CN111525240A - Method for manufacturing circuit and antenna on surface of three-dimensional material by sputtering and laser etching - Google Patents
Method for manufacturing circuit and antenna on surface of three-dimensional material by sputtering and laser etching Download PDFInfo
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- CN111525240A CN111525240A CN202010452353.0A CN202010452353A CN111525240A CN 111525240 A CN111525240 A CN 111525240A CN 202010452353 A CN202010452353 A CN 202010452353A CN 111525240 A CN111525240 A CN 111525240A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
- C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5873—Removal of material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/246—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for base stations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
Abstract
A method for manufacturing a circuit and an antenna on the surface of a three-dimensional material by sputtering and laser etching is characterized in that one or more metal layers are sputtered on the surfaces of plastics, glass, ceramics and the like, then the circuit and the antenna wiring are processed by laser etching, the redundant metal layers on the surfaces are removed, and the processes of electroplating, paint spraying and the like can be combined if necessary, so that the needed three-dimensional circuit and the antenna can be obtained. The method can be widely used in the fields of circuit manufacturing and antenna manufacturing of common electronic products, circuit manufacturing of base station antennas and oscillators and the like. The method comprises the following steps: 1. the method comprises the following steps of (1) sputtering a metal layer on the surface of a non-metal substrate, (2) processing a circuit and an antenna wire by utilizing laser etching, (3) increasing the thickness of the metal layer by electroplating if necessary, and (4) increasing a weldable layer and a protective layer by processing modes such as tinning and gilding if necessary, and (5) spraying paint on the outermost surface if necessary, thickening a contact to achieve the effects of corrosion resistance and friction resistance.
Description
Technical Field
The invention relates to the field of electronics and mobile communication, in particular to a method for manufacturing a circuit and an antenna on the surface of a three-dimensional material by sputtering and laser etching.
Background
Portable electronic products are becoming smaller and thinner, which requires higher integration of internal components and higher manufacturing process requirements of circuits. Meanwhile, with the large-scale commercial use of the 5G mobile network, various mobile terminals, base stations and related products become indispensable articles in daily work and life of people. As a wireless communication tool, the signal intensity of a mobile terminal largely determines the smoothness of the practical use of a mobile network, and under the coverage of a base station under the same mobile network, the signal intensity of the mobile terminal largely depends on an antenna of the mobile terminal. The antenna elements are used as the important components of the antenna, the base station antenna in 4G era generally has 10-40 antenna elements, the number of single-side oscillators of the 5G antenna reaches 128-256, and the number of the 5G base stations reaches more than 1.5-2 times of that of the base station antenna in 4G era. From 4G to 5G, the number of the antennas is greatly increased, and the number of the antenna elements comes up to the outbreak period. Meanwhile, 4G mobile phone antennas are about 4 to 8, and with the popularization of MIMO technology in 5G mobile phones, the number of antennas is increased to more than 20. And as other applications and functions increase, less and less space is reserved for the antenna, so that the size and the integration degree of the antenna are higher and higher.
The materials of the traditional vibrator process are all metals, and the vibrator manufactured by using the metals has the main problems of high manufacturing cost and overlarge weight, and brings great difficulty to the weight control of the antenna. The plastic material is used as the main material of the antenna, so that the weight can be greatly reduced, and the cost is well controlled. In addition, the conventional PCB process is difficult to use on a complex 3D composite surface through various cut surfaces due to the 2D form, and cannot exert the performance of the antenna due to the limitation of the antenna trace form.
Disclosure of Invention
The invention aims to provide a method for manufacturing a circuit and an antenna on the surface of a three-dimensional material by sputtering and laser etching, wherein the method is characterized in that sputtering metal is utilized on the surface of a non-metal material, and a circuit and an antenna manufacturing method of a laser etching gasification process are combined.
In order to achieve the purpose, the invention provides the following technical scheme:
a method for preparing an antenna by combining vacuum plating with a laser process comprises the following steps:
s1, metallization treatment on the surface of the non-metal base material: sputtering a metal layer on the surface of a base material to obtain a blank to be processed, wherein the base material is a three-dimensional non-metal material;
(1) such materials include, but are not limited to: plastics (PC, PC + ABS, PPS, LCP, etc.), glass, ceramics, etc.;
(2) before step S1, a surface cleaning process is performed on the substrate according to the type and requirement of the material, wherein the cleaning process includes water washing, plasma washing, and the like;
(3) the sputtering process in the step S1 includes: vacuum evaporation or sputtering or ion plating of metal;
(4) the metal layers include, but are not limited to: copper, nickel, gold, tin and the like, wherein the metal layer can be one or more of the metal layers, and the thickness of each plating layer is 0.1-10 mu m.
S2, processing the line routing: performing routing processing on the blank obtained in the step S1 by using a laser etching process to remove the metal layer on the redundant part of the surface of the antenna blank;
(1) the laser process in step S2 includes: in the antenna routing processing, all metal layers in the S1 are gasified by laser, unnecessary metal is removed, and the required metal part is reserved;
(2) the wavelength of the laser can be ultraviolet, visible or infrared laser according to different metals.
S3: thickening treatment of the line conducting layer: if the current is too large, the electrode can be added on the surface of the metal layer obtained in S2, and the thickness of the copper layer is increased by an electroplating method;
(1) adding an electrode for electroplating on the surface of the circuit obtained by the S2 process, and then carrying out electroplating metal thickening on the original metal surface in an electroplating mode;
(2) the electroplated metal may be one or more layers, and the metal species include, but are not limited to: a metal having good conductivity such as copper, and the thickness of the plating layer is 2 μm to 20 μm;
(3) the main function of the step is to realize that the product needs overlarge current or has other requirements on the thickness of metal and increase the thickness of the conducting layer.
S4: and (3) performing solderability treatment on the surface of the circuit: if surface welding treatment is needed, the surface can be treated by tin plating, gold plating and the like;
(1) electroplating a weldable or protective metal on the surface of the circuit obtained by the S3 process in an electroplating mode;
(2) the electroplated metal may be one or more layers, and the metal species include, but are not limited to: metals with good weldability or good protectiveness such as nickel, tin, gold and the like, and the thickness of the plating layer is 2-20 μm;
(3) the main function of this step is to increase the solderability of the metal to prepare for the subsequent solder joint addition or SMT process, and at the same time, one or more layers of protective metal are added to increase the oxidation and corrosion resistance of the metal due to the fact that the copper layer metal in the interior is easily oxidized.
S5: line surface protection treatment: according to different use scenes, the reliability requirements of the product are different, the surface of the product can be protected by spraying paint on the surface of the product after the S4 process when needed, and the metal layer is thickened on the contact point, so that the effects of corrosion resistance and friction resistance are achieved.
(1) Spraying one or more layers of primer or finish paint on the surface of the circuit obtained by the S4 process in a paint spraying mode;
(2) the number of the sprayed paint layers can be one or more, the sprayed paint type is a primer or a finish, and the thickness is 2-20 mu m;
(3) the step mainly has the effects of increasing the protection of the metal layer and further enhancing the oxidation resistance, corrosion resistance and friction resistance of the metal in severe environments such as high temperature, high humidity and the like.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention provides a brand-new circuit and antenna preparation method combining sputtering and laser technology on the surface of a non-metal material, namely, the surface of the non-metal material is metalized in a sputtering mode, unnecessary areas are removed by laser gasification, the surface of a three-dimensional metal layer is further formed, a required three-dimensional circuit or antenna is obtained, and the thickening, protection and other technologies of the metal layer are realized by electroplating, paint spraying and other technologies, so that the product can well resist oxidation and corrosion while the conductivity and the radio frequency performance of the product are ensured, and the product can be used under various weather conditions all the year round of a base station antenna oscillator. By utilizing the method, the disadvantages of poor performance, complex connection process, high labor cost and the like of the traditional planar PCB antenna can be well avoided, the special plastic of the traditional laser etching process with high price is avoided, any non-metallic material can be used as the antenna substrate, the defects of poor mechanical performance and brittleness caused by adding metal components in the traditional laser etching special material are overcome, the application range is more flexible and wider, and the method is particularly suitable for the antenna oscillator solution of the current 5G base station or the 5G antenna solution of the terminal.
2. The scheme can manufacture antennas and circuits with various three-dimensional shapes on the surface of the three-dimensional substrate, compared with a two-dimensional plane antenna, the radio frequency performance is better, the antenna space is more widely utilized, the product structure is more compact, an antenna or conductor structure layer is not required to be added on a mechanical structure independently, the two-in-one antenna can be combined, and for the characteristic that a large number of oscillator antennas are required to be used in a 5G base station, the process can well reduce the weight and the occupied area of the 5G base station, and the installation and design difficulty is well reduced;
3. the metal of the scheme is obtained by sputtering or electroplating, compared with other 3D solutions, the metal layer is better in compactness and better in conductivity compared with a metal layer formed by chemical plating, the requirement of high-frequency current can be met in a thinner thickness range, and the transmitting and receiving performance indexes of the antenna are realized. Meanwhile, the environmental protection effect is improved, and the environmental pollution caused by the discharge of chemical plating liquid medicine waste liquid is avoided;
4. by using the mode of laser etching and electroplating after sputtering, the functionality of the product can be well increased, the flexibility of product design can be realized, the requirement of the skin effect thickness of a high-current or radio-frequency antenna cannot be realized due to the limitation of the thickness of a sputtering layer, and meanwhile, metal with good weldability can be used as the outermost layer, so that the requirement of the product on cable welding in the later period can be met, and the reliability of the product for use in a high-temperature and high-humidity environment is improved;
5. when the metal layer is cut by using laser, the laser power density is extremely high, and molecular chains of the metal layer can be directly broken after Q adjustment and focusing, so that the part of the metal layer to be cut is directly gasified and is thoroughly separated from the non-metal substrate.
Drawings
Figure 1 is a cross-sectional view of the layers.
In the figure: 1. paint-spraying protective layer 2, contact protective layer 3, metal weldable layer or protective layer 4, conductive metal layer 5, and substrate
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1: sputtering and laser etching of the mobile phone antenna with the plastic back cover.
Referring to fig. 1, a method for manufacturing an antenna by using a vacuum plating and laser process includes the following steps:
(1) sputtering a metal layer on the surface of the plastic substrate:
firstly, the plastic back cover of the mobile phone is primarily cleaned by alcohol and the like to remove oil stains, dirt, release agent and the like. And then, carrying out plasma cleaning on the surface of the mobile phone plastic back cover substrate 5, further deeply cleaning the surface of the substrate by using plasma, enabling the plastic substrate to have higher surface tension and wettability, and remarkably improving the adhesive force of the substrate, so that the subsequent sputtering layer is combined with the substrate more tightly and firmly. Then the treated substrate is carried out magnetron sputtering, and the vacuum is firstly carried out to 10-5-10-4Pa range, then argon gas was injected to raise the pressure to 10-3-10-1Pa, and then applying a voltage in the range of 500V-700V, so that the argon gas is ionized in the electric field, and argon ions and free electrons are generated. The applied current is 5-20A, and the sputtering speed of the cathode is determined by the different current. The higher the current, the faster the cathode sputtering rate and vice versa. Copper and stainless steel targets were used in sequence for metal sputtering. Metal atoms in the target material are separated from the target material body under the bombardment of cathode ionized gas, and impact on the surface of the plastic back cover along the direction of the magnetic field under the action of the magnetic field to gradually form a metal layer. The sputtering thickness is 2-3 microns of the copper layer and 0.2-1.0 micron of the stainless steel layer. The copper layer is arranged inside the stainless steel layer, the copper layer 4 is used for conducting signals, and the stainless steel layer 3 is used for preventing the copper layer from being oxidized in contact with air and the like.
(2) Carrying out laser etching on the sputtered metal layer:
and (3) placing the sputtered substrate on a special tool clamp, performing three-dimensional laser etching by laser, directly breaking the metal connection between the copper layer and the nickel layer by using laser according to the pattern of antenna routing, and removing the redundant part to leave a useful antenna pattern. The required antenna pattern is finally obtained by using a 10W optical fiber laser with the wavelength of 1064nm, the repetition frequency of 40KHz, the laser power of 6-8W, the pulse width of 100ns, the processing speed of 400mm/s, the cross filling mode and the spacing of 0.02mm, and the processing precision of the process is 0.02 mm.
(3) Contact and antenna line protection
In order to increase the degree of friction resistance of contact site, through the mode of printing silver thick liquid of contact site printing of metal behind the radium carving, printing part width 2 millimeters, length 4 millimeters, 2 thickness 20 microns in silver thick liquid layer, the product that will brush the silver thick liquid is finally put into the baking oven and is dried. After the silver paste part of the final product is shielded, surface spraying is carried out, and a layer of protective paint 1 is sprayed, so that the surface can be enhanced in oxidation resistance and corrosion resistance.
The manufacturing of the metal sputtering antenna on the plastic back cover of the mobile phone is completed through the steps.
Claims (10)
1. The method for manufacturing the circuit and the antenna on the surface of the three-dimensional material by sputtering and laser etching is characterized by comprising the following steps of:
s1, metallization treatment on the surface of the non-metal base material: sputtering a metal layer on the surface of a base material to obtain a blank to be processed, wherein the base material is a three-dimensional non-metal material;
s2, processing the line routing: performing routing processing on the blank obtained in the step S1 by using a laser etching process to remove the metal layer on the redundant part of the surface of the antenna blank;
s3: thickening treatment of the line conducting layer: if the current is too large, the electrode can be added on the surface of the metal layer obtained in S2, and the thickness of the copper layer is increased through electroplating;
s4: and (3) performing solderability treatment on the surface of the circuit: if surface welding treatment is needed, the surface can be treated by tin plating, gold plating and the like;
s5: line surface protection treatment: according to different use scenes, the reliability requirements of the product are different, the surface protection can be carried out by spraying paint on the surface of the product after the S4 process if necessary, the metal layer thickening treatment is carried out on the contact point,
so as to achieve the effects of corrosion resistance and friction resistance.
2. The method of claim 1, wherein the method comprises sputtering and laser etching a three-dimensional material to form a circuit and an antenna, wherein the method comprises: the non-metal substrate is one of plastic, ceramic or glass back cover.
3. The method of claim 1, wherein the method comprises sputtering and laser etching a three-dimensional material to form a circuit and an antenna, wherein the method comprises: before the step S1, the surface of the non-metal substrate may be cleaned by ultrasonic water washing or plasma cleaning.
4. The method of claim 1, wherein the method comprises sputtering and laser etching a three-dimensional material to form a circuit and an antenna, wherein the method comprises: the metal layer comprises one or more layers of metal, wherein the metal is copper, nickel, chromium, tin, titanium, silver, gold or stainless steel, and the thickness of the metal layer is 0.1-10.0 μm.
5. The method of claim 4, wherein the method comprises sputtering and laser etching the surface of the three-dimensional material to form a circuit and an antenna, wherein the method comprises: the treatment method for metalizing the surface of the substrate in the step of metalizing the surface of the non-metal substrate can be realized by vacuum evaporation or sputtering or ion plating process of metal.
6. The method of claim 1, wherein the method comprises sputtering and laser etching a three-dimensional material to form a circuit and an antenna, wherein the method comprises: the antenna routing processing utilizes laser to gasify the metal layer, removes unnecessary metal, and reserves the required metal part, and the wavelength of the laser can select ultraviolet, visible or infrared laser according to different metals.
7. The method of claim 1, wherein the method comprises sputtering and laser etching a three-dimensional material to form a circuit and an antenna, wherein the method comprises: if the requirements of excessive current, low-frequency transmission and the like exist, an electrode can be added on the surface of the metal layer obtained in S2, the thickness of the copper layer is increased through electroplating, the thickness of the copper layer can reach 20 micrometers, and the layer is mainly used for conducting current and realizing the electrical property or the radio frequency property of the product.
8. The method of claim 1, wherein the method comprises sputtering and laser etching a three-dimensional material to form a circuit and an antenna, wherein the method comprises: if a surface soldering process is required, it can be performed by tin plating, gold plating, etc., wherein the thickness of the metal layer can reach 20 μm at the maximum, and the main purpose of this layer is solderability and protection of the metal layer 3.
9. The method of claim 1, wherein the method comprises sputtering and laser etching a three-dimensional material to form a circuit and an antenna, wherein the method comprises: according to the reliability requirements of different products, the surface of the product can be protected by spraying paint on the surface of the product after the S4 process when needed, and the contact points are subjected to metal layer protection treatment to achieve the effects of corrosion resistance and friction resistance, and the main purpose of the layer is to strengthen the protection of the metal layers 2 and 3 and avoid the oxidation and corrosion of the metal layers.
10. A product manufactured by the method for manufacturing the circuit and the antenna on the surface of the three-dimensional material by sputtering and laser etching as described in any one of claims 1 to 9, wherein: the method can be used in the fields of circuit manufacturing and antenna manufacturing of common electronic products, circuit manufacturing of base station antennas and oscillators and the like.
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Cited By (3)
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| CN112436271A (en) * | 2020-11-17 | 2021-03-02 | 常州仁千电气科技股份有限公司 | Production process of 5G antenna oscillator |
| CN113488765A (en) * | 2020-12-16 | 2021-10-08 | 昆山联滔电子有限公司 | Laser direct forming method for spraying medium paint |
| CN115556500A (en) * | 2022-09-21 | 2023-01-03 | 苏州海明包装科技有限公司 | Electroplating laser etching process for composite PETG material injection molding product |
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