CN114867218A - Environment-friendly metallized semi-hole PCB preparation process - Google Patents
Environment-friendly metallized semi-hole PCB preparation process Download PDFInfo
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- CN114867218A CN114867218A CN202210310850.6A CN202210310850A CN114867218A CN 114867218 A CN114867218 A CN 114867218A CN 202210310850 A CN202210310850 A CN 202210310850A CN 114867218 A CN114867218 A CN 114867218A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 238000004519 manufacturing process Methods 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 32
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims abstract description 18
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000005530 etching Methods 0.000 claims abstract description 15
- 238000005520 cutting process Methods 0.000 claims abstract description 11
- 238000005553 drilling Methods 0.000 claims abstract description 11
- 238000009713 electroplating Methods 0.000 claims abstract description 8
- 229910000679 solder Inorganic materials 0.000 claims abstract description 8
- 239000002253 acid Substances 0.000 claims abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- 239000010949 copper Substances 0.000 claims abstract description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- 238000005259 measurement Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 3
- XKMRRTOUMJRJIA-UHFFFAOYSA-N ammonia nh3 Chemical compound N.N XKMRRTOUMJRJIA-UHFFFAOYSA-N 0.000 description 8
- 229910002651 NO3 Inorganic materials 0.000 description 6
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 6
- 239000003814 drug Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000002351 wastewater Substances 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- 241001465754 Metazoa Species 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 239000010865 sewage Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000004083 survival effect Effects 0.000 description 1
- 239000005028 tinplate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a preparation process of an environment-friendly metallized semi-hole PCB, which comprises the following steps: s1: cutting, namely cutting the PCB copper-clad plate into the size of a large production plate according to a preset size; s2: drilling a via hole on the PCB; s3: electroplating copper, namely electroplating the drilled PCB through hole; s4: manufacturing an outer layer circuit, namely manufacturing a preset circuit lead and a connecting disc by using a sulfuric acid and hydrogen peroxide type acid etching process; s5: solder resist characters, wherein a solder resist insulating ink layer and character marks are manufactured on the surface of the PCB according to a preset pattern; s6: forming, namely cutting a large metallized semi-hole product production board into a plurality of small boards, and performing production by adopting one-time rough routing and two-time fine routing during the small board forming; the sulfuric acid and hydrogen peroxide type acid etching process used in the process has better environment-friendly effect.
Description
Technical Field
The invention belongs to the technical field of PCB preparation, and particularly relates to an environment-friendly metallized semi-hole PCB preparation process.
Background
Metallized half-hole PCBs refer to designs that leave only half of the metallized holes in the outline of the PCB, and are often used on power boards, personal consumer products, or backplanes. During welding, the side surface of the semi-metallized hole is used as a matching surface for compression joint, and is mostly used as a daughter board of a mother board, and the semi-metallized hole of the daughter board is welded with the pin of the mother board or a component so as to enhance the welding performance.
The existing metallized half-hole preparation process in the PCB production industry needs to tin plate at the position of the half-hole, then drill and remove the unnecessary half-hole, and finally remove the drilling burr by adopting a nitrate alkaline etching process. Because of the alkaline etching production process of electrotinning and nitrate, a large amount of chemical materials containing ammonia nitrogen such as nitric acid and the like are required to be used in the production process, and a large amount of wastewater containing ammonia nitrogen is discharged at the same time, although the ammonia nitrogen content in the wastewater discharged by an enterprise after the sewage treatment of the enterprise reaches the national or local standard, the total ammonia nitrogen content in the environment can still be enriched due to long-term production, and the hidden danger of environmental pollution caused by the overproof ammonia nitrogen exists; the excessive ammonia nitrogen can reduce the concentration of dissolved oxygen in the water body, so that the water body is blackened and smelled, the water quality is reduced, and the survival of aquatic animals and plants is influenced.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a method which does not use electrolytic tinning and nitrate alkaline etching at all and can effectively control the influence of a large amount of ammonia nitrogen wastewater generated by the electrolytic tinning and nitrate alkaline etching process on the environment; the sulfuric acid and hydrogen peroxide type acid etching process used in the process has better environment-friendly effect.
In order to achieve the purpose, the invention provides the following technical scheme: an environment-friendly metallized semi-hole PCB preparation process comprises the following steps:
s1: cutting, namely cutting the PCB copper-clad plate into the size of a large production plate according to a preset size;
s2: drilling a via hole on the PCB;
s3: electroplating copper, namely electroplating the drilled PCB through hole;
s4: manufacturing an outer layer circuit, namely manufacturing a preset circuit lead and a connecting disc by using a sulfuric acid and hydrogen peroxide type acid etching process;
s5: solder resist characters, wherein a solder resist insulating ink layer and character marks are manufactured on the surface of the PCB according to a preset pattern;
s6: and forming, namely cutting the metallized half-hole product production large board into a plurality of small boards, and producing the small boards by adopting one-time coarse routing and two-time fine routing during forming.
Before the step of forming, a step of surface treatment is further included, and a nickel layer and an OSP organic oxidation resistant layer are manufactured on the surface of the PCB according to the assembly and welding requirements.
And further, when the multilayer PCB is produced, the manufacturing and pressing working procedures of the inner layer circuit are carried out before drilling, wherein the manufacturing working procedure of the inner layer circuit is the same as that of the outer layer circuit, and the multilayer PCB is pressed and fixed together through the pressing working procedure.
Further, in step S6, a gong cutter with a diameter of 1.5mm is used for the coarse gong.
Further, in step S6, 0.1mm is reserved outside the formed small board during rough routing.
Further in step S6, a gong knife with a diameter of 0.8mm is used for gong.
Further in step S6, the first and second fine gongs finish the two end corners of the half hole respectively, and the second fine gong is reversed by a reverse rotation tool and fed counterclockwise.
Further, in step S6, before the small plate is formed, a pin hole for fixing the small plate is drilled on the device base plate by a forming machine according to a preset CNC program, and then the pin is fixed to the device base plate together with the small plate.
Further comprises a step S7 of performing electrical measurement after the small plate is formed and packaging after the small plate is qualified.
Compared with the prior art, the invention has the beneficial effects that: the process completely does not use electrolytic tinning and nitrate alkaline etching, and can effectively control the influence of a large amount of ammonia nitrogen wastewater generated by the electrolytic tinning and nitrate alkaline etching process on the environment; the sulfuric acid and hydrogen peroxide type acidic etching process used in the process has a good environment-friendly effect, and the sulfuric acid and hydrogen peroxide type acidic etching liquid medicine can be used for extracting copper sulfate in the liquid medicine through a regeneration device, so that the zero emission target is achieved.
Drawings
Fig. 1 is a schematic diagram of one-time rough gong and two-time fine gongs in the present invention.
Detailed Description
An embodiment of the environmentally friendly metallized semi-hole PCB manufacturing process of the present invention is further described with reference to fig. 1.
In the description of the present invention, it should be noted that, for the terms of orientation, such as "central", "lateral (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate that the orientation and positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific scope of the present invention.
Furthermore, if the terms "first" and "second" are used for descriptive purposes only, they are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. Thus, a definition of "a first" or "a second" feature may explicitly or implicitly include one or more of the features, and in the description of the invention, "a number" or "a number" means two or more unless explicitly specified otherwise.
An environment-friendly metallized semi-hole PCB preparation process specifically comprises the following steps:
1) if a multilayer PCB is produced, two procedures of 'inner layer circuit manufacturing → laminating' are added before drilling; the manufacturing procedure of the inner layer circuit is the same as that of the outer layer circuit, and the multi-layer PCB board is pressed and fixed together through the pressing procedure.
2) Cutting: and cutting the PCB copper-clad plate into the size of a large production plate according to the preset size.
3) Drilling: and drilling a via hole for communicating each layer on the PCB according to a preset CNC program by using a precision drilling machine.
4) Copper electroplating: electroplating is carried out in the drilled PCB through hole so as to ensure that each layer of the PCB can realize the communication of electric signals among the layers through the electroplated through hole.
5) Outer layer circuit: manufacturing preset patterns such as a line lead, a connecting disc and the like by a sulfuric acid and hydrogen peroxide type acid etching process; the sulfuric acid and hydrogen peroxide type acidic etching liquid medicine can be used for extracting copper sulfate in the liquid medicine through a regenerating device, and the aim of zero emission is achieved.
6) Solder resist characters: and manufacturing a solder resist insulating ink layer and a character mark on the surface of the PCB according to a preset pattern.
7) Surface treatment: according to different assembling and welding requirements, a nickel layer, an OSP organic oxidation resistant layer and the like are manufactured.
8) Molding: firstly, a large plate produced by a metallized semi-hole product is divided into 2 small plates to eliminate the influence of the size expansion and shrinkage of the large plate on the forming precision of the metallized semi-hole, and the large plate can be continuously divided into 3, 4 or more small plates as required;
and before the small plate is formed, a forming machine is used for drilling pin holes for fixing the small plate on the equipment base plate according to a preset CNC program, and then the pins and the small plate are fixed on the equipment base plate together.
Adopt the thick gong of one time and the method production of the smart gong of twice during the platelet shaping, as shown in fig. 1, adopt the diameter to be 1.5 mm's thick gong of gong sword earlier, make the shaping district reserve 0.1mm outward, then the smart gong of the first time uses the gong sword fine trimming half hole A point department of diameter 0.8mm, the smart gong sword fine trimming half hole B point of diameter 0.8mm of use of last second time, the smart gong of second time need adopt the contra-rotation sword reversal with anticlockwise feed, the smart gong step of the above-mentioned twice of all adopting of every metallization half hole department.
9) Electric measurement and packaging: the production is carried out according to normal production conditions.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the invention may occur to those skilled in the art without departing from the principle of the invention, and are considered to be within the scope of the invention.
Claims (9)
1. The preparation process of the environment-friendly metallized semi-hole PCB is characterized by comprising the following steps of:
s1: cutting, namely cutting the PCB copper-clad plate into the size of a large production plate according to a preset size;
s2: drilling a via hole on the PCB;
s3: electroplating copper, namely electroplating the drilled PCB through hole;
s4: manufacturing an outer layer circuit, namely manufacturing a preset circuit lead and a connecting disc by using a sulfuric acid and hydrogen peroxide type acid etching process;
s5: solder resist characters, wherein a solder resist insulating ink layer and character marks are manufactured on the surface of the PCB according to a preset pattern;
s6: and forming, namely cutting the metallized half-hole product production large board into a plurality of small boards, and producing the small boards by adopting one-time coarse routing and two-time fine routing during forming.
2. The process of claim 1, wherein the environmentally friendly metallized semi-hole PCB comprises: before the step of forming, the method also comprises a step of surface treatment, wherein a nickel layer and an OSP organic oxidation resistant layer are manufactured on the surface of the PCB according to the assembly and welding requirements.
3. The process of manufacturing an environmentally friendly metallized semi-hole PCB according to claim 2, wherein: when the multilayer PCB is produced, the manufacturing and pressing procedures of the inner layer circuit are carried out before drilling, wherein the manufacturing procedure of the inner layer circuit is the same as the manufacturing procedure of the outer layer circuit, and the multilayer PCB is pressed and fixed together through the pressing procedure.
4. The process of manufacturing an environmentally friendly metallized semi-hole PCB according to any one of claims 1-3, wherein: in step S6, a routing knife having a diameter of 1.5mm is used for routing.
5. The process of claim 4, wherein the environmentally friendly metallized semi-hole PCB comprises: in step S6, 0.1mm is reserved outside the small board to be formed when the board is roughly routed.
6. The process of claim 5, wherein the environmentally friendly metallized semi-hole PCB comprises: in step S6, a gong cutter with a diameter of 0.8mm is used for the fine gong.
7. The process of claim 6, wherein the environmentally friendly metallized semi-hole PCB comprises: in step S6, the first and second fine gongs are finished at two ends of the half hole, and the second fine gong is reversed by a reverse rotation tool and fed counterclockwise.
8. The process of claim 7, wherein the environmentally friendly metallized semi-hole PCB comprises: in step S6, before the small plate is formed, a pin hole for fixing the small plate is drilled on the device base plate by a forming machine according to a preset CNC program, and then the pin is fixed to the device base plate together with the small plate.
9. The process of claim 8, wherein: also includes step S7, electrical measurement is carried out after the small plate is formed, and the small plate is packaged after being qualified.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210310850.6A CN114867218A (en) | 2022-03-28 | 2022-03-28 | Environment-friendly metallized semi-hole PCB preparation process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210310850.6A CN114867218A (en) | 2022-03-28 | 2022-03-28 | Environment-friendly metallized semi-hole PCB preparation process |
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| Publication Number | Publication Date |
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| CN114867218A true CN114867218A (en) | 2022-08-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210310850.6A Pending CN114867218A (en) | 2022-03-28 | 2022-03-28 | Environment-friendly metallized semi-hole PCB preparation process |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105120598A (en) * | 2015-07-25 | 2015-12-02 | 深圳恒宝士线路板有限公司 | Semi-hole PCB manufacturing method based on acid etching technology |
| CN108575058A (en) * | 2017-03-07 | 2018-09-25 | 惠州中京电子科技有限公司 | A kind of half bore plate producing process |
| CN110602878A (en) * | 2019-08-15 | 2019-12-20 | 鹤山市中富兴业电路有限公司 | Direct forming method for metallized semi-hole |
| CN114040598A (en) * | 2021-11-02 | 2022-02-11 | 江门崇达电路技术有限公司 | Method for removing flash of metalized half hole of electric gold plate |
-
2022
- 2022-03-28 CN CN202210310850.6A patent/CN114867218A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105120598A (en) * | 2015-07-25 | 2015-12-02 | 深圳恒宝士线路板有限公司 | Semi-hole PCB manufacturing method based on acid etching technology |
| CN108575058A (en) * | 2017-03-07 | 2018-09-25 | 惠州中京电子科技有限公司 | A kind of half bore plate producing process |
| CN110602878A (en) * | 2019-08-15 | 2019-12-20 | 鹤山市中富兴业电路有限公司 | Direct forming method for metallized semi-hole |
| CN114040598A (en) * | 2021-11-02 | 2022-02-11 | 江门崇达电路技术有限公司 | Method for removing flash of metalized half hole of electric gold plate |
Non-Patent Citations (1)
| Title |
|---|
| 韩国栋: "《电子工艺技术基础与实训》", 北京：国防工业出版社, pages: 278 * |
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Application publication date: 20220805 |