CN105899002A - Preparation method of semi-hole PCB - Google Patents
Preparation method of semi-hole PCB Download PDFInfo
- Publication number
- CN105899002A CN105899002A CN201410190919.1A CN201410190919A CN105899002A CN 105899002 A CN105899002 A CN 105899002A CN 201410190919 A CN201410190919 A CN 201410190919A CN 105899002 A CN105899002 A CN 105899002A
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- Prior art keywords
- ink
- half bore
- pcb board
- consent
- hole
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention relates to a preparation method of a semi-hole PCB. The method is characterized by comprising the following steps of preparing a hole filling template, preparing hole-filling printing ink, filling holes, baking and solidifying the printing ink, primary molding, removing the ink, and secondary molding. Semi-holes of the prepared semi-hole PCB are smooth in surface and have no residues. The method is reasonable in design, convenient to operate and very high in practicality.
Description
Technical field
Patent of the present invention relates to the manufacture method of a kind of half bore pcb board, belongs to the processing of printed circuit board (PCB) stamp plate
Field.
Background technology
PCB half-pore plate mainly uses support plate or module plate, and its point especially is thin, little, joins with special motherboard
Close attachment and complete function.The half bore of its side is primarily used to climb stannum and is used, and completes the function with motherboard and is connected.
But this half bore is in manufacturing process, if because copper residual in half bore is likely to result in not prison welding, rosin joint, serious herein
May result in short circuit.
Pcb board half bore technology is in the technology that PCB industry is comparative maturity, but is all with positive (figure electricity)
Mode+two is bored or molding mode makes；If by negative film (acid etching) mode, also there is no comparative maturity
Mode.
But currently used method can produce burr phenomena when making half bore at half bore, the most conventional
Method is:
Can bore with positive sheet mode (figure electricity)+two or molding mode makes, but some factories not figure electric wire,
Control more difficult to this problem.(this scheme is suitable for positive factory)；
Negative film mode (acid etching flow process) normal flow adds two brills, reshaping to molding.But this kind of method
There are some problems is: one is, two brills itself can cause again residual copper to produce, and is difficult to thoroughly solve problem, and
Relatively take the production capacity of boring；Two is to have base material burr after shaping to produce, and needs manual method to go to process,
The method is only suitable only for making sample, is not suitable for doing large batch of plate.(this scheme is suitable for negative film factory and does sample panel)
Summary of the invention
The purpose of patent of the present invention is to provide a kind of half bore not have a burr, smooth surface, and can work on a large scale
The manufacture method of the half bore pcb board that factory's metaplasia is produced.
The present invention adopts the following technical scheme that the manufacture method of a kind of half bore pcb board, it is characterised in that include with
Lower step:
Step one, making consent template:
Described consent template selects aluminium sheet, and thickness is 0.15-0.2mm, and this aluminium sheet aluminium sheet has through hole, should
The aperture of through hole is consistent with the half bore pore size needed for pcb board, and the length and width of described aluminium sheet is respectively greater than
Half bore pcb board 4-10mm, pastes grenadine by the one side of obtained aluminium sheet, would correspond to aluminium sheet through-hole section simultaneously
The grenadine of position is removed, and has both obtained consent template.
Step 2, preparation rabbet ink:
What described rabbet ink selection PCB was general selects carburetion ink, the viscosity of this ink > 250pas.
Step 3, consent:
Rabbet ink described in step 2 is filled to the through hole of consent template by scraper so that by consent
In be full of ink.
Step 4, ink baking-curing:
By the ink cured in stages of the consent described in step 3, the Flue curing parameter of solidification is:
First stage, at 55-65 DEG C, toast 5-15min,
Second stage, toasts 10-20min at 75-85 DEG C
Phase III, at 95-105 DEG C, toast 35-45min；
Step 5, one-shot forming:
Consent template and the pcb board overlap of ink solidification in step 4 are placed on backing plate, and are positioned over milling cutter
Under, go out there is the part of half bore by milling cutter gong, prepare and there is the doubling plate of half bore, this milling cutter a diameter of
0.6mm, the distance of distance consent is 4-7cm, and the Milling Speed (m/min) of milling cutter is (10*L+0.12) * 102-
(10*L+0.25)*102, L is the thickness (unit is m) of pcb board.
Step 6, moves back oil
At 45-55 DEG C, alkaline solution is positioned in step 5 the hole of the obtained doubling plate with half bore
In hole, removing the cured printing ink of non-milling, described cured printing ink dissolves in this alkaline solution, and standing time is
5-20min, removes consent template, both must have the pcb board of half bore.
Step 7, post forming
The pcb board with half bore obtained in step 6 is processed into required size, and encapsulates.Made
Obtain the half bore smooth surface of half bore pcb board, there is no residue.
The length and width of described aluminium sheet is respectively greater than half bore pcb board 5mm.Length and width is big, for convenience and
Half-pore plate combines, and the removal being easy to the later stage changes plate
In step mule two, the viscosity of ink is 370-500pas, preferably 480pas.
The design parameter of the scraper described in step 3 is as follows: scraper hardness: 65-75 °, scraper and plug
The angle of hole version is 60-80 degree, and preferably 72 degree (are suspended to use this angle to make through substantial amounts of experiment confirmation
Ink in consent does not has a bubble, and uniformly)；Scraper pressure is 3.5KG/cm2；Scraper speed is
0.5m/min；Scraper uses above-mentioned parameter to contribute to ink and fills up consent, and full, and prevents from depositing in ink
At cavity.
Flue curing parameter in step 4 is:
First stage, at 63 DEG C, toast 12min,
Second stage, toasts 17min at 82 DEG C
Phase III, at 103 DEG C, toast 42min；After baking, the hardness of ink can reach 2H.Through above-mentioned
Baking temperature and baking time so that the hardness of this ink is right up to 2H, be particularly helpful to later stage milling cutter
Half bore smooth surface after milling, and milling.
Backing plate described in step 5 is phenolic aldehyde backing plate；The preferred 5.5cm of distance of milling cutter distance consent, described milling
The Milling Speed of cutter is 19.26m/min.Hardness conjunction through the phenolic aldehyde backing plate that great many of experiments the application is used
Fit, and the distance of Milling Speed and milling cutter the most effectively prevents the copper scroll downward or upward of milling half bore portion
Become copper wire.
Alkaline solution described in step 6 be concentration be the NaOH solution of 3-5%, moving back oil temperature is 49 DEG C, oil
The dissolution velocity of ink is 1.8m/min.The oil temperature of moving back used makes quickly moving back of ink clean, and in hole
Noresidue.
Beneficial effect:
Can assist to carry out half bore making without the factory of figure electrician's sequence, and the mass effect of half bore is the most not
Mistake, half bore edge is smooth, impulse-free robustness, does not has residual copper or copper wire, and is not increasing the basis of equipment
On, can be completed by this factory existing equipment and technology.To reduce the outgoing time of factory, or reduce
The repairing time of Burr Problem, the production time is held in support very actively.The method is reasonable in design, easy to operate,
There is high practicality.
The present invention has passed through substantial amounts of experiment and has confirmed: the scraper parameters of ink plugging is scraper and consent version
Angle be 72 degree, scraper pressure is 3.5KG/cm2；When scraper speed is 0.5m/min, obtained template
Hole is packed with, and full without cavity.Afterwards by the solidification of three phases:
First stage, at 63 DEG C, toast 12min,
Second stage, toasts 17min at 82 DEG C
Phase III, at 103 DEG C, toast 42min；The hardness of the rabbet ink obtained by rear can reach 2H,
It is particularly helpful to later stage milling tool, and the half bore smooth surface after milling；
Finally use milling tool, a diameter of 0.6mm of selected milling cutter, the distance of distance consent is 4-7cm,
The Milling Speed (m/min) of milling cutter is (10*L+0.12) * 102-(10*L+0.25)*102, L is PCB
The thickness (unit is m) of plate, after this milling cutter reaches above-mentioned speed, for the ink institute milling of hardness described above
The hole gone out is the most smooth, and noresidue.The present invention is all linked with one another by ink plugging-solidification-milling etc.
Mode makes half bore edge smooth, and impulse-free robustness does not has residual copper or copper wire.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is expanded on further.
The manufacture method of a kind of half bore pcb board, it is characterised in that comprise the following steps:
Step one, making consent template:
Described consent template selects aluminium sheet, and thickness is 0.15-0.2mm, and this aluminium sheet aluminium sheet has through hole, should
The aperture of through hole is consistent with the half bore pore size needed for pcb board, and the length and width of described aluminium sheet is respectively greater than
Half bore pcb board 4-10mm, pastes grenadine by the one side of obtained aluminium sheet, would correspond to aluminium sheet through-hole section simultaneously
The grenadine of position is removed, and has both obtained consent template.
Step 2, preparation rabbet ink:
What described rabbet ink selection PCB was general selects carburetion ink, the viscosity of this ink > 250pas.
Step 3, consent:
Rabbet ink described in step 2 is filled to the through hole of consent template by scraper so that by consent
In be full of ink.
Step 4, ink baking-curing:
By the ink cured in stages of the consent described in step 3, the Flue curing parameter of solidification is:
First stage, at 55-65 DEG C, toast 5-15min,
Second stage, toasts 10-20min at 75-85 DEG C
Phase III, at 95-105 DEG C, toast 35-45min；
Select carburetion ink when solidification, it is also possible to add firming agent, mass ratio, select carburetion black: firming agent=6:3.5,
The selected carburetion ink that selects is commercially available prod, and selected firming agent is also commercially available, and can solidify choosingization
The firming agent of ink；
Step 5, one-shot forming:
Consent template and the pcb board overlap of ink solidification in step 4 are placed on backing plate, and are positioned over milling cutter
Under, go out there is the part of half bore by milling cutter gong, prepare and there is the doubling plate of half bore, this milling cutter a diameter of
0.6mm, the distance of distance consent is 4-7cm, and the Milling Speed (m/min) of milling cutter is (10*L+0.12) * 102-
(10*L+0.25)*102, L is the thickness (unit is m) of pcb board.The thickness of pcb board is 1-10mm.
Step 6, moves back oil
At 45-55 DEG C, alkaline solution is positioned in step 5 the hole of the obtained doubling plate with half bore
In hole, removing the cured printing ink of non-milling, described cured printing ink dissolves in this alkaline solution, and standing time is
5-20min, removes consent template, both must have the pcb board of half bore.
Step 7, post forming
The pcb board with half bore obtained in step 6 is processed into required size, and encapsulates.Made
Obtain the half bore smooth surface of half bore pcb board, there is no residue.
The length and width of described aluminium sheet is respectively greater than half bore pcb board 5mm.Length and width is big, for convenience and
Half-pore plate combines, and the removal being easy to the later stage changes plate
In step 2, the viscosity of ink is 370-500pas, preferably 480pas.
The design parameter of the scraper described in step 3 is as follows: scraper hardness: 65-75 °, scraper and plug
The angle of hole version is 60-80 degree, and preferably 72 degree (are suspended to use this angle to make through substantial amounts of experiment confirmation
Ink in consent does not has a bubble, and uniformly)；Scraper pressure is 3.5KG/cm2；Scraper speed is
0.5m/min；Scraper uses above-mentioned parameter to contribute to ink and fills up consent, and full, and prevents from depositing in ink
At cavity.
Flue curing parameter in step 4 is:
First stage, at 63 DEG C, toast 12min,
Second stage, toasts 17min at 82 DEG C
Phase III, at 103 DEG C, toast 42min；After baking, the hardness of ink can reach 2H (HRB).Warp
Cross above-mentioned baking temperature and baking time so that the hardness of this ink is right up to 2H, after being particularly helpful to
Phase milling tool, and the half bore smooth surface after milling；
Backing plate described in step 5 is phenolic aldehyde backing plate；The preferred 5.5cm of distance of milling cutter distance consent, described milling
The Milling Speed of cutter is 19.26m/min.Hardness conjunction through the phenolic aldehyde backing plate that great many of experiments the application is used
Fit, and the distance of Milling Speed and milling cutter the most effectively prevents the copper scroll downward or upward of milling half bore portion
Become copper wire.
Alkaline solution described in step 6 be concentration be the NaOH solution of 3-5%, moving back oil temperature is 49 DEG C,
The dissolution velocity of ink is 1.8m/min.The oil temperature of moving back used makes quickly moving back of ink clean, and
Noresidue in hole.
Should be understood that these embodiments are merely to illustrate the present invention rather than limit the scope of the present invention.In addition should
Understanding, after having read the content that the present invention lectures, the present invention can be made various changing by those skilled in the art
Moving or amendment, these equivalent form of values fall within the application appended claims limited range equally.
Claims (8)
1. the manufacture method of a half bore pcb board, it is characterised in that comprise the following steps:
Step one, making consent template:
Described consent template selects aluminium sheet, and thickness is 0.15-0.2mm, and this aluminium sheet aluminium sheet has through hole, should
The aperture of through hole is consistent with the half bore pore size needed for pcb board, and the length and width of described aluminium sheet is respectively greater than
Half bore pcb board 4-10mm, pastes grenadine by the one side of obtained aluminium sheet, would correspond to aluminium sheet through-hole section simultaneously
The grenadine of position is removed, and has both obtained consent template.
Step 2, preparation rabbet ink:
What described rabbet ink selection PCB was general selects carburetion ink, the viscosity of this ink > 250pas.
Step 3, consent:
Rabbet ink described in step 2 is filled to the through hole of consent template by scraper so that by consent
In be full of ink.
Step 4, ink baking-curing:
By the ink cured in stages of consent described in step 3；
Step 5, one-shot forming:
Consent template and the pcb board overlap of ink solidification in step 4 are placed on backing plate, and are positioned over milling cutter
Under, go out there is the part of half bore by milling cutter gong, prepare and there is the doubling plate of half bore, this milling cutter a diameter of
0.6mm, the distance of distance consent is 4-7cm, and the Milling Speed (m/min) of milling cutter is (10*L+0.12) * 102-
(10*L+0.25)*102, L is the thickness (unit is m) of pcb board.
Step 6, moves back oil
At 45-55 DEG C, alkaline solution is positioned in step 5 the hole of the obtained doubling plate with half bore
In hole, removing the cured printing ink of non-milling, described cured printing ink dissolves in this alkaline solution, and standing time is
5-20min, removes consent template, both must have the pcb board of half bore.
Step 7, post forming
The pcb board with half bore obtained in step 6 is processed into required size, and encapsulates.
The manufacture method of a kind of half bore pcb board the most as claimed in claim 1, it is characterised in that oil in step 4
Ink cured in stages, the Flue curing parameter of solidification is:
First stage, at 55-65 DEG C, toast 5-15min,
Second stage, toasts 10-20min at 75-85 DEG C
Phase III, at 95-105 DEG C, toast 35-45min.
The manufacture method of a kind of half bore pcb board the most as claimed in claim 1, it is characterised in that institute in step one
The length and width stating aluminium sheet is respectively greater than half bore pcb board 5mm.
The manufacture method of a kind of half bore pcb board the most as claimed in claim 1, it is characterised in that oil in step 2
The viscosity of ink is 370-500pas, preferably 480pas.
The manufacture method of a kind of half bore pcb board the most as claimed in claim 1, it is characterised in that institute in step 3
The design parameter of the scraper stated is as follows: scraper hardness: 65-75 °, and the angle of scraper and consent template is
60-80 degree, preferably 72 degree；Scraper pressure is 3.5KG/cm2；Scraper speed is 0.5m/min.
The manufacture method of a kind of half bore pcb board the most as claimed in claim 2, it is characterised in that in step 4
Flue curing parameter is:
First stage, at 63 DEG C, toast 12min,
Second stage, toasts 17min at 82 DEG C
Phase III, at 103 DEG C, toast 42min；After baking, the hardness of ink can reach 2H.
The manufacture method of a kind of half bore pcb board the most as claimed in claim 1, it is characterised in that institute in step 5
The backing plate stated is phenolic aldehyde backing plate；The preferred 5.5cm of distance of milling cutter distance consent.
The manufacture method of a kind of half bore pcb board the most as claimed in claim 1, it is characterised in that institute in step 6
The alkaline solution stated be concentration be the NaOH solution of 3-5%, moving back oil temperature is 49 DEG C, and the dissolution velocity of ink is
1.8m/min。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410190919.1A CN105899002A (en) | 2014-05-06 | 2014-05-06 | Preparation method of semi-hole PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410190919.1A CN105899002A (en) | 2014-05-06 | 2014-05-06 | Preparation method of semi-hole PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105899002A true CN105899002A (en) | 2016-08-24 |
Family
ID=56999785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410190919.1A Pending CN105899002A (en) | 2014-05-06 | 2014-05-06 | Preparation method of semi-hole PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105899002A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793580A (en) * | 2016-11-18 | 2017-05-31 | 中国电子科技集团公司第二十九研究所 | A kind of multi-layer PCB edges of boards blind slot processing method |
| CN108575058A (en) * | 2017-03-07 | 2018-09-25 | 惠州中京电子科技有限公司 | A kind of half bore plate producing process |
| CN110933849A (en) * | 2019-12-05 | 2020-03-27 | 恩达电路(深圳)有限公司 | Method for manufacturing small half-hole circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102427667A (en) * | 2011-11-09 | 2012-04-25 | 金悦通电子（翁源）有限公司 | Machining process of half-pore plate |
| CN103025063A (en) * | 2012-12-05 | 2013-04-03 | 深圳市兴达线路板有限公司 | Circuit board machining process capable of preventing oil overflowing |
| CN103415164A (en) * | 2013-08-30 | 2013-11-27 | 武汉七零九印制板科技有限公司 | Method for plugging through hole, of which hole diameter is larger than 1.0mm, of PCB (Printed Circuit Board) by using printing ink |
-
2014
- 2014-05-06 CN CN201410190919.1A patent/CN105899002A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102427667A (en) * | 2011-11-09 | 2012-04-25 | 金悦通电子（翁源）有限公司 | Machining process of half-pore plate |
| CN103025063A (en) * | 2012-12-05 | 2013-04-03 | 深圳市兴达线路板有限公司 | Circuit board machining process capable of preventing oil overflowing |
| CN103415164A (en) * | 2013-08-30 | 2013-11-27 | 武汉七零九印制板科技有限公司 | Method for plugging through hole, of which hole diameter is larger than 1.0mm, of PCB (Printed Circuit Board) by using printing ink |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793580A (en) * | 2016-11-18 | 2017-05-31 | 中国电子科技集团公司第二十九研究所 | A kind of multi-layer PCB edges of boards blind slot processing method |
| CN106793580B (en) * | 2016-11-18 | 2019-03-19 | 中国电子科技集团公司第二十九研究所 | A kind of multi-layer PCB edges of boards blind slot processing method |
| CN108575058A (en) * | 2017-03-07 | 2018-09-25 | 惠州中京电子科技有限公司 | A kind of half bore plate producing process |
| CN110933849A (en) * | 2019-12-05 | 2020-03-27 | 恩达电路(深圳)有限公司 | Method for manufacturing small half-hole circuit board |
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| PB01 | Publication | ||
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Application publication date: 20160824 |