CN112291930A

CN112291930A - Method for manufacturing metallized semi-hole of circuit board

Info

Publication number: CN112291930A
Application number: CN201910726944.XA
Authority: CN
Inventors: 李强
Original assignee: Hong Sheng Precision Electronics Yantai Co ltd
Current assignee: Hong Sheng Precision Electronics Yantai Co ltd
Priority date: 2019-08-07
Filing date: 2019-08-07
Publication date: 2021-01-29

Abstract

The invention provides a method for manufacturing a metallized half hole of a circuit board, which comprises the following steps: providing a circuit board, wherein the circuit board is provided with at least one metalized hole; filling resin ink into the metallized holes and curing the resin ink; cutting the metallized holes filled with the resin ink to obtain metallized half holes; and removing the resin ink. The manufacturing method of the circuit board metallized semi-hole can improve the yield of the circuit board metallized semi-hole and avoid the problem of high production cost caused by manual detection.

Description

Method for manufacturing metallized semi-hole of circuit board

Technical Field

The invention relates to the technical field of circuit board manufacturing, in particular to a method for manufacturing a metallized half hole of a circuit board.

Background

The board edge locations of a Printed Circuit Board (PCB), commonly referred to as a PCB half-hole board, are typically provided with metallized half-holes. Existing board edge metallized half holes are typically made by a numerically controlled machine tool in a manner that can result in the formation of copper wires (burrs) in and on the surface of the hole when the metallized hole is cut. And when the PCB semi-pore plate is connected with the motherboard, the copper wire can cause a short circuit problem, and the product yield is reduced. Therefore, huge manpower is required to be consumed to overhaul the copper wires, which undoubtedly consumes the manpower again and increases the production cost.

Disclosure of Invention

In view of this, the invention provides a method for manufacturing a metallized half-hole of a circuit board, which can improve the yield rate and avoid the problem of high production cost caused by manual detection.

The invention provides a method for manufacturing a metallized half hole of a circuit board, which comprises the following steps:

providing a circuit board, wherein the circuit board is provided with at least one metalized hole;

filling resin ink into the metallized holes and curing the resin ink;

cutting the metallized holes filled with the resin ink to obtain metallized half holes; and

removing the resin ink.

According to the invention, resin ink is filled in the metallized half holes, so that copper wire burrs easily occurring in the process of cutting the metallized holes are avoided, the product yield is improved, and the problem of high production cost caused by manual overhaul of the copper wires is avoided.

Drawings

Fig. 1 is a flow chart of a method for forming metallized holes in a circuit board according to a preferred embodiment of the present invention.

Fig. 2 is a schematic structural diagram of a circuit board provided by the manufacturing method shown in fig. 1.

Fig. 3 is a schematic view of the circuit board shown in fig. 2 after resin ink is filled in the metallized holes.

Fig. 4 is a schematic diagram of a cutting path for cutting the metallized hole shown in fig. 3 to obtain a metallized half hole.

Fig. 5 is a schematic diagram of the circuit board after removing the resin ink in the metallized half holes shown in fig. 4.

Description of the main elements

Circuit board	100
		Metallized hole	10
Hole ring	20
		Metallized half-hole	30
First path	40
		Second path	50

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

Referring to fig. 1, a method for manufacturing a metallized half-hole of a circuit board according to a preferred embodiment of the present invention includes the following steps:

s11, please refer to fig. 2, a circuit board 100 is provided, in which the circuit board 100 has at least one metallized hole 10.

In the present embodiment, the circuit board 100 is a Printed Circuit Board (PCB). Only two of said metallized holes 10 are shown in fig. 2. In fact, the number of the metallized holes 10 is not limited to two, and the number of the metallized holes 10 may be changed according to the actual situation.

The circuit board 100 also has an annular ring 20 disposed around the metallized hole 10.

S12, please refer to fig. 3, filling the metallized hole 10 with resin ink and curing the resin ink.

The resin ink is in a liquid state and can be removed. The resin ink has the characteristic of acid resistance. In the present embodiment, the viscosity of the resin ink is 240 to 280 dPa.s. Preferably, the viscosity of the resin ink is 260 dpa.s.

The present invention fills the resin ink only into the metallized hole 10 of the circuit board 100, and the resin ink is also formed on the surface of the grommet 20. According to the invention, the resin ink is only filled into the metallized holes 10, so that the resin ink is less in use amount and low in production cost, only needs to be filled once, is less in filling times, and is beneficial to improving the production efficiency.

In the embodiment, the resin ink is cured by baking at 130-140 ℃ for 70-90 min. Preferably, the baking temperature is 130 ℃, and the baking time is 90 min.

S13, please refer to fig. 4 and 5, cutting the metalized hole 10 filled with the resin ink to obtain a metalized half-hole 30, wherein the cutting includes sequentially cutting the metalized hole 10 filled with the resin ink along a first path 40 and a second path 50, the first path 40 is disposed from the center of the metalized hole 10 to the hole wall of the metalized hole 10, and the second path 50 is opposite to the first path 40.

In this embodiment, the cutting is performed by a forward/reverse rotation forming machine (not shown). The forward/reverse rotation forming machine has a main shaft and a milling cutter.

Specifically, cutting the metallized hole 10 filled with the resin ink includes:

the main shaft of the forward/reverse rotation forming machine cuts the metallized hole 10 filled with the resin ink along a first path 40 in a forward rotation manner (namely, the main shaft rotates in a forward rotation manner, a milling cutter is used for cutting the left side of the metallized hole 10 from the center of the metallized hole 10 along the first path 40, and the first path 40 is arranged from the center of the metallized hole 10 to the hole wall of the metallized hole 10; and

the main shaft of the forward/reverse rotation forming machine reversely cuts the metallized hole 10 filled with the resin ink along a second path 50 (i.e., the main shaft is reversed, a milling cutter is lowered from the center of the metallized hole 10, and the right side of the metallized hole 10 is cut along the second path 50), and the second path 50 is opposite to the first path 40.

The cutting mode can prevent the copper sheet in the metalized hole 10 from rolling up, does not need manual maintenance and other post processes, does not need to reverse the circuit board 100 in production, saves the feeding and discharging time, and improves the cutting efficiency. The main shaft of the forward/reverse rotation forming machine can rotate forward or reversely under the control of instructions, and is matched with a forming path, so that the problems of poor burrs in the metallized semi-hole 30 and the like are solved.

In addition, since the hole ring 20 disposed around the metalized hole 10 can be covered by the resin ink after the metalized hole 10 is filled with the resin ink, the hole ring 20 can be prevented from being deformed during cutting, thereby preventing burrs from being generated in the hole of the metalized half hole 30.

And S14, removing the resin ink.

In this embodiment, the resin ink is removed by a sodium hydroxide solution having a concentration of 2% to 5%. Preferably, the concentration of the sodium hydroxide solution is 3%. The resin ink can be completely removed by one-time removal, and the quality of the metallized half-holes 30 is not affected after the removal.

According to the invention, the resin printing ink is filled in the metallized semi-hole 30, so that copper wire burrs which are easy to occur in the process of cutting the metallized hole 10 are avoided, the product yield is improved, and the problem of high production cost caused by manual overhaul of the copper wire is avoided.

Although the embodiments of the present invention have been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the embodiments of the present invention.

Claims

1. A method for manufacturing a metallized half hole of a circuit board is characterized by comprising the following steps:

filling resin ink into the metallized holes and curing the resin ink;

cutting the metallized hole filled with the resin ink to obtain a metallized semi-hole, wherein the cutting comprises sequentially cutting the metallized hole filled with the resin ink along a first path and a second path, the first path is arranged from the center of the metallized hole to the hole wall of the metallized hole, and the second path is opposite to the first path in direction; and

removing the resin ink.

2. The method of making a metallized circuit board half hole of claim 1, wherein said circuit board further includes an annular ring disposed about said metallized hole, said resin ink further being formed on a surface of said annular ring.

3. A method of forming circuit board metallized half holes as in claim 1, wherein said cutting is performed by a forward/reverse rotation forming machine.

4. The method for manufacturing a metallized half hole of a circuit board according to claim 1, wherein the viscosity of the resin ink is 240 to 280dpa.

5. The method for manufacturing the metallized semi-hole of the circuit board according to claim 1, wherein the resin ink is cured by baking, the baking temperature is 130-140 ℃, and the baking time is 70-90 min.

6. The method of claim 1, wherein the resin ink is removed by a sodium hydroxide solution.

7. The method of claim 6, wherein the concentration of the sodium hydroxide solution is 2% to 5%.