CN108575058A - A kind of half bore plate producing process - Google Patents
A kind of half bore plate producing process Download PDFInfo
- Publication number
- CN108575058A CN108575058A CN201710131423.0A CN201710131423A CN108575058A CN 108575058 A CN108575058 A CN 108575058A CN 201710131423 A CN201710131423 A CN 201710131423A CN 108575058 A CN108575058 A CN 108575058A
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- Prior art keywords
- production method
- copper
- etching
- pcb
- half bore
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention discloses a kind of production method of half-pore plate, the production method includes the following steps：Sawing sheet-to copper-clad plate carry out the making of PCB internal layers and internal layer AOI-pressing-brown subtract copper-laser drilling-machine drilling-plating-outer layer dry film make and outer layer AOI-it is anti-welding-- change gold-selects dampness elimination film-gong half bore --- etching --- secondary CNC to word.Half bore production method of the present invention can meet the production of fine rule road half-pore plate, and entire technique takes short, and production efficiency is high, and the production of half-pore plate can be completed in 4 hours.
Description
Technical field
The present invention relates to printed circuit board processing technique fields, in particular it relates to a kind of half bore plate producing process.
Background technology
The traditional PCB half-pore plate mode of production is mainly two kinds, the first graphic plating and the alkali etching mode of production, such
Design is limited to graphic plating pitch requirements, can not produce 3/3mil or less circuits；It is produced for mechanical system for second, but by
It is limited to the influences such as half bore aperture/milling cutter diameter, production efficiency is slow, and still having part copper scale residual causes quality risk to be deposited
.With the fast development of electronics industry, great demand is showed for the half-pore plate in production fine rule road field now, and it is traditional
PCB half-pore plates be difficult to take into account the requirement of fine rule road and high-quality simultaneously.
Invention content
The invention reside in overcoming the deficiencies of existing technologies, a kind of novel half bore plate producing process, the half-pore plate are provided
Production method can produce fine rule road half-pore plate, and production cost is low, and production efficiency is high.
Its technical solution is as follows：
A kind of production method of half-pore plate, which is characterized in that include the following steps：
（1）Sawing sheet：Shearing is carried out to copper-clad plate；
（2）Internal layer and internal layer AOI：PCB internal layers are carried out to make and internal layer inspection；
（3）Pressing：Individual or multiple PCB inner platings are pressed together；
（4）Brown subtracts copper：Pcb board surface copper foil is thinned and to surface brown；
（5）Laser drilling：By radium-shine laser position processing blind hole required for pcb board surface layer and time outer layer, it is convenient for rear process
Formation electrically conducts；
（6）Machine drilling：Via hole required for client and rear process used tool hole are processed on forming path；
（7）Plating：Laser drilling and machine drilling institute's processing blind hole and through-hole are subjected to unicom；
（8）Outer layer dry film makes and outer layer AOI：Figure needed for client is etched according to figure and picture conversion, then carries out PCB outer layers
It examines；
（9）It is anti-welding：The ink that one layer of protection figure is coated on pcb board exposes figure needed for client by video conversion；
（10）Word：Identify the position of each part onboard；
（11）Change gold：Chemical nickel plating is carried out on naked copper surface, then chemistry leaching gold；
（12）Select dampness elimination film：With selecting carburetion ink to carry out half bore consent, and prints surface and all cover copper face and golden face；
（13）Gong half bore：The unwanted half of through-hole on forming path is subjected to gong vacancy reason, forms half bore；
（14）Etching：The copper scale burr that gong half bore generates is removed with etching solution；
（15）Secondary CNC：External form processing (being free of half hole site) is carried out to half-pore plate again.
The present invention improves lead to the hole site, and through-hole is opened on the processing and forming path of copper coin, by with selecting carburetion
Ink carries out half bore consent and printing surface can make the production of PCB half-pore plates not by copper thickness and line width image copper face and golden face whole covering
It influences, 1.5mil/1.5mil or less circuits can be produced, and production efficiency is high.In addition, selecting the covering of carburetion ink golden face and copper simultaneously
Face also can avoid the pcb board in etching and be caused to scrap by liquid medicine attack.
It is described in one of the embodiments, to select carburetion ink for the wet printing ink of liquid photosensitive, viscosity 300-400PS/S.
During the experiment, inventor find, when use viscosity be 300-400PS/S select carburetion ink progress half bore consent when, consent
Ink can protect hole wall completely.
It is described in one of the embodiments, to select carburetion ink for the wet printing ink of liquid photosensitive, viscosity 350PS/S.
Further include moving back film in the etching step in one of the embodiments, the film that moves back is that will pass through gong half bore
Be put into after half-pore plate etching in alkaline solution impregnate remove alkaline solution-soluble select carburetion black.
It is 3%-6% sodium hydroxide solutions that the alkaline solution, which is mass concentration, in one of the embodiments,.
The etching solution is alkali etching liquid medicine or acid etching liquid medicine in one of the embodiments,.
In one of the embodiments, the alkali etching liquid medicine be copper chloride and ammonium hydroxide mixing liquid or sodium chloride with
The mixing liquid of ammonium hydroxide.
The acid etching liquid medicine is the mixing liquid of hydrochloric acid and hydrogen peroxide in one of the embodiments,.
Further include electrical measurement and final quality control in one of the embodiments,（FQC）Step.
The beneficial effects of the present invention are：The present invention improves lead to the hole site, and the molding that through-hole is opened in copper coin adds
On work path, by with select carburetion ink carry out half bore consent and print surface by copper face and golden face all covering so that PCB half-pore plates
Production is not influenced by copper thickness and line width image, 1.5mil/1.5mil or less circuits can be produced, and production efficiency is high, in 4 hours
The production of half-pore plate can be completed.
Description of the drawings
Fig. 1 is the partial structural diagram of plank before gong half bore.
Fig. 2 is etching and moves back the partial structural diagram of solder side after film.
Fig. 3 is etching and moves back the partial structural diagram of part surface after film.
Reference sign：1, conductive hole copper；2, forming path.
Specific implementation mode
To make the objectives, technical solutions, and advantages of the present invention more comprehensible, below in conjunction with attached drawing and specific embodiment party
Formula, the present invention is further described in detail.It should be understood that the specific embodiments described herein are only solving
The present invention is released, protection scope of the present invention is not limited.
Embodiment 1
A kind of production method of PCB half-pore plates, includes the following steps：
（1）Sawing sheet：Shearing is carried out to copper-clad plate；
（2）Internal layer and internal layer AOI：PCB internal layers are carried out to make and internal layer inspection；
（3）Pressing：Individual or multiple PCB inner platings are pressed together；
（4）Brown subtracts copper：Pcb board surface copper foil is thinned and to surface brown；
（5）Laser drilling：By radium-shine laser position processing blind hole required for pcb board surface layer and time outer layer, it is convenient for rear process
Formation electrically conducts；
（6）Machine drilling：Via hole required for client and rear process used tool hole, such as Fig. 1 are processed on forming path；
（7）Plating：Laser drilling and machine drilling institute's processing blind hole and through-hole are subjected to unicom；
（8）Outer layer dry film makes and outer layer AOI：Figure needed for client is etched according to figure and picture conversion, then carries out PCB outer layers
It examines；
（9）It is anti-welding：The ink that one layer of protection figure is coated on pcb board exposes figure needed for client by video conversion；
（10）Word：Identify the position of each part onboard；
（11）Change gold：Chemical nickel plating is carried out on naked copper surface, then chemistry leaching gold；
（12）Select dampness elimination film：With selecting carburetion ink to carry out half bore consent, and prints surface and all cover copper face and golden face, the ink
For the wet printing ink of liquid photosensitive, viscosity 350PS/S；
（13）Gong half bore：The unwanted half of through-hole on forming path is subjected to gong vacancy reason, forms half bore；
（14）Etching：The copper scale burr that gong half bore generates is removed with etching solution, further includes moving back film in the etching step, institute
State move back film be by the half-pore plate Jing Guo gong half bore be put into the alkaline solution that mass concentration is 5% impregnate remove alkaline solution can
Molten selects carburetion black, and the partial structurtes of final solder side are as shown in Fig. 2, the partial structurtes of part surface are as shown in Figure 3；
（15）Secondary CNC：External form processing is carried out to half-pore plate again；
（16）Technique afterwards：Electrical measurement and FQC are carried out to pcb board, satisfactory product is packed.
In the present embodiment, conducting wire line width 1.0mil, wire spacing 1.0mil.
Embodiment 2
A kind of production method of PCB half-pore plates, includes the following steps：
（1）Sawing sheet：Shearing is carried out to copper-clad plate；
（2）Internal layer and internal layer AOI：PCB internal layers are carried out to make and internal layer inspection；
（3）Pressing：Individual or multiple PCB inner platings are pressed together；
（4）Brown subtracts copper：Pcb board surface copper foil is thinned and to surface brown；
（5）Laser drilling：By radium-shine laser position processing blind hole required for pcb board surface layer and time outer layer, it is convenient for rear process
Formation electrically conducts；
（6）Machine drilling：Via hole required for client and rear process used tool hole are processed on forming path；
（7）Plating：Laser drilling and machine drilling institute's processing blind hole and through-hole are subjected to unicom；
（8）Outer layer dry film makes and outer layer AOI：Figure needed for client is etched according to figure and picture conversion, then carries out PCB outer layers
It examines；
（9）It is anti-welding：The ink that one layer of protection figure is coated on pcb board exposes figure needed for client by video conversion；
（10）Word：Identify the position of each part onboard；
（11）Change gold：Chemical nickel plating is carried out on naked copper surface, then chemistry leaching gold；
（12）Select dampness elimination film：With selecting carburetion ink to carry out half bore consent, and prints surface and all cover copper face and golden face, the ink
For the wet printing ink of liquid photosensitive, viscosity 400PS/S；
（13）Gong half bore：The unwanted half of through-hole on forming path is subjected to gong vacancy reason, forms half bore；
（14）Etching：The copper scale burr that gong half bore generates is removed with etching solution；
（15）Secondary CNC：External form processing is carried out to half-pore plate again；
（16）Technique afterwards：Electrical measurement and FQC are carried out to pcb board, satisfactory product is packed；
In the present embodiment, conducting wire line width 1.0mil, wire spacing 1.0mil.
Embodiment 3
A kind of production method of PCB half-pore plates, includes the following steps：
（1）Sawing sheet：Shearing is carried out to copper-clad plate；
（2）Internal layer and internal layer AOI：PCB internal layers are carried out to make and internal layer inspection；
（3）Pressing：Individual or multiple PCB inner platings are pressed together；
（4）Brown subtracts copper：Pcb board surface copper foil is thinned and to surface brown；
（5）Laser drilling：By radium-shine laser position processing blind hole required for pcb board surface layer and time outer layer, it is convenient for rear process
Formation electrically conducts；
（6）Machine drilling：Via hole required for client and rear process used tool hole are processed on forming path；
（7）Plating：Laser drilling and machine drilling institute's processing blind hole and through-hole are subjected to unicom；
（8）Outer layer dry film makes and outer layer AOI：Figure needed for client is etched according to figure and picture conversion, then carries out PCB outer layers
It examines；
（9）It is anti-welding：The ink that one layer of protection figure is coated on pcb board exposes figure needed for client by video conversion；
（10）Word：Identify the position of each part onboard；
（11）Change gold：Chemical nickel plating is carried out on naked copper surface, then chemistry leaching gold；
（12）Select dampness elimination film：With selecting carburetion ink to carry out half bore consent, and prints surface and all cover copper face and golden face, the ink
For the wet printing ink of liquid photosensitive, viscosity 300PS/S；
（13）Gong half bore：The unwanted half of through-hole on forming path is subjected to gong vacancy reason, forms half bore；
（14）Etching：The copper scale burr that gong half bore generates is removed with etching solution；
（15）Secondary CNC：External form processing is carried out to half-pore plate again；
（16）Technique afterwards：Electrical measurement and FQC are carried out to pcb board, satisfactory product is packed.
In the present embodiment, conducting wire line width 1.2mil, wire spacing 1.2mil.
When the PCB half-pore plates that the present invention prepares embodiment 1, embodiment 2, embodiment 3 carry out electrical measurement, do not break
The problems such as road, short circuit, embodiment 1 prepare PCB half-pore plates and take 3.5h, and embodiment 2 prepares PCB half-pore plates and takes 4h, embodiment 3
It prepares PCB half-pore plates and takes 4h.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (9)
1. a kind of production method of half-pore plate, which is characterized in that include the following steps：
（1）Sawing sheet：Shearing is carried out to copper-clad plate；
（2）Internal layer and internal layer AOI：PCB internal layers are carried out to make and internal layer inspection；
（3）Pressing：Individual or multiple PCB inner platings are pressed together；
（4）Brown subtracts copper：Pcb board surface copper foil is thinned and to surface brown；
（5）Laser drilling：By radium-shine laser position processing blind hole required for pcb board surface layer and time outer layer, it is convenient for rear process
Formation electrically conducts；
（6）Machine drilling：Via hole required for client and rear process used tool hole are processed on forming path；
（7）Plating：Laser drilling and machine drilling institute's processing blind hole and through-hole are subjected to unicom；
（8）Outer layer dry film makes and outer layer AOI：Figure needed for client is etched according to figure and picture conversion, then carries out PCB outer layers
It examines；
（9）It is anti-welding：The ink that one layer of protection figure is coated on pcb board exposes figure needed for client by video conversion；
（10）Word：Identify the position of each part onboard；
（11）Change gold：Chemical nickel plating is carried out on naked copper surface, then chemistry leaching gold；
（12）Select dampness elimination film：With selecting carburetion ink to carry out half bore consent, and prints surface and all cover copper face and golden face；
（13）Gong half bore：The unwanted half of through-hole on forming path is subjected to gong vacancy reason, forms half bore；
（14）Etching：The copper scale burr that gong half bore generates is removed with etching solution；
（15）Secondary CNC：External form processing is carried out to half-pore plate again.
2. production method according to claim 1, which is characterized in that it is described to select carburetion ink for the wet printing ink of liquid photosensitive,
Viscosity is 300-400PS/S.
3. production method according to claim 2, which is characterized in that it is described to select carburetion ink for the wet printing ink of liquid photosensitive,
Viscosity is 350PS/S.
4. production method according to claim 1, which is characterized in that further include moving back film in the etching step, it is described to move back
Film be by the half-pore plate Jing Guo gong half bore be put into alkaline solution impregnate remove alkaline solution-soluble select carburetion ink.
5. production method according to claim 4, which is characterized in that the alkaline solution is that mass concentration is 3%-6%'s
Sodium hydroxide solution.
6. production method according to claim 1, which is characterized in that the etching solution is alkali etching liquid medicine or acidity
Etching solution.
7. production method according to claim 1, which is characterized in that the alkali etching liquid medicine is copper chloride and ammonium hydroxide
The mixing liquid of mixing liquid or sodium chloride and ammonium hydroxide.
8. production method according to claim 1, which is characterized in that the acid etching liquid medicine is hydrochloric acid and hydrogen peroxide
Mixing liquid.
9. production method according to claim 1, which is characterized in that further include electrical measurement and final quality control step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710131423.0A CN108575058A (en) | 2017-03-07 | 2017-03-07 | A kind of half bore plate producing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710131423.0A CN108575058A (en) | 2017-03-07 | 2017-03-07 | A kind of half bore plate producing process |
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| Publication Number | Publication Date |
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| CN108575058A true CN108575058A (en) | 2018-09-25 |
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| CN201710131423.0A Pending CN108575058A (en) | 2017-03-07 | 2017-03-07 | A kind of half bore plate producing process |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109719404A (en) * | 2019-01-15 | 2019-05-07 | 广东科翔电子科技有限公司 | A kind of method of IC support plate laser drill |
| CN110418504A (en) * | 2019-07-10 | 2019-11-05 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing backlight plate and backlight plate manufactured by same |
| CN110557890A (en) * | 2019-08-08 | 2019-12-10 | 广合科技（广州）有限公司 | method for processing semi-metal blind hole with aspect ratio larger than one |
| CN110933849A (en) * | 2019-12-05 | 2020-03-27 | 恩达电路(深圳)有限公司 | Method for manufacturing small half-hole circuit board |
| CN112291930A (en) * | 2019-08-07 | 2021-01-29 | 宏华胜精密电子(烟台)有限公司 | Method for manufacturing metallized semi-hole of circuit board |
| CN112533399A (en) * | 2020-12-17 | 2021-03-19 | 惠州市润众供应链管理有限公司 | PCB metallization half-hole manufacturing process |
| CN114245587A (en) * | 2021-12-23 | 2022-03-25 | 珠海中京电子电路有限公司 | Method for improving semi-hole flash of system packaging module through wet film coating and application |
| CN114340218A (en) * | 2021-12-29 | 2022-04-12 | 江苏苏杭电子有限公司 | Manufacturing method of second-order HDI multilayer circuit board containing loop type dense circuit |
| CN114765927A (en) * | 2021-01-14 | 2022-07-19 | 深南电路股份有限公司 | Printed circuit board manufacturing method and printed circuit board |
| WO2022151013A1 (en) * | 2021-01-13 | 2022-07-21 | 柏承科技(昆山)股份有限公司 | High-process-capability electroless gold plating process based on application of jet printing ink in selective electroless gold plating |
| CN114867218A (en) * | 2022-03-28 | 2022-08-05 | 诚亿电子（嘉兴）有限公司 | Environment-friendly metallized semi-hole PCB preparation process |
| CN110779782B (en) * | 2019-11-20 | 2024-02-27 | 江苏三亿检测技术有限公司 | PCB micro-slice analysis sample preparation method |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109719404A (en) * | 2019-01-15 | 2019-05-07 | 广东科翔电子科技有限公司 | A kind of method of IC support plate laser drill |
| CN110418504A (en) * | 2019-07-10 | 2019-11-05 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing backlight plate and backlight plate manufactured by same |
| CN110418504B (en) * | 2019-07-10 | 2022-05-13 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing backlight plate and backlight plate manufactured by same |
| CN112291930A (en) * | 2019-08-07 | 2021-01-29 | 宏华胜精密电子(烟台)有限公司 | Method for manufacturing metallized semi-hole of circuit board |
| CN110557890A (en) * | 2019-08-08 | 2019-12-10 | 广合科技（广州）有限公司 | method for processing semi-metal blind hole with aspect ratio larger than one |
| CN110779782B (en) * | 2019-11-20 | 2024-02-27 | 江苏三亿检测技术有限公司 | PCB micro-slice analysis sample preparation method |
| CN110933849A (en) * | 2019-12-05 | 2020-03-27 | 恩达电路(深圳)有限公司 | Method for manufacturing small half-hole circuit board |
| CN112533399A (en) * | 2020-12-17 | 2021-03-19 | 惠州市润众供应链管理有限公司 | PCB metallization half-hole manufacturing process |
| WO2022151013A1 (en) * | 2021-01-13 | 2022-07-21 | 柏承科技(昆山)股份有限公司 | High-process-capability electroless gold plating process based on application of jet printing ink in selective electroless gold plating |
| CN114765927A (en) * | 2021-01-14 | 2022-07-19 | 深南电路股份有限公司 | Printed circuit board manufacturing method and printed circuit board |
| CN114245587A (en) * | 2021-12-23 | 2022-03-25 | 珠海中京电子电路有限公司 | Method for improving semi-hole flash of system packaging module through wet film coating and application |
| CN114245587B (en) * | 2021-12-23 | 2024-05-10 | 珠海中京电子电路有限公司 | Method for improving half-hole flash of system package module by wet film coating and application |
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Application publication date: 20180925 |