CN110099517B - Manufacturing method of HDI rigid-flex printed board ink printing carrier - Google Patents
Manufacturing method of HDI rigid-flex printed board ink printing carrier Download PDFInfo
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- CN110099517B CN110099517B CN201910491046.0A CN201910491046A CN110099517B CN 110099517 B CN110099517 B CN 110099517B CN 201910491046 A CN201910491046 A CN 201910491046A CN 110099517 B CN110099517 B CN 110099517B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Plates And Materials Therefor (AREA)
Abstract
The invention discloses a manufacturing method of an ink printing carrier of an HDI rigid-flex printed board, which belongs to the technical field of circuit boards and mainly solves the technical problems of low manufacturing efficiency and high cost of the existing ink printing carrier of the rigid-flex printed board, and the method comprises the following steps of S1, etching a copper substrate to obtain a copper bump corresponding to a printing ink area; s2, printing a bonding glue on the top of the copper bump, covering a copper-free substrate on the copper-containing substrate, and completely attaching and tightly bonding the copper-free substrate and the copper bump; and S3, cutting (or electrically milling) substrate bumps corresponding to the printing ink area on the copper-free substrate to obtain the carrier. The method can efficiently and accurately manufacture the HDI rigid-flex printed board ink printing carrier, and has low manufacturing cost.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a manufacturing method of an HDI rigid-flex printed board ink printing carrier.
Background
At present, rigid-flex circuit boards are applied more and more in mobile phone consumer portable electronics, but nowadays, in order to better meet the 3D (three-dimensional) assembly requirements of electronic products, multi-stage HDI (high Density interconnection) rigid-flex circuit boards with special structures are appeared. The flexible area of the flexible circuit board is generally provided with a plurality of parts and only has two layers of circuits, the flexible circuit board has the characteristics of short, small, light, thin and soft and the like, photosensitive ink is required to be printed on the flexible circuit board and then exposed, and the requirements of attaching components by SMT behind are met. If the flexible area ink is selected to be screen-printed and exposed when the inner flexible plate is manufactured, the ink is easy to melt to cause uneven thickness in high-temperature pressing for several hours after the subsequent outer layer is combined, and the ink is easy to drop after the outer layer is uncovered, so that the screen-printing and exposure are carried out after the outermost layer circuit is manufactured, but in the process of the outer layer screen-printing ink, the flexible area and the rigid-flexible combined area have unequal thickness drop of 0.2-0.5 mm, a screen printing plate cannot normally contact with the flexible area, the ink thickness after screen printing is uneven, and the subsequent exposure quality is seriously influenced.
As shown in fig. 1, in order to solve the above-mentioned problem of screen printing ink in the flexible area, a conventional method is to attach a bump E (FR4, PI reinforcement, red tape or steel sheet) corresponding to the size and thickness of the position of the printing ink required by the substrate C in the flexible area to a FR4 carrier plate a (1.0 mm to 3.0mm in thickness), so that the bump E pushes up the flexible printing ink area D, and the substrate C in the flexible area and the substrate B in the rigid-flex bonding area are kept at the same level as possible.
At present, the method for producing the printing carrier is that bumps are manufactured through electric milling, laser cutting or die punching, or the bumps are attached to a carrier plate one by one through purchasing (such as steel sheets) and then manually attaching, so that the bumps have large deviation and low attaching efficiency. 500-1000 bumps with different shapes are generally pasted on one substrate, and some bumps need to be pasted twice (such as red adhesive tapes), so that time and labor are wasted, and in addition, the early preparation process seriously influences the production efficiency and influences the market order competition. If the machine pasting is adopted, another set of machine pasting die is required, wherein the steel sheets can be pasted only by purchasing coiled steel sheets, and the purchasing cost is expensive. Some customers can change the product structure continuously, and the substrate carrier manufactured by the method described above is adopted by the customer every time the customer changes the product, which can increase the production cost of the company and affect the production progress.
Disclosure of Invention
The invention aims to solve the technical problem of the prior art, and aims to provide a method for manufacturing an HDI rigid-flex printed board ink printing carrier, which is efficient, accurate and low in manufacturing cost.
The technical scheme of the invention is as follows: a manufacturing method of an HDI rigid-flex printed board ink printing carrier comprises the following steps,
s1, etching the copper substrate to obtain copper bumps corresponding to the printing ink areas;
s2, printing a bonding glue on the top of the copper bump, covering a copper-free substrate on the copper-containing substrate, and completely attaching and tightly bonding the copper-free substrate and the copper bump;
and S3, cutting substrate bumps corresponding to the printing ink areas on the copper-free substrate to obtain the carrier.
As a further improvement, the step S1 includes the following steps,
s11, respectively processing alignment holes on four corners of the copper substrate;
s12, etching all the copper on the bottom surface of the copper substrate according to the alignment holes, and etching a frame line matched with the HDI rigid-flexible combined plate, a plurality of positioning PADs matched with the ink printing positioning holes and copper bumps corresponding to the printing ink areas on the top surface of the copper substrate respectively.
Further, the overall dimension of frame line with the size of HDI rigid-flex board is unanimous, for coaxial arrangement's structure and the diameter of the two unanimous between location PAD and the printing ink printing locating hole.
Further, the outline size of the copper bump is larger than that of the printing ink area.
Further, in step S2, the printing area of the paste is equal to the area of the copper bump, and the paste is left for a predetermined time after printing.
Further, in step S2, the thickness of the copper-free substrate is rigid-flexible region substrate thickness-copper bump thickness.
Further, in step S2, the copper-free substrate and the copper bump are completely bonded and tightly adhered, and then the copper-free substrate is subjected to fast pressing by using a fast press according to set parameters.
Further, the outline size of the substrate bump is larger than that of the copper bump.
Advantageous effects
Compared with the prior art, the invention has the advantages that: according to the invention, the copper bump is obtained by etching on the copper substrate, and the substrate bump corresponding to the printing ink area is cut (or electrically milled) on the copper-free substrate after the copper-free substrate is bonded on the copper bump to complete the manufacturing of the carrier, so that the manual bonding of the bump is avoided, the manufacturing is efficient and accurate, and the manufacturing cost is low; the carrier manufactured by the invention can meet the ink printing requirements of the flexible region of the HDI rigid-flexible combined sample product at the early stage of a client, and also can meet the ink printing requirements of the flexible region of the sample product after batch production, and the ink printing carrier of a batch product does not need to be additionally manufactured.
Drawings
FIG. 1 is a block diagram of a conventional technique;
FIG. 2 is a diagram illustrating a copper bump etched on a copper substrate according to the present invention;
FIG. 3 is a cross-sectional view of a copper bump etched on a copper-containing substrate according to the present invention;
FIG. 4 is a structural diagram of a copper-free substrate bonded to a copper bump according to the present invention;
fig. 5 is a structural view of the carrier manufactured in the present invention.
Wherein: the manufacturing method comprises the following steps of A-carrying plate, B-rigid-flexible combined area substrate, C-flexible area substrate, D-printing ink area, E-bump, 1-copper substrate, 2-copper bump, 3-copper-free substrate, 4-substrate bump, 5-alignment hole, 6-frame line and 7-positioning PAD.
Detailed Description
The invention will be further described with reference to specific embodiments shown in the drawings.
Referring to fig. 1-5, a method for manufacturing an HDI rigid-flex printed board ink carrier includes the following steps,
s1, etching the copper substrate 1 to obtain copper bumps 2 corresponding to the printing ink areas, wherein the copper substrate 1 is an FR-4 copper substrate;
s2, printing a bonding glue on the top of the copper bump 2, covering the copper-free substrate 3 on the copper substrate 1, and enabling the copper-free substrate 3 and the copper bump 2 to be completely attached and adhered tightly, wherein the copper-free substrate 3 is an FR-4 copper-free substrate;
and S3, cutting substrate bumps 4 corresponding to the printing ink areas on the copper-free substrate 3 to obtain the carrier.
The following steps are included in step S1,
s11, processing aligning holes 5 on four corners of the copper substrate 1 respectively, wherein in the embodiment, the number of the aligning holes 5 is 5, the diameter of each aligning hole 5 is 2.0mm, 2 aligning holes 5 are located at the upper left corner, the other 3 aligning holes 5 are distributed on the other 3 corners, and the distance between each aligning hole 5 and the edge of the copper substrate 1 is 5-10 mm;
s12, etching away all the copper on the bottom surface of the copper substrate 1 according to the alignment holes 5, and etching out the frame line 6 matched with the HDI rigid-flex printed board, a plurality of positioning PADs 7 matched with the ink printing positioning holes and the copper bump 2 corresponding to the printing ink area on the top surface of the copper substrate 1, wherein in the embodiment, the line exposure alignment is carried out on any 4 alignment holes 5, and then the process of film pasting-exposure-development-etching is carried out.
The outline dimension of the frame wire 6 is the same as that of the HDI rigid-flexible printed circuit board, that is, the length of the frame wire 6 is equal to that of the HDI rigid-flexible printed circuit board, and the width of the frame wire 6 is equal to that of the HDI rigid-flexible printed circuit board. The positioning PAD7 and the ink printing positioning hole are coaxially arranged, the diameters of the positioning PAD7 and the ink printing positioning hole are consistent, the ink printing accuracy is guaranteed, and the diameter of the positioning PAD7 is 3.2 mm. The shape of the copper bump 2 is set according to the printing ink area, the outline size of the copper bump 2 is larger than that of the printing ink area, the outline of the copper bump 2 protrudes out of the outline of the printing ink area by 0.5-1.0 mm, namely, the distance between the outline of the copper bump 2 and the outline of the printing ink area is 0.5-1.0 mm.
In step S2, the printing area of the water paste is consistent with the area of the copper bump 2, so as to ensure the bonding stability, and the water paste is left for a set time of 5-10 minutes after being printed, so as to ensure the bonding strength of the water paste by natural air drying. The thickness of the copper-free substrate 3 is equal to the thickness of the rigid-flexible combined area substrate B, the thickness of the flexible area substrate C and the thickness of the copper bump 2, and the flexible area substrate C and the rigid-flexible combined area substrate B can be kept at the same horizontal height. After the copper-free substrate 3 and the copper bump 2 are completely attached and tightly adhered, the copper-free substrate 3 is quickly pressed by using a quick press according to set parameters, wherein the set parameters comprise prepressing time of 8-12S, forming time of 70-90S, pressure of 80-100 MPA and temperature of 180 +/-5 ℃, and the connection strength between the copper-free substrate 3 and the copper bump 2 can be ensured after the copper-free substrate and the copper bump 2 are quickly pressed by the set parameters.
In step S3, performing electric blind milling or laser blind cutting on the copper-free substrate 3, wherein the electric blind milling or laser blind cutting depth is the thickness of the copper-free substrate 3, so as to obtain a substrate bump 4 corresponding to the printing ink area, the contour dimension of the substrate bump 4 is greater than the contour dimension of the copper bump 2, the contour line of the substrate bump 4 protrudes out of the contour line of the copper bump 2 by 0.15-0.3 mm, that is, the distance between the contour line of the substrate bump 4 and the contour line of the copper bump 2 is 0.15-0.3 mm, and removing the waste materials to obtain the HDI flex-rigid printed board ink carrier.
According to the invention, the copper bump is obtained by etching on the copper substrate, the substrate bump corresponding to the printing ink area is cut on the copper-free substrate after the copper-free substrate is bonded on the copper bump, so that the carrier is manufactured, the manual bonding of the bump is avoided, the manufacturing is efficient and accurate, and the manufacturing cost is low; the carrier manufactured by the invention can meet the ink printing requirements of the flexible region of the HDI rigid-flexible combined sample product at the early stage of a client, can also meet the ink printing requirements of the flexible region of the sample product after batch production, and does not need to additionally manufacture a batch product ink printing carrier.
The above is only a preferred embodiment of the present invention, and it should be noted that it is obvious to those skilled in the art that several variations and modifications can be made without departing from the structure of the present invention, which will not affect the effect of the implementation of the present invention and the utility of the patent.
Claims (8)
1. A manufacturing method of an HDI rigid-flex printed board ink printing carrier is characterized by comprising the following steps: comprises the following steps of preparing a mixture of a plurality of raw materials,
s1, etching the copper substrate (1) to obtain copper bumps (2) corresponding to the printing ink areas;
s2, printing a bonding glue on the top of the copper bump (2), covering the copper-free substrate (3) on the copper substrate (1) and completely attaching and tightly bonding the copper-free substrate (3) and the copper bump (2);
and S3, cutting substrate bumps (4) corresponding to the printing ink areas on the copper-free substrate (3) to obtain the carrier.
2. The method for manufacturing the HDI rigid-flex printed plate ink carrier according to claim 1, wherein the HDI rigid-flex printed plate ink carrier comprises the following steps: the step S1 includes the following steps,
s11, respectively processing alignment holes (5) on four corners of the copper substrate (1);
s12, etching all copper on the bottom surface of the copper substrate (1) according to the alignment holes (5), and etching frame lines (6) matched with the HDI rigid-flexible combined plate, a plurality of positioning PADs (7) matched with the ink printing positioning holes and copper bumps (2) corresponding to the printing ink areas on the top surface of the copper substrate (1).
3. The method for manufacturing the HDI rigid-flex printed board ink carrier as claimed in claim 2, wherein the steps of: the outline dimension of the frame line (6) is consistent with the outline dimension of the HDI rigid-flex printed circuit board, and the positioning PAD (7) and the ink printing positioning hole are coaxially arranged and have consistent diameters.
4. The method for manufacturing the HDI rigid-flex printed board ink carrier as claimed in claim 2, wherein the steps of: the outline size of the copper bump (2) is larger than that of the printing ink area.
5. The method for manufacturing the HDI rigid-flex printed board ink carrier as claimed in claim 2, wherein the steps of: in the step S2, the printing area of the water paste is equal to the area of the copper bump (2), and the water paste is left for a set time after printing.
6. The method for manufacturing the HDI rigid-flex printed board ink carrier as claimed in claim 2, wherein the steps of: in step S2, the thickness of the copper-free substrate (3) is equal to the thickness of the rigid-flex region substrate (B), the thickness of the flexible region substrate (C), and the thickness of the copper bump (2).
7. The method for manufacturing the HDI rigid-flex printed board ink carrier as claimed in claim 2, wherein the steps of: in the step S2, the copper-free substrate (3) is fast pressed by using a fast press according to set parameters after the copper-free substrate (3) and the copper bump (2) are completely attached and adhered tightly.
8. The method for manufacturing an HDI rigid-flex printed plate ink carrier according to any of claims 1 to 7, wherein: the outline size of the substrate bump (4) is larger than that of the copper bump (2).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910491046.0A CN110099517B (en) | 2019-06-06 | 2019-06-06 | Manufacturing method of HDI rigid-flex printed board ink printing carrier |
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| CN201910491046.0A CN110099517B (en) | 2019-06-06 | 2019-06-06 | Manufacturing method of HDI rigid-flex printed board ink printing carrier |
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| CN110099517A CN110099517A (en) | 2019-08-06 |
| CN110099517B true CN110099517B (en) | 2021-10-01 |
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| CN111465215B (en) * | 2020-05-08 | 2023-05-30 | 瑞声科技(新加坡)有限公司 | Flexible circuit board tooling structure |
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| CN102854741A (en) * | 2012-09-29 | 2013-01-02 | 青岛理工大学 | Compound soft die for wafer-grade nano imprinting of uneven substrate and manufacturing method |
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| CN104302723A (en) * | 2012-05-30 | 2015-01-21 | 东丽株式会社 | Adhesive sheet for production of semiconductor device having bump electrodes and production method for semiconductor device |
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| CN108990305A (en) * | 2018-08-01 | 2018-12-11 | 广州美维电子有限公司 | A kind of Rigid Flex soft board silk-screen green oil method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101079513B1 (en) * | 2009-05-13 | 2011-11-03 | 삼성전기주식회사 | Bump Printing Apparatus And Control Method Thereof |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104302723A (en) * | 2012-05-30 | 2015-01-21 | 东丽株式会社 | Adhesive sheet for production of semiconductor device having bump electrodes and production method for semiconductor device |
| CN103517574A (en) * | 2012-06-26 | 2014-01-15 | 富葵精密组件(深圳)有限公司 | Bearing jig and method for manufacturing rigid-flexible printed circuit board |
| CN102854741A (en) * | 2012-09-29 | 2013-01-02 | 青岛理工大学 | Compound soft die for wafer-grade nano imprinting of uneven substrate and manufacturing method |
| CN107396532A (en) * | 2017-08-24 | 2017-11-24 | 高德（无锡）电子有限公司 | A kind of tool for Rigid Flex flexible arm area text printout |
| CN108990305A (en) * | 2018-08-01 | 2018-12-11 | 广州美维电子有限公司 | A kind of Rigid Flex soft board silk-screen green oil method |
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