CN114938573B - Technological method for removing gold surface fogging in FPC board processing process - Google Patents
Technological method for removing gold surface fogging in FPC board processing process Download PDFInfo
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- CN114938573B CN114938573B CN202210465243.7A CN202210465243A CN114938573B CN 114938573 B CN114938573 B CN 114938573B CN 202210465243 A CN202210465243 A CN 202210465243A CN 114938573 B CN114938573 B CN 114938573B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
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Abstract
The invention relates to a technological method for removing gold surface fogging in the FPC board processing process, which comprises the following steps: step S1: and (3) gold melting: selecting an FPC board to be processed, and carrying out gold-plating on the surface of the FPC board; step S2: baking: roasting the FPC board subjected to the gold-removing treatment through a nitrogen oven, and pasting a shielding film on the surface of the FPC board after roasting; step S3: pyrography: carrying out pyrography on the surface of the FPC board after the shielding film is pasted, carrying out pasting reinforcement on the FPC board after the pyrography is pasted, carrying out secondary pyrography on the surface of the FPC board again after pasting reinforcement is finished, and carrying out secondary pasting reinforcement after the secondary pyrography is finished; step S4: pressing: pressing the reinforced FPC board; step S5: curing: and curing the pressed FPC board by adopting a curing process. The invention integrates a plurality of pressing procedures, reduces the pressing times, improves the production efficiency of products, shortens the hot stamping time, has lower temperature, prevents the gold surface from fogging, reduces excessive high-temperature and high-pressure procedures, and saves the labor cost.
Description
Technical Field
The invention relates to the technical field of FPC board processing, in particular to a process method for removing gold surface fogging in the FPC board processing process.
Background
The FPC generally refers to a flexible circuit board, which is a flexible printed circuit board made of polyimide or polyester film as a base material and has the characteristics of high wiring density, light weight, thin thickness and good bending property, and the flexible circuit (FPC) is a technology developed in the united states of america in the last 70 s for developing space rocket technology, which is a flexible printed circuit made of polyester film or polyimide as a base material and has high reliability and excellent flexibility, and a large number of precise elements are stacked and embedded in a narrow and limited space by embedding circuit designs on a flexible thin plastic sheet, thereby forming a flexible circuit. The circuit can be bent at will, has light folding weight, small volume, good heat dissipation and convenient installation, and breaks through the traditional interconnection technology. In the structure of the flexible circuit, the constituent materials are an insulating film, a conductor, and an adhesive.
The FPC board is manufactured in a wet area, a layer of water mist is formed on the gold surface of the product through a high-temperature high-pressure process, the gold surface is called as gold surface fogging, poor appearance is caused, and the gold surface fogging of the product frequently occurs through a plurality of high-temperature high-pressure processes.
After gold is coated on the gold melting process of the FPC product, the shielding film is pressed mainly through a high-temperature high-pressure pressing process, the test shows that the moisture absorption and the water content of the product are about 0.02g in a normal environment after the gold melting process, and the product flows on a gold surface without the protection of a covering film through the volatilization of high-temperature high-pressure water, so that water mist is formed.
In the prior art, the process of demisting the gold surface comprises the following steps: when the FPC board is subjected to gold surface defogging through the processes of gold melting, shielding film sticking, pressing, reinforcing 1 sticking, pressing, reinforcing 2 sticking and solidification, the pressing times are greatly increased, and the gold surface defogging is performed by adopting pressing, so that the pressing time is long, the temperature is high, the gold surface fogging easily occurs, the product manufacturing efficiency is reduced, the batch reworking is time-consuming and labor-consuming, the cost is wasted, and customer complaints are caused.
Disclosure of Invention
According to the defects existing in the prior art, the invention aims to provide the process method for removing the gold surface fogging in the FPC board processing process, which integrates a plurality of pressing procedures, reduces the pressing times, improves the product manufacturing efficiency, shortens the hot stamping time, has lower temperature, prevents the gold surface fogging, reduces the excessive high-temperature and high-pressure procedures, saves the labor cost, increases the production efficiency, and thoroughly solves the appearance problem caused by the gold surface fogging.
The technical aim of the invention is realized by the following technical scheme:
a technological method for removing gold surface fogging in the FPC board processing process comprises the following steps:
step S1: and (3) gold melting: selecting an FPC board to be processed, and performing gold-plating treatment on the surface of the FPC board to generate a layer of plating;
step S2: baking: baking the FPC board subjected to the gold-removing treatment through a nitrogen oven, wherein the baking time is defined between 25 and 35min, the baking temperature is defined between 100 and 150 ℃, and a shielding film is adhered to the surface of the FPC board after the baking is finished;
step S3: pyrography: carrying out pyrography on the surface of the FPC board after the shielding film is pasted, wherein the temperature of the pyrography is defined between 90 and 130 ℃, the pyrography time is defined between 5 and 15S, pasting reinforcement is carried out on the FPC board after the pyrography is completed, carrying out secondary pyrography on the surface of the FPC board after the pasting reinforcement is completed, the temperature of the pyrography is defined between 90 and 130 ℃, the pyrography time is defined between 5 and 15S, and carrying out secondary pasting reinforcement after the secondary pyrography is completed;
step S4: pressing: pressing the reinforced FPC board for the second time, wherein the pre-pressing time of pressing parameters is defined between 3 and 8S, and the real pressing time is defined between 70 and 130S;
step S5: curing: and curing the pressed FPC board by adopting a curing process.
By adopting the technical scheme, the invention reduces the pressing times by integrating a plurality of pressing procedures, improves the production efficiency of products, has short hot-stamping time and lower temperature, prevents the gold surface from fogging, reduces excessive high-temperature and high-pressure procedures, and saves the labor cost.
The present invention may be further configured in a preferred example to: in the step S1, the specific step of gold melting is to adopt a chemical deposition method, and to plate Ni and Au on the FPC board through a chemical oxidation-reduction reaction to form a layer of plating layer.
By adopting the technical scheme, the invention generates a plating layer by adopting oxidation-reduction reaction in the gold melting step, and can effectively block copper metal and air to prevent oxidation.
The present invention may be further configured in a preferred example to: in step S2, the baking step in the nitrogen oven specifically includes:
(1) after the power supply is connected, the power supply is normally electrified, and the products to be baked are put;
(2) setting constant temperature time and heating the set temperature;
(3) starting vacuumizing, and stopping vacuumizing after the vacuum is achieved;
(4) heating is started, and after baking is finished, the product is decompressed and taken;
the temperature control in the nitrogen baking phase is a PID type touch screen instrument, and the temperature can be controlled in a single-point or program mode, so that the operation can be automatically performed, the PV/SV is displayed at the same time, and the point touch setting is performed; the device has a memory function (such as temperature and time) for memorizing the temperature and time of each use test process, wherein the maximum time for storing the number is 12 months, a 232 computer interface is arranged, the baking time of a nitrogen oven is 30min as the optimal baking time, and the baking temperature is 120 ℃ as the optimal baking temperature.
By adopting the technical scheme, the FPC board is baked through the nitrogen oven, and is baked in a vacuum environment, so that the FPC board is prevented from reacting with particles in the air, and the baking effect of the FPC board is improved.
The present invention may be further configured in a preferred example to: in step S2, the step of attaching the shielding film specifically includes:
(1) bonding one surface of the shielding film provided with the protective film with the adhesive layer on the adhesive film according to the arrangement mode of the surface of the FPC board;
(2) sticking one surface of the shielding film, which is not provided with the protective film, after the adhesive layer is adhered to the FPC board to be adhered;
(3) carrying out pressing treatment on the product to be adhered with the shielding film, and tearing off the adhesive film;
(4) and removing the protective film on the shielding film.
By adopting the technical scheme, the invention can reduce noise, absorb stray light harmful to human bodies, effectively shield electromagnetic radiation interference, ensure normal operation of instruments and equipment, prevent electromagnetic radiation pollution and effectively block harm of electromagnetic waves to human bodies by sticking the shielding film.
The present invention may be further configured in a preferred example to: in the step S3, the specific steps of the hot stamping are as follows: selecting proper ironing board, carving on the surface of the ironing board and providing an electric heating plate, wherein a positioning board for placing an FPC board is arranged below the ironing board and connected with an electric telescopic rod, a pressure sensor is arranged between the ironing board and the electric telescopic rod, a temperature sensor is arranged on the surface of the ironing board, and the electric heating plate, the temperature sensor, the electric telescopic rod and the pressure sensor are connected with a central controller.
By adopting the technical scheme, the electric heating plate is controlled by the central controller to heat, the temperature information is detected by the temperature sensor, the temperature information is transmitted to the central controller, the temperature of the ironing board is controlled, the central controller controls the electric telescopic rod to drive the lying board to move so as to carry out the ironing on the FPC board, the pressure information is detected by the pressure sensor, and the ironing is carried out under proper pressure.
The present invention may be further configured in a preferred example to: in the step S3, the specific steps of reinforcing are as follows: and adding epoxy resin at the position of the FPC board to be reinforced, and melting the epoxy resin in the reinforcement by using high-temperature conditions so as to be combined with the circuit on the FPC board.
By adopting the technical scheme, the invention can ensure that the whole circuit of the circuit is communicated normally by pasting the reinforcing step to the circuit on the FPC board.
The present invention may be further configured in a preferred example to: in step S4, the FPC board is pressed through the pressboard in the pressing process, the FPC board is placed on the force measuring board, the force measuring device for measuring the pressing force is arranged on the force measuring board, the specification of the pressboard is larger than that of the FPC board, the pressboard is provided with an anti-drop slot, the FPC board is clamped inside the anti-drop slot, and the force measuring device is in data connection with a central controller.
Through the adoption of the technical scheme, the FPC board is placed on the force measuring board through the piece, the anti-falling groove on the pressing board is clamped on the FPC board, the FPC board is prevented from moving during pressing, the pressing board is controlled by the central controller to press the FPC board, the force measuring instrument detects pressure information and transmits the pressure information to the central controller, and when the pressure information reaches a proper pressing range, timing is performed to control pressing time.
The present invention may be further configured in a preferred example to: in step S5, during curing, the FPC board is placed inside the curing frame, the top and the bottom of the curing frame are provided with drying holes, the curing frame is connected with the air heater through the air guide pipe, and the air heater is connected with the central controller.
Through the adoption of the technical scheme, the central controller is used for controlling the hot air blower to electrify to generate hot air, the hot air enters the curing frame along the air guide pipe and is blown out along the drying holes, and the blown hot air rapidly dries the top and the bottom of the FPC board, so that rapid curing is realized.
The present invention may be further configured in a preferred example to: the curing frame is composed of an upper cover and a lower cover, a lifting motor for pushing the upper box cover to open and close is arranged in the lower cover, and the lifting motor is connected with a central controller.
Through the adoption of the technical scheme, the lifting motor is controlled by the central controller to work, and the lifting motor drives the upper closing cover to open and close, so that the FPC board is conveniently placed into the lower closing cover for rapid solidification.
In summary, the present invention includes at least one of the following beneficial technical effects:
1. the invention integrates a plurality of pressing procedures, reduces the pressing times, improves the production efficiency of products, has short hot stamping time and lower temperature, prevents the gold surface from fogging, reduces excessive high-temperature and high-pressure procedures, saves labor cost, increases production efficiency, and thoroughly solves the appearance problem caused by the gold surface fogging;
2. the invention integrates a plurality of pressing processes into one process, completes pressing together, reduces the possibility of fogging of a gold surface, integrates a plurality of pressing processes, and performs pre-fixing by adding a hot stamping process of a hot stamping machine between a paste and a plurality of auxiliary materials to prevent materials from falling off.
Drawings
Fig. 1 is a flowchart of a process method for removing gold surface fogging in the FPC board processing process.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1, a process method for removing gold surface fogging in an FPC board processing process includes the following steps:
step S1: and (3) gold melting: selecting an FPC board to be processed, and performing gold-plating treatment on the surface of the FPC board to generate a layer of plating;
the specific steps of the gold melting are to adopt a chemical deposition method, and to plate Ni and Au on the FPC board through a chemical oxidation-reduction reaction to form a layer of plating layer, and the gold melting step adopts an oxidation-reduction reaction to generate the plating layer, so that copper metal and air can be effectively blocked to prevent oxidation.
Step S2: baking: baking the FPC board subjected to the gold-removing treatment through a nitrogen oven, wherein the baking time is defined between 25 and 35min, the baking temperature is defined between 100 and 150 ℃, and a shielding film is adhered to the surface of the FPC board after the baking is finished;
the baking step of the nitrogen oven specifically comprises the following steps:
(1) after the power supply is connected, the power supply is normally electrified, and the products to be baked are put;
(2) setting constant temperature time and heating the set temperature;
(3) starting vacuumizing, and stopping vacuumizing after the vacuum is achieved;
(4) heating is started, and after baking is finished, the product is decompressed and taken;
the temperature control in the nitrogen baking phase is a PID type touch screen instrument, and the temperature can be controlled in a single-point or program mode, so that the operation can be automatically performed, the PV/SV is displayed at the same time, and the point touch setting is performed; the temperature and time of each use test process are memorized for 12 months, a 232 computer interface is arranged, the baking time of a nitrogen oven is the optimal baking time for 30min, the baking temperature is 120 ℃ and is the optimal baking temperature, the nitrogen oven is used for baking in a vacuum environment, the nitrogen oven is prevented from reacting with particles in the air, and the baking effect of the FPC board is improved.
The step of pasting the shielding film comprises the following steps:
(1) bonding one surface of the shielding film provided with the protective film with the adhesive layer on the adhesive film according to the arrangement mode of the surface of the FPC board;
(2) sticking one surface of the shielding film, which is not provided with the protective film, after the adhesive layer is adhered to the FPC board to be adhered;
(3) carrying out pressing treatment on the product to be adhered with the shielding film, and tearing off the adhesive film;
(4) and removing the protective film on the shielding film.
Noise can be reduced, stray light harmful to human bodies is absorbed through the shielding film, electromagnetic radiation interference is effectively shielded, normal operation of instruments and equipment is guaranteed, electromagnetic radiation pollution is prevented, and harm of electromagnetic waves to human bodies is effectively blocked
Step S3: pyrography: carrying out pyrography on the surface of the FPC board after the shielding film is pasted, wherein the temperature of the pyrography is defined between 90 and 130 ℃, the pyrography time is defined between 5 and 15S, pasting reinforcement is carried out on the FPC board after the pyrography is completed, carrying out secondary pyrography on the surface of the FPC board after the pasting reinforcement is completed, the temperature of the pyrography is defined between 90 and 130 ℃, the pyrography time is defined between 5 and 15S, and carrying out secondary pasting reinforcement after the secondary pyrography is completed;
the hot-stamping picture comprises the following specific steps: selecting proper ironing board, engraving the surface of the ironing board and being provided with a pyrograph, wherein an electric heating plate is arranged inside the ironing board, a positioning board for placing an FPC board is arranged below the ironing board and connected with an electric telescopic rod, a pressure sensor is arranged between the ironing board and the electric telescopic rod, a temperature sensor is arranged on the surface of the ironing board, and the electric heating plate, the temperature sensor, the electric telescopic rod and the pressure sensor are connected with a central controller.
The central controller controls the electric heating plate to heat, temperature information is detected through the temperature sensor, the temperature information is conveyed to the central controller, the temperature of the ironing board is controlled, the central controller controls the electric telescopic rod to drive the lying board to move to carry out hot-stamping on the FPC board, pressure information is detected through the pressure sensor, and hot-stamping is carried out under proper pressure.
The concrete steps of the paste reinforcement are as follows: epoxy resin is added at the position of the FPC board to be reinforced, and the epoxy resin in the reinforcement is melted by utilizing the high temperature condition so as to be combined with the circuit on the FPC board, and the circuit on the FPC board can be normally communicated through the step of reinforcing.
Step S4: pressing: pressing the reinforced FPC board for the second time, wherein the pre-pressing time of pressing parameters is defined between 3 and 8S, and the real pressing time is defined between 70 and 130S;
pressing the FPC board through the pressboard in the suppression process, the FPC board is placed on the dynamometer board, be provided with the dynamometer that is used for determining the pressing force on the dynamometer board, the pressboard specification is greater than the FPC board specification, the anticreep groove has been seted up on the pressboard, FPC board joint is inside the anticreep groove, dynamometer data connection has central controller, place on the dynamometer board through the FPC board, the anticreep groove joint on the pressboard is on the FPC board, prevent that the FPC board from taking place to remove when pressing, press the FPC board through central controller control pressboard, the dynamometer detects pressure information and carries to central controller, when reaching suitable pressing range, count time, control pressing time.
Step S5: curing: and curing the pressed FPC board by adopting a curing process.
When solidifying, put the FPC board inside the curing frame, drying hole has all been seted up to curing frame top and bottom, and the curing frame passes through the guide duct and links to each other with the air heater, and the air heater of complaining is connected with central controller, produces hot-blast through central controller control air heater circular telegram, and hot-blast entering curing frame inside along the guide duct blows out along drying hole, and the hot-blast of blowing out carries out quick drying to the top and the bottom of FPC board, and then realizes quick curing, and wherein the meaning of solidification is: chemically refers to the process of converting a substance from a low molecule to a high molecule.
The solidifying frame is composed of an upper closing cover and a lower closing cover, a lifting motor used for pushing the upper box cover to open and close is arranged in the lower closing cover, the lifting motor is connected with a central controller, the lifting motor is controlled to work through the central controller, the lifting motor drives the upper closing cover to open and close, and the FPC board is placed in the lower closing cover to be solidified rapidly.
According to the invention, a plurality of pressing processes are integrated, so that the pressing times are reduced, the product manufacturing efficiency is improved, the hot stamping time is short, the temperature is low, the gold surface is prevented from fogging, the excessive high-temperature and high-pressure processes are reduced, and the labor cost is saved.
The implementation principle of the embodiment is as follows: when the gold surface is removed from the FPC board during the processing process, a chemical deposition method is adopted, ni and Au are plated on the FPC board through a chemical oxidation-reduction reaction to form a layer of plating, the FPC board after the gold treatment is baked through a nitrogen oven, and the baking step of the nitrogen oven specifically comprises the following steps: (1) after the power supply is connected, the power supply is normally electrified, and the products to be baked are put; (2) the baking time is defined as 30min, and the baking temperature is defined as 120 ℃; (3) starting vacuumizing, and stopping vacuumizing after the vacuum is achieved; (4) starting heating, decompressing after baking, taking out the product, and pasting a shielding film on the surface of the FPC board after baking.
Carrying out pyrography on the surface of the FPC board after the shielding film is pasted, wherein the temperature of the pyrography is defined at 110 ℃, the pyrography time is defined at 10S, pasting reinforcement is carried out on the FPC board after the pyrography, secondary pyrography is carried out on the surface of the FPC board after pasting reinforcement is finished, the temperature of the pyrography is defined at 110 ℃, the pyrography time is defined at 10S, secondary pasting reinforcement is carried out after the secondary pyrography is finished, pressing is carried out after the secondary reinforcement is finished, the FPC board is pressed through a pressing plate in the pressing process, the pressing plate is controlled to press the FPC board through a central controller, when pressure information detected by a dynamometer is conveyed to the central controller and reaches a proper pressing range, timing is carried out, the pressing time is controlled, and the pressed FPC board is solidified through a solidification technology.
The embodiments of the present invention are all preferred embodiments of the present invention, and are not intended to limit the scope of the present invention in this way, therefore: all equivalent changes in structure, shape and principle of the invention should be covered in the scope of protection of the invention.
Claims (9)
1. A technological method for removing gold surface fogging in the FPC board processing process is characterized in that: the method comprises the following steps:
step S1: and (3) gold melting: selecting an FPC board to be processed, and performing gold-plating treatment on the surface of the FPC board to generate a layer of plating;
step S2: baking: baking the FPC board subjected to the gold-removing treatment through a nitrogen oven, wherein the baking time is defined between 25 and 35min, the baking temperature is defined between 100 and 150 ℃, and a shielding film is adhered to the surface of the FPC board after the baking is finished;
step S3: pyrography: carrying out pyrography on the surface of the FPC board after the shielding film is pasted, wherein the temperature of the pyrography is defined between 90 and 130 ℃, the pyrography time is defined between 5 and 15S, pasting reinforcement is carried out on the FPC board after the pyrography is completed, carrying out secondary pyrography on the surface of the FPC board after the pasting reinforcement is completed, the temperature of the secondary pyrography is defined between 90 and 130 ℃, the secondary pyrography time is defined between 5 and 15S, and carrying out secondary pasting reinforcement after the secondary pyrography is completed;
step S4: pressing: pressing the reinforced FPC board for the second time, wherein the pre-pressing time of pressing parameters is defined between 3 and 8S, and the real pressing time is defined between 70 and 130S;
step S5: curing: and curing the pressed FPC board by adopting a curing process.
2. The process for removing gold surface fogging in the FPC board processing process according to claim 1, wherein the process comprises the following steps: in the step S1, the specific step of gold melting is to adopt a chemical deposition method, and to plate Ni and Au on the FPC board through a chemical oxidation-reduction reaction to form a layer of plating layer.
3. The process for removing gold surface fogging in the FPC board processing process according to claim 1, wherein the process comprises the following steps: in step S2, the baking step in the nitrogen oven specifically includes:
(1) after the power supply is connected, the power supply is normally electrified, and the products to be baked are put;
(2) setting constant temperature time and heating the set temperature;
(3) starting vacuumizing, and stopping vacuumizing after the vacuum is achieved;
(4) heating is started, and after baking is finished, the product is decompressed and taken;
the temperature control in the nitrogen oven is a PID type touch screen instrument, the temperature is controlled in a single-point or program mode, the calculation is automatic, the PV/SV is displayed at the same time, and the touch setting is performed; the device has a memory function, the maximum data storage time is 12 months, a 232 computer interface is provided, the baking time of a nitrogen oven is 30min, and the baking temperature is 120 ℃.
4. The process for removing gold surface fogging in the FPC board processing process according to claim 1, wherein the process comprises the following steps: in step S2, the step of attaching the shielding film specifically includes:
(1) bonding one surface of the shielding film provided with the protective film with the adhesive layer on the adhesive film according to the arrangement mode of the surface of the FPC board;
(2) sticking one surface of the shielding film, which is not provided with the protective film, after the adhesive layer is adhered to the FPC board to be adhered;
(3) carrying out pressing treatment on the product to be adhered with the shielding film, and tearing off the adhesive film;
(4) and removing the protective film on the shielding film.
5. The process for removing gold surface fogging in the FPC board processing process according to claim 1, wherein the process comprises the following steps: in the step S3, the specific steps of the hot stamping are as follows: selecting a proper ironing plate, engraving a pyrograph on the surface of the ironing plate, arranging an electric heating plate inside the ironing plate, arranging a positioning plate for placing an FPC plate below the ironing plate, connecting the ironing plate with an electric telescopic rod, arranging a pressure sensor between the ironing plate and the electric telescopic rod, arranging a temperature sensor on the surface of the ironing plate, and connecting the electric heating plate, the temperature sensor and the pressure sensor with a central controller.
6. The process for removing gold surface fogging in the FPC board processing process according to claim 1, wherein the process comprises the following steps: in the step S3, the specific steps of reinforcing are as follows: and adding epoxy resin at the position of the FPC board to be reinforced, and melting the epoxy resin in the reinforcement by using high-temperature conditions so as to be combined with the circuit on the FPC board.
7. The process for removing gold surface fogging in the FPC board processing process according to claim 1, wherein the process comprises the following steps: in step S4, the FPC board is pressed through the pressboard in the pressing process, the FPC board is placed on the force measuring board, the force measuring instrument for measuring the pressing force is arranged on the force measuring board, the specification of the pressboard is larger than that of the FPC board, the pressboard is provided with the anti-drop groove, the FPC board is clamped inside the anti-drop groove, and the force measuring instrument is connected with the central controller.
8. The process for removing gold surface fogging in the FPC board processing process according to claim 1, wherein the process comprises the following steps: in step S5, during curing, the FPC board is placed inside the curing frame, drying holes are formed in the top and bottom of the curing frame, the curing frame is connected with the air heater through the air guide pipe, and the air heater is connected with the central controller.
9. The process for removing gold surface fogging in the FPC board processing procedure according to claim 8, wherein the process comprises the following steps: the curing frame is composed of an upper cover and a lower cover, a lifting motor for pushing the upper box cover to open and close is arranged in the lower cover, and the lifting motor is connected with a central controller.
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