CN104183911A - Manufacturing method of antenna - Google Patents
Manufacturing method of antenna Download PDFInfo
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- CN104183911A CN104183911A CN201310192853.5A CN201310192853A CN104183911A CN 104183911 A CN104183911 A CN 104183911A CN 201310192853 A CN201310192853 A CN 201310192853A CN 104183911 A CN104183911 A CN 104183911A
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- antenna
- antenna area
- conductive layer
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- manufacture method
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Abstract
Disclosed is a manufacturing method of an antenna. The manufacturing method of the antenna includes the following steps: (A) preparing an insulating base material provided with a conductive layer on one surface; (B) forming a slit on the conductive layer, wherein the slit divides the conductive layer into an antenna area and a non-antenna area, which are not electrically connected mutually; (C) carrying out electroplating on the antenna area of the conductive layer so as to form an electroplating layer on the antenna area; and (D) synchronously etching the conductive layer and the electroplating layer in a specific preset time so that the non-antenna area is removed and the thickness sum of the antenna area and the electroplating layer are larger than 0. The manufacturing method of the antenna can prevent material and work procedure cost needed when a resist is used and prevent defects in using laser engraving to remove the non-antenna area so that the antenna can be produced in a time-saving and simple method.
Description
Technical field
The present invention relates to a kind of manufacture method of antenna, refer to especially a kind of manufacture method of the antenna that comprises etching step.
Background technology
The manufacture method of general PCB antenna can be used etching resist or anti-plating resist conventionally.Etching resist is for being arranged at the antenna area of Copper Foil, and when carrying out etch process, antenna area can be subject to the protection of etching resist, and the non-antenna area of Copper Foil can etchedly be removed.Anti-plating resist is that when thickening technique, the antenna area of Copper Foil can be plated and thicken for being arranged at the non-antenna area of Copper Foil, and the non-antenna area of Copper Foil can be subject to the impact of anti-plating resist and can not thickened.The technique of etching resist or anti-plating resist comprises formation resist technique (as spraying, rotation or printing), the graphical technique of resist (as exposure/development) and removes resist technique.Because aforementioned technique relates to the material cost of etching resist or anti-plating resist itself, and the processing step relevant to resist is numerous and diverse, thereby the technique of this use resist has increased the cost that antenna is made widely.
The manufacture method of another kind of existing PCB antenna is not used etching resist or anti-plating resist, and its mode with laser engraving (Laser Direct Structuring) is removed the non-antenna area of Copper Foil.Yet this method need expend the non-antenna area of a large amount of time removal Copper Foils, and a large amount of heat energy of supporter produces conventionally, causes the plastic variable color or the distortion that for Copper Foil, arrange.In addition,, when dwi hastasana is formed in the casing of electronic installation and casing complex-shaped, it is regions that laser engraving cannot be removed that casing often exists some dead angles, and non-antenna area cannot be completely removed.The kish meeting potato masher antenna characteristic of non-antenna area, and affect outward appearance.Therefore, how to develop a kind of manufacture method of new antenna, can overcome the shortcoming of aforementioned prior art, then become the emphasis that the present invention further will inquire into.
Thereby, need to provide a kind of manufacture method of antenna to solve the problems referred to above.
Summary of the invention
Therefore, object of the present invention, is to provide the preferably manufacture method of antenna of the lower and effect of a kind of cost.
So the manufacture method of antenna of the present invention comprises: (A) prepare the insulating substrate that a surface is provided with a conductive layer; (B) at this conductive layer, form a slit, this slit is divided into this conductive layer an antenna area and the non-antenna area not being electrically connected to each other; (C) this antenna area of this conductive layer electroplated and on this antenna area, formed an electrodeposited coating; And (D) this conductive layer and this electrodeposited coating are synchronously carried out to etching according to a scheduled time, this non-antenna area is removed, and makes the thickness summation of this antenna area and this electrodeposited coating be greater than zero.
Preferably, this slit forms by the mode of laser engraving.
Preferably, the path of this slit is sealed.
Preferably, in step (D), carry out Wet-type etching or dry-etching.
Preferably, in step (A), by the mode of plastic electroplating, spraying, transfer printing or physical vapour deposition (PVD), prepare this conductive layer and this insulating substrate.
Effect of the present invention is by forming this slit, antenna area not to be electrically connected to each other with non-antenna area, and make the thickness summation of antenna area and electrodeposited coating be greater than the thickness of non-antenna area by electroplating antenna area, by etching, remove non-antenna area again, make residual antenna area or residual electrodeposited coating and antenna area form antenna, can avoid by this using the required material of resist and process cost, and can avoid using laser engraving to remove the shortcoming of non-antenna area, and produce antenna in the easy mode that saves time.
Accompanying drawing explanation
Other feature and effect of the present invention, will clearly present in the execution mode with reference to accompanying drawing, wherein:
Fig. 1 is the flow chart of preferred embodiment of the manufacture method of antenna of the present invention;
Fig. 2,4,6, the 8th, a schematic top plan view of an insulating substrate of this preferred embodiment, a conductive layer and an electrodeposited coating, illustrates the making flow process of this preferred embodiment; And
Fig. 3,5,7, the 9th, a generalized section of corresponding diagram 2,4,6,8 respectively, illustrates the making flow process of this preferred embodiment.
Primary clustering symbol description:
The non-antenna area of 1 insulating substrate 23
11 surfaces 3,3 ' electrodeposited coating
2 conductive layer d1, d2, d3 thickness
21 slit S01～S04 process steps
22 antenna areas
Embodiment
Consult Fig. 1, Fig. 2 and Fig. 3, the preferred embodiment of the manufacture method of antenna of the present invention is first as shown in step S01, and preparation one surface 11 is provided with an insulating substrate 1 of a conductive layer 2.In the present embodiment, insulating substrate 1 be take plastics and is made as material, conductive layer 2 is formed at the surface 11 of insulating substrate 1 by the mode of plastic electroplating (Plating on Plastic, POP), spraying, transfer printing or physical vapour deposition (PVD) (Physical Vapor Deposition, PVD).Conductive layer 2 can be metal level (as Copper Foil) or conducting polymer composite.
Consult Fig. 1, Fig. 4 and Fig. 5, then, as shown in step S02, at conductive layer 2, form a slit 21, this slit 21 is divided into conductive layer 2 antenna area 22 and the non-antenna area 23 not being electrically connected to each other.The path of the slit 21 in the present embodiment is sealed, around antenna area 22.It is inverted U-shaped that antenna area 22 is in the present embodiment, but not as limit.In the present embodiment, slit 21 forms by the mode of laser engraving.
Consult Fig. 1, Fig. 6 and Fig. 7, then, as shown in step S03, the antenna area 22 of conductive layer 2 is electroplated and on antenna area 22, formed an electrodeposited coating 3.Because antenna area 22 and non-antenna area 23 are isolated by slit 21, so 3 of electrodeposited coatings can be formed at antenna area 22 and can not be formed at non-antenna area 23.As shown in Figure 7, the thickness of conductive layer 2 is d1, and conductive layer 2 is d2 with the thickness summation of electrodeposited coating 3, and the thickness summation d2 of antenna area 22 and electrodeposited coating 3 and the thickness d 1 of non-antenna area 23 have differed the thickness of electrodeposited coating 3.
Consult Fig. 1, Fig. 8 and Fig. 9, then, as shown in step S04, conductive layer 2 and electrodeposited coating 3 are synchronously carried out to etching according to a scheduled time, non-antenna area 23 is removed, and makes the thickness summation of antenna area 22 and electrodeposited coating 3 ' be greater than zero.More particularly, step S04 utilizes thickness d 1, d2(to see Fig. 7) difference, while making to carry out etching according to the scheduled time, only have the non-antenna area 23 of thickness less (d1) to be removed completely, and antenna area 22 and electrodeposited coating 3 ' can not be completely removed, residual electrodeposited coating 3 ' and antenna area 22 form antenna, and it has thickness d 3(d3 and is less than d2 and is greater than zero).In the present embodiment, after carrying out etching, there are residual electrodeposited coating 3 ' and antenna area 22 in insulating substrate 1 surface 11, and in another embodiment, electrodeposited coating 3 is also removed, and substrate surface 11 only has residual antenna area 22.
Because the manufacture method of antenna of the present invention does not need to use etching resist or anti-plating resist, therefore can reduce widely and use required material and the process cost of resist.Moreover, compare the prior art of using laser engraving to remove non-antenna area, the manufacture method of antenna of the present invention is only used laser engraving to cut out the profile of antenna area 22, therefore can avoid that non-antenna area 23 is removed not exclusively, technique is consuming time, the situation of insulating substrate 1 temperature distortion variable color.
In sum, the manufacture method of antenna of the present invention makes antenna area 22 not be electrically connected to each other with non-antenna area 23 by forming this slit 21, and make antenna area 22 and the thickness summation of electrodeposited coating 3 be greater than the thickness of non-antenna area 23 by electroplating antenna area 22, by etching, remove non-antenna area 23 again, make residual antenna area 22 or residual electrodeposited coating 3 ' and antenna area 22 form antenna, can effectively simplify by this flow process that antenna is made, reduce the cost that antenna is made, therefore really can reach object of the present invention.
Only as described above, it is only preferred embodiment of the present invention, can not limit scope of the invention process with this, every simple equivalent variations and modification of doing according to the scope of the claims in the present invention book and patent specification content, all still remains within the scope of the patent.
Claims (5)
1. a manufacture method for antenna, the manufacture method of this antenna comprises:
(A) prepare the insulating substrate that a surface is provided with a conductive layer;
(B) at this conductive layer, form a slit, this slit is divided into this conductive layer an antenna area and the non-antenna area not being electrically connected to each other;
(C) this antenna area of this conductive layer electroplated and on this antenna area, formed an electrodeposited coating; And
(D) this conductive layer and this electrodeposited coating are synchronously carried out to etching according to a scheduled time, this non-antenna area is removed, and make the thickness summation of this antenna area and this electrodeposited coating be greater than zero.
2. the manufacture method of antenna as claimed in claim 1, this slit forms by the mode of laser engraving.
3. the manufacture method of antenna as claimed in claim 1, the path of this slit is sealed.
4. the manufacture method of antenna as claimed in claim 1 is carried out Wet-type etching or dry-etching in step (D).
5. the manufacture method of antenna as claimed in claim 1 is prepared this conductive layer and this insulating substrate by the mode of plastic electroplating, spraying, transfer printing or physical vapour deposition (PVD) in step (A).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310192853.5A CN104183911A (en) | 2013-05-22 | 2013-05-22 | Manufacturing method of antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310192853.5A CN104183911A (en) | 2013-05-22 | 2013-05-22 | Manufacturing method of antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104183911A true CN104183911A (en) | 2014-12-03 |
Family
ID=51964781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310192853.5A Pending CN104183911A (en) | 2013-05-22 | 2013-05-22 | Manufacturing method of antenna |
Country Status (1)
| Country | Link |
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| CN (1) | CN104183911A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107820366A (en) * | 2017-09-30 | 2018-03-20 | 上海安费诺永亿通讯电子有限公司 | The manufacturing process for metal circuit on different azimuth surface on a kind of small-sized insulator |
| CN107846783A (en) * | 2017-11-13 | 2018-03-27 | 上海安费诺永亿通讯电子有限公司 | A kind of manufacturing process for metal circuit for being distributed in insulator different azimuth surface |
| CN107910311A (en) * | 2017-12-04 | 2018-04-13 | 中芯长电半导体（江阴）有限公司 | A kind of fan-out-type antenna packages structure and preparation method thereof |
| CN110519415A (en) * | 2018-05-21 | 2019-11-29 | 富智康精密电子（廊坊）有限公司 | Shell prepared by the preparation method and utilization this method of shell |
| CN111525240A (en) * | 2020-05-26 | 2020-08-11 | 讯创(天津)电子有限公司 | Method for manufacturing circuit and antenna on surface of three-dimensional material by sputtering and laser etching |
| WO2021027534A1 (en) * | 2019-08-13 | 2021-02-18 | 华为技术有限公司 | Touch screen and electronic device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101017925A (en) * | 2006-02-09 | 2007-08-15 | 晟辉科技股份有限公司 | The making method of the thin film antenna |
| US20070231962A1 (en) * | 2006-03-29 | 2007-10-04 | Shinko Electric Industries Co., Ltd. | Manufacturing method of wiring substrate and manufacturing method of semiconductor device |
| CN101246989A (en) * | 2007-02-15 | 2008-08-20 | 上海安费诺永亿通讯电子有限公司 | Antenna production method and antenna structure |
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2013
- 2013-05-22 CN CN201310192853.5A patent/CN104183911A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101017925A (en) * | 2006-02-09 | 2007-08-15 | 晟辉科技股份有限公司 | The making method of the thin film antenna |
| US20070231962A1 (en) * | 2006-03-29 | 2007-10-04 | Shinko Electric Industries Co., Ltd. | Manufacturing method of wiring substrate and manufacturing method of semiconductor device |
| CN101246989A (en) * | 2007-02-15 | 2008-08-20 | 上海安费诺永亿通讯电子有限公司 | Antenna production method and antenna structure |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107820366A (en) * | 2017-09-30 | 2018-03-20 | 上海安费诺永亿通讯电子有限公司 | The manufacturing process for metal circuit on different azimuth surface on a kind of small-sized insulator |
| CN107846783A (en) * | 2017-11-13 | 2018-03-27 | 上海安费诺永亿通讯电子有限公司 | A kind of manufacturing process for metal circuit for being distributed in insulator different azimuth surface |
| CN107846783B (en) * | 2017-11-13 | 2020-05-12 | 上海安费诺永亿通讯电子有限公司 | Method for manufacturing metal lines distributed on different orientation surfaces of insulator |
| CN107910311A (en) * | 2017-12-04 | 2018-04-13 | 中芯长电半导体（江阴）有限公司 | A kind of fan-out-type antenna packages structure and preparation method thereof |
| CN110519415A (en) * | 2018-05-21 | 2019-11-29 | 富智康精密电子（廊坊）有限公司 | Shell prepared by the preparation method and utilization this method of shell |
| WO2021027534A1 (en) * | 2019-08-13 | 2021-02-18 | 华为技术有限公司 | Touch screen and electronic device |
| CN111525240A (en) * | 2020-05-26 | 2020-08-11 | 讯创(天津)电子有限公司 | Method for manufacturing circuit and antenna on surface of three-dimensional material by sputtering and laser etching |
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Application publication date: 20141203 |