TWI544847B - Chemical plating product and method forming thereof - Google Patents

Description

Electroless plating product and molding method thereof

The invention relates to an electroless plating product and a molding method thereof, in particular to an electroless plating product on an electronic product and a molding method thereof.

Usually, electronic products need to make functions such as talking and surfing through wireless components. They mainly transmit and receive wireless data through antennas mounted on electronic products. Currently, there are many ways to install antennas on electronic products, such as initial stamping. The rear three-dimensional metal antenna is held on the insulating body by screws, and then evolved to form a three-dimensional antenna directly by the laser engraving in the insulating body.

The laser engraving technology is a laser processing principle that uses a high-intensity focused laser beam emitted from a laser to oxidize the material at the focal point and thus processes it. For this part of the technology, please refer to the Chinese invention patent application filed on January 28, 2004. No. 02127135.6, which discloses a method for laser engraving and plating of plastic surface, which has a transparent plastic material, and is coated on the back side of the plastic material with a light-transmitting anti-plating ink mark and a front surface of the plastic material coated with a metal film. Pre-treatment; finally, the metal film pre-treated with the metal film is subjected to laser engraving to determine the desired pattern. However, the method of manufacturing the antenna module requires a laser device, which increases the manufacturing cost of the antenna.

In addition, the conventional laser engraving process requires plastic injection molding using a special plastic added with a metal compound, and then the laser is used to activate the surface of the plastic to be plated by laser. A metal core is produced on the surface, and then plasticized plating is performed to plate the metal with the laser-activated region, thereby achieving the purpose of controlling the pattern or range to be plated. The disadvantages of this method are as follows: (1) plastics with added metal compounds are required, and the cost is higher than that of ordinary plastics. (2) Thunder carvings are required with expensive laser equipment, and the equipment cost and mass production cost are high.

Therefore, it is indeed necessary to provide an improved molding method and its products to improve the above-mentioned drawbacks in the prior art.

It is an object of the present invention to provide an electroless plated product capable of controlling a pattern to be plated and a method of forming the same.

The electroplating product of the present invention can be realized by the following technical solutions: an electroless plating product, which is formed by a chemical method, the electroless plating product comprising an insulating member and a metal plating layer on the insulating member, and the metal plating layer comprises a pre-plating range formed by coating the catalyst. And chemical copper covering the coating catalyst.

The present invention can also be achieved by a method of molding the electroless plated product according to claim 1, wherein the method comprises the steps of: a. providing an insulating member; b. placing the insulating member in a chemical solution for chemical removal. Film, then chemically roughening the insulating member; c. confirming the pre-plating range on the insulating member as a coating catalyst; d. performing electroless copper plating on the coating catalyst.

Compared with the prior art, the invention confirms the pre-plating range by using a coating catalyst on the insulating member, and can reduce the laser engraving equipment and reduce the manufacturing cost compared with the existing laser engraving technology, and The coating catalyst can also facilitate accurate determination of the structure of the control pre-plated product.

1‧‧‧Insulation

2‧‧‧Pre-plating range

3‧‧‧Electrochemical copper plating

The first drawing is a schematic plan view of the insulating member of the electroless plating product of the present invention; the second drawing is a schematic plan view of the insulating member of the electroless plating product of the present invention after coating; the third drawing is a plan view of the semi-finished product of the electroless plating product of the present invention. .

Referring to the first to third figures, the electroless plating method of the present invention mainly has the following steps:

a. Providing insulation 1 (refer to the first figure);

b. The above insulating member is placed in a chemical solution for chemical stripping, and then the insulating member is chemically roughened;

c. The coating catalyst is used as the coating catalyst on the insulating member to confirm the pre-plating range 2 (refer to the second figure). In the present embodiment, the pre-plating range is taken as an example of the "ten" frame;

d. Electroless copper plating 3 at the coating catalyst to form a semi-finished product (see the third figure).

e. A nano-organo-palladium metal conductive layer of a planar structure formed by coating a catalyst in the step c.

f. The coating catalyst in step c forms a nanostructured palladium metal conductive layer of a stereostructure.

g. On the electroless copper plating in step d, steps such as thick copper plating, electroless nickel plating, and electroless gold plating may be sequentially performed to form a finished product.

h. On the electroless copper plating in step d, steps such as electroplating copper, electroplating nickel, and electroplating gold may be sequentially performed to form a finished product.

i. Steps of electroplating copper, electroplating nickel, etc. may be sequentially performed on the electroless copper plating in step d.

j. Further electroplating a metal such as black nickel on the i step.

k. Further electroplating gold or the like on the i step.

Among them, the chemical roughening system forms a microscopic rough structure on the surface of the insulating member to improve the bonding force between the subsequent metal plating layer and the insulating member. In the step g to k, since the metal element is not plated on the portion of the insulating member where the catalyst is not coated, the plating range of the subsequent metal plating can be effectively controlled during the coating of the catalyst, and the prior art does not need to pass. The laser engraving equipment determines the pre-plating range and effectively reduces the manufacturing cost.

Referring to FIG. 1 to FIG. 3 again, an electroless plating product formed by the chemical method of the present invention comprises an insulating member 1 and a metal plating layer on the insulating member, and the metal plating layer comprises a pre-plating formed by coating the catalyst. Range 2 and chemical copper 3 overlying the coating catalyst. And the insulating member is chemically roughened at least in the pre-plating range region.

In the present invention, the nano-organo palladium formed by the planar coating method in the coating catalyst or the nano-organo-palladium formed by the three-dimensional spraying method in the coating catalyst may be used.

In the first embodiment of the present invention, chemical nickel and chemical gold may be sequentially coated on the upper layer of the chemical copper.

In the second embodiment of the present invention, the upper layer of the chemical copper may be sequentially covered with electroplated copper, electroplated nickel, and electroplated gold, and nickel plating is advantageous for preventing oxidation.

In the third embodiment of the present invention, the upper layer of the chemical copper may be sequentially covered with electroplated copper, electroplated nickel, and electroplated black nickel, and the radio frequency of the product may be increased by electroplating black nickel.

In the fourth embodiment of the present invention, the upper layer of the chemical copper may be sequentially covered with electroplated copper, electroplated nickel, and electroplated gold to increase the soldering function of the product.

In summary, the creation has indeed met the requirements of the invention patent, and the patent application was filed according to law. However, the above-mentioned embodiments are merely preferred embodiments of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and those skilled in the art will be able to make equivalent modifications or variations in accordance with the spirit of the present invention. It should be covered by the following patent application.

1‧‧‧Insulation

3‧‧‧Electrochemical copper plating

Claims (14)

An electroless plating product formed by a chemical method, wherein the electroless plating product comprises a chemically demolded insulating member and a metal plating layer on the insulating member, the insulating member being chemically roughened to form a microscopic surface on the insulating member In the rough structure, the metal plating layer includes a pre-plating range formed by coating a catalyst on the micro-rough structure and chemical copper covering the catalyst. The electroless plated product according to claim 1, wherein the upper layer of the chemical copper is sequentially covered with chemical nickel and chemical gold. The electroless plating product according to claim 1, wherein the upper layer of the chemical copper is sequentially covered with electroplated copper, electroplated nickel, and electroplated gold. The electroless plated product according to claim 1, wherein the upper layer of the chemical copper is sequentially covered with electroplated copper or electroplated nickel. The electroless plated product of claim 4, wherein the electroplated nickel is further covered with electroplated black nickel. The electroless plating product according to any one of claims 1 to 5, wherein the coating catalyst is a nano-palladium formed by a planar spray method. The electroless plated product according to any one of claims 1 to 5, wherein the coating catalyst is a stereoscopic spray-formed nanoorgano palladium. A method for forming an electroless plating product, which mainly comprises the steps of: a. providing an insulating member; b. placing the insulating member in a chemical solution for chemical stripping, and then chemically roughening the insulating member to surface on the insulating member Forming a microscopically rough structure; c. coating a catalyst on the microscopically rough structure to form a pre-plating range; d. Electroless copper plating on the catalyst. The molding method according to claim 8, wherein the coating catalyst in the step c forms a planar nano-palladium metal conductive layer. The molding method according to claim 8, wherein the coating catalyst in the step c forms a nano organic palladium metal conductive layer of a three-dimensional structure. The molding method according to claim 9 or claim 10, wherein the step of electroless copper plating in the step d is performed by steps of thickening copper plating, electroless nickel plating, and electroless gold plating. The molding method according to claim 9 or claim 10, wherein the electroless copper plating in the step d is performed by sequentially performing steps such as electroplating copper and electroplating nickel. The molding method according to claim 12, wherein the electroplated nickel is further plated with a metal such as black nickel. The molding method according to claim 12, wherein the electroplated nickel is further plated with a metal such as gold.