CN105555038B - The method that circuit is formed on non-metallic substrate - Google Patents
The method that circuit is formed on non-metallic substrate Download PDFInfo
- Publication number
- CN105555038B CN105555038B CN201610075168.8A CN201610075168A CN105555038B CN 105555038 B CN105555038 B CN 105555038B CN 201610075168 A CN201610075168 A CN 201610075168A CN 105555038 B CN105555038 B CN 105555038B
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- China
- Prior art keywords
- metallic substrate
- laser
- method described
- circuit
- metal powder
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Abstract
The method that the invention discloses a kind of to form circuit on non-metallic substrate, including：The surface of the non-metallic substrate is handled according to preset path using double excitation light beam；The spray metal powder on the surface of the non-metallic substrate；After the non-metallic substrate is cleaned, dried, completion forms circuit on the non-metallic substrate.It is proposed by the present invention on non-metallic substrate formed circuit method, without modified matrix material can quickly, efficiently, contamination-freely manufacture 3 D stereo circuit.
Description
Technical field
The present invention relates to circuit production field more particularly to a kind of methods forming circuit on non-metallic substrate.
Background technology
3D mold interconnecting devices (3D-MID：Three Dimensions-Molded Interconnect Device) be
Finger is incorporated in electric function and mechanical function in one single structural units, and circuit-line is integrated on shell to be passed with replacing
The printed circuit board of system, to effectively reduce weight and assembly space, can be simple and popular be interpreted as three-dimensional circuits.
Manufacture using bicomponent injection molding, hot die platen press, embedded injection molding for 3D-MID earliest, but all it is limited by needs
Particular manufacturing craft can just process circuit on device.Until German LPKF D. O. O.'s invention laser direct structuring technique (LDS) it
Afterwards, just make it possible the volume production and large-scale application of 3D-MID devices.In simple terms, 3D- is manufactured using 3D-LDS techniques
The process of MID devices is to manufacture carrier by modified plastics injection molding, and the plastic casing surface being modified changes through laser irradiation
Property after can be activated, active region forms conducting channel by the metallization of the method for chemical plating, finally by assembling shaper
Part.
Plastics needed for existing 3D-LDS technologies are modified plastics, and cost is higher, and entire device only has surface lines
The metal ion wherein adulterated is just really utilized in part, the modification performance of plastics has been used, for most of case material
For, modified plastics is nonsensical, the cost of product is also therefore improved, so demand uses common plastics conduct in the industry
Bearing housing manufactures circuit on it, but common shell is in terms of the electrical property of chemical plating circuit and mechanical adhesion is poor,
And have larger pollution during change plating using traditional depositing process, therefore a kind of new technique realization device is urgently sought in this field
High performance metallization.
Invention content
In order to solve the above technical problems, the present invention proposes a kind of method forming circuit on non-metallic substrate, without changing
Property basis material can quickly, efficiently, contamination-freely manufacture 3 D stereo circuit.
In order to achieve the above objectives, the present invention uses following technical scheme：
The method that the invention discloses a kind of on non-metallic substrate forms circuit includes successively：
S1：The surface of the non-metallic substrate is handled according to preset path using double excitation light beam；
S2：The spray metal powder on the surface of the non-metallic substrate；
S3：After the non-metallic substrate is cleaned, dried, completion forms circuit on the non-metallic substrate.
In further technical solution, the present invention can also include following technical characteristic：
The double excitation light beam is the short wavelength laser merging of the long wavelength laser and a short pulse of a long pulse
Laser beam.
The double excitation light beam is that the laser emitted respectively by first laser device and second laser is merged by light combination mirror
To the laser beam in same light path, wherein the first laser device is quasi-continuous optical fiber laser, the second laser is
Green (light) laser.
The pulse width of the first laser device is Millisecond, and the pulse width of the second laser is picosecond.
The wavelength of the first laser device is 1030~1090nm, and the wavelength of the second laser is 515~545nm.
Step S2 is specifically included：The metal powder more than the jet velocity of 340m/s to be sprayed on the non-metallic substrate
Surface on.
The metal powder is at least one of copper powder, nickel powder, bronze, silver powder, aluminium powder, it is preferable that the metal powder
The particle diameter at end is 5~50 μm.
Step S2 is specifically included：Using compressed gas as power by metal powder painting to the surface of the non-metallic substrate
On, it is preferable that the compressed gas is nitrogen or argon gas.
Step S3 is specifically included：The non-metallic substrate is placed in ultrasonic cleaning apparatus after being cleaned and is dried, it is complete
At forming circuit on non-metallic substrate.
The non-metallic substrate is ceramics, glass, plastics or fiberglass reinforced plastics.
Compared with prior art, the beneficial effects of the present invention are：The present invention is by using double excitation light beam according to default
Path handles the surface of non-metallic substrate, recessed so as to be formed in the surface construction of non-modified non-metallic substrate
The micro-structures such as slot hole, hole, barb so that the metal powder of spraying and the modifying moieties of non-metallic substrate preset path can be with
Combine closely, and by cleaning the metal layer of the unprocessed portion of non-metallic substrate is washed after i.e. on non-metallic substrate shape
At circuit；The present invention during forming circuit on non-metallic substrate, without modified basis material, non-chemical plating mistake
Journey, environment friendly and pollution-free, process velocity is fast, production efficiency is high；Metal powder granulates recoverable, production cost are low；It can be
Quick Fabrication stereo circuit and planar circuit in various types of materials have huge than the situation that material in traditional chemical plating process is limited
Improve；Equipment and simple for process, large area plants and production equipment without chemical plating.
In further embodiment, the present invention is using ultrasonic jet velocity by metal powder painting in non-metallic substrate
Surface on so that between metallic and non-metallic substrate high-speed impact generate plastic deformation to combine it is even closer,
And supersonic speed metallic particles will produce apparent sedimentation deposition, to further increase metal powder and non-metallic substrate
Adhesive force.The non-metallic substrate of the present invention can select non-modified ceramics, glass, plastics or fiberglass reinforced plastics, fit
It is more extensive with range.
Description of the drawings
Fig. 1 is the flow chart that circuit is formed on non-metallic substrate of this hair preferred embodiment.
Specific implementation mode
Below against attached drawing and in conjunction with preferred embodiment, the invention will be further described.
As shown in Figure 1, the preferred embodiment of the present invention provides a kind of method forming circuit on non-metallic substrate, including
Following steps：
S1：The surface of non-metallic substrate is handled according to preset path using double excitation light beam.
After by non-metallic substrate surface cleaning, material surface is changed according to preset path using double excitation light beam
Property processing, i.e., laser surface micro-structure build.Wherein double excitation light beam is the long wavelength laser and a short arteries and veins of a long pulse
The laser beam that the short wavelength laser of punching merges, further, double excitation light beam is sent out respectively by first laser device and second laser
The laser gone out is merged into the laser beam in same light path by light combination mirror, wherein the first of transmitting long pulse long wavelength laser swashs
Light device generally selects pulse width in Millisecond (10-3Second) quasi-continuous optical fiber laser, wavelength is between 1030~1090nm
(such as 1064nm), it is picosecond (10 that the second laser of transmitting short pulse short wavelength laser, which generally selects pulse width,-12Second)
Green (light) laser, wavelength (such as 532nm) between 515~545nm, two beam laser are merged into using light combination mirror in same light path,
Two-way laser is modified processing to the surface of non-metallic substrate simultaneously, after the completion of modification, on the surface of non-metallic substrate
Form numerous micro-structures, such as groove hole, hole, barb.Non-metallic substrate in the present invention can be ceramics, glass, non-
The material of modified common plastics, fiberglass reinforced plastics etc., the wherein parameter of laser and machined parameters according to non-metallic substrate
Difference it is variant, carry out debugging selection according to actual conditions.
When in two beam laser irradiations to the surface of non-metallic substrate, green light picosecond laser belongs to ultrafast laser, when processing
No fuel factor belongs to cold working, can complete the processing of the uniform miniature hole of neat in edge on the surface of non-metallic substrate, adjust
It is 20~30 μm that section parameter can process depth on the surface of non-metallic substrate, a diameter of 15~25 μm of Microvia；With this
Quasi-continuous optical fiber laser is processed non-metallic substrate surface simultaneously, since optical fiber laser is near infrared band, has
Preferable fuel factor, the surface for focusing on non-metallic substrate can control irradiation time, make material to heating and melting around hole
Melt after flowing with the interlaced formation cavity of hole or overhead structure, completes the structure of micro-structure.Different materials such as ceramics,
Glass, plastics can select the ginseng of laser processing according to material character in process due to fusing point, boiling point difference
Number, such as power, repetition rate, duty ratio, sweep speed.The present invention combines the characteristics of two kinds of lasers, will be in non-metal base
The process that the keyhole formation process on material surface and melting are staggered to form the micro-structures such as hole, cavity, barb is detached, and is realized
The structure of micro-structure, so as to which micro-structure can be built in the plastics, ceramics, glass surface that are not required to be modified, not only
It simplifies processing step, reduce cost, and the scope of application is also more extensive.
S2：The spray metal powder on the surface of non-metallic substrate；
The metal powder form made needed for conducting channel is chosen, metal powder granulates diameter can be 5~50 μm, metal
The type of powder can be at least one of copper powder, nickel powder, bronze, silver powder, aluminium powder etc.；Then made using high pressure compressed gas
Metal powder is sprayed for power, the inert gases such as compressed gas generally use nitrogen, argon gas by pipeline, is compressed by controlling
The parameters such as the pressure and pipe diameter of gas, nozzle arrangements shape, nozzle outlet diameter adjust gas spouting velocity i.e. metal
Particle spouting velocity, in the particular embodiment, exit gas flow rate and metallic particles speed are all higher than 340m/s, i.e. Supersonic
Speed；It simultaneously can also be according to adjustings such as adhesive force of metal layer after the material character, spray-on coating thickness requirement, spraying of non-metallic substrate
Spray parameters appropriate.
After regulating suitable spray parameters, in confined space, the non-metallic substrate after laser treatment is placed in spray
Under loophole, the metallic that high speed projects is set to impinge upon material surface, one side non-metallic substrate surface is in preset path
There are numerous micro-structures, therefore the modifying moieties of metallic and non-metallic substrate can combine closely；Another aspect metallic
High-speed impact generates plastic deformation to combine even closer, simultaneously because supersonic speed metallic particles between non-metallic substrate
The difference of essence is coated with traditional low speed, supersonic speed metallic particles will produce apparent sedimentation deposition, can be further
Improve the adhesive force of metal powder and non-metallic substrate；And it is smooth without the part surface of laser treatment on non-metallic substrate,
Poor adhesive force.In spraying process, keeps metal layer thickness covering uniform by controlling non-metallic substrate uniform rotation, pass through control
Spray time controls the thickness of metal layer.
S3：After non-metallic substrate is cleaned, drying, completion forms circuit on non-metallic substrate.
The last non-metallic substrate of metallisation is placed in ultrasonic cleaning apparatus after being cleaned and is dried, due to non-
Smooth without the part surface of laser treatment on metal base, the poor adhesive force of metal powder falls off, only after over cleaning
Continue to retain by the metal layer in the preset path of laser treatment, that is, completes to form circuit on non-metallic substrate.
The circuit on non-metallic substrate made to method through the invention is tested, and test result obtains metal layer
Peel strength ＞ 6N/mm, pull-off strength ＞ 60N, the requirement of coincident circuit.
It should be noted that laser surface modification structure micro-structure and the laser surface modification in the prior art of the present invention
Technology such as laser roughening or activating technology is different, wherein laser in the prior art roughening refer to using laser to material surface into
Row selective removal makes material surface roughness increase, and material surface roughness is only made to increase, and can not component cavity
And the surface micro-structures such as barb；In addition laser activation in the prior art is swashed using the pulse fiber of the medium pulsewidth of long wavelength
Light device, pulse width are microsecond (10-6Second), process is laser to making metal ion be precipitated after the modified plastics heating of material surface
As change plating source, while also having the function of laser roughening, since needs is plated in follow-up circuit formation process, it is therefore necessary to adopt
Use the modified plastics of doping metals complex compound as the basic material of laser activation.It can by using double excitation light beam in the present invention
To build to form hole, barb etc. in material surface after being surface-treated non-modified ceramics, glass, plastic or other material
Micro-structure so that cold spraying can be directly used when making circuit, and traditional cold spraying is needed when material surface makes figure
Mask is made, and there are many particular/special requirements to material surface property, can not be sprayed on all material；And the work of the present invention
Skill by double excitation light beam to non-metallic substrate surface be modified based on so that directly progress cold spraying metal powder with it is nonmetallic
The modifying moieties of the preset path of substrate surface are combined closely, and the manufacture of 3D-MID devices is completed, and expand materials'use range, no
It only disclosure satisfy that (these are also traditional cold for the spraying appearance of high request, coating layer thickness, adhesive force, mechanics electricity thermal property
Spray impossible), and also avoid existing LDS technologies and chemical plating is needed to make the deficiency of circuit, it avoids because of chemistry
The complicated technology of plating and environmental pollution.
The present invention on non-metallic substrate formed circuit method in, without modified matrix material, non-chemical plating process,
It is environment friendly and pollution-free, process velocity is fast, production efficiency is high；Metal powder granulates recoverable, production cost are low；It can be all kinds of
Quick Fabrication stereo circuit and planar circuit on material, situation about being limited than material in traditional chemical plating process have huge change
It is kind；Equipment and simple for process, large area plants and production equipment without chemical plating.
The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be said that
The specific implementation of the present invention is confined to these explanations.For those skilled in the art to which the present invention belongs, it is not taking off
Under the premise of from present inventive concept, several equivalent substitute or obvious modifications can also be made, and performance or use is identical, all answered
When being considered as belonging to protection scope of the present invention.
Claims (11)
1. a kind of method forming circuit on non-metallic substrate, which is characterized in that include successively：
S1：The surface of the non-metallic substrate is handled according to preset path using double excitation light beam, the double excitation light
Beam is that the laser emitted respectively by first laser device and second laser is merged into the laser light in same light path by light combination mirror
Beam, wherein the first laser device is quasi-continuous optical fiber laser, the second laser is green (light) laser；
S2：The spray metal powder on the surface of the non-metallic substrate；
S3：After the non-metallic substrate is cleaned, dried, completion forms circuit on the non-metallic substrate.
2. according to the method described in claim 1, it is characterized in that, the long wavelength that the double excitation light beam is a long pulse swashs
The laser beam that light and the short wavelength laser of a short pulse merge.
3. according to the method described in claim 1, it is characterized in that, the pulse width of the first laser device be Millisecond, institute
The pulse width for stating second laser is picosecond.
4. according to the method described in claim 1, it is characterized in that, the wavelength of the first laser device be 1030~1090nm,
The wavelength of the second laser is 515~545nm.
5. according to the method described in claim 1, it is characterized in that, step S2 is specifically included：The metal powder is to be more than
The jet velocity of 340m/s is sprayed on the surface of the non-metallic substrate.
6. according to the method described in claim 1, it is characterized in that, the metal powder is copper powder, nickel powder, bronze, silver powder, aluminium
At least one of powder.
7. according to the method described in claim 6, it is characterized in that, the particle diameter of the metal powder is 5~50 μm.
8. according to the method described in claim 1, it is characterized in that, step S2 is specifically included：It will using compressed gas as power
On metal powder painting to the surface of the non-metallic substrate.
9. according to the method described in claim 8, it is characterized in that, the compressed gas is nitrogen or argon gas.
10. according to the method described in claim 1, it is characterized in that, step S3 is specifically included：The non-metallic substrate is placed in
It is dried after being cleaned in ultrasonic cleaning apparatus, completion forms circuit on non-metallic substrate.
11. the method according to any of claims 1 to 10, which is characterized in that the non-metallic substrate is ceramics, glass
Glass, plastics or fiberglass reinforced plastics.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610075168.8A CN105555038B (en) | 2016-02-02 | 2016-02-02 | The method that circuit is formed on non-metallic substrate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610075168.8A CN105555038B (en) | 2016-02-02 | 2016-02-02 | The method that circuit is formed on non-metallic substrate |
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| CN105555038A CN105555038A (en) | 2016-05-04 |
| CN105555038B true CN105555038B (en) | 2018-07-31 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107493660A (en) * | 2016-06-12 | 2017-12-19 | 品翔电通股份有限公司 | The manufacture method of conductive wires |
| CN107623233A (en) * | 2017-09-13 | 2018-01-23 | 中国电子科技集团公司第二十九研究所 | A kind of 3-D abnormal cinch connector and implementation method |
| CN108337812A (en) * | 2018-03-27 | 2018-07-27 | 北京大学东莞光电研究院 | A method of preparing metal line on substrate |
| CN108511349B (en) * | 2018-03-27 | 2020-03-27 | 北京大学东莞光电研究院 | Metallization method of ceramic substrate |
| CN111413762B (en) * | 2020-03-27 | 2021-11-23 | 北京交通大学 | Composite coating low-temperature measuring optical fiber and preparation method thereof |
| CN114393207A (en) * | 2022-01-24 | 2022-04-26 | 吉安市瑞鸿电子有限公司 | Metal powder for forming circuit on surface of three-dimensional non-metal substrate through spraying |
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| CN1332054A (en) * | 2000-06-09 | 2002-01-23 | 住友重机械工业株式会社 | Laser process device and method |
| CN1385276A (en) * | 2001-05-10 | 2002-12-18 | 中国科学技术大学 | Laser holing device and two-step holing method |
| CN1433350A (en) * | 1999-11-29 | 2003-07-30 | 西门子公司 | Device for processing substrates and method therefor which entails the use of such a device |
| CN1770424A (en) * | 2004-11-05 | 2006-05-10 | 精工爱普生株式会社 | Manufacturing method of substrate |
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| US6624382B2 (en) * | 1997-01-30 | 2003-09-23 | Anvik Corporation | Configured-hole high-speed drilling system for micro-via pattern formation, and resulting structure |
| CN102318451B (en) * | 2008-12-13 | 2013-11-06 | 万佳雷射有限公司 | Method and apparatus for laser machining relatively narrow and relatively wide structures |
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|---|---|---|---|---|
| CN1433350A (en) * | 1999-11-29 | 2003-07-30 | 西门子公司 | Device for processing substrates and method therefor which entails the use of such a device |
| CN1332054A (en) * | 2000-06-09 | 2002-01-23 | 住友重机械工业株式会社 | Laser process device and method |
| CN1385276A (en) * | 2001-05-10 | 2002-12-18 | 中国科学技术大学 | Laser holing device and two-step holing method |
| CN1770424A (en) * | 2004-11-05 | 2006-05-10 | 精工爱普生株式会社 | Manufacturing method of substrate |
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