CN201947544U - PTH (Through hole type element) half-hole molding copper-dropped pad - Google Patents
PTH (Through hole type element) half-hole molding copper-dropped pad Download PDFInfo
- Publication number
- CN201947544U CN201947544U CN2010206838594U CN201020683859U CN201947544U CN 201947544 U CN201947544 U CN 201947544U CN 2010206838594 U CN2010206838594 U CN 2010206838594U CN 201020683859 U CN201020683859 U CN 201020683859U CN 201947544 U CN201947544 U CN 201947544U
- Authority
- CN
- China
- Prior art keywords
- hole
- pad
- copper
- ring
- weld
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model provides a PTH (Through hole type element) half-hole molding copper-dropped pad, which comprises a PCB, a terminal pad base and a welding hole. The terminal pad base with a welding loop is set on the PCB. The welding loop extrudes from the terminal pad base. The welding hole half pads located base, located on the half welding loop. By the symmetric design of the half-hole terminal pad, the two ends of the mold are stressed uniformly when punching, and the half-hole copper foil breaks down in the middle. The utility model can avoid the problems of copper wire residual resulted from incomplete fracture in the middle of perforated copper, and the copper free hole resulted from the inadequate thickness of the perforated copper which can not take away the copper foil in the hole wall.
Description
Technical field
The utility model relates to the equipment of manufacturing of PCB wiring board, says so exactly to be used for the device that pad is manufactured.
Background technology
Pad (land or pad) is the basic comprising unit of surface mount assembling, is used for the welding disk pattern (land pattern) of forming circuit plate, and promptly various be that the pad of particular components type design makes up.Pad adopts mould beer plate to come moulding usually, and existing technology has pad in the film half hole profile when manufacturing, and profile is landless outward, and draws the minimum monolateral 0.15mm of copper with profile; Mould adopts the straight line clip.
When pad was manufactured, the asymmetric both sides Copper Foil adhesive force that makes of both sides pad inside and outside the Yin Feilin profile was inhomogeneous easily, causes residual copper plug-hole or falls the copper phenomenon like this.
Summary of the invention
Therefore, the purpose of this utility model provides consistent PTH half hole forming and falls copper pad, and this pad two ends when die stamping are stressed evenly, make half hole Copper Foil therefrom between fracture, avoided hole copper can not be fully therefrom between fracture cause copper wire residual.
Another purpose of the present utility model is to provide a kind of PTH half hole forming to fall copper pad, and this pad structure is simple, practical, can be widely used in falling in the manufacturing of copper pad of pcb board.
In order to achieve the above object, the utility model is achieved in that
A kind of PTH half hole forming falls copper pad, this pad comprises pcb board, pad pedestal and welding hole, the pad pedestal is arranged on the pcb board, it is characterized in that the pad pedestal is provided with weld-ring, weld-ring protrudes from outside the pad pedestal, half is positioned at described welding hole on the pad pedestal, half is positioned on the weld-ring, symmetric design by this half eyelet welding dish, two ends are stressed evenly during die stamping, make half hole Copper Foil therefrom between fracture, avoided hole copper can not be fully therefrom between fracture cause copper wire residual, or cause Kong Wutong because of hole copper thickness deficiency is pulled away the hole wall Copper Foil in the profile.
Described weld-ring, the edge that it is arranged at the pad pedestal is fixed in the outside of pad pedestal, and half of welding hole is positioned on the weld-ring, and second half of welding hole is positioned on the pad pedestal.
Described weld-ring and pad pedestal all have a plurality ofly, and weld-ring and pad pedestal are evenly distributed and be fixed on the side of pcb board.
Described weld-ring and pad pedestal are one to one relation, and described weld-ring and pad pedestal have a plurality ofly, and symmetric arrays is in the both sides of pcb board.
The utility model makes the welding hole of pad be able to symmetric design by the setting of weld-ring, when die stamping, the pad two ends are stressed evenly, half hole Copper Foil can be therefrom between fracture, avoided the pad asymmetric both sides Copper Foil adhesive force that makes in original both sides inhomogeneous, caused residual copper plug-hole or fall the copper phenomenon.
And the formed pad structure of the utility model is simple, practical, can be widely used in falling in the manufacturing of copper pad of pcb board.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Embodiment
Below, in conjunction with the accompanying drawings shown in, enforcement of the present utility model is elaborated.
Shown in Figure 1, enforcement of the present utility model comprises pcb board 1, pad pedestal 2, weld-ring 21 and welding hole 3.Wherein, pad pedestal 2 is fixed on the pcb board 1, and weld-ring 21 is fixed in the outside of pad pedestal 2, is integrative-structure with pad pedestal 2.Half of welding hole 3 is positioned on the weld-ring 21, and second half then is positioned on the pad pedestal 1.
Weld-ring 21 and pad pedestal 2 are one to one relation, and weld-ring 21 and pad pedestal 2 have a plurality ofly, evenly distributed on pcb board 1, and simultaneously, weld-ring 2 and welding hole 3 are symmetrically distributed in the both sides of pad pedestal 1.
When specifically manufacturing, earlier pad pedestal 2 is fixed on the rectangular pcb board, again two long limits of pad pedestal is extended to the profile outside of moulding, and be designed to monolateral 0.2-0.3mm wait the large square weld-ring, other need not enlarge on both sides; Pad pedestal and weld-ring are integrative-structure, pad pedestal and weld-ring are used and are higher than other steel molding of D2 level, all design half hole that welding hole is arranged on pad pedestal and the weld-ring, and place, half hole adopts the arc clip, and than the little 0.1mm of cutter that processes usefulness, electroplating hole copper is accomplished more than the 20um.By the symmetry of PTH half eyelet welding dish and the arcuation design of mould, the copper that falls that efficiently solves the long-term puzzlement of half orifice plate is asked residual copper plug-hole problem.
The above person only is the embodiment that enumerates of the utility model, when the scope that can not limit the utility model enforcement with this.Promptly the equalization of being done according to the utility model claim generally changes and modifies, and all should still belong in the scope that the utility model patent contains.
Claims (4)
1. PTH half hole forming falls copper pad, and this pad comprises pcb board, pad pedestal and welding hole, and the pad pedestal is arranged on the pcb board, it is characterized in that the pad pedestal is provided with weld-ring, weld-ring protrudes from outside the pad pedestal, and half is positioned at described welding hole on the pad pedestal, and half is positioned on the weld-ring.
2. PTH half hole forming as claimed in claim 1 falls copper pad, it is characterized in that described weld-ring, and the edge that it is arranged at the pad pedestal is fixed in the outside of pad pedestal, and half of welding hole is positioned on the weld-ring, and second half of welding hole is positioned on the pad pedestal.
3. PTH half hole forming as claimed in claim 1 falls copper pad, it is characterized in that described weld-ring and pad pedestal, all has a plurality ofly, and weld-ring and pad pedestal are evenly distributed and be fixed on the side of pcb board.
4. PTH half hole forming as claimed in claim 1 falls copper pad, it is characterized in that described weld-ring and pad pedestal, is one to one relation, and described weld-ring and pad pedestal have a plurality ofly, and symmetric arrays is in the both sides of pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206838594U CN201947544U (en) | 2010-12-28 | 2010-12-28 | PTH (Through hole type element) half-hole molding copper-dropped pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206838594U CN201947544U (en) | 2010-12-28 | 2010-12-28 | PTH (Through hole type element) half-hole molding copper-dropped pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201947544U true CN201947544U (en) | 2011-08-24 |
Family
ID=44474878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206838594U Expired - Fee Related CN201947544U (en) | 2010-12-28 | 2010-12-28 | PTH (Through hole type element) half-hole molding copper-dropped pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201947544U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103763861A (en) * | 2014-02-13 | 2014-04-30 | 遂宁市广天电子有限公司 | Manufacturing technology of half-pore board |
| CN108738248A (en) * | 2018-06-21 | 2018-11-02 | 江门崇达电路技术有限公司 | A kind of production method of PCB of the edges of boards with metallized semi-pore |
| CN109905980A (en) * | 2019-04-19 | 2019-06-18 | 高德（江苏）电子科技有限公司 | A kind of small copper facing hole side reservation half bore design technology |
-
2010
- 2010-12-28 CN CN2010206838594U patent/CN201947544U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103763861A (en) * | 2014-02-13 | 2014-04-30 | 遂宁市广天电子有限公司 | Manufacturing technology of half-pore board |
| CN108738248A (en) * | 2018-06-21 | 2018-11-02 | 江门崇达电路技术有限公司 | A kind of production method of PCB of the edges of boards with metallized semi-pore |
| CN109905980A (en) * | 2019-04-19 | 2019-06-18 | 高德（江苏）电子科技有限公司 | A kind of small copper facing hole side reservation half bore design technology |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201947544U (en) | PTH (Through hole type element) half-hole molding copper-dropped pad | |
| US20130016480A1 (en) | Printed circuit board having heat gathering structures and manufacturing process thereof | |
| CN205160945U (en) | Copper billet palmization frock clamp | |
| CN204069487U (en) | A kind of printed circuit board (PCB) | |
| CN201528466U (en) | Shapeable printed circuit board | |
| CN204859739U (en) | Multilayer flexible circuit board | |
| CN204795837U (en) | Easily install circuit board | |
| CN211580280U (en) | Circuit board | |
| CN203590670U (en) | Heat radiation structure of radio frequency power amplifier | |
| CN203968493U (en) | For the fixture of thin plate internal layer DES and brown production | |
| CN203277355U (en) | Leading wire frame for sound-control and light-control plastic packaging device | |
| CN202488891U (en) | Forming mould with high ramming material balance | |
| CN202143293U (en) | Print circuit board convenient for die punching | |
| CN204131845U (en) | A kind of chip mounter automatic-lifting type machine changes mouth frame | |
| CN204615028U (en) | A kind of transfer of data sheet of terminal | |
| CN204761826U (en) | Printed circuit board with heat radiation structure | |
| CN210928375U (en) | Communication equipment cold and hot base plate mounting structure with heat dissipation function | |
| CN204761825U (en) | PCB circuit board with heat radiation structure | |
| CN202755087U (en) | Novel rack | |
| CN204157161U (en) | The wiring board that pcb board metal throuth hole slotted eye is combined with non-metallic platform | |
| CN207915624U (en) | A kind of middle mould of carrier band punching die | |
| CN202217702U (en) | Light source module group and lighting device | |
| CN207518941U (en) | A kind of high-accuracy PCB metallized semi-pores wiring board | |
| CN103700757A (en) | Surface-mounted LED (light-emitting diode) lead frame and manufacturing method thereof | |
| CN215773704U (en) | Novel resin consent multilayer printed wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110824 Termination date: 20151228 |
|
| EXPY | Termination of patent right or utility model |