KR101250644B1 - Built in antenna module manufacture method and that's goods - Google Patents

Abstract

PURPOSE: A method for manufacturing an embedded antenna module and the embedded antenna module manufactured by the same are provided to actively deal with various mobile devices by directly processing a pattern of the embedded antenna on a base surface. CONSTITUTION: A base surface is plated with electroless copper(S70). The outside of a pattern except an antenna pattern is etched with a laser on the electroless copper plated base surface(S80). When the pattern is obtained, a pattern region is electroplated(S90). An electroless copper plated part is corroded in a region except the pattern(S100). The remaining pattern region after corrosion is electrically plated with nickel(S110). [Reference numerals] (S10) Plasma surface processing step; (S100) Pattern except area corrosion step; (S110) Electrical nickel plating step; (S20) Conductive polymer coating step; (S30) Etching step; (S40) Neutralization step; (S50) Catalytic step; (S60) Active step; (S70) Electroless copper plating step; (S80) Laser etching step; (S90) Pattern area electrolytic copper plating step;

Description

Built-in antenna module manufacturing method and built-in antenna module manufactured therefrom {BUILT IN ANTENNA MODULE MANUFACTURE METHOD AND THAT'S GOODS}

The present invention relates to a built-in antenna manufacturing method and a built-in antenna module manufactured from the method, to enable the pattern processing of the built-in antenna directly on the base surface for constituting the built-in antenna, the use of a film and the like pattern printed as before By applying various types of antenna patterns to a base having a variety of forms without a short period, it is possible to manufacture a built-in antenna module inside a mobile device that has a short period of time, to overcome the problems associated with the change of equipment, The present invention relates to a method for manufacturing a highly reliable internal antenna module having a low reception sensitivity and a low defective rate, and a built-in antenna module manufactured therefrom.

2. Description of the Related Art Generally, a wireless communication terminal is a device for transmitting voice, text, and image data through a wireless communication such as a PCS (Personal Communication Service) terminal, a PDA (Personal Digital Assistant), a smart phone, a next generation mobile communication And the like.

In such a wireless communication terminal, an antenna such as a helical antenna or a dipole antenna is mounted so as to improve transmission and reception sensitivity. Such an antenna is an external antenna and protrudes to the outside of the wireless communication terminal. .

However, while the external antenna has an advantage of omnidirectional radiation characteristics, since the antenna protrudes to the outside, there is a high possibility of damage due to external force, it is inconvenient to carry, and many limitations in designing the appearance of the terminal are beautiful. There is a problem that follows, it is well known that there is a tendency that a built-in antenna of a flat structure such as a micro strip patch antenna or an inverted-F antenna is used as the antenna mounted inside the terminal without protruding to the outside.

For example, in the case of Figure 1 and 2, it shows a built-in antenna module that is mounted on a conventional terminal, this conventional built-in antenna module 40 is configured to include a base 10 of the antenna 20.

The antenna 20 has a radiator 22 (22a, 22b) made of a conductor such as a conductive metal and a pin 21 for connecting the radiator 22 to a substrate of a terminal so as to receive and transmit a radio signal from a base station. Consists of a plate-shaped material is produced by pressing / punching according to a preset pattern.

Here, the base 10 corresponds to a fixed structure of the antenna module 40 formed of a non-conductive resin and mounted on a substrate of the terminal, and the radiator 22 is formed on an outer surface of the base 10. It is provided with a plurality of assembling projections 13 are inserted into the assembling hole 24 formed in the radiator 22 to be mounted on the 12a, 12b and fixedly arranged.

In addition, the substrate on which the antenna module is mounted is mounted in the terminal case, and the pins 21 of the antenna 20 mounted on the base 10 are electrically connected to the substrate. As will be generally recognized as a circuit board on which an electronic component is mounted, a separate drawing is not shown.

In order to process the antenna 20 in a predetermined pattern shape, the conventional antenna module 40 as described above is press-processed into a plate-like material, and then perforated according to a preset pattern, and processed radiator 20 ) Was produced by a worker assembling on the base 10 in a separate assembly line.

However, the antenna module 40 takes a considerable time to complete the assembly, as well as the manufacturing process is very complicated and cumbersome due to the assembly has been limited in improving the work productivity and lowering the manufacturing cost.

In addition, when the shape of the radiator 22 is to be changed due to the structural change of the base 10 or the design of the radiator 22, the mold used for pressing and punching the plate material must be replaced so that additional cost is incurred. This occurs, and a considerable time is required to replace the equipment, and there is a problem in that an active and quick response to the design change of the antenna, which must be changed according to various pattern changes and new releases of the terminal, is not possible.

In addition, the radiator 22 should be bent during the press working to be coupled to the base 10, but the curved surface 21 is inaccurate and does not fit the base 10, the pin 21 is a problem If it is not located correctly, the problem is that the contact connection is not good only by its own elastic force.

In addition, in addition to the above-described problems, the antenna module 40 is provided with the assembling hole 24 on the surface of the radiator 22, which makes it difficult to design the radiator pattern, thereby forming the slit 23 in the plate material. When designing the pattern of the radiator 22 in the form should be designed in consideration of the influence of the assembly hole 24, in general, the pattern of the radiator 22 can be variously designed to have an optimal transmission and reception sensitivity by those skilled in the art There has been a problem that the reliability of the quality of the product is variable according to the influence of the assembly hole 24.

On the other hand, in addition to the above-described conventional technology, the electric supply is interrupted or an alarm sounds when the desired plating thickness is reached through the integration of the amount of current supplied and the value of the current detected in real time and the plating time. Method of making a three-dimensional conductor pattern described in the Patent Publication No. 10-2011-1023872 or even using a laser to uniformly form the thickness of the plating layer formed on the radiation pattern portion and the antenna contact portion of the fixed base panel and Korean Patent Registration No. 10-1012138, which is a device, includes known techniques having various methods and types. In manufacturing an internal antenna according to the conventional technology, the reception sensitivity of the internal antenna and the reliability of the product are deteriorated. The problem is not solved.

Republic of Korea Patent Publication No. 10-2011-0123872 (Published November 16, 2011) Republic of Korea Patent Registration No. 10-1012138 (2011. 02. 07 announcement)

The present invention has been made to solve the above-mentioned various problems, and the object of the present invention is to simplify the complicated manufacturing process of the built-in antenna and to reduce the production cost of the built-in antenna. Its purpose is to manufacture highly reliable built-in antennas, and to actively respond to mobile devices with varying shapes and structures to produce built-in antennas for mobile devices that can be changed without subsequent procedures or costs, such as design changes of facilities. Has a different purpose.

According to an aspect of the present invention,

In the method for manufacturing an embedded antenna module using electroplating,

Plasma surface treatment step (S10) to the plasma surface treatment to surface-activate the base surface;

A conductive polymer coating step (S20) of applying a conductive polymer to the base surface surface activated by the plasma processing step (S10);

Etching step (S30) to form a fine concavo-convex on the base surface to etch the base surface to improve the adhesion;

Neutralizing the base etched by the etching step (S30) with hydrochloric acid having a concentration of 10% for 3 minutes (S40);

A catalytic step (S50) of adsorbing colloid of Sn / Pd component having colloidal material property on the base surface which has undergone the neutralization step (S40) to give catalytic property;

An active step (S60) to remove the Sn compound from the base having undergone the catalytic step (S50) so that Pd and Cu are combined;

Electroless copper plating step (S70) for plating the electroless copper on the base surface passed through the active step (S60);

A laser etching step (S80) of etching a pattern outside the pattern except for a pattern designed to form a pattern of an antenna on the base surface which has undergone the electroless copper plating step (S70);

A pattern region electroplating step (S90) of performing electrocopper plating to the pattern region in a state where a pattern is obtained by the laser etching step (S80);

A non-pattern region corrosion step (S100) of etching the electroless copper plating existing in a region other than the pattern separated by the laser etching step (S80) after the pattern region electrocopper plating step (S90);

It is characterized in that it has an antenna pattern completed by the electric nickel plating step (S110) for plating the electric nickel to the remaining pattern area by the region other than the pattern corrosion step (S100).

Or the present invention,

In the method for manufacturing an embedded antenna module using electroplating,

Conductive polymer applying step (P10) for applying a conductive polymer to the base surface;

A drying step (P20) of drying the base coated with the conductive polymer;

A laser etching step (P30) of etching a pattern outside of the pattern except for a pattern designed to form a pattern of an antenna on the base surface which has undergone the drying step (P20);

An electroless copper plating step (P40) of plating the electroless copper onto the base surface which has undergone the laser etching step (P30);

A pattern region electroplating step (P50) of electroplating the pattern region in a state where a pattern is obtained by the laser etching step (S80);

After the pattern region electroplating step (P50) and the etching step by the laser etching step (P30), the non-pattern area corrosion step (P60) to corrode the electroless copper plating existing in the area other than the separated pattern;

It is characterized in that it has an antenna pattern completed by the electric nickel plating step (P70) for plating the electric nickel to the remaining pattern region by the region other than the pattern corrosion step (P60).

According to the present invention, in manufacturing a built-in antenna to be applied to a mobile communication terminal such as a mobile device, the complicated manufacturing process can be simplified to significantly reduce the production price and the reliability of the produced product can be expected, as well as in a short time. Even if the shape of the mobile communication terminal is changed in response to the short-term cycle in which the model is changed, the compatibility of the product is possible using the same manufacturing method and equipment.

1 is a process flow diagram showing a manufacturing step according to the first embodiment of the present invention
Figure 2 is a process flow diagram showing a manufacturing step according to a second embodiment of the present invention
3 is a perspective view showing an example of an antenna module manufactured by the present invention;

Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings divided into a first embodiment and a second embodiment.

On the other hand, the base 10 in the first and second embodiments of the present invention is one of the components constituting the built-in antenna module of the mobile device, which means to be mounted inside the mobile device, the base 10 of the present invention The antenna pattern according to each embodiment is formed.

In addition, the antenna module as used in the present invention means both the antenna region pattern processed by the base and the base surface.

1st Example

The first embodiment of the present invention will be able to manufacture the built-in antenna according to the process flow shown in FIG.

In the process of manufacturing the embedded antenna module according to the first embodiment of the present invention, the step (S10) of plasma surface treatment on the base 10, the conductive polymer coating step (S20) of applying the conductive polymer to the surface activated base surface Etching step (S30), neutralization step (S40), catalytic step (S50), activation step (S60), electroless copper plating step (S70), laser etching step (S80), pattern region electroplating step of etching the base surface A built-in antenna module may be manufactured by performing the process of S90, a non-pattern region corrosion step S100, and an electric nickel plating step S110 of plating the electric nickel with a pattern region.

Hereinafter, each step will be described in more detail.

On base 10 Plasma  Surface Treatment Steps- S10

This step refers to a step of plasma treatment for the surface activity of the base 10 is a pattern of the antenna.

Such a plasma treatment includes a method of physically treating the surface of a plastic to introduce a functional group, or a method of preventing electrification by metallizing with a vacuum deposition ION Spar Tering or ION Plating. In the present invention, .

Such plasma surface treatment may be applicable to methods that are commercially available in the art.

Conductive Polymer  Application step- S20

After the surface treatment is completed on the surface of the base 10 as described above, it is a step of applying a conductive polymer.

Application of the conductive polymer corresponding to the polymer compound, the surface of the base 10 can be antistatic, such a conductive polymer is iron (Fe), copper (Cu), nickel (Ni), carbon monoxide (Co), zinc ( Zn), tin (Sn), gold (Au), silver (Ag), platinum (Pt), radium (Rh), and palladium (Pd).

Etching Step to Etch Base Surface- S30

This step is to etch the surface of the base 10 coated with the conductive polymer as described above, 400 to 520 g / L chromic anhydride and sulfuric acid (H ₂ SO ₄ ) by using an etching solution having a concentration of 100 to 220 g / L, the base surface is etched or corroded at 63 to 73 ° C. for 1 to 10 minutes to form fine irregularities on the surface of the base 10, thereby improving adhesion.

Neutralization stage- S40

In this step, the base surface is etched (S30), and then neutralized. The base 10 is neutralized with hydrochloric acid having a concentration of 10% for 3 minutes, and then washed with water once. Alternatively, the negative electric average position is overlapped so that the influence of the electric charge does not appear at all.

Catalyst stage- S50

This step refers to a process of adsorbing a colloid of Sn / Pb component having a fine colloidal material property on the surface of the base 10 subjected to the neutralization step (S40).

In order to adsorb colloid, 100 cc / L of a mixture of 0.25 g / L and 10 g / L of palladium chloride (PoCl ₂ ) and tin tin chloride (SnCl ₂ ), respectively, Using the activating solution, the first activation treatment for 3 minutes at 25 ℃ and then washed four times.

Active stage- S60

This step is to activate the palladium (Pd) and copper (Cu) to combine by removing the Sn compound in the base 10, the Sn / Pb colloid adsorbed on the surface through the catalyst step (S50) described above it means.

For this activation, activation treatment is carried out at a temperature of 57 캜 for 3 minutes by using sulfuric acid having a concentration of 13%, followed by washing with water three times.

Electroless Copper Plating  step - S70

This step, after washing the base 10 through the active step (S60) with water and then copper chloride (CuCl ₂ ) 1 ~ 2 g / L, formaldehyde (CH ₂ O) 2.0 ~ 3.0 g / L, caustic soda 6 to 7 g / L, 15 to 20 g / L of Ethylene Diamine Tetra Acetic Acid (EDTA) are mixed and chemically plated using an aqueous solution containing a small amount of 2,2-bipyridyl (2,2-Bypyridyl). Electroless copper plating was performed to have a thickness of 0.1 to 3 μ (micron), followed by washing with water three times.

laser Etching  step - S80

The outer surface of the pattern except for the pattern designed to form the pattern of the antenna on the base surface subjected to the electroless copper plating step (S70) is etched with a laser.

Pattern Area Electroplating Step- S90

Electroplating treatment to the pattern region in the state of obtaining the pattern of the antenna by the laser etching step (S80), copper sulfate 210 ~ 300 g / L, sulfuric acid 65 ~ 100 g / L, polish 10 Using a solution mixed with ~ 20 ml to have a current density of 0.5 ~ 4 A / dm 2 in the range of 20 ~ 35 ℃ and the electroplating to a thickness of 5 ~ 20 μ (micron).

Non-pattern Corrosion Stage- S100

This step is to corrode regions other than the pattern. After the electroplating is completed as the pattern region, the pattern region in which the electroplating is formed is divided into a pattern region and a non-pattern region by the laser etching step (S80). Except for this, it means a step of stripping the non-patterned region.

The non-patterned region is subjected to electroless copper plating, which corrodes the electroless copper plating.

For this corrosion, potassium persulfate (K ₂ S ₂ O ₈ ), sodium perchlorate (NaClO ₄ ), potassium perchlorate (KClO ₄ ), calcium perchlorate (Ca (ClO ₄ ) ₂ ), potassium peroxide (K ₂ O ₂ ) , Sodium peroxide (Na ₂ O ₂ ), calcium peroxide (CaO ₂ ), ammonium persulfate ((NH ₄ ) ₂ S ₂ O ₈ ), sodium persulfate (Na ₂ S ₂ O ₈ ), perchloric acid (HClO ₄ ), permanganic acid 3-15 wt% peroxide, hydrogen peroxide selected from the group consisting of a mixture of potassium (KMnO ₄ ), sodium permanganate (NaMnO ₄ ), potassium dichromate (K ₂ Cr ₂ O ₇ ), sodium dichromate (Na ₂ Cr ₂ O ₇ ) (H ₂ O ₂ ) Using a corrosion solution consisting of 1 to 15 wt%, 1 to 20 wt% of carboxylic acid, sulfonic acid or a mixture thereof and the balance of water, it is corroded to form a copper or copper alloy film.

With pattern area Electric nickel  Plated Electro Nickel Plating Step  - S110

On the other hand, this step is a pattern region formed on the surface of the base 10, the corrosion step (S100) is completed as described above means a step of plating the electric nickel in this step, nickel sulfate 265 ~ 300 g / L, nickel chloride 35 ~ 45 g / L, boric acid 40 ~ 60 g / L, polish agent 10 ml / L, and the mixture is treated with electric titanium plating within a temperature range of 55 ~ 65 ℃ to provide a built-in antenna module I can complete it.

Second Example

The process of manufacturing the built-in antenna module according to the second embodiment of the present invention, the conductive polymer coating step (P10), drying step (P20), laser etching step (P30), electroless copper plating step (P40), pattern area electrical It is characterized in that it has an antenna pattern completed by the copper plating step (P50), the non-pattern area corrosion step (P60), the electro-nickel plating step (P70).

Hereinafter, the second embodiment will be described concretely. Each step follows the conditions in the first embodiment.

In the second embodiment, the plasma surface treatment step (S10) of performing plasma surface treatment to surface-activate the base surface proceeding in the first embodiment is performed without applying the conductive polymer to the surface of the base 10 ( P10), drying step (P20), laser etching step (P30), electroless copper plating step (P40), pattern area electroplating step (P50), non-pattern area corrosion step (P60), electronickel plating step (P70) Through the built-in antenna module can be manufactured.

First, the conductive polymer coating step (P10) is a step of applying the conductive polymer after the surface treatment is completed on the surface of the base 10 as in the first embodiment as described above, by applying the conductive polymer corresponding to the polymer compound The surface of the base 10 is antistatic, and the conductive polymer is iron (Fe), copper (Cu), nickel (Ni), carbon monoxide (Co), zinc (Zn), tin (Sn), gold ( Au), silver (Ag), platinum (Pt), radium (Rh) and palladium (Pd).

In this manner, a conductive polymer applying step P11 for applying a conductive polymer of 500 nanometers or less to the surface of the base 10 is further added.

Thus, using the base 10, the conductive polymer coating step (P11) is completed, the drying step (P20) is dried using a laser or AR, UV, infrared, hot air, etc., the dried base 10 A laser etching step (P30) is performed to etch the outside of the pattern with a laser except for a pattern designed to form a pattern of the antenna on the surface.

On the other hand, when the pattern of the antenna is formed on the surface of the base 10 by the laser etching step (P30) in this way, copper chloride (CuCl ₂ ) 1 ~ 2 g / L, formaldehyde (CH ₂ O) 2.0 ~ 3.0 g / L, caustic soda 6-7 g / L, EDTA (Ethylene Diamine Tetra Acetic Acid) 15-20 g / L are mixed, and a small amount of 2,2-bipyridyl (2,2-Bypyridyl) is used. It is chemically plated and electroless copper plating having a thickness of 0.1 to 3 μ (micron) is applied to both the pattern region and the non-pattern region and then washed three times with water. The copper plating step (P40) is performed.

As described above, in the base 10 which has undergone the electroless copper plating step P40, the copper sulfate 210 to 300 may be used as the pattern area among the areas divided into the pattern area and the non-pattern area of the antenna by the laser etching step P30. Using a solution mixed with g / L, sulfuric acid 65-100 g / L, and polisher 10-20 ml, it should have a current density of 0.5-4 A / dm2 within the range of 20-35 ℃, but the thickness should be 5-20. The pattern region is subjected to the electroplating step (P50) to be electroplated to be μ (micron).

As described above, in the base 10 where the electroplating is completed with the pattern region (P50), the non-pattern region is corroded (P60), except for the pattern region in which the electroplating is made. For corrosion, as in the first embodiment, potassium persulfate (K ₂ S ₂ O ₈ ), sodium perchlorate (NaClO ₄ ), potassium perchlorate (KClO ₄ ), calcium perchlorate (Ca (ClO ₄ ) ₂ ), Potassium peroxide (K ₂ O ₂ ), sodium peroxide (Na ₂ O ₂ ), calcium peroxide (CaO ₂ ), ammonium persulfate ((NH ₄ ) ₂ S ₂ O ₈ ), sodium persulfate (Na ₂ S ₂ O ₈ ) , Selected from the group consisting of perchloric acid (HClO ₄ ), potassium permanganate (KMnO ₄ ), sodium permanganate (NaMnO ₄ ), potassium dichromate (K ₂ Cr ₂ O ₇ ), sodium dichromate (Na ₂ Cr ₂ O ₇ ) Corrosion solution consisting of 3 to 15 wt% peroxide, 1 to 15 wt% hydrogen peroxide (H ₂ O ₂ ), 1 to 20 wt% carboxylic acid, sulfonic acid or mixtures thereof and the balance of water By using, it is corroded to form a copper or copper alloy film.

Meanwhile, as described above, the electroplating nickel is plated to a pattern region formed on the surface of the base 10 on which the corrosion step P60 to the non-pattern region is completed. Nickel sulfate 265 to 300 g / L, nickel chloride 35 to 45 g / L, boric acid 40 to 60 g / L, polisher 10 ml / L are mixed, and the mixture is mixed in a temperature range of 55 to 65 ° C. The electroplated plating can be used to complete the built-in antenna module.

S10; Plasma surface treatment steps S20 and P10; Conductive polymer application step
P20; Drying step S30; Etching Step
S40; Neutralization step S50; Catalyst stage
S60; Activation step S70, P40; Electroless Copper Plating Step
S80, P30; Laser etching step S90, P50; Pattern Area Electroplating Step
S100, P60; Corrosion stage outside the pattern
S110, P70; Electro nickel plating step
10; Base

Claims (12)

In the method for manufacturing an embedded antenna module using electroplating,
A plasma surface treatment step (S10) of performing a plasma surface treatment for activating the base surface;
A conductive polymer application step (S20) of applying the conductive polymer to the surface of the base surface activated by the plasma processing step (S10);
An etching step (S30) of etching the base surface to form fine irregularities on the base surface to improve the adhesion;
Neutralizing the base etched by the etching step (S30) with hydrochloric acid having a concentration of 10% for 3 minutes (S40);
A catalytic step (S50) of adsorbing colloid of Sn / Pd component having colloidal material property on the base surface which has undergone the neutralization step (S40) to give catalytic property;
An active step (S60) to remove the Sn compound from the base having undergone the catalytic step (S50) so that Pd and Cu are combined;
Electroless copper plating step (S70) for plating the electroless copper on the base surface passed through the active step (S60);
A laser etching step (S80) of etching a pattern outside the pattern except for a pattern designed to form a pattern of an antenna on the base surface which has undergone the electroless copper plating step (S70);
A pattern region electroplating step (S90) of performing electrocopper plating to the pattern region in a state where a pattern is obtained by the laser etching step (S80);
A non-pattern region corrosion step (S100) of etching the electroless copper plating existing in a region other than the pattern separated by the laser etching step (S80) after the pattern region electrocopper plating step (S90);
Method of manufacturing an embedded antenna module characterized in that to have the antenna pattern completed by the electro-nickel plating step (S110) for plating the electric nickel to the remaining pattern region by the region other than the pattern corrosion step (S100).
In the method for manufacturing an embedded antenna module using electroplating,
Conductive polymer coating step (P10) for applying a conductive polymer to the base surface;
A drying step (P20) of drying the base to which the conductive polymer is applied;
A laser etching step (P30) of etching the outer surface of the pattern except for the pattern designed to form the antenna pattern on the base surface after the drying step (P20);
An electroless copper plating step (P40) of plating the electroless copper onto the base surface which has undergone the laser etching step (P30);
A pattern region electroplating step (P50) of electroplating the pattern region in a state where a pattern is obtained by the laser etching step (S80);
After the pattern region electroplating step (P50) and the etching step by the laser etching step (P30), the non-pattern area corrosion step (P60) to corrode the electroless copper plating existing in the area other than the separated pattern;
And an antenna pattern completed by the electronickel plating step (P70) of plating the electric nickel with the remaining pattern areas by the non-pattern area corrosion step (P60).
3. The method according to claim 1 or 2,
The conductive polymer coating step (S10, P10) is iron (Fe), copper (Cu), nickel (Ni), carbon monoxide (Co), zinc (Zn), tin (Sn) to enable antistatic to the surface of the base 10 ), A coating method comprising coating a conductive polymer containing a conductive material of gold (Au), silver (Ag), platinum (Pt), radium (Rh), and palladium (Pd).
The method of claim 1,
Etching step (S30) of etching the base surface, the conductive polymer is applied to the base 10 has a concentration of 400 ~ 520 g / L chromic anhydride, sulfuric acid (H ₂ SO ₄ ) 100 ~ 220 g / L concentration Etching or eroding the base surface for 1 to 10 minutes at 63 ~ 73 ℃ using an etchant to form a fine concavo-convex on the surface of the base (10) to improve the adhesion, embedded antenna module manufacturing method.
The method of claim 1,
In the neutralization step (S40), the base 10 is neutralized with hydrochloric acid having a concentration of 10% for 3 minutes, followed by washing with water once, and the same positive or negative electric average position overlaps with each other. A method of manufacturing an embedded antenna module, comprising processing to show no effect at all.
The method of claim 1,
The catalyst step (S50), in order to adsorb the colloid of the Sn / Pb component having a fine colloidal material on the surface of the base 10 through the neutralization step (S40), palladium chloride (PoCl ₂ ) and tin tin chloride ( SnCl ₂ ) was first activated at 25 ° C. for 3 minutes using 100 cc / L of a mixture of 0.25 g / L and 10 g / L, and 100 cc / L hydrochloric acid. A method of manufacturing a built-in antenna module, comprising washing with water.
The method of claim 1,
In the activating step (S60), the base 10 having Sn / Pb colloid adsorbed on the surface was activated for two minutes at a temperature of 57 ° C. using sulfuric acid having a concentration of 13%, and then three times. Washing treatment to remove the Sn compound to allow palladium (Pd) and copper (Cu) to combine, embedded antenna module manufacturing method.
3. The method according to claim 1 or 2,
The electroless copper plating step (S70, P40), after washing the base 10 with water, copper chloride (CuCl ₂ ) 1 ~ 2 g / L, formaldehyde (CH ₂ O) 2.0 ~ 3.0 g / L, caustic soda 6 to 7 g / L, 15 to 20 g / L of EDTA (Ethylene Diamine Tetra Acetic Acid), and 0.1 to 3 using an aqueous solution containing a small amount of 2,2-bipyridyl (2,2-Bypyridyl) A method of manufacturing an embedded antenna module comprising electroless copper plating treatment having a micron and washing with water.
3. The method according to claim 1 or 2,
The pattern region electroplating step (S90, P50), 20 ~ 35 ℃ using a solution in which copper sulfate 210 ~ 300 g / L, sulfuric acid 65 ~ 100 g / L, 10 ~ 20 ml of a mixture of the pattern region of the antenna To have a current density of 0.5 to 4 A / dm 2 within the range of the electroplated to a thickness of 5 to 20 μ (micron), embedded antenna module manufacturing method.
3. The method according to claim 1 or 2,
In the non-pattern area corrosion step (S100, P60), in order to corrode the non-pattern area where the electroless copper plating is treated in the base 10, potassium persulfate (K ₂ S ₂ O ₈ ), sodium perchlorate (NaClO ₄ ), Potassium perchlorate (KClO ₄ ), calcium perchlorate (Ca (ClO ₄ ) ₂ ), potassium peroxide (K ₂ O ₂ ), sodium peroxide (Na ₂ O ₂ ), calcium peroxide (CaO ₂ ), ammonium persulfate (( NH ₄ ) ₂ S ₂ O ₈ ), sodium persulfate (Na ₂ S ₂ O ₈ ), perchloric acid (HClO ₄ ), potassium permanganate (KMnO ₄ ), sodium permanganate (NaMnO ₄ ), potassium dichromate (K ₂ Cr ₂ O ₇ ), 3-15 wt% peroxide selected from the group consisting of a mixture of sodium dichromate (Na ₂ Cr ₂ O ₇ ), 1-15 wt% hydrogen peroxide (H ₂ O ₂ ), carboxylic acid, sulfonic acid or mixtures thereof Using a corrosion solution consisting of 1 to 20 wt% and the amount of water remaining, to form a copper or copper alloy film to corrode.
3. The method according to claim 1 or 2,
The electroplating step (S110, P70) of plating the nickel with the pattern region, the base 10 is nickel sulfate 265 ~ 300 g / L, nickel chloride 35 ~ 45 g / L, boric acid 40 ~ 60 g / L And mixing 10 ml / L of a polisher and subjecting the mixture to an electric titanium plating in a temperature range of 55 to 65 ° C.
The built-in antenna module, characterized in that manufactured by any one of claims 1 to 2.

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