CN201919236U

CN201919236U - Single-sided circuit board manufactured by flat stranded bundle conductor

Info

Publication number: CN201919236U
Application number: CN201020275787XU
Authority: CN
Inventors: 王定锋; 徐文红
Original assignee: 张�林
Priority date: 2010-07-29
Filing date: 2010-07-29
Publication date: 2011-08-03
Anticipated expiration: 2020-07-29

Abstract

The utility model relates to single-sided circuit board manufactured by a flat stranded bundle conductor; particularly, a stranded conductor is pressed into the flat stranded bundle conductor with certain width; and then the flat bundle conductor is arranged parallelly; insulation layers with thermosetting adhesives are simultaneously hot-pressed at both sides of the parallel flat stranded bundle conductor; and the position of the flat stranded bundle conductor, which needs to be disconnected, is cut off in the final forming process, so as to lead the parallel flat conductor to form a circuit layer to be manufactured into the single-sided circuit board; and gap bridge connection adopts a printing electrically conductive ink or a welding conductor. Compared with the single-sided circuit board manufactured by a single flat conductor, the single-sided circuit board manufactured by the flat stranded conductor is harder to fold, has better strength and is suitable for manufacturing overlong circuit boards.

Description

The single face circuit board that adopts flat stranded conductor bundle to make

Technical field

The utility model belongs to circuit-board industry, is pressed into the flat stranded conductor bundle of certain width with stranded conductor, then with this flat conductor bundle and put to arrange and make the single face wiring board.Respectively with the two sides of the insulating barrier of being with hot-setting adhesive hot pressing simultaneously at juxtaposed flat stranded conductor bundle, during moulding in the end, cut away the position that flat stranded conductor bundle need disconnect, make juxtaposed flat wire form circuit layer, be made into the single face circuit board, pass a bridge to connect and adopt printing conductive inks or welding conductors to connect.

The utility model is made the more folding of single face circuit board that the single face circuit board is made than single flat wire with the stranded conductor that flattens, and intensity is better, and it is fit to make the circuit board of overlength dragon.

Background technology

Traditional circuit board lead all is that copper-clad plate etches circuit usually, or takes laser and the unwanted copper of milling cutter cutting removal to go out circuit.But the former is high cost and pollution is very serious, and latter's efficient is too low, can't produce in enormous quantities.

Single flat conductor that the utility model is invented in front with the inventor and the single face circuit board of putting making are compared, and have better folding resistance and better intensity, and it is fit to make circuit board of overlength dragon.

Summary of the invention

The utility model is the flat stranded conductor bundle that is pressed into certain width with stranded conductor, then with this flat conductor bundle and put to arrange and make the single face wiring board.Respectively with the two sides of the insulating barrier of being with hot-setting adhesive hot pressing simultaneously at juxtaposed flat stranded conductor bundle, during moulding in the end, cut away the position that flat stranded conductor bundle need disconnect, make juxtaposed flat wire form circuit layer, be made into the single face circuit board, pass a bridge to connect and adopt printing conductive inks or welding conductors to connect.

According to the utility model, a kind of usefulness single face circuit board that flat stranded conductor bundle is made is provided, comprising: and put the flat stranded conductor bundle of arrangement; Be bonded in the insulating barrier of the band glue on the upper and lower faces of this flat stranded conductor bundle respectively; Wherein, the gap bridge between the flat stranded conductor bundle connects takes printing conductive inks or welding conductors or soldered elements to connect, and realizes the conducting of power supply and element.

According to an embodiment of the present utility model, the upper and lower insulating barrier of described band glue has window in advance, thereby forms the insulation bearing bed and the solder mask of described single face circuit board.

According to another embodiment of the present utility model, the structure of described circuit board comprises following four layers successively:

Ground floor is the insulation bearing bed;

The second layer is flat stranded conductor bundle layer;

The 3rd layer is solder mask;

The 4th layer is element layer.

According to another embodiment of the present utility model, described circuit board is Flexible Printed Circuit or rigidity wiring board.

According to another embodiment of the present utility model, the insulating layer material of described band glue is epoxy glass base material or phenolic aldehyde base material or polyimide base material or metal base, or ceramic base material.

According to another embodiment of the present utility model, the copper cash bundle that described flat stranded conductor bundle is any stranded mode, copper cover aluminum wire harness, copper covered steel wire harness, the zinc-plated wire harness of copper, copper nickel plating gold thread bundle, the zinc-plated wire harness of iron or the zinc-plated wire harness of steel.

According to another embodiment of the present utility model, described flat stranded conductor bundle forms with the calendering of stranded conductor bundle.

According to another embodiment of the present utility model, described flat stranded conductor bundle disconnects in the position excision that needs disconnect, and in the position of excision, upper and lower insulating layer material is excised simultaneously.

According to another embodiment of the present utility model, described single face circuit board is used for band, illuminating module, guardrail pipe, neon light, fluorescent tube or Christmas lamp.

According to another embodiment of the present utility model, the length of described single face circuit board is less than or equal to 100 meters, perhaps more than 100 meters.

Description of drawings

By reading this specification in conjunction with the following drawings, it is more apparent that feature of the present utility model, purpose and advantage will become, in the accompanying drawings:

Fig. 1 is the planar structure and the cross-sectional structure figure of the single face circuit board of flat stranded conductor bundle making, comprise Figure 1A, 1B and 1C, wherein Fig. 1 C is the three-dimensional view of single face circuit board, and Figure 1A is the cross sectional view of structure shown in Fig. 1 C, and Figure 1B is the plan view of structure shown in Fig. 1 C.

Fig. 2 is the schematic diagram of the flat stranded conductor bundle of compacting.

Fig. 3 for and put the schematic diagram of groove mould, comprise Fig. 3 A, 3B, wherein Fig. 3 B is and puts the three-dimensional view of groove mould, and Fig. 3 A is shown in Fig. 3 B and put the zoomed-in view of groove structure.

Fig. 4 for and put the groove mould cross-sectional view.

Fig. 5 is for flat stranded conductor bundle and put wiring diagram, comprises Fig. 5 A, 5B, and Fig. 5 B is that flat conductor is fixed on the wiring diagram in the groove, and Fig. 5 A is the juxtaposed zoomed-in view of flat conductor shown in Fig. 5 B.

Fig. 6 vacuumizes air-breathing fixing schematic diagram for flat stranded conductor bundle and when putting deployment line.

Fig. 7 for and flat stranded conductor bundle stick on a schematic diagram of wearing on the insulating barrier of hot-setting adhesive.

Fig. 8 for and put flat stranded conductor bundle and stick on schematic diagram on another insulating barrier of wearing hot-setting adhesive, comprise Fig. 8 A, 8B, wherein Fig. 8 B be with and schematic diagram when putting flat conductor and sticking on another insulating barrier of wearing hot-setting adhesive, and Fig. 8 A view that to be the structure of Fig. 8 B finished after pasting.

Fig. 9 is the schematic diagram that cuts away the position that flat stranded conductor bundle need disconnect.

Figure 10 is the schematic diagram behind the circuit board soldered elements.

The parts label

1 base material; 2 flat stranded conductor bundles; 3 end face coverlays; 4, Chip-R; 5, paster LED; 6, soldering; 7, paster gap bridge conductor; 4,5,7, element and short circuit conductive layer; 8 power supply pads; 9 parallel grooves; 10 vacuum-pumping tubes; 11, excision mouth

Embodiment

To adopt the specific embodiment of the method for the single face circuit board that flat stranded conductor bundle makes to be described in more detail to the utility model below.

But, it will be appreciated by those skilled in the art that the following stated only is to illustrate and describe some preferred implementations, some other similarly or the execution mode that is equal to equally also can be used for implementing the utility model.

1. the making of flat stranded conductor bundle is rolled the flat stranded conductor bundle 2 (as Fig. 2) that the stranded conductor bundle becomes certain width and thickness with calender.

2. and put groove mould and make: adopt etching or mach method with minute surface stainless steel plate, process consistent with line width and put groove 9 (as Fig. 3), the degree of depth of groove 9 can more shallow than the thickness of flat stranded conductor bundle 2 (as Fig. 4).Wherein, Fig. 3 for and put the schematic diagram of groove mould, comprise Fig. 3 A, 3B, wherein Fig. 3 B is and puts the three-dimensional view of groove mould, and Fig. 3 A is shown in Fig. 3 B and put the zoomed-in view of groove structure.Fig. 4 for and put the groove mould cross-sectional view.

3, flat stranded conductor bundle and put layout: design and produce in advance and have consistent with flat stranded conductor beam width and put groove mould, flat stranded conductor bundle and put and arrange and to be fixed on 9 li of grooves (as Fig. 5), vacuumize air-breathing fixing (as Fig. 6) by vacuum-pumping tube 10.Wherein, Fig. 5 is for flat conductor and put wiring diagram, comprises Fig. 5 A, 5B, and wherein Fig. 5 B is that flat conductor is fixed on and puts the wiring diagram in the groove, and Fig. 5 A is the juxtaposed zoomed-in view of flat conductor shown in Fig. 5 B.Fig. 6 vacuumizes air-breathing fixing schematic diagram for flat conductor and when putting deployment line.Fig. 6 vacuumizes air-breathing fixing schematic diagram for flat conductor and when putting deployment line.

4, with the bottom surface coverlay 1 insulating substrate 1 of hot-setting adhesive (promptly with) of band hot-setting adhesive be furnished with 5 to 10 seconds of the overlapping hot pressing of Die and mould plate (precompressed) of flat conductor bundle 2, make bottom surface coverlay 1 with and put flat wire 2 and be pasted together (as Fig. 7), take away mould.Will hold successfully in advance the end face coverlay 3 (also being the insulating substrate of band hot-setting adhesive) of window, contraposition is attached to the another side of flat stranded conductor bundle 2, in 5 to 10 seconds of hot pressing (being precompressed equally), the two sides all is covered with release film again.At last, to 150 ℃ to 180 ℃ of the bottom surface coverlay 1 that forces together in advance,

end face coverlay

3 and 2 hot repressings of flat stranded conductor bundle, 90 to 180 seconds, fixedly secure circuit simultaneously, use baking box again under 120 ℃ to 160 ℃ condition, baking-curing 45 minutes to 90 minutes (as shown in Figure 8).Wherein, Fig. 7 for and flat conductor stick on a schematic diagram of wearing on the insulating barrier of hot-setting adhesive, comprise Fig. 7 A, 7B, wherein, Fig. 7 A is and flat conductor sticks on a schematic diagram of wearing on the insulating barrier of hot-setting adhesive, and Fig. 7 B is the zoomed-in view of structure shown in Fig. 7 A.Fig. 8 for and put flat conductor and stick on schematic diagram on another insulating barrier of wearing hot-setting adhesive, comprise Fig. 8 A, 8B, wherein Fig. 8 B be with and schematic diagram when putting flat conductor and sticking on another insulating barrier of wearing hot-setting adhesive, and Fig. 8 A view that to be the structure of Fig. 8 B finished after pasting.

5, remove the position 11 (as shown in Figure 9) that flat stranded conductor bundle need disconnect with mould is die-cut.

6, printing word, this technology is traditional handicraft, does not carefully state at this.

7, butt welding point is carried out the OSP processing.

8, soldered elements and gap bridge bonding conductor (as shown in figure 10).

9, cut into required single products (as shown in Figure 1) with cutting die.Fig. 1 is the planar structure and the cross-sectional structure figure of the single face circuit board of flat stranded conductor bundle making, comprise Figure 1A, 1B and 1C, wherein Fig. 1 C is the three-dimensional view of single face circuit board, and Figure 1A is the cross sectional view of structure shown in Fig. 1 C, and Figure 1B is the plan view of structure shown in Fig. 1 C.

Below in conjunction with the accompanying drawings the method specific embodiment is described in detail the utility model.But, it will be appreciated by those skilled in the art that the above only is to illustrate and describe some embodiments, to scope of the present utility model, especially the scope of claim does not have any restriction.

Claims

1. single face circuit board of making of flat stranded conductor bundle comprises:

And put the flat stranded conductor bundle of arrangement;

Be bonded in the insulating barrier of the band glue on the upper and lower faces of this flat stranded conductor bundle respectively;

Wherein, the gap bridge between the flat stranded conductor bundle connects takes printing conductive inks or welding conductors or soldered elements to connect, and realizes the conducting of power supply and element.

2. single face circuit board according to claim 1 is characterized in that, the upper and lower insulating barrier of described band glue has window in advance, and forms the solder mask and the insulation bearing bed of described single face circuit board respectively.

3. single face circuit board according to claim 1 and 2 is characterized in that, the structure of described circuit board comprises following four layers successively:

Ground floor is the insulation bearing bed;

The second layer is flat stranded conductor bundle layer;

The 3rd layer is solder mask;

The 4th layer is element layer.

4. single face circuit board according to claim 1 and 2 is characterized in that, described circuit board is Flexible Printed Circuit or rigidity wiring board.

5. single face circuit board according to claim 1 and 2 is characterized in that: the insulating layer material of described band glue is epoxy glass base material or phenolic aldehyde base material or polyimide base material or metal base, or ceramic base material.

6. single face circuit board according to claim 1 and 2, it is characterized in that the copper cash bundle that described flat stranded conductor bundle is any stranded mode, copper cover aluminum wire harness, copper covered steel wire harness, the zinc-plated wire harness of copper, copper nickel plating gold thread bundle, the zinc-plated wire harness of iron or the zinc-plated wire harness of steel.

7. single face circuit board according to claim 1 and 2 is characterized in that, described flat stranded conductor bundle flattens with the stranded conductor bundle and forms.

8. single face circuit board according to claim 1 and 2 is characterized in that, described flat stranded conductor bundle disconnects in the position excision that needs disconnect, and in the position of excision, upper and lower insulating layer material is excised simultaneously.

9. single face circuit board according to claim 1 and 2 is characterized in that, described single face circuit board is used for LED lamp band, LED illuminating module, LED guardrail pipe, LED neon light, LED fluorescent tube or LED Christmas lamp etc.

10. single face circuit board according to claim 1 and 2 is characterized in that, the length of described single face circuit board is less than or equal to 100 meters, perhaps more than 100 meters.