CN101394710A - Manufacturing and repairing method for conductive circuit of three dimensional mold interconnecting device - Google Patents
Manufacturing and repairing method for conductive circuit of three dimensional mold interconnecting device Download PDFInfo
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Abstract
The invention discloses a method for manufacturing and repairing a three-dimensional molding interconnection device conductive line. The method comprises the following steps: (1) depositing a 0.1-50 micrometer thick prearranged sizing agent layer of a conductive sizing agent on the surface of a molding structural element according to the design configuration of a conductive line; (2) baking or airing the prearranged layer of the conductive sizing agent, and removing an organic solvent thereof; (3) utilizing a laser beam to irradiate the prearranged sizing agent layer so as to enable metal conductive particles in the sizing agent to be melted and mixed with a 5-500mum thin layer of the surface of a plastic matrix, and the metal conductive particles in the sizing agent to be embedded in the surface of the matrix, thereby obtaining a conductive pattern; and (4) conducting chemical plating of 2-10mum copper on the surface of the conductive pattern, and then conducting chemical plating of 1-3mum anticorrosion metal. By the method, various complex conductive lines can be quickly and directly manufactured or repaired on the surface of three-dimensional molding structural member of various plastic matrix. No platability is required for base materials or no special requirement is needed for the molding technical. The invention has the advantages of simple process, environment-friendliness, low cost and high flexibility.
Description
Technical field
The invention belongs to the making recovery technique field and the laser fine processing technique field of conducting wire, relate to a kind of making and restorative procedure of conductive circuit of three dimensional mold interconnecting device.Specifically, be making and the reparation that the little melting and coating technique of laser is used for three dimensional mold interconnecting device surface interconnection circuit.
Background technology
Three dimensional mold interconnecting device (Three-dimensional moulded interconnect device, 3D-MID), be meant on molded plastic casing, be manufactured with lead, the figure of electric function, thereby functions such as the support of the function of the electric interconnection function of common circuit board, supporting components and parts and plastic casing, protection are implemented on the device, form circuit carrier three-dimensional, that integrate dynamo-electric function, its application comprises automobile, communication, household appliances, in medical field vast potential for future development is arranged also.Molded and other correlation technique of producing 3D-MID is called as the 3D-MID technology.In general, present 3D-MID production technology comprises two steps: the manufacturing of molded structural member (circuit carrier) and the assembling of discrete electronic devices and components on the circuit carrier.Wherein, the manufacturing of first step molded structural member (circuit carrier) comprises two subprocess: 1) molded structural member moulding; 2) the interconnect conductive circuit generates, and promptly obtains needed metallic conduction circuit on the constitutional detail surface.
Existing 3D-MID manufacturing process mainly contains following several:
(1) secondary bi-component injection, but cardinal principle is through injection moulding plated resin successively and can not plated resin, to produce the molded structure part, generates the conducting wire through surface catalysis activation processing and plating then.This method spatial design degree of freedom is big, with short production cycle, be fit to produce in enormous quantities, uses very extensively at present, but base material cost height, equipment and mold investment are big, and be little to the adaptability (flexibility) of line map design variation.
(2) hot padding method, cardinal principle are to lay metal forming on plastic substrate, and hot padding makes design position, conducting wire and plastic substrate bonding then, removes unnecessary metal forming at last, forms required conducting wire.This method weak point process time, plastic matrix material are selected wide, but the 3 D auto degree is less, only are suitable for producing the comparatively simple 3D-MID of circuit.
(3) injection composite algorithm, cardinal principle is to make plastic film or the sheet material that has line pattern in advance, be placed in the injection molding after, carry out injection moulding again, finish composite steps simultaneously.Laggard row metalization of the demoulding and reprocessing are to form product.By injecting compound some large-scale integrated parts of producing, for example door-plate of automobile and center pillar etc., but because the cause of its processing method is restricted the three-dimensional structure design can not be used for the product of production structure complexity.
Along with the plastic electronic product to miniaturization, lightweight, high density, low cost and small lot, variation, the environmental protection direction develops, above 3D-MID manufacturing process technology exists some shortcomings: at first be that the molded structural member base material with platability costs an arm and a leg, as plating plastics in order to obtain, secondary bi-component injection is everlasting and is added precious metal such as palladium (Pd) in the plastics, gold (Au) obtains so-called catalytic activation platability plastics (LCP-Pd or LCP-Au), except adding element Pd, Au's is expensive, it is very expensive especially that this catalytic activation can plate the used catalyst of plastics, though secondary bi-component injection is particularly suitable for producing the miniature parts with fine structure, final 3D-MID product cost is higher.Next is that complex process, flexibility degree are low, and as injection composite algorithm, hot padding method, its mold design and manufacturing cycle are long, and the circuit precision is not high, can not be satisfied with high accuracy, small lot and diversified production demand.
In order to address the above problem, the researcher constantly makes great efforts to attempt the laser direct-writing process technology of highly flexibleization is applied to the manufacturing of 3D-MID always both at home and abroad.Laser ablation technology at first is widely studied, its cardinal principle is through catalytic activation with the injection-moulded part surface, and then make in conjunction with chemical plating and electroplating technology and to cover the copper layer, be coated with corrosion inhibitor at the copper layer then, utilize laser ablation corrosion inhibitor layer method to generate conductive pattern, the final etching copper-clad plate is to generate required conducting wire.This laser etching method has two major advantages, and the one, can make very fine circuit, minimum feature can reach 20～50 microns; The 2nd, change line design easily, be suitable for the production of small lot batch manufacture or complicated circuit.Process cycle is long, the shortcoming of not environmental protection but this method also exists, and requires base material to have platability equally, and cost height, material are selected limited.Another is laser direct forming method (the LaserDirect Structuring of German LPKF D. O. O. exploitation, LDS), basic principle is that to adopt the plastics be added with certain non-conductive organic metal compound be raw material, directly laser beam irradiation on the moulding surface, but the part chemical deposition metal of illuminated mistake is made 3D-MID at last.This method adopts common one pack system Shooting Technique, and technology is simple and direct, reliable, and laser beam is directly write according to cad data, production process flexibility degree height.Shortcoming is to adopt the plastics with LDS performance, so raw material must buy from designated company, and cost is higher.
In addition, several very promising circuit production technique of making the field broad research at rapid prototyping in recent years also merits attention.As the miniature straight deposition technique (seeing United States Patent (USP): " Carl E; Dr umheller.Inking System for Producing Circuit Patterns.United States; United States Patent; 4485387; 1984. " and Chinese patent: " a kind of directly write the miniature pen of electronics/photoelectron element and by its device that constitutes ") of writing, micro nozzle is directly write deposition technique and (is seen patent documentation CN1876244, " a kind of electronic device for direct slurry atomization and deposition ") and no mask mesoscale material deposition (M3D) technology (see " Maskless mesoscale material deposition ", Bruce King.Electronic Package and Production, 2003:18-20).The principle that miniature pen (Micropen) is directly write wiring is to utilize gas or fluid pressure to force miniature the fluent material in the chamber to be squeezed out written aperture, moves the conductor material rete that deposits predetermined pattern on substrate along with nib.The principle that micro nozzle is directly write wiring and do not had a mask mesoscale material deposition technique is similar with miniature, different is its material mode of movement, be that fluent material at first forms the aerosol mixture through the atomizing back specifically, then by nozzle system with it to spray than low velocity and to deposit on the substrate, on substrate, deposit the conductor material rete of predetermined pattern.The post-depositional conductive film layer of above method all needs follow-up sintering curing operation to obtain excellent conducting performance.These several direct writing technologies are owing to need not advantages such as mask, the cycle is short, stock utilization is high, environmental pollution is little, and development in recent years is very rapid.
2002, the Central China University of Science and Technology once knew people such as wild goose and had proposed the method (seeing patent documentation CN1395462, " a kind of circuit board making and restorative procedure ") that a kind of laser scanning electric slurry rete is realized circuit board making and reparation.Its basic principle is: at first utilize sol evenning machine, miniature pen or micro nozzle to preset the electric slurry rete of 3-100 micron on substrate, organic solvent is wherein removed in oven dry; Utilize laser beam by the track scanning initialization layer of setting then, be scanned on the track bonding solidifying in the electric slurry or fusing-solidify, make the conductive phase bonding in the electric slurry, form electronic component; Clean at last and remove the not initialization layer of sweep test.This method technology is simple, and therefore the reliability height can satisfy the demand that high accuracy is directly write.Yet, this laser direct-writing electric slurry method only depends on laser heat action that the bonding phase remelting in the electric slurry is solidified, and various compositions are bonded together form the conducting wire, the performance of substrate own does not change substantially in this technical process, only depend on the cementation of bonding phase that the function lead is bonding on substrate, therefore the adhesive force of conductive layer and substrate is not strong, and resistance to wear is not high.
Summary of the invention
The object of the invention aims to provide a kind of making and restorative procedure of conductive circuit of three dimensional mold interconnecting device, it can directly prepare or repair the conducting wire of various complexity fast on the three dimensional mold structural member surface of various plastic basis materials, basis material there is not the platability requirement, molding process planning there is not specific (special) requirements, technology is simple, environmental friendliness, cost is low, the flexible degree height.
For achieving the above object, the making of the conductive circuit of three dimensional mold interconnecting device of the present invention's proposition and the step of restorative procedure are:
(1) according to the design configuration of conducting wire, electrocondution slurry is deposited the pulp layer that presets of 0.1～50 micron thickness on the molded structural member surface, contain the required activated metal element of chemical plating process in this electrocondution slurry;
(2) solvent in the removal electrocondution slurry initialization layer;
(3) utilize laser beam irradiation to preset pulp layer, make the low melting point in the electrocondution slurry become fractional melting or vaporization, the thin layer of molded structural member surface 5～500 μ m is also melted, and conducting metal particles sinks and is partially mixed with the frosting generation in the molded structural member; After laser beam was removed, molten plastic rapid solidification, conducting metal particles partly sank and imbed molded structural member, made conductive layer particle and molded structural member surface combination, obtained the preliminary profile of conductive pattern layer;
(4) carrying out chemical plating one layer thickness on above-mentioned conductive pattern surface is the copper of 2～10 μ m, and then to carry out chemical plating one layer thickness be the corrosion resistant metal of 1～3 μ m.
The present invention proposes to utilize the little cladding electrocondution slurry of laser directly to make or repair the conducting wire in conjunction with the method for chemical plating on three dimensional mold interconnecting device first.Its core key is, when adopting laser irradiation to handle, pass through controlling laser process parameters, make in the laser action process, low melting point bonding phase and surface of plastic matrix thin layer in the electrocondution slurry melt, and dystectic conductive phase granule mixes with plastic matrix material mutually mutually with the low melting point bonding.After laser action stopped, solidifying rapidly on the surface, makes strong bonded between electrocondution slurry rete and the plastic substrate, and the heeling-in of metallic conduction phase particle is gone in the plastic substrate, forms the conducting wire.This circuit plays the effect of " grain of crystallization " simultaneously also as chemical plating activated metal layer in chemical-copper-plating process subsequently, finally rely on the metallochemistry depositing process further to improve the conductivity of conductive path.Technologies such as plated metal nickel after this then are in order to improve the oxidation resistance of conductive layer.
Compared with prior art, the inventive method has following basic characteristics:
(1) with secondary bi-component injection, injection composite algorithm or laser direct forming method existing three dimensional mold interconnecting device manufacturing process such as (LDS) are compared, the inventive method does not have the platability requirement to basis material, common three dimensional mold interconnecting device basis material all can use, moulding process to molded structural member does not have specific (special) requirements, common plastic shaping processing technology such as compression moulding (compression molding), extrusion molding (extrusion molding), injection moulding (injection moulding), blowing (hollow molding), calendering etc. all can be used, therefore the material cost of three dimensional mold interconnecting device reduces greatly, do not need corrosive agent, environmental friendliness.
(2) the inventive method adopts the method that presets the electrocondution slurry rete to realize conductive pattern, both can adopt the miniature pen or the micro nozzle of highly flexibleization directly to write the material deposition technique, the three dimensions track of the conductive pattern that electrocondution slurry is set along CAD is directly write and is deposited on the molded structural member matrix surface, be fit to very much mass customized production, also can adopt brushing of conductive pattern mask plate or spraying method that electrocondution slurry is preset in matrix surface, cost is low, efficient is high, adapts to produce in enormous quantities.
(3) compare with the method for existing laser direct-writing electric slurry method realization circuit board making and reparation, the inventive method adopts laser little cladding heeling-in activated metal layer and makes the conducting wire in conjunction with the technology of chemical plating, though all there is laser radiation to preset the operation of pulp layer, intension is also inequality.In the laser action process, the laser direct-writing electric slurry is owned by France, and itself does not change substrate in the LASER HEAT principle of solidification, only depend on the cementation of bonding phase to make conductive phase be connected with each other, so the adhesive force of conductive layer and substrate is not strong, and resistance to wear is good inadequately.And among the present invention by selecting suitable laser power scope, make in the laser action process, bonding phase and surface of plastic matrix in the electrocondution slurry melt-mix-setting effect, the heeling-in of metallic conduction phase particle is gone in the plastic substrate, the conductive traces that formation is made up of conducting particles, it is double as chemical plating activated metal (i.e. so-called " grain of crystallization " layer) simultaneously, finally thicken conductive layer, and form conductive path with high-adhesion and superior electrical conductivity, resistance to wear, oxidative resistance and corrosion resistance by chemical plating process.In addition, owing to preset pulp layer as heeling-in activated metal layer, thickness is thinner relatively, and does not have follow-up cleaning step, therefore more saves material, and the technology cost is also lower.
(4) prepared conducting wire size depends mainly on the craft precision that presets of electrocondution slurry rete, by regulating the composition and the rheological properties of nib or jet expansion diameter, electrocondution slurry, present miniature pen or micro nozzle are directly write and can be realized 20 microns～500 microns single track deposition width, and finish the conductive path deposition of bigger live width by multiple tracks deposition, can satisfy the trend that following three dimensional mold interconnecting device circuit develops toward high density, high accuracy direction fully.
Description of drawings
Fig. 1 is the schematic flow sheet of first kind of embodiment of the inventive method.
Fig. 2 is the schematic flow sheet of second kind of embodiment of the inventive method.
Embodiment
The inventive method utilizes little cladding electrocondution slurry of laser and chemical plating to make and repair the conducting wire on the three dimensional mold structural member.It utilizes miniature pen or little spray directly to write depositing operation, or mask plate is brushed or spraying method, electrocondution slurry is preset at the molded structural member matrix surface by the designed conductive pattern of CAD, behind the low temperature drying organic solvent, adopt laser beam irradiation electrocondution slurry rete, the heeling-in of metallic conduction phase particle is gone in the plastic substrate, and rely on chemical plating process to form conductive path with high-adhesion and superior electrical conductivity, resistance to wear, oxidative resistance and corrosion resistance.
Below the included step of the inventive method is described in further detail.
(1) presetting of three dimensional mold structural member conductive layer: the three dimensions track (comprising planar graph) that adopts miniature pen or minute nozzle that electrocondution slurry is set conductive pattern along the molded structural member cad data is directly write and is deposited on the member matrix surface, perhaps adopt brushing of conductive pattern mask plate or spraying method that electrocondution slurry is preset in the molded structural member matrix surface, preset 0.1～50 micron of slurry thicknesses of layers.
The main component of electrocondution slurry is good conductive metal powder and solvent, adds the bonding phase or adds organic binder matter for improving rheological properties for improving adhesive strength sometimes.Good conductive metal powder is metal dusts such as gold, copper, silver, nickel, aluminium, palladium, should contain the activated metal element in the conventional chemical copper-plating technique, and its powder diameter is 1nm～50 μ m.Inorganic and organic solvent two classes of the general branch of solvent, inorganic solvent mainly is a water, organic solvent can be alcohols and esters solvents such as terpinol, ethanol, acetate, tributyl citrate.Bonding is thermosetting polymer resin mutually, or softening temperature is that 200～450 ℃, its particle diameter are 0.01～10 micron flux powder, or fusing point is that 180～300 ℃, its particle diameter are 0.01～10 micron fusible metal powder; When being flux powder or fusible metal powder mutually, bonding also must add film forming matter.Film forming matter can be any or several mixing in celluloid, ethyl cellulose, vistanex, polyisobutene, polyvinyl alcohol, polyvinyl acetate and the poly-α-methyl styrene.
The inventive method can adopt various types of electrocondution slurries, is not limited to the kind that invention example part is given an example.
The inventive method molded structural member material category applicatory can be the material category that the whole bag of tricks adopted in the prior art, as polyethylene (PE, PET), polypropylene (PP), polystyrene series (PS, PPS), polyvinyl chloride (PVC), resin (ABS, POM, PBT), polyamide series (PA, PPA, PI), Merlon (PC), phenolic aldehyde serial plastic (PE, PET, PEI, PESU) or liquid crystal polymer (LCP) are not limited to specific material.
Existing method is confined to the molded structural member of injection moulding (injection moulding) method institute processing and forming usually, the molded structural member that the present invention was suitable for goes for various method for processing forming, comprises various method for processing forming such as compression moulding (compression molding), extrusion molding (extrusion molding), injection moulding (injection moulding), blowing (hollow molding), calendering.
(2) dry or dry the electrocondution slurry initialization layer, remove organic solvent wherein.
The bake out temperature of step (2) is lower than the heat resisting temperature of molded structural member, removes the organic solvent of electrocondution slurry.
(3) laser beam irradiation presets pulp layer, and the low melting point composition in the electrocondution slurry is melted rapidly, and the surface of plastic matrix thin layer also melts simultaneously, and bonding phase, conducting metal particles sink and mix with plastics.After laser beam is removed, the molten plastic rapid solidification, thus conducting metal particles is partly imbedded the plastic base surface, make conductive layer particle and plastic substrate strong bonded, obtain the preliminary profile of conductive pattern layer.These heeling-ins also are the activated metal layers of subsequent chemistry depositing process at the metallic conduction phase particle of matrix surface simultaneously;
The laser beam that uses is continuous wave laser or quasi-continuous pulse laser emitted laser bundle, regulate suitable laser power density according to electrocondution slurry/basis material combination, with the bonding solidifying in the electrocondution slurry after the laser irradiation or fusing-solidify, and the skin layer that 5～500 μ m take place plastic substrate is molten into foundation.By changing defocusing amount to obtain different single track laser scanning live widths, realize that the laser irradiation of thin wire or wide lead is handled, wideer regional pattern filling is then scanned by the multi-track overlapping mode to be finished.Sweep speed is generally selected between 0.5mm/s～100mm/s, corresponding laser power scope 1W～50W.
(4) chemical plating is handled, will heeling-in have the substrate of the conductive pattern of activated metal layer to put into the container that fills chemical copper plating solution by the laser irradiation effect, and temperature and other technological parameter of control container carry out electroless copper.After this, carry out anti-oxidation metal coatings such as chemical nickel plating, chromium or gold at once, form the conductive path that electric property and mechanical strength all meet the demands.
Chemical plating is handled and is adopted conventional chemical plating metal technology.Because the surface of molded structural member matrix itself does not have platability, therefore only preset pulp layer and heeling-in has the conductive pattern position of activated metal layer that chemical reaction could take place and deposits the copper layer by the laser irradiation processing having.After the laser treatment at first copper facing be in order to strengthen the electric conductivity of three-dimensional conductive pattern, thickness of coating can be regulated at 2～10 mu m ranges according to the technological requirement difference.Then, select corrosion resistant metal plating baths such as nickel plating, chromium or gold according to the concrete environment for use of three dimensional mold interconnecting device and performance requirement, carry out chemical plating, thickness 1～3 μ m of coating is to improve resistance to wear and oxidative resistance and ageing resistance.
Fig. 1 (a) and (b) and (c) shown in, adopt miniature pen or micro nozzle 2 electrocondution slurry to be deposited on the matrix surface of three dimensional mold spare 1, pulp layer 3 is preset in formation, and by low temperature drying or mode such as dry naturally make its drying, utilize laser beam 4 to carry out laser irradiation handles on three dimensional mold spare 1 surface, form conductive path 5, be treated as the conducting wire 6 that thickens through chemical plating again.
Fig. 2 (a) and (b) represent to adopt conductive pattern mask plate 2 to brush or spraying method is preset in the matrix surface of molded structural member 1 with electrocondution slurry, form and preset pulp layer 3, and Fig. 2 (c), (d) and Fig. 1 (b), (c) are identical.
For example the inventive method is described in further detail below.
The molded structural member that present embodiment adopted is polystyrene (PS) material, and by the compression-molding process moulding, the electrocondution slurry that uses is the auri slurry.At first, utilize the miniature straight depositing operation of writing, the conductive path space tracking that generates according to the CAD software design, at the pulp layer that presets that presets on the molded structural member about 10 microns, and 90 ℃ of oven dry 30 minutes are to remove organic solvent wherein with electrocondution slurry.Then, utilize the continuous Nd of peak power output: the YAG laser for 50W, equally according to the pulp layer that presets after the conductive path space tracking scanning irradiation oven dry of the designed generation of CAD software, sweep speed is 10mm/s, the single-channel scanning live width is 100 microns, and the wideer pulp layer that presets is then scanned by the multi-track overlapping mode and finishes.After this, implement electroless copper and Nickel Plating Treatment according to standard technology successively, thickness of coating is respectively 4 microns and 1 micron.The conducting wire resistivity that finally obtains is 5 x 10
-5Ω cm, minimum feature is 100 microns, defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
The molded structural member that present embodiment adopted is liquid crystal polymer (LCP) material, and by the Shooting Technique moulding, the electrocondution slurry that uses is the auri slurry.At first, utilize micro nozzle directly to write depositing operation, according to the conductive path space tracking of the designed generation of CAD software with electrocondution slurry at the pulp layer that presets that presets on the molded structural member about 5 microns, and 85 ℃ of oven dry 30 minutes are to remove organic solvent wherein.Then, utilize the continuous CO of peak power output for 100W
2Laser, equally according to the pulp layer that presets after the conductive path space tracking scanning oven dry of the designed generation of CAD software, sweep speed is 25mm/s, the single-channel scanning live width is 120 microns, the wideer pulp layer that presets is then scanned by the multi-track overlapping mode and finishes, after this, implement electroless copper and Nickel Plating Treatment according to standard technology successively, thickness of coating is respectively 4 microns and 2 microns.The conducting wire resistivity that finally obtains is 4x10
-5Ω cm, minimum feature is 120 microns, defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
The molded structural member that present embodiment adopted is polyethylene (PE) material, and by the compression-molding process moulding, the electrocondution slurry that uses is the copper based sizing.At first, utilize micro nozzle directly to write depositing operation, according to the conductive path space tracking of the designed generation of CAD software with electrocondution slurry at the pulp layer that presets that presets on the molded structural member about 10 microns, and 80 ℃ of oven dry 40 minutes are to remove organic solvent wherein.Then, utilize the continuous Nd of peak power output: the YAG laser for 50W, equally according to the pulp layer that presets after the conductive path space tracking scanning oven dry of the designed generation of CAD software, sweep speed is 15mm/s, the single-channel scanning live width is 100 microns, and the wideer pulp layer that presets is then scanned by the multi-track overlapping mode and finishes, after this, implement electroless copper and chromium plating processing according to standard technology successively, thickness of coating is respectively 5 microns and 1 micron.Prepared conductive path figure minimum feature is 100 microns, and resistivity is 1 x 10
-3Ω cm.Defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
The molded structural member that present embodiment adopted is polypropylene (PP) material, and by the extrusion process moulding, the electrocondution slurry that uses is the copper based sizing.At first, utilize the miniature straight depositing operation of writing, according to the conductive path space tracking of the designed generation of CAD software with electrocondution slurry at the pulp layer that presets that presets on the molded structural member about 20 microns, and 85 ℃ of oven dry 30 minutes are to remove organic solvent wherein.Then, utilize the continuous CO of peak power output for 100W
2Laser, equally according to the pulp layer that presets after the conductive path space tracking scanning oven dry of the designed generation of CAD software, sweep speed is 10mm/s, the single-channel scanning live width is 120 microns, the wideer pulp layer that presets is then scanned by the multi-track overlapping mode and finishes, after this, implement electroless copper and Nickel Plating Treatment according to standard technology successively, thickness of coating is respectively 3 microns and 2 microns.Prepared conductive path figure minimum feature is 150 microns, and conducting wire resistivity is 5 x 10
-5Ω cm, defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
The molded structural member that present embodiment adopted is ABS or POM resin material, and by the Shooting Technique moulding, the electrocondution slurry that uses is silver-based paste.At first, utilize the miniature straight depositing operation of writing, according to the conductive path space tracking of the designed generation of CAD software with electrocondution slurry at the pulp layer that presets that presets on the molded structural member about 10 microns, and 90 ℃ of oven dry 30 minutes are to remove organic solvent wherein.Then, utilize the continuous CO of peak power output for 100W
2Laser, equally according to the pulp layer that presets after the conductive path space tracking scanning oven dry of the designed generation of CAD software, sweep speed is 60mm/s, the single-channel scanning live width is 80 microns, the wideer pulp layer that presets is then scanned by the multi-track overlapping mode and finishes, after this, implement electroless copper and chromium plating processing according to standard technology successively, thickness of coating is respectively 4 microns and 2 microns.Prepared conductive path figure minimum feature is 80 microns, and conducting wire resistivity is 4 x 10
-5Ω cm, defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
The molded structural member that present embodiment adopted is a PBT resin material, and by the blow molding process moulding, the electrocondution slurry that uses is the palladium-silver based sizing.At first, utilize micro nozzle directly to write depositing operation, according to the conductive path space tracking of the designed generation of CAD software with electrocondution slurry at the pulp layer that presets that presets on the molded structural member about 10 microns, and 95 ℃ of oven dry 30 minutes are to remove organic solvent wherein.Then, utilize the continuous Nd of peak power output: the YAG laser for 50W, equally according to the pulp layer that presets after the conductive path space tracking scanning oven dry of the designed generation of CAD software, sweep speed is 50mm/s, the single-channel scanning live width is 80 microns, and the wideer pulp layer that presets is then scanned by the multi-track overlapping mode and finishes, after this, implement electroless copper and Nickel Plating Treatment according to standard technology successively, thickness of coating is respectively 4 microns and 2 microns.Prepared conductive path figure minimum feature is 80 microns, and conducting wire resistivity is 1 x 10
-5Ω cm, defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
Embodiment 7
The molded structural member that present embodiment adopted is polyamide (PI) material, and by the extrusion process moulding, the electrocondution slurry that uses is the palladium-silver based sizing.At first, utilize the miniature straight depositing operation of writing, according to the conductive path space tracking of the designed generation of CAD software with electrocondution slurry at the pulp layer that presets that presets on the molded structural member about 20 microns, and 100 ℃ of oven dry 30 minutes are to remove organic solvent wherein.Then, utilize the continuous CO of peak power output for 100W
2Laser, equally according to the pulp layer that presets after the conductive path space tracking scanning oven dry of the designed generation of CAD software, sweep speed is 10mm/s, and the single-channel scanning live width is 120 microns, and the wideer pulp layer that presets is then scanned by the multi-track overlapping mode and finishes.After this, implement electroless copper and Nickel Plating Treatment according to standard technology successively, thickness of coating is respectively 3 microns and 1 micron.Prepared conductive path figure minimum feature is 120 microns, and conducting wire resistivity is 1 x 10
-5Ω cm, defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
Embodiment 8
The molded structural member that present embodiment adopted is the polyamide (PA) material, and by the blow molding process moulding, the electrocondution slurry that uses is silver-based paste.At first, utilize the miniature straight depositing operation of writing, according to the conductive path space tracking of the designed generation of CAD software with electrocondution slurry at the pulp layer that presets that presets on the molded structural member about 10 microns, 85 ℃ of oven dry 30 minutes are to remove organic solvent wherein then.Utilize the Pulse Nd of peak power output: the YAG laser for 50W, according to the pulp layer that presets after the conductive path space tracking scanning oven dry of the designed generation of CAD software, pulse frequency is 20KHz, sweep speed is 20mm/s, the single-channel scanning live width is 100 microns, and the wideer pulp layer that presets is then scanned by the multi-track overlapping mode and finishes, and is last, implement electroless copper, nickel plating and chromium plating successively and handle, thickness of coating is respectively 6 microns, 2 microns and 2 microns.Prepared conductive path figure minimum feature is 100 microns, and conducting wire resistivity is 1 x 10
-5Ω cm, defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
Embodiment 9
The molded structural member that present embodiment adopted is polyvinyl chloride (PVC) material, and by the Shooting Technique moulding, the electrocondution slurry of use is aluminium base slurry.At first, utilize micro nozzle directly to write depositing operation, according to the conductive path space tracking of the designed generation of CAD software with electrocondution slurry at the pulp layer that presets that presets on the molded structural member about 0.2 micron, 100 ℃ of oven dry 30 minutes are to remove organic solvent wherein then.Then, utilize the continuous CO of peak power output for 100W
2Laser, equally according to the pulp layer that presets after the conductive path space tracking scanning oven dry of the designed generation of CAD software, sweep speed is 10mm/s, and the single-channel scanning live width is 120 microns, and the wideer pulp layer that presets is then scanned by the multi-track overlapping mode and finishes.At last, implement electroless copper and gold-plated processing successively, thickness of coating is respectively 4 microns and 1 micron.Prepared conductive path figure minimum feature is 120 microns, and conducting wire resistivity is 7 x 10
-5Ω cm, defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
Embodiment 10
The molded structural member that present embodiment adopted is Merlon (PC) material, and by the calendering technology moulding, the electrocondution slurry that uses is the auri slurry.At first, utilize micro nozzle directly to write depositing operation, according to the conductive path space tracking of the designed generation of CAD software with electrocondution slurry at the pulp layer that presets that presets on the molded structural member about 1 micron, and 85 ℃ of oven dry 50 minutes are to remove organic solvent wherein.Then, utilize the continuous CO of peak power output for 100W
2Laser, equally according to the pulp layer that presets after the conductive path space tracking scanning oven dry of the designed generation of CAD software, sweep speed is 25mm/s, and the single-channel scanning live width is 150 microns, and the wideer pulp layer that presets is then scanned by the multi-track overlapping mode and finishes.At last, implement electroless copper, nickel plating and gold-plated processing successively, thickness of coating is respectively 4 microns, 2 microns and 1 micron.Prepared conductive path figure minimum feature is 150 microns, and conducting wire resistivity is 1 x 10
-5Ω cm, defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
Embodiment 11
The molded structural member that present embodiment adopted is phenolic resins (PEI) material, and by the Shooting Technique moulding, the electrocondution slurry that uses is the palladium-silver based sizing.At first, utilize the miniature straight depositing operation of writing, according to the conductive path space tracking of the designed generation of CAD software with electrocondution slurry at the pulp layer that presets that presets on the molded structural member about 10 microns, then 90 ℃ of oven dry 40 minutes to remove organic solvent wherein.Then, utilize the continuous Nd of peak power output: the YAG laser for 50W, equally according to the pulp layer that presets after the conductive path space tracking scanning oven dry of the designed generation of CAD software, sweep speed is 25mm/s, the single-channel scanning live width is 120 microns, and the wideer pulp layer that presets is then scanned by the multi-track overlapping mode and finishes.At last, implement electroless copper and Nickel Plating Treatment successively, thickness of coating is respectively 4 microns and 2 microns.Prepared conductive path figure minimum feature is 120 microns, and conducting wire resistivity is 4 x 10
-5Ω cm, defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
Embodiment 12
The molded structural member that present embodiment adopted is phenolic resins (PESU) material, and by the extrusion process moulding, the electrocondution slurry that uses is silver-based paste.At first, utilize micro nozzle directly to write depositing operation, according to the conductive path space tracking of the designed generation of CAD software with electrocondution slurry at the pulp layer that presets that presets on the molded structural member about 1 micron, 80 ℃ of oven dry 20 minutes are to remove organic solvent wherein then.Then, utilize the continuous Nd of peak power output: the YAG laser for 50W, equally according to the pulp layer that presets after the conductive path space tracking scanning oven dry of the designed generation of CAD software, sweep speed is 5mm/s, the single-channel scanning live width is 150 microns, and the wideer pulp layer that presets is then scanned by the multi-track overlapping mode and finishes.At last, implement electroless copper and Nickel Plating Treatment successively, thickness of coating is respectively 4 microns and 2 microns.Prepared conductive path figure minimum feature is 150 microns, and conducting wire resistivity is 5 x 10
-5Ω cm, defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
Embodiment 13
The molded structural member that present embodiment adopted is the ABS plastic material, and by the Shooting Technique moulding, the electrocondution slurry that uses is silver-based paste.Conductive pattern according to the designed generation of CAD software, make the three-dimensional chromium mask plate that typography is used in advance, utilize mask plate to brush technology electrocondution slurry preset the pulp layer figure about 10 microns presetting on the molded structural member, then 90 ℃ of oven dry 50 minutes to remove organic solvent wherein.Then, utilize the continuous Nd of peak power output for 50W: the YAG laser, according to the pulp layer that presets after the conductive path space tracking scanning oven dry, sweep speed is 15mm/s, the single-channel scanning live width is 150 microns, and the wideer pulp layer that presets is then scanned by the multi-track overlapping mode and finishes.At last, implement electroless copper and Nickel Plating Treatment successively, thickness of coating is respectively 4 microns and 2 microns.Prepared conductive path figure minimum feature is 150 microns, and conducting wire resistivity is 2 x 10
-5Ω cm, defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
Embodiment 14
The molded structural member that present embodiment adopted is the ABS plastic material, and by the compression-molding process moulding, the electrocondution slurry that uses is the palladium-silver based sizing.Conductive pattern according to the designed generation of CAD software, make the three-dimensional chromium mask plate that typography is used in advance, utilize the mask plate spraying coating process that the palladium-silver electrocondution slurry is preset the pulp layer figure about 5 microns presetting on the molded structural member, then 90 ℃ of oven dry 50 minutes to remove organic solvent wherein.Then, utilize the continuous Nd of peak power output for 50W: the YAG laser, according to the pulp layer that presets after the conductive path space tracking scanning oven dry, sweep speed is 20mm/s, the single-channel scanning live width is 100 microns, and the wideer pulp layer that presets is then scanned by the multi-track overlapping mode and finishes.At last, implement electroless copper, nickel plating and chromium plating successively and handle, thickness of coating is respectively 4 microns, 2 microns and 2 microns.Prepared conductive path figure minimum feature is 100 microns, and conducting wire resistivity is 1 x 10
-5Ω cm, defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
Embodiment 15
The molded structural member that present embodiment adopted is the vinyon material, and by the Shooting Technique moulding, the electrocondution slurry that uses is the copper based sizing.Conductive pattern according to the designed generation of CAD software, make the three-dimensional chromium mask plate that typography is used in advance, utilize the mask plate spraying coating process that electrocondution slurry is preset the pulp layer figure about 5 microns presetting on the molded structural member, through 90 ℃ of oven dry 30 minutes to remove organic solvent wherein.Then, utilize the continuous CO of peak power output for 35W
2Laser, according to the pulp layer that presets after the scanning oven dry of conductive path space tracking, sweep speed is 10mm/s, and the single-channel scanning live width is 150 microns, and the wideer pulp layer that presets is then scanned by the multi-track overlapping mode and finishes.At last, implement electroless copper and Nickel Plating Treatment successively, thickness of coating is respectively 4 microns and 2 microns.Prepared conductive path figure minimum feature is 150 microns, and conducting wire resistivity is 2 x 10
-5Ω cm, defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
Embodiment 16
The molded structural member that present embodiment adopted is the polypropylene plastics material, and by the Shooting Technique moulding, the electrocondution slurry that uses is water based silver solution (only argentiferous particle and aqueous solvent do not contain bonding phase and film forming matter).Conductive pattern according to the designed generation of CAD software, make the three-dimensional chromium mask plate that typography is used in advance, utilize the mask plate spraying coating process that electrocondution slurry is preset the pulp layer figure about 0.5 micron presetting on the molded structural member, room temperature is dried 60 minutes naturally to remove the wherein water more than 95%.Then, utilize the continuous CO of peak power output for 35W
2Laser, according to the pulp layer that presets after the scanning oven dry of conductive path space tracking, sweep speed is 10mm/s, and the single-channel scanning live width is 150 microns, and the wideer pulp layer that presets is then scanned by the multi-track overlapping mode and finishes.At last, implement electroless copper and Nickel Plating Treatment successively, thickness of coating is respectively 8 microns and 2 microns.Prepared conductive path figure minimum feature is 150 microns, and conducting wire resistivity is 2 x 10
-5Ω cm, defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
Embodiment 17
The molded structural member that present embodiment adopted is the ABS plastic material, and by the compression-molding process moulding, the electrocondution slurry that uses is water base nano silver solution (only contain nano-Ag particles, water and a small amount of alcohols solvent do not contain bonding phase and film forming matter).At first, utilize micro nozzle directly to write depositing operation, according to the conductive path space tracking of the designed generation of CAD software with electrocondution slurry at the pulp layer that presets that presets on the molded structural member about 1 micron, then 80 ℃ of oven dry more than 30 minutes to remove wherein water more than 80% and organic solvent composition.Then, utilize the continuous YAG laser of peak power output for 50W, according to the pulp layer that presets after the conductive path space tracking scanning oven dry, sweep speed is 10mm/s, the single-channel scanning live width is 100 microns, and the wideer pulp layer that presets is then scanned by the multi-track overlapping mode and finishes.At last, implement electroless copper and Nickel Plating Treatment successively, thickness of coating is respectively 8 microns and 2 microns.Prepared conductive path figure minimum feature is 100 microns, and conducting wire resistivity is 2 x 10
-5Ω cm, defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
Embodiment 18
Molded structural member material and moulding process such as embodiment 11, electrocondution slurry such as embodiment 11 adopt micro nozzle directly to write this slurry of deposition at the place, conducting wire of defectiveness (opening circuit), make slurry thickness a little more than the thickness of lead on every side.Utilize CO
2Laser, sweep speed 10mm/s scans the place that needs conducting, and it is solidified, and just can finish the reparation of circuit board.Defectives such as conductive line surfaces is continuous, even, pore-free, crackle.
The above is preferred embodiment of the present invention, but the present invention should not be confined to the disclosed content of this embodiment and accompanying drawing.So everyly do not break away from the equivalence of finishing under the spirit disclosed in this invention or revise, all fall into the scope of protection of the invention.
Claims (6)
1. the making of a conductive circuit of three dimensional mold interconnecting device and restorative procedure the steps include:
(1) according to the design configuration of conducting wire, electrocondution slurry is deposited the pulp layer that presets of 0.1～50 micron thickness on the molded structural member surface, contain the required activated metal element of chemical plating process in this electrocondution slurry;
(2) solvent in the removal electrocondution slurry initialization layer;
(3) utilize laser beam irradiation to preset pulp layer, make the low melting point in the electrocondution slurry become fractional melting or vaporization, the thin layer of molded structural member surface 5～500 μ m is also melted, and conducting metal particles sinks and is partially mixed with the frosting generation in the molded structural member; After laser beam was removed, molten plastic rapid solidification, conducting metal particles partly sank and imbed molded structural member, made conductive layer particle and molded structural member surface combination, obtained the preliminary profile of conductive pattern layer;
(4) carrying out chemical plating one layer thickness on above-mentioned conductive pattern surface is the copper of 2～10 μ m, and then to carry out chemical plating one layer thickness be the corrosion resistant metal of 1～3 μ m.
2, making according to claim 1 and restorative procedure, it is characterized in that: when employed electrocondution slurry also comprises the bonding phase time, in the step (3), when laser beam irradiation presets pulp layer, bonding in the electrocondution slurry melts mutually, after laser beam was removed, metal sank mutually with bonding and mixes with plastics.
3. method according to claim 1 and 2, it is characterized in that: employed molded structural member matrix plastic kind comprises the PE polyethylene, the TPE polyethylene, PP polypropylene, PS polystyrene series, PPS polystyrene series, the PVC polyvinyl chloride, ABS resin, POM resin, the PBT resin, PA polyamide series, PPA polyamide series, PI polyamide series, the PC Merlon, PE phenolic aldehyde serial plastic, PET phenolic aldehyde serial plastic, PEI phenolic aldehyde serial plastic, PESU phenolic aldehyde serial plastic and LCP liquid crystal high polymer material.
4. method according to claim 1 and 2, it is characterized in that: step (1) is to adopt the three dimensions track of the conductive pattern that miniature pen or micro nozzle set electrocondution slurry along CAD directly to write to be deposited on the molded structural member matrix surface, or adopts prefabricated conductive pattern mask plate to brush or spraying method is preset in matrix surface with electrocondution slurry.
5. method according to claim 1 and 2 is characterized in that: step (3) laser beam that adopts is continuous wave laser or quasi-continuous pulse laser institute emitted laser bundle.
6. method according to claim 1 and 2 is characterized in that: contain at least a in gold, copper, silver, nickel, aluminium and the palladium in the electrocondution slurry.
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