CN202488891U - Forming mould with high ramming material balance - Google Patents
Forming mould with high ramming material balance Download PDFInfo
- Publication number
- CN202488891U CN202488891U CN2012200870415U CN201220087041U CN202488891U CN 202488891 U CN202488891 U CN 202488891U CN 2012200870415 U CN2012200870415 U CN 2012200870415U CN 201220087041 U CN201220087041 U CN 201220087041U CN 202488891 U CN202488891 U CN 202488891U
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- China
- Prior art keywords
- mould
- pcb
- reduced
- material balance
- ramming material
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Abstract
The utility model discloses a forming mould with high ramming material balance. The forming mould with high ramming material balance comprises a mould body, wherein the mould body is provided with a plurality of through-holes, and optimal force glue is arranged on a through-hole intensively distributing portion of the mould body. The technique scheme includes that the optimal force glue is increased on the through-hole intensively distributing portion according to the through-hole distribution status of a printed circuit board (PCB) to improve the ramming material balance, and therefore PCB hanging copper sheet phenomena can be reduced, PCB wedding effect can be improved, manual repairing wedding can be reduced and production efficiency of a whole plant can be improved, at the same time, the number of needle broken times and mould repairing frequency can be reduced, coining production efficiency can be improved, deformations of wooden pushing materials on the mould can be reduced and the service life of the mould can be prolonged.
Description
Technical field
The utility model relates to the processing mold of PCB, relates in particular to a kind of mould with higher dnockout balance.
Background technology
Along with the develop rapidly of electron trade, the trend of electronic product microminiaturization is obvious day by day, and a pcb board is except fixing various little electronic components, and its major function provides being electrically connected each other of various electronic components in addition.Along with the development of information technology, electronic equipment also becomes increasingly complex, and the part that needs is more and more, and circuit and part on the pcb board are also more and more intensive.In the pcb board manufacturing; Pcb board is heat insulation by insulation, also unbending material constitutes substrate, and the tiny line material that can see on the surface is a Copper Foil, and Copper Foil is to cover on the whole plate originally; Part is etched and disposes in manufacture process; The part that stays has just become netted tiny circuit, and these circuits are known as lead, and is used to provide the circuit of part on the pcb board to connect.
In the PCB Production process, the stressed distribution situation of die hole is different, tends to occur the PCB punching and hangs the copper sheet phenomenon, reduces welding effect, has increased artificial repair welding, has also increased the broken needle number of times simultaneously and has repaired a die frequency, has reduced punching out production efficiency.
The utility model content
The purpose of the utility model is the problem that solves above-mentioned existence, and a kind of simple in structure, increase mould dnockout degree of balance is provided, and improves a kind of mould with higher dnockout balance that welding effect prolongs the useful life of mould.
The purpose of the utility model realizes as follows: a kind of mould with higher dnockout balance, have die ontology, and said die ontology has some through holes, and the densely distributed position of through hole that is positioned at said die ontology is provided with excellent power glue.
Saying further, said excellent power glue is distributed in said die ontology end.
The advantage of the utility model: adopt the technical scheme of the utility model,, the intensive position of pore size distribution is increased excellent power glue improve the dnockout degree of balance according to the distribution situation of PCB die hole.Can reduce PCB and hang the copper sheet phenomenon, improve the welding effect of pcb board, reduce artificial repair welding; Improve complete system plant's production efficiency, reduce the broken needle number of times simultaneously, reduce the frequency that repairs a die; Improve punching out production efficiency, reduce the distortion of mould overwood pusher plate hole on the other hand, improve die life.
Description of drawings
For the content that makes the utility model is expressly understood more easily,, the utility model is done further detailed explanation, wherein below according to specific embodiment and combine accompanying drawing
Fig. 1 is the structural representation of the utility model;
Reference numeral: 1, die ontology, 2, through hole, 3, excellent power glue.
Embodiment:
See shown in Figure 1; A kind of mould with higher dnockout balance has die ontology 1, and said die ontology 1 has some through holes 2; The through hole 2 densely distributed positions that are positioned at said die ontology 1 are provided with excellent power glue 3, and said excellent power glue 3 is distributed on four angles of said die ontology 1; Its operation principle is: in the PCB Production process, this technology is inserted excellent power glue 3 according to the stressed distribution situation of die hole on through hole 2, increases balance mould punching product dynamics, reduces PCB and hangs the copper sheet phenomenon.
Above-described specific embodiment; Purpose, technical scheme and beneficial effect to the utility model have carried out further explain, it should be understood that the above is merely the specific embodiment of the utility model; Be not limited to the utility model; All within the spirit and principle of the utility model, any modification of being made, be equal to replacement, improvement etc., all should be included within the protection range of the utility model.
Claims (2)
1. the mould with higher dnockout balance has die ontology (1), and said die ontology (1) has some through holes (2); It is characterized in that: the densely distributed position of through hole (2) that is positioned at said die ontology (1) is provided with excellent power glue (3).
2. according to the said mould with higher dnockout balance of claim 1, it is characterized in that: said excellent power glue (3) is distributed in said die ontology (1) end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200870415U CN202488891U (en) | 2012-03-09 | 2012-03-09 | Forming mould with high ramming material balance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200870415U CN202488891U (en) | 2012-03-09 | 2012-03-09 | Forming mould with high ramming material balance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202488891U true CN202488891U (en) | 2012-10-10 |
Family
ID=46963273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200870415U Expired - Lifetime CN202488891U (en) | 2012-03-09 | 2012-03-09 | Forming mould with high ramming material balance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202488891U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103042096A (en) * | 2012-12-20 | 2013-04-17 | 景旺电子科技(龙川)有限公司 | Aluminum base plate punching die and plate punching method thereof |
-
2012
- 2012-03-09 CN CN2012200870415U patent/CN202488891U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103042096A (en) * | 2012-12-20 | 2013-04-17 | 景旺电子科技(龙川)有限公司 | Aluminum base plate punching die and plate punching method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121010 |
|
| CX01 | Expiry of patent term |