CN108734154A - A kind of packaging method and its encapsulating structure of ultra-thin fingerprint recognition chip - Google Patents
A kind of packaging method and its encapsulating structure of ultra-thin fingerprint recognition chip Download PDFInfo
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The invention discloses a kind of packaging methods and its encapsulating structure of ultra-thin fingerprint recognition chip, belong to fingerprint recognition chip package field, technological process is as follows：Wafer and base panel frame carry out plasma clean；Composite protection film is bonded with film is loaded, then is bonded with the back side of base panel frame；Using chip attachment machine by the front of the flip-chip on wafer to base panel frame；Use die press technology for forming plastic package chip and base panel frame；Cure after plastic packaging product；The plastic packaging layer polishing reduction process of plastic packaging product；Film is loaded by solving bonding technology separation；The composite protection film polishing reduction process of plastic packaging product；Wearing layer is coated on the outside of composite protection film after being thinned；Laser cutting molding.Present invention obtains the reliable binding force between composite protection film and ultra-thin fingerprint recognition chip, base panel frame, plastic packaging material, it is bad to solve product appearance, and entire to encapsulate flow succinct.
Description
Technical Field
The invention relates to a packaging method and a packaging structure of an ultrathin fingerprint identification chip, belonging to the field of fingerprint identification chip packaging.
Background
Fingerprints are unique characteristics of human bodies, and the fingerprint identification technology is the key of the current biological identification technology. Nowadays, mobile phones become an indispensable part in daily life of people, and due to frequent use times, people feel very inconvenient by repeatedly inputting passwords, and users feel more convenient, faster and safer due to the fingerprint identification system.
However, the reliability performance of the fingerprint identification chip cannot meet the test requirement, and the fingerprint identification chip needs to be packaged for the second time, so that the fingerprint identification chip can meet the requirements of reliability, ultra-thinness, screen undersize and the like which meet the current mobile phone development trend. Currently, fingerprint packaging is generally adopted in the field of fingerprint identification, but in the actual production process, a large number of appearance defects, such as Die Mark and Dent (concave-convex points) shown in fig. 1, are found on the surface of a fingerprint identification product.
Disclosure of Invention
The invention mainly aims at the defects of the prior packaging technology and provides a packaging method and a packaging structure of an ultrathin fingerprint identification chip for improving poor appearance.
The purpose of the invention is realized as follows:
the invention provides a packaging method of an ultrathin fingerprint identification chip, which comprises the following process flows of:
the method comprises the following steps: the wafer and the substrate frame are subjected to plasma cleaning by adopting argon and hydrogen as cleaning gases, a plurality of ultrathin fingerprint identification chip units for completing the packaging process are arranged on the wafer, a dielectric layer is arranged on the front surface of each ultrathin fingerprint identification chip unit, and a welding ball is arranged on the back surface of each ultrathin fingerprint identification chip unit;
step two: the composite protective film is attached to the loading film and then attached to the back of the substrate frame cleaned in the step one;
step three: inversely installing the ultrathin fingerprint identification chip unit in the first step to the position of the chip to be attached on the front surface of the substrate frame after the second step by using a chip mounter;
step four: the ultrathin fingerprint identification chip unit and the substrate frame in the third plastic packaging step are packaged by a compression molding process (C-mold) to form a plastic packaging product;
step five: carrying out post-curing (PMC) process on the plastic package product obtained in the step four;
step six: polishing and thinning the plastic packaging layer of the plastic packaging product cured in the fifth step to expose the welding surface of the welding ball;
step seven: separating the loading membrane by adopting a bonding-releasing process;
step eight: polishing and thinning the composite protective film stripped from the loading film;
step nine: coating a wear-resistant layer on the outer side of the thinned composite protective film;
step ten: laser cutting is performed to form single packages, and the substrate frame is removed at the same time.
In the second step of the invention, the composite protective film comprises a base layer and a semi-cured resin layer, wherein the base layer is made of polyimide or PEN (polyethylene naphthalate), the base layer contains atomized particles, the haze is 3-5%, the transmittance is 95-98%, and the semi-cured resin layer is PSA or silicone adhesive.
The thickness of the base layer is 20-30 micrometers.
The inner side of the base layer is provided with a wear-resistant polyurethane layer to form a wear-resistant layer, and the hardness of the wear-resistant polyurethane layer is 2H or 3H.
The thickness of the semi-cured resin layer is 10-18 microns.
In the fourth step of the invention, the plastic packaging thickness of the plastic packaging formed product is larger than the design thickness of the product, and the error of the plastic packaging thickness is controlled as follows: +/-15 microns.
In the eighth step of the invention, the thickness of the composite protective film is reduced to 20 micrometers +/-2 micrometers, and the surface roughness Ra of the composite protective film is as follows: 0.2 to 0.5 μm.
In the seventh step of the invention, before the loaded membrane is separated, the plastic packaged product in the sixth step needs to be baked at 180 ℃ for 4 hours.
The invention also provides a packaging structure of the ultrathin fingerprint identification chip, which comprises a fingerprint identification sensor chip and an encapsulating body, wherein the front surface of the fingerprint identification sensor chip is provided with a fingerprint induction identification area and a plurality of chip electrodes, the chip electrodes are arranged on one side of the fingerprint induction identification area, the encapsulating body encapsulates the fingerprint identification sensor chip and the metal connecting piece, the upper surface of the encapsulating body exposes the front surface of the fingerprint identification sensor chip, the front surface of the fingerprint identification sensor chip and the upper surface of the encapsulating body are covered with a patterned insulating layer, an insulating layer opening is arranged at the chip electrode, a front surface rewiring metal layer is selectively arranged on the upper surface of the insulating layer, the front surface rewiring metal layer is distributed on one side of the chip electrode outside the vertical area of the front surface of the fingerprint induction identification area and is connected with the chip electrode through the insulating layer opening, the front surface of the fingerprint identification sensor chip is coated with a dielectric layer, the dielectric layer covers the front surface rewiring metal layer and the insulating layer, the metal connecting pieces are arranged on one side of the fingerprint identification sensor chip and are arranged nearby the chip electrodes and correspond to the chip electrodes in number one by one, the metal connecting pieces are rewiring metal layers, the top of each metal connecting piece penetrates through the insulating layer to reach the lower surface of the front surface rewiring metal layer, and the bottom of each metal connecting piece is exposed out of the packaging body,
the lower surface of the encapsulating body is provided with a back rewiring metal layer and a back plastic packaging layer, one end of the back rewiring metal layer is provided with a solder ball, the other end of the back rewiring metal layer is connected with the bottom of the metal connecting piece, the metal connecting piece and the back rewiring metal layer are of an integral structure, the back plastic packaging layer covers the back rewiring metal layer, the encapsulating body and the four walls of the dielectric layer, only the welding surface of the solder ball is exposed, and the front surface of the back plastic packaging layer is flush with the upper surface of the dielectric layer,
the composite protective film comprises a semi-cured resin layer and a base layer, wherein the semi-cured resin layer is in bonding connection with the front surfaces of the dielectric layer and the back surface plastic package layer, the base layer contains atomized particles, the haze is 3-5%, the transmittance is 95-98%, and the composite protective film is thinned to 20 micrometers +/-2 micrometers.
The outer side and/or the inner side of the base layer are/is provided with a wear-resistant polyurethane layer to form a wear-resistant layer, and the hardness of the wear-resistant polyurethane layer is 2H or 3H.
Advantageous effects
According to the packaging method of the ultrathin fingerprint identification chip, the reliable binding force between the composite protective film and the ultrathin fingerprint identification chip, the substrate frame and the plastic package material is obtained, the problem of poor product appearance is solved, and the product yield is improved; meanwhile, the composite protective film and the loading film bear the packaging structure in the whole packaging process, so that the whole packaging process is simple; the ultrathin packaging structure of the fingerprint identification chip is realized by the thinned composite protective film, and the reliability and the wear resistance of the packaging structure are enhanced by the combination of the outer wear-resistant layer and the inner wear-resistant layer.
Drawings
FIG. 1 is a poor diagram of the package appearance of a prior art fingerprint identification chip;
FIG. 2 is a process flow diagram of a method for packaging an ultra-thin fingerprint identification chip according to the present invention;
FIG. 3 is a diagram of an embodiment of a package structure of an ultra-thin fingerprint identification chip;
FIG. 4A is a schematic front view of the metal connector of FIG. 3, the chip electrode and the sensing element region;
FIG. 4B is a schematic bottom view of the metal connector and the back redistribution metal layer of FIG. 3;
FIG. 5 is a schematic diagram of a packaging method of an ultra-thin fingerprint identification chip according to the present invention;
FIG. 6 is an appearance effect diagram of a package structure of an ultra-thin fingerprint identification chip according to the present invention;
wherein,
fingerprint identification sensor chip 1
Chip body 10
Fingerprint sensing identification area 12
Chip electrode 14
Insulating layer 31
Dielectric layer 35
Envelope 4
Metal connecting piece 5
Front surface rewiring metal layer 6
Back surface rewiring metal layer 7
Solder ball 71
Rewiring metal wiring 72
Back plastic-sealed layer 78
Base plate frame 8
Composite protective film 91
Base layer 911
Semi-cured resin layer 912
Loading film 92
Loading film base 921
The film adhesive layer 921 is loaded.
Detailed Description
In order to explain the spirit of the invention in detail and to assist those skilled in the art to understand the full technical solution of the invention practically and completely, the following detailed description will be made with reference to the embodiments and the accompanying drawings:
the technical scheme adopted by the invention is as follows: a packaging method of an ultrathin fingerprint identification chip is disclosed, the process flow chart of which is shown in figure 2, and the method specifically comprises the following steps:
s1: carrying out plasma cleaning on the wafer and the substrate frame;
s2: the composite protective film is attached to the loading film and then attached to the back surface of the substrate frame;
s3: flip-chip mounting the chip to the front surface of the substrate frame using a chip mounter;
s4: a compression molding process (C-mold) is used for plastically packaging the chip, the welding balls of the chip and the substrate frame;
s5: post-curing (PMC) of the plastic packaging product;
s6: polishing and thinning a plastic packaging layer of a plastic packaging product;
s7: a separation loading membrane process;
s8: polishing and thinning the composite protective film of the plastic package product;
s9: coating a wear-resistant layer on the outer side of the thinned composite protective film;
s10: and (5) laser cutting and forming.
Examples
The invention relates to a packaging structure of an ultrathin fingerprint identification chip, wherein a fingerprint identification sensor chip 1 is rectangular, the sectional schematic view is shown in figure 3, a fingerprint induction identification area 12 and a plurality of chip electrodes 14 are arranged on the front surface of a chip body 10 of the fingerprint identification sensor chip 1, the chip electrodes 14 are arranged on one side of the fingerprint induction identification area 12 so as to ensure that the effective detection area of the fingerprint induction identification area 12 is as large as possible, the figure shows that 6 chip electrodes 14 arranged on one side of the fingerprint induction identification area 12 are used for indicating, an induction element is arranged in the fingerprint induction identification area 12, and the circuit of the circuit and the chip electrodes 14 are arranged in the fingerprint identification sensor chip 1.
The fingerprint sensor chip 1 and the metal connecting piece 5 are encapsulated by an encapsulating material, and the material of the encapsulating material is most commonly epoxy resin, phenolic resin, organic silicon resin and unsaturated polyester resin at present. After the encapsulation and curing of the encapsulating material are completed, the solid encapsulating body 4 can play a role in water resistance, moisture resistance, shock resistance, dust prevention, heat dissipation, insulation and the like. Meanwhile, in order to reduce the problem of the thermal expansion coefficient of the encapsulating material and improve the thermo-mechanical reliability of the structure, fillers such as silicon oxide and silicon nitride are added into the encapsulating material.
The upper surface of the encapsulation 4 exposes the front side of the fingerprint sensor chip 1. The front surface of the fingerprint sensor chip 1 and the upper surface of the encapsulating body 4 are covered with the patterned insulating layer 31, and an insulating layer opening 311 is opened at the chip electrode 14. The insulating layer 31 is made of silicon oxide, silicon nitride, or the like. The front redistribution metal layer 6 is selectively disposed on the upper surface of the insulating layer 31, the front redistribution metal layer 6 is disposed on one side of the chip electrode 14 outside the vertical region of the front surface of the fingerprint sensing identification region 12, and is connected to the chip electrode 14 through the insulating layer opening 311, and the front redistribution metal layer 6 is generally made of copper Cu, iron Fe, nickel Ni, or other materials with good electrical conductivity. The specific number of layers can be set to one or more layers according to the product requirements, and usually, the front rewiring metal layer 6 is a high-density wiring layer, that is, the line width/line distance is below 5 um. The front surface of the fingerprint identification sensor chip 1 is coated with a dielectric layer I35, and the dielectric layer I35 covers the front surface rewiring metal layer 6 and the insulating layer 31.
The metal connecting member 5 is disposed beside the fingerprint sensor chip 1, and the metal connecting member 5 is preferably disposed on the same side of the chip electrode 14 of the fingerprint sensor chip 1. The metal connecting piece 5 is solid or hollow column-shaped and is made of copper Cu, nickel Ni, vanadium V, titanium Ti, palladium Pd, gold Au, silver Ag and the like. Alternatively, the metal connector 5 is a rewiring metal layer and is integrally formed with the back-surface rewiring metal layer 7. The top of the metal connecting piece 5 penetrates through the insulating layer 31 to reach the lower surface of the front rewiring metal layer 6, and is connected with the front rewiring metal layer 6. The number of the metal connecting pieces 5 has no absolute corresponding relation with the number of the chip electrodes 14, and is designed according to actual requirements. In fig. 4A, in order to clearly illustrate the connection relationship between the metal connectors 5 and the chip electrodes 14, the number of the metal connectors 5 and the number of the chip electrodes 14 are illustrated in a one-to-one correspondence manner. The bottom of the metal connector 5 is exposed from the enclosure 4.
The lower surface of the package body 4 is provided with a back surface rewiring metal layer 7. The back rewiring metal layer 7 is generally made of metal with good conductivity, such as copper Cu, iron Fe, nickel Ni, and the like. The specific number of layers can be set to one or more layers according to the product requirements, and usually, the back rewiring metal layer 7 is a high-density wiring layer, namely, the line width/line distance is less than 5um, so that the reliability of electricity is improved. One end of the back surface rewiring metal layer 7 is provided with a solder ball 71, and the other end thereof is connected to the bottom of the metal connector 5. The chip electrode on the front side of the fingerprint sensor chip 1 is led to the back side of the fingerprint sensor chip 1 to be conducted with the substrate. Therefore, compared with the prior art of the fingerprint identification sensor packaging structure, the scheme of the invention also reduces the vertical space amount required by the fingerprint identification sensor, so that the fingerprint identification sensor is designed at a position closer to the finger of a user, and the contact sensitivity of the fingerprint identification sensor is effectively improved.
The front surface of the fingerprint identification sensor chip 1 is coated with the dielectric layer 35, and the dielectric constant of the dielectric layer 35 is 4.5-6, so that the parasitic resistance, the capacitance and the inductance of the circuit structure are reduced, and meanwhile, the circuit is guaranteed to have good insulating performance.
The back molding layer 78 covers the back redistribution layer 7, the encapsulant 4 and the walls of the dielectric layer 35 and exposes only the solder balls 71, and the front surface of the back molding layer is flush with the upper surface of the dielectric layer 35. After the back surface is polished, the solder balls 71 are exposed out of the soldering surface for connecting with a PCB or a substrate when in use. The material of the back molding layer 78 typically comprises silicon oxide, silicon nitride or resin-based dielectric materials. The positions of the solder balls 71 can be flexibly arranged corresponding to different substrates, and the shapes of the solder balls 71 can also be flexibly designed, generally, the solder balls 71 are arranged in an array shape, the larger the solder balls are, the better the solder balls are, on one hand, convenient for connection, and on the other hand, the solder balls are also one of heat dissipation channels of the packaging structure. According to different solder ball 71 layouts, as shown in fig. 4B, the solder balls 71 are shown in a 3 × 2 array arrangement, and the re-wiring metal layer 7 realizes the electrical connection between the solder balls 71 and the metal connectors 5 in the most convenient wiring scheme, so as to save the production cost.
The composite protective film 91 includes a semi-cured resin layer 912 and a base layer 911. The base layer 911 is made of polyimide (polyimide), polyethylene naphthalate (PEN), and the like, and has very good impact resistance and tear resistance. The base layer 911 material contains atomized particles, the haze is 3-5%, the transmittance is 95-98%, the diffuse reflection of light in the base layer is uniform, and defects such as concave and convex points, die marks and the like existing in the packaging structure of the whole ultrathin fingerprint identification chip can be shielded. In order to enhance the abrasion resistance, a thin abrasion-resistant polyurethane layer is arranged on the outer side and/or the inner side of the base layer 911 to form an abrasion-resistant layer, the hardness of the abrasion-resistant polyurethane layer is 2H or 3H, and the film surface can be further prevented from being scratched. The semi-cured resin layer 912 is a tacky PSA, silicone adhesive, or the like, has a thickness of 5 to 18 μm, is softened under heat and pressure, has a tackiness, and reacts and solidifies after cooling. Through a mold pressing plastic package forming process (C-mold), the semi-cured resin layer 912 side of the composite protective film 91 is in bonding connection with the dielectric layer 35 on the front side of the fingerprint identification sensor chip 1 and the front side of the back plastic package layer 78, so that reliable bonding force between the composite protective film and the ultrathin fingerprint identification package structure can be obtained, and the package yield of products is improved.
The thickness of the composite protective film 91 is reduced to 20 micrometers +/-2 micrometers, so that on one hand, the ultrathin packaging thickness is obtained, on the other hand, flaws on the surface of the composite protective film 91 can be removed, and meanwhile, the sensitivity and quick response speed of the fingerprint chip are improved.
The packaging thickness of the under-screen ultrathin fingerprint identification packaging structure is less than 300um, and the packaging structure completely conforms to the development trend.
Referring to fig. 5, the packaging method of the packaging structure of the ultra-thin fingerprint identification chip of the present invention is as follows:
step one, adopting argon (Ar) and hydrogen (H) for the wafer and the substrate frame2) Plasma cleaning is performed as a cleaning gas.
The wafer is provided with a plurality of ultrathin fingerprint identification chip units which finish the packaging process, the front surfaces of the chip units are coated with dielectric layers 35, the dielectric constants of the dielectric layers 35 are 4.5-6, and the back surfaces of the chip units are provided with solder balls 71. In order to remove contaminants on the surfaces of the wafer and the substrate frame, improve the bonding force between the chip and the substrate frame and the plastic package material, and ensure the pressing reliability of the fingerprint product on the sensor surface (fingerprint sensing and identifying area 12), the wafer and the substrate frame need to be put into a plasma cleaning machine for plasma cleaning, and argon (Ar) and hydrogen (H) are adopted for plasma cleaning2) As a purge gas. The plasma cleaning is to bombard the surface of the lead frame by using the plasma state formed by argon and hydrogen to remove surface pollutants, and simultaneously remove oxides of the lead frame by using the reducibility of hydrogen ions to achieve the aim of cleaning. The cleaning method belongs to an environment-friendly green cleaning method. After plasma cleaning, the product is dried and can be sent to the next procedure without drying treatment.
Plasma cleaning key parameters:<1>cleaning gas: argon (Ar) and hydrogen (H)2），<2>Cleaning power: 300 to 500W of the total weight of the steel,<3>cleaning time: 300-500 seconds. Generally, the cleaning power is selected to be 480 watt-hours, and the cleaning time is preferably 360 seconds.
And step two, the composite protective film 91 is attached to the loading film 92 and then attached to the back surface of the substrate frame 8.
The composite protective film 91 has two layers including a semi-cured resin layer 912 and a base layer 911, as shown in fig. 5. The base layer 911 is made of polyimide (polyimide), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), and the like, has a thickness of 20-30 micrometers, and has very good impact resistance and tear resistance. In order to enhance the abrasion resistance, a thin abrasion-resistant polyurethane layer is arranged on the inner side of the base layer 911 to form an abrasion-resistant layer, the hardness of the abrasion-resistant layer is 2H or 3H, and the film surface can be further prevented from being scratched. The semi-cured resin layer 41 is a tacky PSA, silicone adhesive, or the like, and has a thickness of 10 to 18 μm. The adhesive film can be softened under heating and pressurization, has viscosity, can react and solidify after being cooled, can obtain reliable bonding force between the composite protective film 91 and the substrate frame 8 as well as the plastic package material, and improves the packaging yield of products. Therefore, the thickness of the composite protective film 91 is 45-60 microns, and the composite protective film has good flatness and adhesion.
The carrier film 92 has two layers including a carrier film base layer 921 and an adhesive layer 922. The material of the carrier film base layer 921 is PET, and the adhesive layer 922 of the carrier film 92 is bonded to the base layer 911 of the composite protective film 91, as shown in fig. 5.
Due to the special requirements of the bonding process, a vacuum laminator is required, the loading film 92 is fixed on the vacuum laminator, the composite protective film 91 is bonded with the loading film 92, and the back of the substrate frame 8 is bonded with the semi-cured resin layer 41 of the composite protective film 91.
Key parameters of a vacuum film pressing machine table: <1> evacuation time: 10 s-60 s, <2> vacuum press-fit time: 10 s-60 s, <3> vacuum pressing pressure: 1kg/cm 2-5 kg/cm 2. Generally, a vacuum pumping time of 50s, a vacuum pressing time of 30s and a pressure of 2kg/cm2 were selected.
The composite protective film 91, the loading film 92 and the substrate frame 8 are all formed for supporting the fingerprint identification chip and the plastic package process.
And step three, inversely installing the chip to the front surface of the substrate frame by using a chip mounter.
In this step, the ultra-thin fingerprint identification chip unit which is subjected to the packaging process in the first step is taken out from the wafer and is inversely mounted to the chip to be mounted on the front surface of the substrate frame 8, to which the composite protective film 91 is bonded, in the second step by using the chip mounter, and the dielectric layer 35 of the ultra-thin fingerprint identification chip unit is directly bonded to the semi-cured resin layer 41 of the composite protective film 91.
Chip film sticking parameters: <1> chip bonding time (bond time): 200-800 milliseconds, <2> chip bonding force (bond force): 5-30 newtons, <3> chip site (die displacement): +/-30 microns. At a die attach force of 20 newtons, the die attach time required was only 400 milliseconds.
And step four, plastically packaging the ultrathin fingerprint identification chip unit, the welding balls of the ultrathin fingerprint identification chip unit and the substrate frame by using a compression molding process (C-mold) to form a plastic packaging layer.
The compression molding process parameters are as follows:<1>plastic packaging material: the EMC of the vehicle is controlled,<2>plastic packaging temperature: 160-180 ofoC ，<3>Plastic packaging pressure: 6 to 16 tons of the organic silicon compound,<4>curing time: the time of the first step is 100 to 150 seconds,<5>and (3) plastic package thickness of the product: is larger than the designed thickness of the product,<6>controlling the plastic packaging thickness error of the product: +/-15 microns. If the plastic packaging thickness of the product is 450 micrometers, the plastic packaging temperature is 175 DEGoC, plastic packaging pressure: 6 tons, curing time: for 100 seconds.
And fifthly, carrying out plastic package on the product and then curing (PMC).
And (3) further curing the plastic package material after the plastic package forming of the product is finished, so that the semi-cured resin layer 912 of the composite protective film 91 is in bonding connection with the dielectric layer 35 and the front surface of the plastic package layer formed in the fourth step, the reliability of the product is ensured, and the internal stress of the product is released.
Product post-curing parameters:<1>post-curing temperature: 170 to 180oC<2>Post-curing time: 2-8 hours. Typically, the post-cure temperature is 175 deg.CoC, post-curing time required 5 hours.
And step six, polishing and thinning a plastic packaging layer of the plastic packaging product.
Polishing and thinning process parameters: <1> rotation speed of grinding wheel: and (3) controlling the polishing thickness error at 800-3000 RPM <2 >: +/-10 microns.
The process is to polish the plastic package layer of the product to make the overall thickness of the product meet the product design requirement through a polishing process to form a back plastic package layer 78, and simultaneously polish the solder balls 71 to form the soldering surfaces of the solder balls so as to facilitate the soldering of a PCB (printed circuit board), as shown in fig. 5. The thickness of the polishing target of the plastic packaging layer of the packaging structure of the ultrathin fingerprint identification chip is 270 micrometers, and the rotating speed of a grinding wheel can be selected: 2000 RPM.
And step seven, separating the loading film 92.
After baking for 4 hours at 180 ℃, the bonding between the loading film 92 and the composite protective film 91 is opened through a bonding releasing process, the packaged product is adsorbed on a vacuum platform, one corner of the loading film 92 is uncovered by using tweezers, and then the loading film 92 is uncovered at a constant speed manually along the corner slightly. The loading film 92 can also be peeled off by a full-automatic film peeling machine.
Because the compound protective film 91 is linked with the plastic package material and the dielectric layer 35 by chemical bonds, the reliability of the plastic package material is ensured and the plastic package material cannot be torn off.
And step eight, polishing and thinning the composite protective film 91 of the plastic package product.
The thickness of the composite protective film 91 needs to be further thinned to 20 microns +/-2 microns, and the surface roughness Ra: 0.2-0.5 micron, on one hand, the ultrathin packaging thickness is obtained, and the sensitivity and quick response speed of the fingerprint chip are achieved; on the other hand, the atomized particles in the base layer 911 material have 3-5% of haze and 95-98% of transmittance, and the uniform diffuse reflection of light in the atomized particles can shield flaws such as concave and convex points, die marks and the like existing in the packaging structure of the whole ultrathin fingerprint identification chip.
And step nine, coating an abrasion-resistant layer on the outer side of the thinned composite protective film 91.
In order to enhance the abrasion resistance, a thin layer of abrasion-resistant polyurethane is coated on the outer side of the thinned composite protective film 91 to form an abrasion-resistant layer, the hardness of the abrasion-resistant layer is 2H or 3H, and the composite protective film 91 can be further prevented from being scratched.
Step ten, laser cutting and forming.
The product is cut into individual packages of a desired shape by laser dicing along dicing lines, and the substrate frame 8 is cut away as shown in fig. 3, 4A, and 4B.
The packaging method of the packaging structure of the ultrathin fingerprint identification chip can obtain reliable bonding force between the composite protective film 91 and the plastic packaging layer of the product, solves the problem of poor appearance of the product, and improves the packaging yield of the product. As shown in fig. 6, the appearance of the package structure of the ultra-thin fingerprint identification chip was observed without Dent (concave-convex point) and Die Mark (chip print).
The above-mentioned embodiments are intended to explain the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A packaging method of an ultrathin fingerprint identification chip comprises the following process flows:
the method comprises the following steps: the wafer and the substrate frame are subjected to plasma cleaning by adopting argon and hydrogen as cleaning gases, a plurality of ultrathin fingerprint identification chip units for completing the packaging process are arranged on the wafer, a dielectric layer is arranged on the front surface of each ultrathin fingerprint identification chip unit, and a welding ball is arranged on the back surface of each ultrathin fingerprint identification chip unit;
step two: the composite protective film is attached to the loading film and then attached to the back of the substrate frame cleaned in the step one;
step three: inversely installing the ultrathin fingerprint identification chip unit in the first step to the position of the chip to be attached on the front surface of the substrate frame after the second step by using a chip mounter;
step four: the ultrathin fingerprint identification chip unit and the substrate frame in the third plastic packaging step are packaged by a compression molding process (C-mold) to form a plastic packaging product;
step five: carrying out post-curing (PMC) process on the plastic package product obtained in the step four;
step six: polishing and thinning the plastic packaging layer of the plastic packaging product cured in the fifth step to expose the welding surface of the welding ball;
step seven: separating the loading membrane by adopting a bonding-releasing process;
step eight: polishing and thinning the composite protective film stripped from the loading film;
step nine: coating a wear-resistant layer on the outer side of the thinned composite protective film;
and step ten, laser cutting is carried out to form a single packaging body, and meanwhile, the substrate frame is removed.
2. The method for packaging an ultra-thin fingerprint identification chip of claim 1, wherein: in the second step, the composite protective film comprises a base layer and a semi-cured resin layer, wherein the base layer is made of polyimide or PEN (polyethylene naphthalate), the base layer contains atomized particles, the haze is 3-5%, the transmittance is 95-98%, and the semi-cured resin layer is PSA or silicone adhesive.
3. The method for packaging an ultra-thin fingerprint identification chip of claim 2, wherein: the thickness of the base layer is 20-30 microns.
4. The method for packaging an ultra-thin fingerprint identification chip of claim 2 or 3, wherein: the inner side of the base layer is provided with a wear-resistant polyurethane layer with the hardness of 2H or 3H to form a wear-resistant layer.
5. The method for packaging an ultra-thin fingerprint identification chip of claim 2, wherein: the thickness of the semi-cured resin layer is 10-18 microns.
6. The method for packaging an ultra-thin fingerprint identification chip of claim 1, wherein: in the fourth step, the plastic packaging thickness of the plastic packaging formed product is larger than the design thickness of the product, and the error of the plastic packaging thickness is controlled: +/-15 microns.
7. The method for packaging an ultra-thin fingerprint identification chip of claim 1, wherein: step eight, the thickness of the composite protective film is reduced to 20 micrometers +/-2 micrometers, and the surface roughness Ra is as follows: 0.2 to 0.5 μm.
8. The method for packaging an ultra-thin fingerprint identification chip of claim 1, wherein: in the seventh step, before the loaded membrane is separated, the plastic packaged product in the sixth step needs to be baked for 4 hours at 180 ℃.
9. The method for packaging an ultra-thin fingerprint identification chip of claim 1, wherein: in the ninth step, the single package body comprises a fingerprint identification sensor chip and an encapsulation body, the front surface of the fingerprint identification sensor chip is provided with a fingerprint induction identification area and a plurality of chip electrodes, the chip electrodes are arranged on one side of the fingerprint induction identification area, the encapsulation body encapsulates the fingerprint identification sensor chip and the metal connecting piece, the front surface of the fingerprint identification sensor chip is exposed on the upper surface of the encapsulation body, the front surface of the fingerprint identification sensor chip and the upper surface of the encapsulation body are covered with a patterned insulating layer, an insulating layer opening is arranged on each chip electrode, a front surface rewiring metal layer is selectively arranged on the upper surface of the insulating layer, the front surface rewiring metal layer is distributed on one side of the chip electrode outside the vertical area of the front surface of the fingerprint induction identification area and is connected with the chip electrodes through the insulating layer opening, the front surface of the fingerprint identification sensor chip is coated with a dielectric layer, the dielectric layer covers the front surface rewiring metal layer and the insulating layer, the metal connecting pieces are arranged on one side of the fingerprint identification sensor chip and are arranged nearby the chip electrodes and correspond to the chip electrodes in number one by one, the metal connecting pieces are rewiring metal layers, the top of each metal connecting piece penetrates through the insulating layer to reach the lower surface of the front surface rewiring metal layer, and the bottom of each metal connecting piece is exposed out of the packaging body,
the lower surface of the encapsulating body is provided with a back rewiring metal layer and a back plastic packaging layer, one end of the back rewiring metal layer is provided with a solder ball, the other end of the back rewiring metal layer is connected with the bottom of the metal connecting piece, the metal connecting piece and the back rewiring metal layer are of an integral structure, the back plastic packaging layer covers the back rewiring metal layer, the encapsulating body and the four walls of the dielectric layer, only the welding surface of the solder ball is exposed, and the front surface of the back plastic packaging layer is flush with the upper surface of the dielectric layer,
the composite protective film comprises a semi-cured resin layer and a base layer, wherein the semi-cured resin layer is in bonding connection with the front surfaces of the dielectric layer and the back surface plastic package layer, the base layer contains atomized particles, the haze is 3-5%, the transmittance is 95-98%, and the composite protective film is thinned to 20 micrometers +/-2 micrometers.
10. The method for packaging an ultra-thin fingerprint identification chip of claim 9, wherein: and a wear-resistant polyurethane layer is arranged on the outer side and/or the inner side of the base layer to form a wear-resistant layer, and the hardness of the wear-resistant layer is 2H or 3H.
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