avoids the quality of the excessive formation of excessive glue bad.
As depicted in figs. 1 and 2, described roasting the temperature inside the box is 150 degree, and the cover layer curable adhesive layer time is 120 minutes, glue-line
Solidification is abundant, effectively avoids follow-up stagnation pressure process from forming secondary excessive glue.
The foregoing is only a preferred embodiment of the present invention, not makees any formal limitation to the present invention；It is all
The those of ordinary skill of the industry can be shown in by specification accompanying drawing and described above and swimmingly implement the present invention；It is but all
Those skilled in the art without departing from the scope of the present invention, using disclosed above technology contents
The equivalent variations for a little variation, modification and evolution made, it is the equivalent embodiment of the present invention；It is meanwhile all according to the present invention
The variation, modification and evolution of any equivalent variations made to above example of substantial technological etc., still fall within the present invention's
Within the protection domain of technical scheme.
Claims (6)
- A kind of 1. preparation method of rigid-flex combined board of flexure region with pad, it is characterised in that：Comprise the following steps：The first step, the making of the preceding various raw materials of process, the flex plate with copper pad is completed to covering epiphragma soon, and it is right Cover layer carries out the laser windowing processing and the processing of fast pressure drag glue of cover layer, then by the flex plate with copper pad with having made Into PP prepregs and rigid plate be superimposed together successively from top to bottom, be then transferred to lamination pressing working procedure；Second step, stagnation pressure processing, the copper pad of flexure region is exposed in above-mentioned cover layer windowing, after the processing of cover layer curable adhesive layer, Start stagnation pressure process and stagnation pressure processing is carried out to the flex plate after lamination successively, PP prepregs and rigid plate, pressed after stagnation pressure processing Conventional flowsheet is handled to outer layer welding resistance process；Lid processing and soft board frame manufacture are taken off in 3rd step, soft board region, it is main include controlling deep V cut with the pre- groove millings of CNC, first firm Scratch junction and preset the position of copper cash and carry out controlling deep V and cut, it be the pre- groove milling stiffened plate CNC of soft board then to optimize CNC files, in control depth V carries out the pre- groove milling of soft board after cutting, and the hardboard milling of flexure region is broken, other hardboard join domains are retained as soft board framework； Control deep V to cut with after the completion of the pre- groove millings of CNC, the hardboard covering layer outside soft board is removed, expose the brazing that internal layer soft board need to change gold Disk；4th step, flexure region pad turmeric synchronous with outer layer pad, copper face is cleaned using sandblasting mode, then inside and outside progress Layer pad synchronization turmeric processing；5th step, CNC hardboard forming processes, test step is carried out after the completion of turmeric processing, after the completion of test step, to hardboard outside Frame carries out CNC hardboard forming processes and obtains the production board for meeting client's appearance and size.
- 2. the preparation method of rigid-flex combined board of the flexure region according to claim 1 with pad, it is characterised in that：The The laser windowing processing of cover layer described in one step, comprises the following steps, makes cover layer windowing file first, and pad windowing is pressed Unilateral big 0.1mm to 0.2mm compensates processing, and windowing file then is broken up into pore-forming, is converted to laser drill file, passes through Laser cutting removes unwanted cover layer, makes the copper pad for exposing flexure region on flex plate.
- 3. the preparation method of rigid-flex combined board of the flexure region according to claim 2 with pad, it is characterised in that：First The fast pressure drag glue processing of cover layer described in step, comprises the following steps：Fast press parameter is first adjusted, is acted on using with resistance glue The fast pressure of mould release membrance auxiliary, be put on baking sheet frame after fast pressure, be then placed in baking box and carry out solidification a period of time, make cover layer glue-line Fully solidification.
- 4. the preparation method of rigid-flex combined board of the flexure region according to claim 3 with pad, it is characterised in that：It is described Mould release membrance with resistance glue effect must be changed every using 2 to 3 times.
- 5. the preparation method of rigid-flex combined board of the flexure region according to claim 4 with pad, it is characterised in that：It is described Press parameter is soon：Temperature 180 degree is fast to press pressure force as 90 tons to 100 tons to 190 degree, and fast pressure pressing time is 90 seconds to 120 Second.
- 6. the preparation method of rigid-flex combined board of the flexure region according to claim 5 with pad, it is characterised in that：It is described Roasting the temperature inside the box is 150 degree, and the cover layer curable adhesive layer time is 60 minutes to 120 minutes, and curable adhesive layer is abundant.
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| CN201510776372.8A CN105430899B (en) | 2015-11-14 | 2015-11-14 | The rigid-flex combined board of a kind of flexure region with pad and preparation method thereof |
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