KR101534796B1 - The Antenna of manufacture method using Plastic platting solution - Google Patents

Abstract

The present invention forms a pattern by laser masking a surface layer of a plastic material of a plastic material such as PC (Poly Carbonate) PI (Poly Imide), PET (Polyethylene), and PP (Polypropylene) The present invention relates to a method of manufacturing an antenna using a plastic material that provides electric and electronic characteristics by forming a metal layer only in a laser processing region through a pretreatment process of plating,
The detailed procedure includes a first step of cutting a plastic or film disk including the via hole so as to be energized according to the NFC antenna size; A second step of forming a fine crack on the surface of the plastic plate or the original plate of the plastic plate, which is cut according to the antenna size, so that the seed can be seated upon plating according to the antenna pattern;
A third step of irradiating laser-masked plastic or film with a chemical agent to change the physical properties of the film, and then applying a daisy to the surface of the film, thereby plating a seed of plating to coat a metal film having adhesion; And a fourth step of forming the metal film through the plating process only on the laser masked portion of the seed of the etched plastic or film original plate.
Accordingly, the present invention can be applied to a film material such as PC (Poly Carbonate) PI (Poly Imade) and the like. By realizing a pattern in a general injection structure and using thinner and better electric and electronic properties, And provides an improvement effect.

Description

Technical Field [0001] The present invention relates to an antenna manufacturing method using a plastic material,

The present invention relates to a method of manufacturing an antenna using a plastic material, and more particularly, to a method of manufacturing an antenna by forming a pattern on a surface of a plastic film of a general PC, PI, PET or PP by laser masking, To a method of manufacturing an antenna using a plastic material that provides electrical and electronic characteristics by forming a metal layer only in a laser machining area.

The mobile phone antenna industry is rapidly growing in line with the size of the mobile phone market. In the existing mobile phone market, hardware elements stimulated consumers 'purchase desires, but now they are mostly leveled. Consumers' desire for consumption is shifting to external factors such as thickness and design.

Currently, antennas that maximize space efficiency such as LDS and IMA type are mainly used. Depending on the tendency of other mobile phones, antennas suitable for each usage environment are used. As the spread of smart phones is expanded, functional antennas The market has been steadily expanding as it has been added.

Near Field Communication (NFC) is a non-contact communication technology that uses a frequency band as one of radio tag (RFID) technologies. It is a next generation short-range communication technology that is attracting attention because its communication distance is short. In other words, since it can use both data reading and writing functions, it does not need the dongle that was needed for RFID use, and it is similar to the conventional short range communication technology such as Bluetooth, but it does not need to set the period as like a blue pitcher.

In addition, it is difficult to estimate the size of the global mobile phone antenna market due to the surge in the number of antennas installed in smartphones and the inclusion of NFC antennas in other components.

Therefore, except for DMB and NFC antennas, which are used only for limited devices, except for one main antenna for communication and one LTE antenna, the feature phone has one main antenna for communication and three main antennas and three functional antennas for LTE smartphone , The number of antennas for mobile phones is increasing significantly.

As shown in FIG. 1, a conventional F-PCB NFC (Near Field Communication) antenna is manufactured by cutting an original plate according to the size of an antenna, performing a drilling operation and Cu plating process and then cutting the front face of the cut original plate into a thin plate- The lamination process is performed so that the structures overlap each other in a predetermined direction so as to have a sheet shape, and then the exposure and etching processes are performed (refer to step S30)

Then, the surface is plated and the antenna is manufactured through the printing process.

The F-PCB NFC antenna produced by the procedure described above is formed of the PI PCB of the PCB substrate, which results in a low productivity and an increase in manufacturing cost.

Therefore, NFC antennas applied in smartphones are very expensive among the parts of mobile phones, so that many companies compete to reduce the manufacturing cost, and the miniaturization, light weight, thin film and other parts are being developed. Accordingly, the present invention is proposed to provide an NFC antenna using a new PPS technique required for cost reduction.

1. METHOD MANUFACTURING OF NFC ANTENNA (Patent Application No. 10-2012-0037902) for a mobile communication terminal 2. Loop antenna manufacturing method for NFC (Patent Application No. 10-2013-0013831)

Disclosure of the Invention The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to solve the above-mentioned problems, and an object of the present invention is to provide a method of manufacturing a plastic film, which is made of plastic material such as general PC (poly carbonate) PI (polyimide), PET (polyethylene terephthalate) The present invention is to provide a method of manufacturing an antenna using a plastic material that provides electric and electronic characteristics by forming a pattern through laser masking and forming a metal layer only in a laser processing region through a pretreatment process of plating.

In addition, the present invention can be applied to a plastic (PC, ABS, PI, Nylon, etc.) material using an industrial laser device and an electroless plating method, And an object of the present invention is to provide a method of manufacturing an antenna using a plastic material capable of implementing multiple patterns at once in a CASE pursuing space-intensive, compact, and thin.

However, the objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

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In order to accomplish the above object, according to a second aspect of the present invention, there is provided a method of manufacturing an antenna using a plastic material, comprising the steps of: cutting a plate of a plastic or a film by cutting a via hole, ; A second step of forming a fine crack on the surface of the plastic plate or the original plate of the plastic plate, which is cut according to the antenna size, so that the seed can be seated upon plating according to the antenna pattern; A third step of irradiating laser-masked plastic or film with a chemical agent to change the physical properties of the film, and then applying a daisy to the surface of the film, thereby plating a seed of plating to coat a metal film having adhesion; And a fourth step of forming a metal film on the seed of the etched plastic film or the original plate through a plating process only in the laser masking region.

At this time, according to an additional feature of the present invention, the original plate of the plastic or the film may be any one of PC (Poly Carbonate), PI (Poly Imide), PET (Polyethylene) .

According to an additional feature of the present invention, the etching procedure of the third step includes ultrasonic degreasing of the laser-masked plastic or film at a temperature of 60 to 70 DEG C for 30 minutes at a temperature of 30 to 50 g / A first step of advancing water ultrasonic waves in order to improve the liquefaction phenomena of the plastic and film caused by the used esculin drug; Hydrochloric 10vol% / the hydrochloride three step for 1-2 min at room temperature, ℓ and the activation process is conducted at room temperature and the hydrochloric acid 3㎖ _{PdCl 2 0.1 ~ 0.4g / ℓ,} HCl 100 ~ 300㎖ / ℓ, SnCl .2H 2 O A second step of applying 5 to 30 g / l on the surface of a plastic film to conduct an electrodeposition process at room temperature for 1 to 2 minutes; 10 to 50 g / l of sulfuric acid and 10 to 15 ml / l of sulfuric acid, and the etching process is carried out at 45 to 60 ° C for 1 to 2 minutes. The plastic film is immersed in an aqueous solution containing sulfuric acid at 40 to 80 ml / After the activation process is performed for 2 minutes, the third etching step is carried out at 45 to 60 ° C for 1 to 2 minutes by applying 10 to 50 g / l of strong sulfuric acid and 10 to 15 ml / ; And the second etching step, the activation process is carried out at 40 to 80 ml / l of sulfuric acid at room temperature for 1 to 2 minutes, and 10 vol% / l of sulfuric acid is applied, and the neutralization process is carried out at room temperature for 1 to 2 minutes And the fourth step.

Further, according to an additional feature of the present invention, the plating procedure of the fourth step comprises performing a Ni plating process for 5-10 minutes at a temperature of 50-65 deg. C at a temperature of 5-6 g / l of Ni, A first step of conducting the Cu plating process at a temperature of 40 to 50 DEG C for 5 to 6 hours by using Ni plated plastic against the lower surface and metal copper, caustic soda and formalin as a whole; After the first step, a second step of applying 0.1 to 0.4 g / l of PdCl ₂ and 100 to 300 ml / l of HCl to the surface of a plastic film and conducting an electrodeposition process at room temperature for 1 to 2 minutes; A third step of conducting a Ni plating process for 5 minutes at a temperature of 50 to 65 ° C for 30 minutes with respect to the upper surface of the plastic or film electrodeposited by the above process, 5 to 6 g / l of Ni; And plating process, ultrasonic cleaning is carried out for about 30 seconds to remove chemicals on plastic and film NFC antennas. To prevent discoloration of the generated NFC antenna, 80-100 ml / L of sodium gluconate is applied And a fourth step of performing a color fading treatment at a temperature of 45 to 55 DEG C for 1 minute.

A method of manufacturing an antenna using a plastic material according to an embodiment of the present invention is a method of manufacturing an antenna using a plastic material such as general PC (poly carbonate) PI (polyimide), PET (polyetylene polyethylene) PP (polypropylene) By forming a pattern through laser masking on the surface of the film to form a metal layer only in the laser machining area through the pretreatment process of plating, the cost ratio can be lower than that of the existing F-PCB.

According to another embodiment of the present invention, there is provided a method of manufacturing an antenna using a plastic material, the method comprising the steps of: laminating a plastic (PC, ABS, PI, Nylon, And is formed in a plating type. Thus, it is possible to manufacture various types of antennas, to pursue space-intensive, small-sized, and thin-walled antennas, and to realize multiple patterns at once in a case.

In addition, the method of manufacturing an antenna using a plastic material according to another embodiment of the present invention is capable of soldering SMT in a plated state due to the characteristic of a PI (Poly Imide) film, So that there is no mechanical restriction and it is possible to increase the productivity by supplying and manufacturing the antenna of the plating method.

In addition, it can be applied to film materials such as PC (Poly Carbonate) PI (Poly Imade), etc., and realizes space and cost improvement by utilizing patterns of thinner and better electric and electronic characteristics to provide.

FIG. 1 is a flowchart showing a conventional F-PCB NFC antenna manufacturing process.
2 is a flowchart illustrating an antenna manufacturing process using a PPS according to the present invention.
FIGS. 3 to 5 are views showing a state of the PPS material according to the present invention,

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a detailed description of preferred embodiments of the present invention will be given with reference to the accompanying drawings. In the following description of the present invention, detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

The method of manufacturing an antenna using the plastic material of the present invention is configured to form a pattern on a surface layer of a plastic film by laser masking to form a metal layer only in a laser processing region through a pretreatment process of plating.

The plastic material may be selected from the group consisting of PC (Poly Carbonate), PI (Polyimide), PET (Polyethylene), PP (polypropylene) and ABS (acrylonitrile + butadiene + styrene) Butadiene, and styrene, and an impact-resistant thermoplastic resin and a resin of PBT (polybutylene terephthalate) can be selectively used.

Hereinafter, a method of manufacturing an antenna using a plastic material according to an embodiment of the present invention will be described in detail.

2. Description of the Related Art [0002] Generally, a PPS (Plastic Plating Solution) antenna manufacturing process forms a pattern through laser masking on a surface layer of a plastic or a film. The PPS NFC antenna manufacturing method according to the present invention, The original plate is cut according to the size of the antenna on the original plate of the film, and the drilling process is carried out.

In this case, the shape of the plastic or film at the time of cutting the original plate is cut considering the future mass production of the laser process and the post-process, and a via hole that can be energized by using a guide hole and both sides according to the jig necessary for the laser process and the plating process It is made in advance in the cutting process.

The laser masking process is performed to form a pattern on the original plate formed through the drilling process. At this time, fine cracks having a depth of 10 to 15 microns are generated on the surface of the plastic or film, , The frontal physical etching process is performed first.

The fine cracks facilitating the deposition of the seeds of the plating serve to make the initial conditions that the laser-masked portions only become faster and deeply etched during the surface etching process of the plating solution during the plating pretreatment process.

In the etching process, the main chain which is the material component of the plastic and the film is grasped, and the main chain is changed by the chemical property to give the daisy to the surface, thereby seeding the seed, which is an essential requirement of plating, and coating the metal film with the adhesion.

Thereafter, the plating process is performed, and Cu plating and Ni plating may be sequentially performed, and then Cu plating, Ni plating, and Au plating may be sequentially performed. Generally, the plating process is performed on the surface of the plastic film in the form of ABS injection plating, but the plating process of the present invention proceeds with the plating process for the selected region in the pretreatment process. Thus, in the plating process, alkaline, acid-based chemicals can provide additional etching effects through time and concentration control only to the laser-masked portions to minimize damage to the surface of the film.

After that, the seed is subjected to a process that only a laser masking region can be planted, a metal film is formed to finish the plating, and the outer shape of the NFC antenna is processed.

In detail, the detailed manufacturing process of an antenna of a plastic platting solution (PPS) through PI (Poly Imide) and PC (Polycarbonate) among plastics and film materials according to the present invention will be described. , The original plate of the film is cut. At this time, a via hole is formed so that the guide hole and the both surfaces can be energized.

Through the drilling process, laser masking treatment is performed so as to generate fine cracks so that the seeds can be seated when plating according to the pattern shape on the surface of the plastic or film formed disk. At this time, the depth of the fine crack to deposit the seed at plating may be 10-15 microns deep.

The fine cracks facilitating the deposition of the seeds of the plating serve to make the initial conditions that the laser-masked portions only become faster and deeply etched during the surface etching process of the plating solution during the plating pretreatment process.

That is, in the etching process described below, the main chain which is the material component of the plastic and the film is grasped, and the main chain is changed by the chemical property to give a daisy to the surface to plant the seed, which is an essential requirement of plating, The branches are coated with a metal film.

Then, the etching process of the PI (Poly Imide) sheet is performed by ultrasonically degreasing the laser-masked plastic and the film at a temperature of 60 to 70 ° C for 5 minutes at a temperature of 30 to 50 g / l of esculin, Process improves the liquefaction phenomena of plastic and film caused by escherin chemicals used in ultrasonic degreasing.

Hydrochloric 10vol% / the hydrochloride three step for 1-2 min at room temperature, ℓ and the activation process is conducted at room temperature and the hydrochloric acid 3㎖ _{PdCl 2 0.1 ~ 0.4g / ℓ,} HCl 100 ~ 300㎖ / ℓ, SnCl .2H 2 O 5 to 30 g / l is applied to the surface of a plastic film and the electrodeposition process is carried out at room temperature for 1 to 2 minutes.

Then, 10 to 50 g / l of sulfuric acid and 10 to 15 ml / l of sulfuric acid are applied, and the etching process is performed at 45 to 60 ° C for 1 to 2 minutes. After the etching process, the activation process is carried out at 40 to 80 ml / l of sulfuric acid at room temperature for 1 to 2 minutes, and 10 to 50 g / l of sulfuric acid and 10 to 15 ml / The secondary etching process proceeds at a temperature of 45 to 60 DEG C for 1 to 2 minutes. After the secondary process is completed, the activation process proceeds at 40 to 80 ml / l of sulfuric acid at room temperature for 1 to 2 minutes, and 10 vol% / l of sulfuric acid is applied and the neutralization process is performed at room temperature for 1 to 2 minutes.

When the above etching process is completed, the plating process is performed on the laser masking and the etched plastic and the film cut and cut. First, 5 to 6 g / l of Ni is applied to the lower surface of the plastic film at a temperature of 50 to 65 ° C The Ni plating process is carried out for 7 to 10 minutes and the Cu plating process is carried out for 5 to 6 hours at a temperature of 40 to 50 DEG C using Ni-plated plastic for the lower surface, metal copper, caustic soda, 0.1 to 0.4 g / l of PdCl ₂ and 100 to 300 ml / l of HCl are applied to the surface of the plastic film, and the electrodeposition process is performed at room temperature for 1 to 2 minutes.

The plating process is finished by performing the Ni plating process for 5 minutes at a temperature of 50 to 65 ° C for 30 minutes on the upper surface of the plastic or film electrodeposited by the above process for 5 to 6 g /

In this case, ultrasonic cleaning is performed for about 30 seconds in order to remove the chemicals on the plastic or film NFC antenna, and the discoloration of the generated NFC antenna is prevented Sodium Gluconate 80 ~ 100ml / ℓ is applied to prevent discoloration at 45 ~ 55 ℃ for 1 minute.

On the other hand, in the etching process of PC (Poly Carbonate) sheet among the raw materials of the original plate and the laser-masked plastic or film, the laser masked plastic or film is irradiated with 30 to 50 g / After ultrasonic degreasing for a minute,

The ultrasonic degreased plastic film was immersed in the front side at 40 to 90 g / l and subjected to the immersion degreasing process at a temperature of 55 to 65 ° C for 5 to 15 minutes, Plastic and film liquefaction phenomenon improves.

Hydrochloric 10vol% / the hydrochloride three step for 1-2 min at room temperature, ℓ and the activation process is conducted at room temperature and the hydrochloric acid 3㎖ _{PdCl 2 0.1 ~ 0.4g / ℓ,} HCl 100 ~ 300㎖ / ℓ, SnCl .2H 2 O 5 to 30 g / l is applied to the surface of a plastic film and the electrodeposition process is carried out at room temperature for 1 to 2 minutes.

Then, 10 to 50 g / l of sulfuric acid and 10 to 15 ml / l of sulfuric acid are applied, and the etching process is performed at 45 to 60 ° C for 1 to 2 minutes. After the etching process, the activation process is carried out at 40 to 80 ml / l of sulfuric acid at room temperature for 1 to 2 minutes, and 10 to 50 g / l of sulfuric acid and 10 to 15 ml / The secondary etching process proceeds at a temperature of 45 to 60 DEG C for 1 to 2 minutes. After the secondary process is completed, the activation process proceeds at 40 to 80 ml / l of sulfuric acid at room temperature for 1 to 2 minutes, and 10 vol% / l of sulfuric acid is applied and the neutralization process is performed at room temperature for 1 to 2 minutes.

When the above etching process is completed, the plating process is performed on the laser masking and the etched plastic and the film cut and cut. First, 5 to 6 g / l of Ni is applied to the lower surface of the plastic film at a temperature of 50 to 65 ° C The Ni plating process is carried out for 7 to 10 minutes and the Cu plating process is carried out for 5 to 6 hours at a temperature of 40 to 50 DEG C using Ni-plated plastic for the lower surface, metal copper, caustic soda, 0.1 to 0.4 g / l of PdCl ₂ and 100 to 300 ml / l of HCl are applied to the surface of the plastic film, and the electrodeposition process is performed at room temperature for 1 to 2 minutes.

The plating process is finished by performing the Ni plating process for 5 minutes at a temperature of 50 to 65 ° C for 30 minutes on the upper surface of the plastic or film electrodeposited by the above process for 5 to 6 g /

In this case, ultrasonic cleaning is performed for about 30 seconds in order to remove the chemicals on the plastic or film NFC antenna, and the discoloration of the generated NFC antenna is prevented Sodium Gluconate 80 ~ 100ml / ℓ is applied to prevent discoloration at 45 ~ 55 ℃ for 1 minute.

The PI (Poly Imide) of an NFC antenna of a plastic platting solution (PPS) manufactured by the above process is a commercially available heat resistant non-metallic material used at temperatures up to 300 ° C. It has excellent thermodynamic properties and heat resistance, HDT 260 ° C, Tm 338 ° C, tensile strength 800 kg / cm ² , elongation 10%, flexural modulus 40 kg / cm ² (Polycarbonate) is a flame retardant material that is widely used in various electronic devices because it has excellent electrical insulation, heat resistance and cold resistance. It is easy to cut, mold release, and hole processing. As one of the materials, the electric and electronic characteristics are excellent when manufacturing a plating type antenna.

As shown in FIG. 3, the laser masking procedure of the antenna manufacturing process of a plastic platting solution (PPS) according to the present invention will be described. First, after checking the appearance of the cut plastic and film, Confirm the marking position required for laser masking on the masking jig, assemble the cut plastic or film to the jig as shown in FIG.

Then, as shown in FIG. 5, the assembled plastic or film is seated on the hole and laser masking is performed. After the laser masking, the coating film is checked for the removed state and the peripheral line is shaken, and the etching process is performed.

As described above, preferred embodiments of the present invention have been disclosed in the present specification and drawings, and although specific terms have been used, they have been used only in a general sense to easily describe the technical contents of the present invention and to facilitate understanding of the invention , And are not intended to limit the scope of the present invention. It is to be understood by those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.

Claims (5)

delete Plastic plate made of any one of PC (Poly Carbonate) PI (Polyimide), PET (Polyethylene) or PP (Polypropylene) A first step of cutting including a via hole; A second step of forming a fine crack on the surface of the plastic plate or the original plate of the plastic plate, which is cut according to the antenna size, so that the seed can be seated upon plating according to the antenna pattern; A third step of irradiating laser-masked plastic or film with a chemical agent to change the physical properties of the film, and then applying a daisy to the surface of the film, thereby plating a seed of plating to coat a metal film having adhesion; And a fourth step of forming a metal film on the seed of the etched plastic film or the original plate through a plating process only in a laser masked area,
The etching procedure of the third step
Laser masked plastic and film were ultrasonically degreased at 30 ~ 50g / ℓ at 60 ~ 70 ℃ for 5 minutes. Ultrasonic degreasing was used for ultrasonic degreasing to improve the liquefaction of plastics and films. ;
Hydrochloric 10vol% / the hydrochloride three step for 1-2 min at room temperature, ℓ and the activation process is conducted at room temperature and the hydrochloric acid 3㎖ _{PdCl 2 0.1 ~ 0.4g / ℓ,} HCl 100 ~ 300㎖ / ℓ, SnCl .2H 2 O A second step of applying 5 to 30 g / l on the surface of a plastic film to conduct an electrodeposition process at room temperature for 1 to 2 minutes;
10 to 50 g / l of sulfuric acid and 10 to 15 ml / l of sulfuric acid, and the etching process is carried out at 45 to 60 ° C for 1 to 2 minutes. The plastic film is immersed in an aqueous solution containing sulfuric acid at 40 to 80 ml / After the activation process is performed for 2 minutes, the third etching step is carried out at 45 to 60 ° C for 1 to 2 minutes by applying 10 to 50 g / l of strong sulfuric acid and 10 to 15 ml / ; And
After the second etching step, the activation process is carried out at 40 to 80 ml / l of sulfuric acid at room temperature for 1 to 2 minutes, and 10 vol% / l of sulfuric acid is applied, and the neutralization process is carried out at room temperature for 1 to 2 minutes. The method of manufacturing an antenna using a plastic material according to claim 1,
delete delete 3. The method of claim 2,
The plating procedure of the fourth step
Plated on the lower surface of the plastic and film at a temperature of 50 to 65 ° C for 7 to 10 minutes, and the Ni-plated plastic is applied to the lower surface of the film and the entire film is coated with metal copper, caustic soda , A first step of conducting a Cu plating process at a temperature of 40 to 50 DEG C for 5 to 6 hours using formalin
After the first step, a second step of applying 0.1 to 0.4 g / l of PdCl ₂ and 100 to 300 ml / l of HCl to the surface of a plastic film and conducting an electrodeposition process at room temperature for 1 to 2 minutes;
A third step of conducting a Ni plating process for 5 minutes at a temperature of 50 to 65 ° C for 30 minutes with respect to the upper surface of the plastic or film electrodeposited by the above process, 5 to 6 g / l of Ni; And
Ultrasonic cleaning was performed for 30 seconds to remove the chemicals on plastic and film NFC antennas by plating process. To prevent discoloration of the NFC antenna, 80 ~ 100ml / ℓ of Sodium Gluconate was applied to obtain 45 And a fourth step of performing a discoloration prevention treatment at a temperature of ~ 55 ° C for one minute.

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