CN104955281A - Method for manufacturing or repairing stereoscopic circuit on surface of three-dimensional high polymer material - Google Patents
Method for manufacturing or repairing stereoscopic circuit on surface of three-dimensional high polymer material Download PDFInfo
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- CN104955281A CN104955281A CN201510418346.8A CN201510418346A CN104955281A CN 104955281 A CN104955281 A CN 104955281A CN 201510418346 A CN201510418346 A CN 201510418346A CN 104955281 A CN104955281 A CN 104955281A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
Abstract
The invention provides a method for manufacturing or repairing a stereoscopic circuit on the surface of a three-dimensional high polymer material. The method comprises the following steps: covering the surface of the high polymer material with a layer of solid powder according to circuit diagram location designed in advance by using a synchronous powder feeding technology; at the same time, processing areas covered with metal or metal compounds through laser so as to improve the roughness of the processed areas on the surface of the high polymer material, and meanwhile, introducing or embedding the metal or the metal compounds to the areas processed by the laser; putting the high polymer material into a chemical plating solution for chemical plating so as to obtain a stereoscopic circuit board. The method provided by the invention is simple in process step, high in efficiency, low in cost, high in flexibility degree, and high in precision, three-dimensional wiring is realized easily, the obtained conductive circuit is good in conductivity and high in binding force with a base body, the used high polymer material does not have platability, and does not have special requirements for a mould forming process and specific electronic paste is also not required.
Description
Technical field
The invention belongs to the making field of stereoscopic circuit board, more precisely, relate to a kind of in three-dimensional polymer surface making or the technology of repairing stereo circuit.
Background technology
In recent years, along with the fast development of electronics industry and the extensive use of macromolecular material, polymer surface local selective metallization has attracted increasing concern in the making of electronic device, the field such as reparation and encapsulation.Electric equipment products continues the development to directions such as digitlization, lightweight, small lot, flexibility, multifunction, intellectuality, high reliability, low energy consumption, further promotes at polymer surface making and the rapid advances repairing conducting wire technology.
Traditional polymer surface local metallization technology, as injected complex technique, hot press printing technology and traditional print circuit plates making technology etc., usually there is the shortcomings such as complex manufacturing technology, raw material loss is large, environmental pollution is serious, and the requirement of the manufactures such as small lot, high accuracy and flexibility can not be met.For this reason, domestic and international researcher attempts one after another high for flexibility degree, be applied to surface of polymer material three-dimensional conductive circuit without the need to the laser processing technology of mask making with in repairing.
Three dimensional mold interconnecting device (three dimensional molded interconnect devices, 3D-MID), refer to have the moulded component of mechanical function as substrate, by at the direct arranging electronic circuit of piece surface, being coupled together by discrete electronic component at three dimensions, is the device of an organic whole by machinery and the function i ntegration of electronics.3D-MID technology can by the function i ntegration such as support, protection of the electric interconnection function of common circuit board, the supporting function of components and parts and plastic casing on a device, form circuit carrier that is three-dimensional, that integrate dynamo-electric function, its application relates to automobile, communication, household appliances etc., and also has development prospect widely in medical field.The technical process of 3D-MID can be divided into injecting forming structure part, generate assembling three part of metallic circuit and electronic devices and components.Wherein, the generating mode of metallic conduction circuit is the research emphasis of academia always.As laser three-D circuit straight forming technology (the Laser Direct Structuring that German LPKF D. O. O. develops, LDS) development in recent years is very rapid, its core process is by a kind of plastics batch mixing and laser activation metal component compound that some are special, be injection molded into and there is thermoplastic processed element, when this component exposure is in laser, this laser activation metal component will be broken down into elemental metals (as copper, palladium, nickel or its mixture etc.) and remaining organic substance tissue, meanwhile, in the position of laser beam flying, the rough surface containing elemental metals particle can be left, these metallic particles using in follow-up chemical plating process as catalytic active center, deposit thickness on circuit is finally made to be the coated metal of 5 ~ 8 μm.The advantage of this technology is that technique is convenient, reliable, and laser beam directly can be write according to cad data, and production process flexibility degree is high, and at present, this technology realizes commercialization, and has successfully produced the products such as hearing aids, car antenna, antenna for mobile phone.But this technology also exists obvious shortcoming, namely this technology must adopt the particular plastic with LDS performance, expensive, and has only used the laser activation metal component on moulding surface, causes the waste of most of activated metal.
Patent documentation (patent No.: ZL200810197225.5) also discloses a kind of laser direct-writing and micro-melting and coating technique of utilizing and makes and repair the method for conductive circuit of three dimensional mold interconnecting device.Its general principle directly writes technique for utilizing micro-pen or micro-spray, or the mode such as spraying, mask plate silk screen printing, according to designed line pattern, at the electric slurry that molded structural member surface preset one deck 0.1 ~ 50 μm is thick, after low temperature drying slurry organic solvent, adopt infrared laser (as ND:YAG laser and CO2 laser etc.) along the track irradiation pulp layer of electric slurry again, form the preliminary profile of conductive circuit pattern, then rely on chemical plating process to form the conducting wire with high-bond and superior electrical conductivity, resistance to wear, oxidative resistance and corrosion resistance.Utilize this kind of technology can produce metallic circuit respectively on tens kinds of polymeric matrixs such as polystyrene (PS), polyethylene (PE), polypropylene (PP), polyimides (PI), and to basis material without platability requirement, can prepare and repair various complicated conducting wire fast, flexibility degree is high.But the major defect of the method is that working (machining) efficiency is low, is difficult to making in enormous quantities; In addition, infrared laser can cause certain damage to matrix itself, and when its heat affected area can cause subsequent chemistry to be plated, the selectivity of figure reduces; And electric slurry is as the requisite raw material of this method, also have impact on the range of application of this technology.
In laser-induced deposition technical field, laser-induced chemical gas phase deposition technology at multiple deposited on substrates various metals, but can need vacuum condition, and equipment manufacturing cost is expensive, and gas toxicity is large; The shortcoming of induced with laser solid precipitation technology is that depositing electrically conductive lines are thinner, in uneven thickness, poor with basal body binding force; The advantages such as laser-induced chemical liquid-phase deposition technique has simple to operate, and technological process is few, but also there is the too thin shortcoming of plated metal layer thickness.
About laser induction chemical plating technology, its key is how to utilize laser technology to produce catalytic active center according to the line pattern of design at matrix surface desired zone, and then forms conducting wire after chemical plating.Around how to form catalytic active center, researcher proposes serial of methods, as (Appl.Phys.Lett. such as H.Niino, 1993, vol.63, pp.3527-3529:surface modification and metall ization of fluorocarbon polymers by excimer laser processing) in hydrazine atmosphere, first surface modification is carried out to polytetrafluoroethylene (PTFE) and fluorinated ethylene propylene copolymer (FEP), introduce amino, and then sensitization, activation, finally realize chemical plating, but this process is comparatively complicated, the people such as G.A.Shafeev (Appl.Surf.Sci.1999, vol.138-139, pp.455-460:Light-enhanced electroless Cudeposition on laser-treated polyimide surface) proposition Ar+ laser carries out radiation to PI material, defect, crackle, free radical etc. that irradiated area produces can become catalytic active center, and then realize electroless copper, but the binding force of cladding material that this method obtains is difficult to ensure, the people such as the Chen Hengwu of Zhejiang University (number of patent application: 200510050716.3) propose using low pressure mercury lamp as radiation source, by quartz/chromium plate mask to PC surface local selective light chemical modification, the carboxyl produced in light area is afterwards by the silver ammino ion in direct Adsorption For Ag ammonia solution, the reduction of the reducing agent in chemical plating fluid, silver ammino ion is reduced into metal A g, form catalytic active center thus, and then optionally prepare gold microelectrode at PC surface local.This method take low pressure mercury lamp as light source, and equipment is simple, is easy to operation, but has mask plate owing to adopting, and be therefore suitable only for making that is two-dimentional, simple conductive circuit pattern, and fabrication cycle is long, flexibility degree is low.
Summary of the invention
An object of the present invention is to provide a kind of new solution making or repair the method for stereo circuit at three-dimensional polymer surface.
According to a first aspect of the invention, provide a kind of method making stereo circuit at three-dimensional polymer surface, comprise the following steps:
A, utilize synchronous powder feeding system technology, cover last layer metal in the line pattern position that polymer surface designs in advance or/and the pressed powder of metallic compound;
B, meanwhile, utilizes laser to carry out processing process to the region covering pressed powder, to improve the roughness of area to be machined on polymer surface, and simultaneously by metal or/and in the region that is lasered of metallic compound introducing or be embedded into;
C, above-mentioned macromolecular material put in chemical plating fluid and carries out chemical plating, can stereoscopic circuit board be obtained.
Preferably, described pressed powder is simple substance, compound and/or the mix powder containing at least one in element palladium, silver, platinum, gold, nickel, copper, zinc, aluminium, tin, chromium, iron.
Preferably, the particle diameter of described pressed powder is 5nm ~ 100 μm.
Preferably, the thickness of described solid powder last layer is 10nm ~ 100 μm.
Preferably, described macromolecular material is at least one in isoprene rubber, butadiene-styrene rubber, Merlon, poly-titanate esters, polybutylene terephthalate (PBT), polymethyl methacrylate, liquid crystal polymer, nylon, acrylonitrile-butadiene-styrene (ABS) plastics, vinyon, polystyrene plastics, polystyrene-acrylonitrile plastics, polypropylene plastics, PC-glass fiber compound material, epoxy-fiberglass composite material, Melamine-glass fiber compound material.
Preferably, at described step b) and step c) between, also comprise and the surface of macromolecular material is cleaned, so that the pressed powder of excessive residual is washed.
A kind of method making stereo circuit at three-dimensional polymer surface provided by the invention, first on macromolecular material, layer of metal is covered or/and metallic compound, by laser to improve the roughness on processed surface, in order to strengthen the bond strength between next step electroless deposited metal and basis material; By laser specific metallic element introduced simultaneously and be embedded into these positions, metallic element and macromolecular material being combined firm, can as the catalytic active center of next step chemical plating; The processing step of this method is simple, efficiency is high, with low cost, flexibility degree is high, precision is high, easily realize three dimensional wiring, the conducting wire good conductivity obtained, with basal body binding force high, and the macromolecular material used self does not have platability, to molding process planning without particular/special requirement, do not need specific electric slurry yet yet.
Process of the present invention, also has the following advantages:
(1) compared with the LDS technology of LPKF D. O. O., to the molding process planning of used macromolecular material without particular/special requirement, such three dimensional mold interconnecting device material cost will reduce greatly;
(2) formed compared with the method for conducting wire with utilizing infrared, the micro-cladding electric slurry of Submillineter Wave Technology and then chemical plating, the present invention does not need the specific electric slurry of outsourcing, does not need silk screen printing yet, finely straightly to write or the preset electric slurry layer of micro-spray;
(3) by the application of synchronous powder feeding system technology in process, while covering powder, utilize laser to be embedded into the surface of macromolecular material, make it possible to adopt pressed powder to cover on the 3 D stereo surface of macromolecular material.
The present inventor finds, in the prior art, realize the complex process of stereo circuit method, cost is high, and fabrication cycle is long, weak effect.Therefore, the technical assignment that the present invention will realize or technical problem to be solved are that those skilled in the art never expect or do not anticipate, therefore the present invention is a kind of new technical scheme.
Embodiment
To describe now various exemplary embodiment of the present invention in detail.It should be noted that: unless specifically stated otherwise, otherwise positioned opposite, the numerical expression of the parts of setting forth in these embodiments and step and numerical value do not limit the scope of the invention.
Illustrative to the description only actually of at least one exemplary embodiment below, never as any restriction to the present invention and application or use.
May not discuss in detail for the known technology of person of ordinary skill in the relevant, method and apparatus, but in the appropriate case, described technology, method and apparatus should be regarded as a part for specification.
In all examples with discussing shown here, any occurrence should be construed as merely exemplary, instead of as restriction.Therefore, other example of exemplary embodiment can have different values.
The invention provides in three-dimensional polymer surface making or the method for repairing stereo circuit, the steps include:
Such as under the cooperation of linkage work-table and synchronous powder feeding system device, last layer metal can be covered in the line pattern position that polymer surface designs in advance or/and metallic compound pressed powder; Utilize synchronous powder feeding system technology, while covering pressed powder, utilize laser, by laser galvanometer (or dynamic focusing mirror), processing process is carried out to these positions; The roughness on processed surface will significantly increase, in order to strengthen the bond strength in next step chemical deposit between metal and basis material; Metal or metallic compound are introduced into and are embedded into these positions, as the catalytic active center of next step chemical plating simultaneously;
Such as by a synchronization feeding device, cover or coating layer of metal, metallic compound at polymer surface, meanwhile, utilize laser aid to carry out processing process to these positions, make introducing and the embedding that can realize fixing powder at the three-dimensional surface of macromolecular material.
The surface of cleaning macromolecular material, cleans up the metal of excessive residual or metallic compound; Cleaned macromolecular material is put into chemical plating fluid and implements chemical plating, can stereoscopic circuit board be obtained.
Preferably, described pressed powder is simple substance, compound and/or the mix powder containing at least one in element palladium, silver, platinum, gold, nickel, copper, zinc, aluminium, tin, chromium, iron.The particle diameter of preferred described pressed powder is 5nm ~ 100 μm.The thickness that preferred described pressed powder covers is 10nm ~ 100 μm.Described macromolecular material is at least one in isoprene rubber, butadiene-styrene rubber, Merlon, poly-titanate esters, polybutylene terephthalate (PBT), polymethyl methacrylate, liquid crystal polymer, nylon, acrylonitrile-butadiene-styrene (ABS) plastics, vinyon, polystyrene plastics, polystyrene-acrylonitrile plastics, polypropylene plastics, PC-glass fiber compound material, epoxy-fiberglass composite material, Melamine-glass fiber compound material.
Embodiment 1
Under the cooperation of linkage work-table and synchronous powder feeding system device, cover last layer silver nitrate powder in the line pattern position that Merlon (polycarbonate, PC) material surface designs in advance; Meanwhile, utilize laser, by laser galvanometer, processing process is carried out to these positions; The surface of cleaning material afterwards, by clean for the powder cleaning of excessive residual; Cleaned workpiece is put into chemical plating fluid and implement electroless copper, nickel, silver and/or golden, can conducting wire be obtained.The conductive line surfaces of gained is continuous, even, the defect such as pore-free, crackle, good conductivity, and high with substrate combinating strength.
Embodiment 2
Under the cooperation of linkage work-table and synchronous powder feeding system device, cover last layer palladium bichloride powder in the line pattern position that styrene-butadiene-acrylonitrile (ABS) frosting designs in advance; Meanwhile, utilize laser, by dynamic Laser focus lamp, processing process is carried out to these positions; Clean the surface of plastics afterwards, by clean for the powder cleaning of excessive residual; Cleaned workpiece is put into chemical plating fluid and implement electroless copper, nickel, silver and/or golden, can conducting wire be obtained.The conductive line surfaces of gained is continuous, even, the defect such as pore-free, crackle, good conductivity, and good with basal body binding force.
Embodiment 3
Under the cooperation of linkage work-table and synchronous powder feeding system device, the line pattern position designed in advance on PC-glass fiber material surface covers last layer silver oxide powder; Meanwhile, utilize laser, by laser galvanometer, processing process is carried out to these positions; Clean the surface of plastics afterwards, by clean for the powder cleaning of excessive residual; Cleaned workpiece is put into chemical plating fluid and implement electroless copper, nickel, silver and/or golden, can conducting wire be obtained.The conductive line surfaces of gained is continuous, even, the defect such as pore-free, crackle, good conductivity, and good with basal body binding force.
Embodiment 4
Under the cooperation of linkage work-table and synchronous powder feeding system device, cover last layer argent powder in the line pattern position that epoxy resin-glass fiber material surface is designed in advance; Meanwhile, utilize laser, by dynamic Laser focus lamp, processing process is carried out to these positions; Clean the surface of plastics afterwards, by clean for the powder cleaning of excessive residual; Cleaned workpiece is put into chemical plating fluid and implement electroless copper, nickel, silver and/or golden, can conducting wire be obtained.The conductive line surfaces of gained is continuous, even, the defect such as pore-free, crackle, good conductivity, and high with substrate combinating strength.
Embodiment 5
Under the cooperation of linkage work-table and synchronous powder feeding system device, cover last layer metallic nickel powder in the line pattern position that PC material surface designs in advance; Meanwhile, utilize laser, by dynamic Laser focus lamp, processing process is carried out to these positions; Clean the surface of plastics afterwards, by clean for the powder cleaning of excessive residual; Cleaned workpiece is put into chemical plating fluid and implement electroless copper, nickel, silver and/or golden, can conducting wire be obtained.The conductive line surfaces of gained is continuous, even, the defect such as pore-free, crackle, good conductivity, and high with substrate combinating strength.
Embodiment 6
Under the cooperation of linkage work-table and synchronous powder feeding system device, the line pattern position designed in advance on ABS surface covers last layer metal platinum powder; Meanwhile, utilize laser, by laser galvanometer, processing process is carried out to these positions; Clean the surface of plastics afterwards, by clean for the powder cleaning of excessive residual; Cleaned workpiece is put into chemical plating fluid and implement electroless copper, nickel, silver and/or golden, can conducting wire be obtained.The conductive line surfaces of gained is continuous, even, the defect such as pore-free, crackle, good conductivity, and high with substrate combinating strength.
Embodiment 7
Under the cooperation of linkage work-table and synchronous powder feeding system device, cover last layer gold trichloride powder in the line pattern position that epoxy resin-glass fiber material surface is designed in advance; Meanwhile, utilize laser, by dynamic Laser focus lamp, processing process is carried out to these positions; Clean the surface of plastics afterwards, by clean for the powder cleaning of excessive residual; Cleaned workpiece is put into chemical plating fluid and implement electroless copper, nickel, silver and/or golden, can conducting wire be obtained.The conductive line surfaces of gained is continuous, even, the defect such as pore-free, crackle, good conductivity, and high with substrate combinating strength.
Embodiment 8
Under the cooperation of linkage work-table and synchronous powder feeding system device, the line pattern position designed in advance on PC-glass fiber material surface covers last layer metallic copper powder; Meanwhile, utilize laser, by laser galvanometer, processing process is carried out to these positions; Clean the surface of plastics afterwards, by clean for the powder cleaning of excessive residual; Cleaned workpiece is put into chemical plating fluid and implement electroless copper, nickel, silver and/or golden, can conducting wire be obtained.The conductive line surfaces of gained is continuous, even, the defect such as pore-free, crackle, good conductivity, and high with substrate combinating strength.
Embodiment 9
Under the cooperation of linkage work-table and synchronous powder feeding system device, the line pattern position designed in advance on ABS surface covers last layer metallic zinc powder; Meanwhile, utilize laser, by laser galvanometer, processing process is carried out to these positions; Clean the surface of plastics afterwards, by clean for the powder cleaning of excessive residual; Cleaned workpiece is put into chemical plating fluid and implement electroless copper, nickel, silver and/or golden, can conducting wire be obtained.The conductive line surfaces of gained is continuous, even, the defect such as pore-free, crackle, good conductivity, and high with substrate combinating strength.
Embodiment 10
Under the cooperation of linkage work-table and synchronous powder feeding system device, cover last layer metallic aluminium powder in the line pattern position that epoxy resin-glass fiber material surface is designed in advance; Meanwhile, utilize laser, by dynamic Laser focus lamp, processing process is carried out to these positions; Clean the surface of plastics afterwards, by clean for the powder cleaning of excessive residual; Cleaned workpiece is put into chemical plating fluid and implement electroless copper, nickel, silver and/or golden, can conducting wire be obtained.The conductive line surfaces of gained is continuous, even, the defect such as pore-free, crackle, good conductivity, and high with substrate combinating strength.
Although be described in detail specific embodiments more of the present invention by example, it should be appreciated by those skilled in the art, above example is only to be described, instead of in order to limit the scope of the invention.It should be appreciated by those skilled in the art, can without departing from the scope and spirit of the present invention, above embodiment be modified.Scope of the present invention is limited by claims.
Claims (6)
1. make a method for stereo circuit at three-dimensional polymer surface, it is characterized in that, comprise the following steps:
A, utilize synchronous powder feeding system technology, cover last layer metal in the line pattern position that polymer surface designs in advance or/and the pressed powder of metallic compound;
B, meanwhile, utilizes laser to carry out processing process to the region covering pressed powder, to improve the roughness of area to be machined on polymer surface, and simultaneously by metal or/and in the region that is lasered of metallic compound introducing or be embedded into;
C, above-mentioned macromolecular material put in chemical plating fluid and carries out chemical plating, can stereoscopic circuit board be obtained.
2. method according to claim 1, is characterized in that: described pressed powder is simple substance, compound and/or mix powder containing at least one in element palladium, silver, platinum, gold, nickel, copper, zinc, aluminium, tin, chromium, iron.
3. method according to claim 1, is characterized in that: the particle diameter of described pressed powder is 5nm ~ 100 μm.
4. method according to claim 1, is characterized in that: the thickness of described solid powder last layer is 10nm ~ 100 μm.
5. method according to claim 1, is characterized in that: described macromolecular material is at least one in isoprene rubber, butadiene-styrene rubber, Merlon, poly-titanate esters, polybutylene terephthalate (PBT), polymethyl methacrylate, liquid crystal polymer, nylon, acrylonitrile-butadiene-styrene (ABS) plastics, vinyon, polystyrene plastics, polystyrene-acrylonitrile plastics, polypropylene plastics, PC-glass fiber compound material, epoxy-fiberglass composite material, Melamine-glass fiber compound material.
6. method according to claim 1, is characterized in that: at described step b) and step c) between, also comprise and the surface of macromolecular material is cleaned, so that the pressed powder of excessive residual is washed.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110785018A (en) * | 2018-07-31 | 2020-02-11 | 精工爱普生株式会社 | Wiring board and method for manufacturing wiring board |
| CN110798990A (en) * | 2019-11-22 | 2020-02-14 | 广东工业大学 | Repair method of fine circuit |
| TWI693002B (en) * | 2017-12-18 | 2020-05-01 | 大陸商上海微電子裝備（集團）股份有限公司 | Additive manufacturing device and manufacturing method |
| CN114050422A (en) * | 2021-10-30 | 2022-02-15 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Self-repairing method for phased array antenna micro-system integrated packaging structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI693002B (en) * | 2017-12-18 | 2020-05-01 | 大陸商上海微電子裝備（集團）股份有限公司 | Additive manufacturing device and manufacturing method |
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| CN110798990A (en) * | 2019-11-22 | 2020-02-14 | 广东工业大学 | Repair method of fine circuit |
| CN110798990B (en) * | 2019-11-22 | 2020-06-09 | 广东工业大学 | Repair method of fine circuit |
| CN114050422A (en) * | 2021-10-30 | 2022-02-15 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Self-repairing method for phased array antenna micro-system integrated packaging structure |
| CN114050422B (en) * | 2021-10-30 | 2023-07-11 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Self-repairing method for integrated package structure of phased array antenna microsystem |
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| CN104955281B (en) | 2018-01-16 |
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