CN201440755U - Array circuit board - Google Patents

Array circuit board Download PDF

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Publication number
CN201440755U
CN201440755U CN2009201336527U CN200920133652U CN201440755U CN 201440755 U CN201440755 U CN 201440755U CN 2009201336527 U CN2009201336527 U CN 2009201336527U CN 200920133652 U CN200920133652 U CN 200920133652U CN 201440755 U CN201440755 U CN 201440755U
Authority
CN
China
Prior art keywords
circuit board
board
platelet
utility
model
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2009201336527U
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Chinese (zh)
Inventor
崔红兵
章光辉
徐书勤
肖建光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DONGGUAN HONGYUEN ELECTRONICS Co Ltd
Original Assignee
DONGGUAN HONGYUEN ELECTRONICS Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DONGGUAN HONGYUEN ELECTRONICS Co Ltd filed Critical DONGGUAN HONGYUEN ELECTRONICS Co Ltd
Priority to CN2009201336527U priority Critical patent/CN201440755U/en
Application granted granted Critical
Publication of CN201440755U publication Critical patent/CN201440755U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model relates to an array circuit board, which comprises a plurality of groups of arrays, wherein each group of arrays comprises a large board and a small board, and the large board is arranged around the small board. The array circuit board can splice the circuit boards of products with irregular shapes, can simultaneously carry out mass production and has high production efficiency; by adopting the arraying mode that the large board is sleeved with the small board in a staggering way, the utility model has high use ratio of board material, avoids wasting materials and effectively saves the production cost.

Description

The layout circuit board
Technical field
The utility model relates to a kind of printed circuit pressing plate, relates in particular to a kind of layout circuit board with different sizes.
Background technology
Layout is an important technology in the circuit board making process, be about to several same PCB circuit board amalgamations and make a PCB, this technology especially is fit to the production in enormous quantities of circuit board, can reduce cost, improve consistency, the saving material of circuit board specification, performance, raises the efficiency.
Existing domestic in, small business adopts manual operations more, the method of single-piece production is made, it is in the layout process, usually many printed circuit prototypes are spliced into a larger-size printed circuit prototypes, after finishing relevant attachment process, again it is cut out, yet the layout of this mode, also just improved production efficiency, to some out-of-shape products or middle circuit board with idle position, idle position can not well be utilized in its circuit board making process, form a large amount of waste materials easily, cause the waste of material, be unfavorable for saving cost.
The utility model content
The purpose of this utility model is, a kind of layout circuit board is provided, and this layout circuit board can splice the circuit board of out-of-shape product, can produce in enormous quantities simultaneously, the production efficiency height, and its utilance to plate is higher, avoid waste of material, effectively saved production cost.
For achieving the above object, the utility model layout circuit board comprises: array layout, each spelling version comprise a big plate and a platelet, and described big plate is located on the platelet periphery.
After making finished product, described big plate is to separate the circuit board that uses with platelet.
Described big plate in the form of a ring.
Described platelet is round shape.
The big plate of described each spelling version and platelet electrically connect.
The big plate of described different spelling versions electrically connects successively.
The beneficial effects of the utility model: layout circuit board of the present utility model can splice the circuit board of out-of-shape product, can produce the production efficiency height simultaneously in enormous quantities; And it adopts the mode of the staggered layout of big sleeve-board platelet, and is higher to the utilance of plate, avoids waste of material, has effectively saved production cost.
In order further to understand feature of the present utility model and technology contents, see also following about detailed description of the present utility model and accompanying drawing, yet accompanying drawing only provide with reference to and the explanation usefulness, be not to be used for the utility model is limited.
Description of drawings
Below in conjunction with accompanying drawing,, will make the technical solution of the utility model and other beneficial effect apparent by embodiment of the present utility model is described in detail.
Fig. 1 is the structural representation of the utility model layout circuit board one embodiment.
Embodiment
For further setting forth technological means and the effect thereof that the utility model is taked, be described in detail below in conjunction with preferred embodiment of the present utility model and accompanying drawing thereof.
As shown in Figure 1, structural representation for the utility model layout circuit board one embodiment, this layout circuit board comprises: array layout 1, each spelling version 1 comprises a big plate 12 and a platelet 14, described big plate 12 is located on platelet 14 peripheries, after making finished product, described big plate 12 is to separate the circuit board that uses with platelet 14.
Layout circuit board of the present utility model is selected existing ordinary circuit board plate for use, the plate type of its big plate 12 and platelet 14 is identical, specification is also identical, big plate 12 in the form of a ring, platelet 14 is round shape, big plate 12 interior zones will have bigger space to place platelet 14, be wasted with regard to the plate of having avoided existing big intralamellar part space like this, cause waste of material, be unfavorable for the drawback that saves production cost, improved the utilance of large tracts of land plate effectively.Simultaneously, the big plate 12 and the platelet 14 of each spelling version of this circuit board all electrically connect, and the big plate 12 of described different spelling versions electrically connects successively.The work flow of big plate 12 and platelet 14 is basic identical, and when production and processing, the processing platelet is reprocessed big plate earlier, because it is processed on same plate, has improved production efficiency greatly, helps large-scale mass production.
In sum, layout circuit board of the present utility model, it can splice the circuit board of out-of-shape product, can produce the production efficiency height simultaneously in enormous quantities; And it adopts the mode of the staggered layout of big sleeve-board platelet, and is higher to the utilance of plate, avoids waste of material, has effectively saved production cost.
The above; for the person of ordinary skill of the art; can make other various corresponding changes and distortion according to the technical solution of the utility model and technical conceive, and all these changes and distortion all should belong to the protection range of the utility model accompanying Claim.

Claims (6)

1. a layout circuit board is characterized in that, comprises the array layout, and each spelling version comprises a big plate and a platelet, and described big plate is located on the platelet periphery.
2. layout circuit board as claimed in claim 1 is characterized in that, after making finished product, described big plate is to separate the circuit board that uses with platelet.
3. the layout circuit board of stating as claim 1 is characterized in that, described big plate in the form of a ring.
4. layout circuit board as claimed in claim 1 is characterized in that described platelet is round shape.
5. layout circuit board as claimed in claim 1 is characterized in that, the big plate of described each spelling version and platelet electrically connect.
6. layout circuit board as claimed in claim 1 is characterized in that, the big plate of described different spelling versions electrically connects successively.
CN2009201336527U 2009-07-15 2009-07-15 Array circuit board Expired - Lifetime CN201440755U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009201336527U CN201440755U (en) 2009-07-15 2009-07-15 Array circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009201336527U CN201440755U (en) 2009-07-15 2009-07-15 Array circuit board

Publications (1)

Publication Number Publication Date
CN201440755U true CN201440755U (en) 2010-04-21

Family

ID=42545410

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009201336527U Expired - Lifetime CN201440755U (en) 2009-07-15 2009-07-15 Array circuit board

Country Status (1)

Country Link
CN (1) CN201440755U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104768329A (en) * 2015-04-03 2015-07-08 广州杰赛科技股份有限公司 Manufacturing method of circuit board
WO2015131458A1 (en) * 2014-03-03 2015-09-11 深圳市百能信息技术有限公司 Pcb splicing method and device
CN106239623A (en) * 2016-08-02 2016-12-21 福建利德宝电子有限公司 A kind of die cutting die jigsaw and the punching molding method of circuit substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015131458A1 (en) * 2014-03-03 2015-09-11 深圳市百能信息技术有限公司 Pcb splicing method and device
CN104768329A (en) * 2015-04-03 2015-07-08 广州杰赛科技股份有限公司 Manufacturing method of circuit board
CN104768329B (en) * 2015-04-03 2017-08-11 广州杰赛科技股份有限公司 A kind of preparation method of circuit board
CN106239623A (en) * 2016-08-02 2016-12-21 福建利德宝电子有限公司 A kind of die cutting die jigsaw and the punching molding method of circuit substrate

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GR01 Patent grant
CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20100421