CN109905980A - A kind of small copper facing hole side reservation half bore design technology - Google Patents

A kind of small copper facing hole side reservation half bore design technology Download PDF

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Publication number
CN109905980A
CN109905980A CN201910319264.6A CN201910319264A CN109905980A CN 109905980 A CN109905980 A CN 109905980A CN 201910319264 A CN201910319264 A CN 201910319264A CN 109905980 A CN109905980 A CN 109905980A
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Prior art keywords
copper facing
hole
design
half bore
ring
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CN201910319264.6A
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CN109905980B (en
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王留刚
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Gaode (Jiangsu) Electronic Technology Co.,Ltd.
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High Tak (jiangsu) Electronic Technology Co Ltd
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Abstract

The present invention relates to a kind of small copper facing hole sides to retain half bore design technology, by before the traditional etching of industry it is preforming be cut into half bore after, it is etched edge and sticks up copper, final shape technique is done again, is changed to final molding cutting half bore, is cancelled preforming process before etching, to reach promotion process capability, the remaining deficiency of hole wall caused by production procedure, the offset of solution half bore and side etching is reduced, causes to eat tin bad problem when piece.Improve the total yield of plate factory.

Description

A kind of small copper facing hole side reservation half bore design technology
Technical field
The present invention relates to pcb board preparation and communication technical field of semiconductors, specially a kind of small copper facing hole side retains Half bore design technology.
Background technique
With the development of science and technology, the raising of social progress and living standards of the people, it is indispensable that communication electronics become people Few electronic equipment.The universal and upcoming 5G of domestic 3G4G communication is communicated, therewith the core of the communication quality of phase mutual induction Piece, at one of the main performance for directly affecting a communication electronics product.And one of evaluation electronic product superiority and inferiority is important Index.And communicate in relevant device, chip is then the heart of equipment, directly influences the performance of equipment.Normal chip, industry Use IC support plate as bearing mode, such support plate, manufacturing cost is high, and yield is low, and the selection of material is very expensive.Existing core Piece manufacturer copies the design of support plate on the basis of meeting support plate function, designs a kind of special pcb board, is designed in plate Support plate welded disc, but edges of boards are eaten into tin PAD change and are designed to copper facing half bore, tin ability is eaten using copper, eats tin to substitute Half bore is connected, to complete the assembling of chip by PAD after surface chip welds OK with the specific PAD on motherboard.It is such to set Meter, not only can satisfy requirement, and material price is compared compared with support plate, differs greatly, can also step to a new level on yield in performance.
Normal small copper facing hole, aperture is small, and the whole half that need to retain pore radius, is just able to satisfy and normally eats tin and want It asks.And industry is normally that, using etchant flow, will stick up copper etching removal using pre- fishing is done before etching at present.Such technique needle Small copper facing hole is made, has very high fraction defective, and when through overetch, since lateral erosion influences, leads to remaining plating copper face Product is smaller, causes to eat tin bad.
Summary of the invention
The purpose of the present invention is to solve the above problems, provide a kind of new design and manufacture craft, optimize operation Former molding twice is reduced into one-pass molding operation, and solves the problems, such as side etching by process, greatly remains remaining half The copper facing area in hole increases scolding tin effect.
The purpose of the present invention can be achieved through the following technical solutions: a kind of small copper facing hole side reservation half bore design work Skill, side retain half bore design technology, which comprises the steps of:
(1) design data: edges of boards copper facing hole, the hole site skimmed need to be designed to nothing at Data Design front end, design first Ring design causes the exception for sticking up copper to solve final molding when hole is given up in excision copper facing;
(2) egative film is extracted: because in Data Design, copper facing edge grinding is therefore need to make special egative film using no ring design;That is bottom In piece, when the copper facing hole of side half copper facing hole, retains the ring design that client needs, the ring in useless hole is changed to by the other half waste material side Without ring design, to reach the figure in the Data Design of front end;
(3) anti-welding operation: copper facing is given up hole edge, normally make it is anti-welding, to guarantee the intensity in edges of boards copper facing hole, guarantor when reaching fishing type Shield and supporting role;
(4) it forms: using main shaft can be with positive and negative rotation board;When upper plate, the corresponding top and bottom of plank are both needed to plus every blank sheet of paper or ox Mulberry paper is protected;Cut type first uses anti-rotation knife holes, then is made by the way of rotating forward cutter deburring;
(5) it cleans: being cleaned using normal wash line, remove the dust in plate face.
Further, small copper facing hole, the diameter range in hole are 0.25~0.45mm.
Further, small copper facing hole, final finished retain the half in whole hole, the other half needs to remove, the half bore of removal, if Timing need to be designed to no ring design, remaining copper facing half bore, and the ring of half bore edges meets the design needs of client.
Further, remaining copper facing half bore, after molding, the edge in hole, which can not have, sticks up copper, and remaining half bore value need to be greater than The half of radius.
Compared with the existing technology, the invention has the following advantages that
It is compared compared with original process design, saves a process flow, solve in traditional operation, the lateral erosion that can not prevent is abnormal, And can guarantee that normal copper facing is remaining, without sticking up copper.The yield of raising product that can be very big, reduction are scrapped.
Detailed description of the invention
Fig. 1 is the product appearance structure chart that the present invention need to make.
The good picture of the production that Fig. 2 present invention need to make.
It is first before Fig. 3 production that molding making is counter fishes out programme diagram.
Fig. 4 is the traditional method of indicating the pronunciation of a Chinese character cutter path procedure design drawing that present invention needs make.
Fig. 5 is the tangent cutter path programming figure that need of the invention make.
Specific embodiment
The present invention will be further described in conjunction with the embodiment in attached drawing below:
As shown in Figs. 1-5, a kind of small copper facing hole side of the invention retains half bore design technology, and side retains half bore and designs work Skill, which comprises the steps of:
(1) design data: edges of boards copper facing hole, the hole site skimmed need to be designed to nothing at Data Design front end, design first Ring design causes the exception for sticking up copper to solve final molding when hole is given up in excision copper facing;
(2) egative film is extracted: because in Data Design, copper facing edge grinding is therefore need to make special egative film using no ring design;That is bottom In piece, when the copper facing hole of side half copper facing hole, retains the ring design that client needs, the ring in useless hole is changed to by the other half waste material side Without ring design, to reach the figure in the Data Design of front end;
(3) anti-welding operation: copper facing is given up hole edge, normally make it is anti-welding, to guarantee the intensity in edges of boards copper facing hole, guarantor when reaching fishing type Shield and supporting role;
(4) it forms: using main shaft can be with positive and negative rotation board;When upper plate, the corresponding top and bottom of plank are both needed to plus every blank sheet of paper or ox Mulberry paper is protected;Cut type first uses anti-rotation knife holes, then is made by the way of rotating forward cutter deburring;
(5) it cleans: being cleaned using normal wash line, remove the dust in plate face.
Further, small copper facing hole, the diameter range in hole are 0.25~0.45mm.
Further, small copper facing hole, final finished retain the half in whole hole, the other half needs to remove, the half bore of removal, if Timing need to be designed to no ring design, remaining copper facing half bore, and the ring of half bore edges meets the design needs of client.
Further, remaining copper facing half bore, after molding, the edge in hole, which can not have, sticks up copper, and remaining half bore value need to be greater than The half of radius.
As shown in Fig. 1-Fig. 4, by copper facing half bore item number to be fished out, cancel pre- fishing design before etching, using final molding system It is made as mode.
Before production, first molding making is counter to be fished out program (such as Fig. 3 Fig. 4 left and right side feed), and circular hole is copper facing hole in figure, and dotted line is The center line in copper facing hole, arrow are the milling cutter of design.Milling cutter selects 1.2mm diameter tool when design, and cut direction is designed according to inverse It being designed to tool path pattern, cutter uses 30 degree of feeds of tilted direction, and wherein the left side in cutter top and hole is tangent, cutter right hand edge, The right hole 0.1mm above distance need to be avoided when design, to guarantee safe distance when positive cutting plate.After final traditional method of indicating the pronunciation of a Chinese character design OK Pattern simulation drawing, is shown in Fig. 3.
After the traditional method of indicating the pronunciation of a Chinese character completes, normal practical tangent (such as Fig. 5) when tangent designs, designs cutter according to normal tool orientation, When feed, direction is according to clockwise direction feed, cutting tool choice 1.4mm cutter, and when feed, hole edge is according to linear fashion feed, cutter The center line in edge and hole is tangent.
Finally, it should be noted that the above examples are only used to illustrate the technical scheme of the present invention, rather than its limitations;Although Present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: it still may be used To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features; And these are modified or replaceed, the range for technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution.

Claims (4)

1. a kind of small copper facing hole side retains half bore design technology, which comprises the steps of:
(1) design data: edges of boards copper facing hole, the hole site skimmed need to be designed to nothing at Data Design front end, design first Ring design causes the exception for sticking up copper to solve final molding when hole is given up in excision copper facing;
(2) egative film is extracted: because in Data Design, copper facing edge grinding is therefore need to make special egative film using no ring design;That is bottom In piece, when the copper facing hole of side half copper facing hole, retains the ring design that client needs, the ring in useless hole is changed to by the other half waste material side Without ring design, to reach the figure in the Data Design of front end;
(3) anti-welding operation: copper facing is given up hole edge, normally make it is anti-welding, to guarantee the intensity in edges of boards copper facing hole, guarantor when reaching fishing type Shield and supporting role;
(4) it forms: using main shaft can be with positive and negative rotation board;When upper plate, the corresponding top and bottom of plank are both needed to plus every blank sheet of paper or ox Mulberry paper is protected;Cut type first uses anti-rotation knife holes, then is made by the way of rotating forward cutter deburring;
(5) it cleans: being cleaned using normal wash line, remove the dust in plate face.
2. a kind of small copper facing hole side as described in claim 1 retains half bore design technology, it is characterised in that: described small Copper facing hole, the diameter range in hole are 0.25~0.45mm.
3. a kind of small copper facing hole side as described in claim 1 retains half bore design technology, it is characterised in that: described small Copper facing hole, final finished retain the half in whole hole, the other half needs to remove, the half bore of removal, and when design need to be designed to no ring design, Remaining copper facing half bore, the ring of half bore edges meet the design needs of client.
4. a kind of small copper facing hole side as described in claim 1 retains half bore design technology, it is characterised in that: remaining plating Copper half bore, after molding, the edge in hole, which can not have, sticks up copper, and remaining half bore value need to be greater than the half of radius.
CN201910319264.6A 2019-04-19 2019-04-19 Design process for retaining half-hole on side edge of micro copper-plated hole Active CN109905980B (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112291930A (en) * 2019-08-07 2021-01-29 宏华胜精密电子(烟台)有限公司 Method for manufacturing metallized semi-hole of circuit board
CN112752437A (en) * 2020-12-11 2021-05-04 深圳市景旺电子股份有限公司 Forming method of metallized half hole and PCB (printed circuit board)
CN112996258A (en) * 2021-02-21 2021-06-18 四川英创力电子科技股份有限公司 One-step forming processing method of half-hole plate and printed circuit board

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US6121678A (en) * 1997-12-19 2000-09-19 Stmicroelectronics, Inc. Wrap-around interconnect for fine pitch ball grid array
US20090124099A1 (en) * 2007-11-14 2009-05-14 Simplo Technology Co., Ltd. PCB with improved soldering holes and a battery set with the same
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CN102264195A (en) * 2010-05-25 2011-11-30 百硕电脑(苏州)有限公司 Molding method of circuit board with half-bores
CN102970834A (en) * 2011-09-02 2013-03-13 悦虎电路(苏州)有限公司 Method for fabricating circuit board metallized half hole
CN104918422A (en) * 2015-05-21 2015-09-16 东莞市五株电子科技有限公司 Method for manufacturing semi-metallized hole of printed circuit board
CN105792545A (en) * 2016-03-25 2016-07-20 柏承科技(昆山)股份有限公司 PCB half hole forming process
CN106034379A (en) * 2015-03-20 2016-10-19 富葵精密组件(深圳)有限公司 Circuit board and manufacturing method thereof
CN107580419A (en) * 2017-09-19 2018-01-12 珠海精毅电路有限公司 A kind of preparation method of printed substrate metallized semi-pore
CN108024461A (en) * 2018-01-11 2018-05-11 广合科技(广州)有限公司 Remove the processing unit (plant) and its processing technology of PTH half bore hole inner burr
CN108040438A (en) * 2017-12-14 2018-05-15 悦虎电路(苏州)有限公司 A kind of manufacture craft of circuit board metallization half bore
CN109392256A (en) * 2017-08-14 2019-02-26 东莞市国盈电子有限公司 A kind of half heavy copper hole wiring board preventing residual copper and its manufacturing method
CN109462942A (en) * 2018-12-20 2019-03-12 东莞市鼎新电路有限公司 A kind of processing method of pcb board edges of boards PTH half bore

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5140745A (en) * 1990-07-23 1992-08-25 Mckenzie Jr Joseph A Method for forming traces on side edges of printed circuit boards and devices formed thereby
US6121678A (en) * 1997-12-19 2000-09-19 Stmicroelectronics, Inc. Wrap-around interconnect for fine pitch ball grid array
US20090124099A1 (en) * 2007-11-14 2009-05-14 Simplo Technology Co., Ltd. PCB with improved soldering holes and a battery set with the same
CN102264195A (en) * 2010-05-25 2011-11-30 百硕电脑(苏州)有限公司 Molding method of circuit board with half-bores
CN201947544U (en) * 2010-12-28 2011-08-24 深圳市翔宇电路有限公司 PTH (Through hole type element) half-hole molding copper-dropped pad
CN102970834A (en) * 2011-09-02 2013-03-13 悦虎电路(苏州)有限公司 Method for fabricating circuit board metallized half hole
CN106034379A (en) * 2015-03-20 2016-10-19 富葵精密组件(深圳)有限公司 Circuit board and manufacturing method thereof
CN104918422A (en) * 2015-05-21 2015-09-16 东莞市五株电子科技有限公司 Method for manufacturing semi-metallized hole of printed circuit board
CN105792545A (en) * 2016-03-25 2016-07-20 柏承科技(昆山)股份有限公司 PCB half hole forming process
CN109392256A (en) * 2017-08-14 2019-02-26 东莞市国盈电子有限公司 A kind of half heavy copper hole wiring board preventing residual copper and its manufacturing method
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CN108040438A (en) * 2017-12-14 2018-05-15 悦虎电路(苏州)有限公司 A kind of manufacture craft of circuit board metallization half bore
CN108024461A (en) * 2018-01-11 2018-05-11 广合科技(广州)有限公司 Remove the processing unit (plant) and its processing technology of PTH half bore hole inner burr
CN109462942A (en) * 2018-12-20 2019-03-12 东莞市鼎新电路有限公司 A kind of processing method of pcb board edges of boards PTH half bore

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112291930A (en) * 2019-08-07 2021-01-29 宏华胜精密电子(烟台)有限公司 Method for manufacturing metallized semi-hole of circuit board
CN112752437A (en) * 2020-12-11 2021-05-04 深圳市景旺电子股份有限公司 Forming method of metallized half hole and PCB (printed circuit board)
CN112996258A (en) * 2021-02-21 2021-06-18 四川英创力电子科技股份有限公司 One-step forming processing method of half-hole plate and printed circuit board
CN112996258B (en) * 2021-02-21 2021-09-21 四川英创力电子科技股份有限公司 One-step forming processing method of half-hole plate and printed circuit board

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Address after: Jiangsu province Wuxi Chunhui road 214101 Xishan City Economic Development Zone No. 32

Patentee after: Gaode (Jiangsu) Electronic Technology Co.,Ltd.

Address before: Jiangsu province Wuxi Chunhui road 214101 Xishan City Economic Development Zone No. 32

Patentee before: GULTECH (JIANGSU) ELECTRONIC TECHNOLOGIES CO.,LTD.

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