CN106132113B - The production method of component pcb board built in a kind of cover film protectionization is golden - Google Patents
The production method of component pcb board built in a kind of cover film protectionization is golden Download PDFInfo
- Publication number
- CN106132113B CN106132113B CN201610519424.8A CN201610519424A CN106132113B CN 106132113 B CN106132113 B CN 106132113B CN 201610519424 A CN201610519424 A CN 201610519424A CN 106132113 B CN106132113 B CN 106132113B
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- China
- Prior art keywords
- cover film
- protectionization
- fastly
- epiphragma
- patch
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Laser Beam Processing (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses the production methods of component pcb board built in a kind of cover film protectionization gold, including be laminated folded structure design, internal layer patch component wheat flour is made, cover epiphragma fastly, cover film protectionization gold, core material patch, pressing and forming and rear process.The production method of component pcb board has the characteristics that low in cost, quality stability is good and product reliability is high built in cover film protectionization gold of the invention.
Description
Technical field
The present invention relates to printed circuit board processing technique field, component built in specially a kind of cover film protectionization gold
The production method of pcb board.
Background technique
Currently, it is small to solve traditional PCB plate plate face, it is unable to satisfy more and more component patch demands, and tradition
After PCB patch, component is external, forms electromagnetic interference to each other, is easy to be caused to scrap by external factor damage component
There is built-in device technology, can effectively solve the above problem in problem.
The processing method of built-in component PCB is processed by following technique mostly: inner figure production → internal layer pad is dry
Film protectionization gold → internal layer pad paste solder printing → internal layer pad pastes component → cleaning internal layer plate face → lamination → normal multilayer
Plate production, wherein the problem of being easy to appear in the process flow has:
The first, the golden process of internal layer pad dry film protectionization is complicated, after core material figure completes the production, need to re-start patch
Film contraposition exposure, it is necessary to using the golden golden region of dry film protection non-ization of dedicated resistance toization, common dry film protectionization gold is easy to fall off, still,
Golden 5 times more expensive than common dry film of the dry film cost of dedicated resistance toization, the holding time 3 months, for current built-in component PCB still in sample
For the stage of product production, enterprise's cost of manufacture is considerably increased, and exposure energy requires high, the time for exposure than common dry film
Long, taking off film need to carry out 2-3 times, otherwise have dry film residual, influence other products producing efficiency；
The second, whole plate carries out brownification processing after core material padization gold, pad SMT after brownification liquid medicine will affect gold
Quality, meanwhile, after Reflow Soldering, the brownification film of the circuit pack of non-pad is influenced to change colour by high temperature, influences process flow
Quality is pressed, the production risk of enterprise is increased.
Summary of the invention
The object of the present invention is to provide the production method of component pcb board built in a kind of cover film protectionization gold, have at
The feature that this is cheap, quality stability is good and product reliability is high.
The present invention can be achieved through the following technical solutions:
The invention discloses a kind of production methods of component pcb board built in cover film protectionization gold, comprising the following steps:
A, the folded structure design of lamination presses addition cover film to be designed to folded structure is laminated fastly in the patch core plate for being laminated folded structure.
Cover film is added, first is that internal layer patch core plate progress can be protected golden, second is that the thin core plate intensity of patch can be enhanced, guarantees manufacturing
The problem of (SMT, cleaning, transfer etc.) is not in deformation folded plate in the process.
B, internal layer patch component wheat flour is made: routinely process flow carries out core material sawing sheet, route makes, AOI is detected,
Brownification, epiphragma to be pasted after brownification is qualified；
C, epiphragma is covered fastly, designed by cover film and prepares and then covers epiphragma fastly in plate surface, if flowing
Pad carries out laser ablation gummosis on glue.It can effectively avoid the circuit pack brownification film of non-pad by reflux after covering epiphragma fastly
The problem of being influenced discoloration by high temperature when weldering, it is ensured that pressing quality avoids layering plate bursting.Internal layer patch core plate covers clear after epiphragma fastly
It washes, since another side is non-patch face, does not need progress gold, thick golden dry film is pasted using whole face and exposes dead protection, saves object
Expect cost.Progress gold together with the PCB big with the golden area of otherization, golden causing of the effective area deficiency gold of avoiding is undesirable to ask
Topic；The quality of pad SMT after avoiding will affect of brownification liquid medicine golden simultaneously.
D, cover film protectionization gold: internal layer patch core plate cleans after covering epiphragma fastly, and it is dead to paste thick golden dry film exposure using whole face
Protection, then progress is golden；
E, it core material patch: is made by normal SMT process, paste solder printing, patch, Reflow Soldering, inspection；
F, pressing and forming successively carries out the circuit board after the completion of core material patch plasma cleans processing, plate-laying knot
After structure optimization, pressing and forming is then carried out.It is needed before pressing to patch component core material plasma cleans and pressing plate-laying knot
Structure optimization could effectively ensure to press quality.
G, rear process: routinely circuit board technique process carries out subsequent production.
Further, C walks described the step of covering epiphragma fastly and includes:
C1, cover film design and preparation: cover film laser windowing is obtained according to pad size and unilateral increasing 6mil, simultaneously
Core plate cursor point position need to increase 1mm windowing.Cover film laser windowing according to pad size and compensation (unilateral increasing 6mil) be
It accurately calculates to obtain, otherwise too small or excessive windowing compensation will lead to that window size is not inconsistent, open a window the bad problem deviated.
C2, rigid plate cover epiphragma fastly: routinely pressure parameter is pressed fastly for selection cover film and pressing padded coaming；
C3, laser ablation gummosis: if there is the bad problem of pad on gummosis, using laser ablation gummosis, production swashs
Light file carries out laser except chemical cleaning is carried out after glue removal gummosis, so that bond pad surface is clean, no gummosis is remained.
Further, the step of F step pressing and forming includes:
F1, plasma cleans processing: for the reliability for guaranteeing lamination, need to manage the pan cleanliness after patch,
The rosin remaining influence pressing during SMT in tin cream is avoided, carry out cleaning using plasma and covering film surface is carried out thick
Change, enhancing pressing quality.For the reliability for guaranteeing lamination, the pan cleanliness after patch need to be managed, avoid SMT process
Rosin remaining influence pressing in middle tin cream carries out cleaning using plasma and is roughened to covering film surface, enhancing pressing
Quality.
F2, plate-laying structure optimization: " aluminium flake+epoxy backing plate+aluminium flake+PE film+aluminium flake " assisted compression is used to ensure internal layer member
The full no cavity of gap filler of device and patch line layer.F3, product pressing: routinely technological parameter and process carry out product
Pressing.
Further, C step is described covers in epiphragma fastly, rigid plate copper thickness and cover film bondline thickness select according to 1:1 or
The requirement of 1:1.5.By taking the rigid plate of 35um copper thickness selects the cover film of 35um bondline thickness as an example, it is possible to prevente effectively from glue-line mistake
Small, there are bubble, thermal shock cover films to be easily layered with rigid plate for filler deficiency；Glue-line is excessive, causes gummosis serious, seriously affects
Welding disking area gold quality.
Further, the cover film with a thickness of 12.5um, 25um, 35um or 50um.Further, described in being walked in C2
Rigid plate covers in epiphragma fastly, using having the release film for hindering glue effect to assist pressing fastly, after rigid plate pastes epiphragma in advance, adds up and down
Two release films are pressed fastly, and release film thickness control is replaced in 4mil or 6mil, every use 3 times.
Further, C3 is walked in the laser ablation gummosis, removes glue, design parameter are as follows: pulsewidth using small energy laser
3us, energy 3mj, ablation number 3 times, MASK3.3mm.
The production method of component pcb board built in a kind of present invention cover film protectionization gold, with as follows the utility model has the advantages that
The first, low in cost, replace customizations gold dry film to patch core plate progress gold by using cover film, drops significantly
Low Material Cost is suitble to built-in component sample making at this stage；
The second, quality stability is good, and rigid plate covers the brownification film of the energy non-pad circuit pack of effective protection after epiphragma fastly,
It avoids high temperature reflux brazier from causing the discoloration of brownification film to influence subsequent pressing quality, while avoiding brownification process after first change gold
In, attack of the brownification liquid medicine to pad layer gold, it is ensured that the quality of SMT patch；
Third, product reliability are high, by the plasma treatment to internal layer patch core plate and press the optimization of plate-laying structure,
Pan cleanliness effectively after control patch, guarantees the reliability of lamination；Also gap, easy to form can not be filled up by solving gummosis
The problem of empty crack.
Specific embodiment
In order that those skilled in the art will better understand the technical solution of the present invention, below with reference to embodiment to this hair
Bright product is described in further detail.
The invention discloses a kind of production methods of component pcb board built in cover film protectionization gold, comprising the following steps:
A, the folded structure design of lamination presses addition cover film to be designed to folded structure is laminated fastly in the patch core plate for being laminated folded structure；
B, internal layer patch component wheat flour is made: routinely process flow carries out core material sawing sheet, route makes, AOI is detected,
Brownification, epiphragma to be pasted after brownification is qualified；
C, epiphragma is covered fastly, is designed and is prepared by cover film, selected with a thickness of 12.5um, 25um, 35um or 50um
Then cover film covers epiphragma in plate surface fastly, if pad on gummosis occur carries out laser ablation gummosis.Its specific steps
Include:
C1, cover film design and preparation: cover film laser windowing is obtained according to pad size and unilateral increasing 6mil, simultaneously
Core plate cursor point position need to increase 1mm windowing；
C2, rigid plate cover epiphragma fastly: routinely pressure parameter is pressed fastly for selection cover film and pressing padded coaming,
Rigid plate copper thickness and cover film bondline thickness is asked to select according to 1:1 or 1:1.5 ratio；Padded coaming is used with resistance glue effect
The fast pressure of release film auxiliary, after rigid plate pastes epiphragma in advance, up and down plus two release films are pressed fastly, and release film thickness control exists
4mil or 6mil, it is every to be replaced using 3 times；
C3, laser ablation gummosis: if there is the bad problem of pad on gummosis, using laser ablation gummosis, production swashs
Light file carries out laser except chemical cleaning is carried out after glue removal gummosis, so that bond pad surface is clean, no gummosis is remained.Removing glue mistake
Glue, design parameter are specifically removed using small energy laser in journey are as follows: pulsewidth 3us, energy 3mj, ablation number 3 times, MASK3.3mm.
D, cover film protectionization gold: internal layer patch core plate cleans after covering epiphragma fastly, and it is dead to paste thick golden dry film exposure using whole face
Protection, then progress is golden；
E, it core material patch: is made by normal SMT process, paste solder printing, patch, Reflow Soldering, inspection；
F, pressing and forming successively carries out the circuit board after the completion of core material patch plasma cleans processing, plate-laying knot
After structure optimization, pressing and forming is then carried out.Its specific steps includes:
F1, plasma cleans processing: for the reliability for guaranteeing lamination, need to manage the pan cleanliness after patch,
The rosin remaining influence pressing during SMT in tin cream is avoided, carry out cleaning using plasma and covering film surface is carried out thick
Change, enhancing pressing quality；
F2, plate-laying structure optimization: " aluminium flake+epoxy backing plate+aluminium flake+PE film+aluminium flake " assisted compression is used to ensure internal layer member
The full no cavity of gap filler of device and patch line layer.
F3, product pressing: routinely technological parameter and process carry out product pressing.
G, rear process: routinely circuit board technique process carries out subsequent production.
The foregoing is only a preferred embodiment of the present invention, is not intended to limit the present invention in any form；It is all
The those of ordinary skill of the industry can be shown in by specification and described above and swimmingly implement the present invention；But it is all familiar
Professional and technical personnel without departing from the scope of the present invention, makes using disclosed above technology contents
A little variation, modification and evolution equivalent variations, be equivalent embodiment of the invention；Meanwhile all realities according to the present invention
The variation, modification and evolution etc. of matter technology any equivalent variations to the above embodiments, still fall within technology of the invention
Within the protection scope of scheme.
Claims (7)
1. the production method of component pcb board built in a kind of cover film protectionization gold, it is characterised in that the following steps are included:
A, the folded structure design of lamination presses addition cover film to be designed to folded structure is laminated fastly in the patch core plate for being laminated folded structure；
B, internal layer patch component wheat flour is made: routinely process flow carries out core material sawing sheet, route production, AOI detection, palm fibre
Change, epiphragma to be pasted after brownification is qualified；
C, epiphragma is covered fastly, designed by cover film and prepares and then covers epiphragma fastly in plate surface, if occurring on gummosis
Pad carries out laser ablation gummosis:
D, cover film protectionization gold: internal layer patch core plate cleans after covering epiphragma fastly, pastes thick golden dry film using whole face and exposes dead protection,
Then progress gold；
E, it core material patch: is made by normal SMT process, paste solder printing, patch, Reflow Soldering, inspection；
F, it is excellent successively to carry out the circuit board after the completion of core material patch plasma cleans processing, plate-laying structure for pressing and forming
After change, pressing and forming is then carried out；
G, rear process: routinely circuit board technique process carries out subsequent production.
2. the production method of component pcb board built in cover film protectionization gold according to claim 1, it is characterised in that: C
Walking described the step of covering epiphragma fastly includes:
C1, cover film design and preparation: cover film laser windowing is obtained according to pad size and unilateral increasing 6mil, while core plate
Cursor point position need to increase 1mm windowing；
C2, rigid plate cover epiphragma fastly: routinely pressure parameter is pressed fastly for selection cover film and pressing padded coaming；
C3, laser ablation gummosis: laser text is made using laser ablation gummosis if there is the bad problem of pad on gummosis
Part carries out laser except chemical cleaning is carried out after glue removal gummosis, so that bond pad surface is clean, no gummosis is remained.
3. the production method of component pcb board built in cover film protectionization gold according to claim 2, it is characterised in that: F
The step of walking the pressing and forming include:
F1, plasma cleans processing: for the reliability for guaranteeing lamination, the pan cleanliness after patch need to be managed, is avoided
Rosin remaining influence pressing during SMT in tin cream carries out cleaning using plasma and is roughened to covering film surface, increases
Suppress conjunction quality；
F2, plate-laying structure optimization: " aluminium flake+epoxy backing plate+aluminium flake+PE film+aluminium flake " assisted compression is used to ensure internal layer component
With the full no cavity of gap filler of patch line layer；
F3, product pressing: routinely technological parameter and process carry out product pressing.
4. the production method of component pcb board built in cover film protectionization gold according to claim 3, it is characterised in that: C step
Described to cover in epiphragma fastly, rigid plate copper thickness and cover film bondline thickness select the requirement according to 1:1 or 1:1.5.
5. the production method of component pcb board built in cover film protectionization gold according to claim 4, it is characterised in that: institute
State cover film with a thickness of 12.5um, 25um, 35um or 50um.
6. the production method of component pcb board built in cover film protectionization gold according to claim 5, it is characterised in that:
C2 walks the rigid plate and covers in epiphragma fastly, assists fast pressure using the release film with resistance glue effect, rigid plate pastes epiphragma in advance
Afterwards, two release films are added to be pressed fastly up and down, release film thickness control is replaced in 4mil or 6mil, every use 3 times.
7. the production method of component pcb board built in cover film protectionization gold according to claim 6, it is characterised in that: C3
It walks in the laser ablation gummosis, glue, design parameter are as follows: pulsewidth 3us, energy 3mj, ablation number 3 is removed using small energy laser
Secondary, MASK3.3mm.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610519424.8A CN106132113B (en) | 2016-07-05 | 2016-07-05 | The production method of component pcb board built in a kind of cover film protectionization is golden |
| PCT/CN2016/105892 WO2018006527A1 (en) | 2016-07-05 | 2016-11-15 | Method for manufacturing a cover film-protected, gold-electroplated and component-inbuilt pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610519424.8A CN106132113B (en) | 2016-07-05 | 2016-07-05 | The production method of component pcb board built in a kind of cover film protectionization is golden |
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| Publication Number | Publication Date |
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| CN106132113A CN106132113A (en) | 2016-11-16 |
| CN106132113B true CN106132113B (en) | 2018-12-07 |
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| CN (1) | CN106132113B (en) |
| WO (1) | WO2018006527A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108040426A (en) * | 2017-11-02 | 2018-05-15 | 广州兴森快捷电路科技有限公司 | The production method of core plate with built-in component and the production method of circuit board |
| CN112752447B (en) * | 2020-12-25 | 2022-05-17 | 惠州市大亚湾科翔科技电路板有限公司 | Manufacturing process of circuit board with embedded components |
| CN112911836B (en) * | 2021-01-20 | 2023-02-28 | 惠州市煜鑫达科技有限公司 | Method for producing multilayer circuit board |
| CN113438831B (en) * | 2021-06-03 | 2022-08-09 | 中国电子科技集团公司第三十八研究所 | Microwave multifunctional assembly with interconnected embedded chips in any layer and manufacturing method thereof |
| CN113939075B (en) * | 2021-09-24 | 2023-01-03 | 珠海杰赛科技有限公司 | Rigid-flex board for improving color change of brown oxide layer of multi-layer flexible core board and manufacturing method thereof |
| CN114051323A (en) * | 2021-11-19 | 2022-02-15 | 阔智科技（广州）有限公司 | High-precision windowing process for connecting flexible printed circuit board with flexible and rigid combined board |
| CN114071885B (en) * | 2021-12-02 | 2023-01-17 | 广州源康精密电子股份有限公司 | Processing method of flexible circuit board for new energy automobile battery |
| CN114938573B (en) * | 2022-04-29 | 2023-08-11 | 吉安新宇腾跃电子有限公司 | Technological method for removing gold surface fogging in FPC board processing process |
| CN115334761B (en) * | 2022-09-01 | 2023-09-01 | 广州源康精密电子股份有限公司 | Ultrathin single-sided FPC module product and manufacturing process thereof |
| CN115666016B (en) * | 2022-09-24 | 2024-04-09 | 深圳市实锐泰科技有限公司 | Manufacturing method of ultrathin high-shielding flexible circuit board |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN106132113A (en) | 2016-11-16 |
| WO2018006527A1 (en) | 2018-01-11 |
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