KR20150019255A

KR20150019255A - Method of Manufacturing Antenna

Info

Publication number: KR20150019255A
Application number: KR20130095881A
Authority: KR
Inventors: 박득일; 이석원
Original assignee: 주식회사 루피너스
Priority date: 2013-08-13
Filing date: 2013-08-13
Publication date: 2015-02-25

Abstract

A method of forming an antenna according to the present invention includes a first step of preparing a panel to form an antenna, a second step of attaching a film to an antenna forming part of the panel, etching the film using a laser, A fourth step of forming a metal thin film by spraying a conductive material forming the antenna on the film on which the pattern is formed, and a fifth step of removing the film.

Description

Antenna Forming Method {Method of Manufacturing Antenna}

The present invention relates to an antenna forming method, and more particularly, to an antenna forming method capable of minimizing the size and thickness of a portable device, simplifying a manufacturing process and a manufacturing time, minimizing a defect rate, To an antenna forming method.

Generally, a portable wireless communication terminal such as a cellular phone or a mobile phone is provided with an antenna for transmitting and receiving a wireless signal.

Such an antenna is divided into an external type and an internal type according to a mounting method, and an internal antenna is referred to as an intenna.

Intenna is a special antenna designed to keep the antenna characteristics without the protrusion on the outside by being mounted inside the terminal. It has been developed in various ways for the purpose of miniaturization of the terminal, design and improvement of the Specific Absorption Rate (SAR) It is not yet possible to replace the conventional protruding antenna.

The antenna of a mobile communication terminal such as a mobile phone has been mainly made of an external protruding type such as a helical antenna and a whip antenna in the past. Recently, a PIFA having a narrow bandwidth, a low gain but easy to manufacture, PCB type metal film PCB, ceramic chip antenna, low temperature co-fired ceramics (LTCC) antenna, and various types of built-in antennas in a three-dimensional shape have been put to practical use including Planar Inverted-F Antenna.

As an example of such a built-in antenna, Korean Patent Registration Nos. 0605421 and 0735701 propose to form an antenna by forming a metal thin film pattern on a substrate of a nonconductive material. Conventionally, in forming a metal thin film pattern on a substrate which is a nonconductive material, a pattern is formed by applying a metal paste, followed by drying and etching, or a thin copper plate is adhered with an adhesive or by an insert mold method , The manufacturing process is complicated, a large number of defects are generated, and there is a problem that the thickness is also limited.

Korean Patent Laid-Open Publication No. 2006-0040464 discloses a method in which a groove having a predetermined depth is formed along an antenna pattern on a substrate which is a nonconductive material, a metal paste is applied on the entire surface of the substrate including the grooves, There is disclosed a method of forming an antenna pattern having a metal embedded along the groove. However, since this method requires a mechanical working process, mass production is difficult and the metal paste component dried during the machining is dropped from the substrate groove And the like.

On the other hand, in Korean Patent Registration No. 0573309, a non-conductive synthetic resin film such as plastic, polycarbonate, or polyethylene resin is cut along a desired antenna pattern and is plated with a metal to manufacture an antenna and then attached to an external case of a terminal Method is disclosed. In order to perform plating of the surface of a product made of a non-conductive material such as a plastic product, a pretreatment process for imparting conductivity to the portion to be plated should precede. Pretreatment to impart conductivity generally includes etching and activation processes. Etching is a process for roughly scraping off a portion to be plated of a product to form a hole through which a noble metal particle such as palladium can physically be caught, for example, a palladium-containing colloidal solution containing tin and palladium. Followed by sulfuric acid treatment to immobilize the palladium metal particles in the holes formed by the etching. The surface of the product is imparted with conductivity by the palladium metal particles thus captured, and the surface of the product to which conductivity is imparted can be electroplated or electrolessly plated similarly to metal.

Conventionally, an ABS resin paint or the like has been proposed for pretreatment of plating for applying a metal film to a thermoplastic resin or a thermosetting resin. However, it is effective only for some plastic products such as ABS resin, and for other plastic products such as polycarbonate, The metal capturing performance is not greatly improved, and the plating is easily peeled due to the weak adhesion force. In this case, the adhesion can be improved by increasing the etching time as described above so that the hole for the physical trapping of the catalyst metal is formed deeply, but the improvement is limited, and the surface of the product is excessively modified, And the like.

KR2004-0090067 10

Accordingly, the present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to minimize the size and thickness of a portable device, simplify a manufacturing process and a manufacturing time, minimize a defect rate, The present invention provides a method of forming an antenna.

According to another aspect of the present invention, there is provided an antenna forming method comprising the steps of: preparing a panel to form an antenna; attaching a film to an antenna forming portion of the panel; A third step of forming a pattern of the antenna by etching, a fourth step of forming a metal thin film by spraying a conductive material forming the antenna on the film on which the pattern is formed, and a fifth step of removing the film .

At this time, in the third step, the pattern may be formed in a shape corresponding to the frequency characteristic of the terminal communication portable device.

In the third step, the panel may be etched with the film to a predetermined depth.

In the fourth step, a high-pressure spray nozzle may be used.

The fourth step may form the thin metal film by spraying the conductive material to a thickness corresponding to the frequency characteristic of the terminal communication portable device.

In the fourth step, the conductive material may be formed to be equal to or smaller than the width of the pattern.

In addition, the conductive material may be silver.

The present invention has the following effects.

First, since the manufacturing process is simple and the manufacturing time is reduced, the working efficiency can be improved and the manufacturing cost can be reduced.

Secondly, there is an effect that the defective rate of antenna formation can be minimized by using a method of injecting a conductive material.

Third, since a pattern is formed on a film by using a laser, it is easy to form a pattern, and a 3D pattern of a complex and various shapes can be easily formed without limitation on the shape of the pattern.

Fourth, since the thickness of the metal thin film forming the antenna can be minimized, the size and volume of the portable device using the antenna can be minimized.

Fifth, even if the pattern of the antenna is changed, there is an effect that it can be used without changing the apparatus and method.

BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate preferred embodiments of the invention and, together with the description, serve to further the understanding of the technical idea of the invention, And shall not be interpreted.
FIG. 1 is a flowchart sequentially illustrating an antenna forming method according to the present invention; FIG. And
FIG. 2 is a schematic front view showing an antenna forming method according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a flow chart sequentially showing an antenna forming method according to the present invention, and FIG. 2 is a schematic front view sequentially showing an antenna forming method according to the present invention. First, as shown in FIGS. 1 and 2A, a panel 100 having an antenna 300 is prepared (S100). The panel 100 may be a case of a portable device such as a cellular phone. The case of such a portable device can be formed of a plastic such as polycarbonate. In addition, the panel 100 may be of any type as long as the antenna 300 can be formed only by using a case of a portable device. In addition, the panel 100 may be made of any material as long as it is a non-conductive material.

Next, as shown in FIG. 2B, the film 200 is attached to a portion where the antenna 300 is to be formed (S200). The film 200 has a relatively larger area than the pattern 210 of the antenna 300 to be formed.

Next, as shown in FIGS. 2C and 2D, the pattern 200 of the antenna 300 is formed by etching the film 200 using the laser L (S300). At this time, it is preferable that the intensity of the laser beam L irradiated by the film 200 is irradiated with the intensity that does not give much influence to the panel 100, because the film 200 is rusted. In addition, the pattern 210 has a different phenomenon depending on the frequency characteristics of the portable device, and is not limited to the shape such as a loop shape or a closed loop shape. The pattern 210 may be formed on the film 200, And can be selectively formed in consideration of the type of portable equipment and the like. At this time, a pattern 210 is formed by considering the shape of the panel 100 on which the pattern 210 is formed. In addition, the panel 210 may be formed with a pattern 210 at a predetermined depth along with the film 200. As described above, when the grooves are formed in the panel 100 to have a predetermined depth, the antenna characteristics can be easily maintained and peeling of the conductive material E to be described later can be more reliably prevented.

Next, as shown in FIG. 2E, a conductive material E such as conductive metal particles is sprayed onto the film 200 on which the pattern 210 is formed. In this manner, the injected conductive material E is cured to form the metal thin film 300 (S400). At this time, the conductive material E is injected by using the high-pressure injection nozzle 400 in order to improve the adhesion with the panel 100. The use of the high-pressure spray nozzle 400 improves the adhesion between the conductive material E and the panel 100 because the conductive material E is injected at a high pressure. When the panel 100 has grooves with a predetermined depth, The conductive material E is inserted into the groove and the adhesion is further improved, so that the peeling can be more reliably prevented. The thickness of the metal thin film 300 varies depending on the injection pressure and time of the conductive material E. The thickness of the metal thin film 300 is set to be a thickness corresponding to the frequency specification of the portable device, Can be adjusted. At this time, the metal thin film 300 may be formed to be more or less than the width of the pattern 210 in order to more easily form the metal thin film 300 and to easily maintain the frequency characteristics of the portable device. Since the conductive metal particles are sprayed on the panel 100 by adjusting the strength of the grooves by etching, the defective rate is remarkably reduced as compared with the conventional plating method in which the groove is formed in the panel 100 Effect can be obtained. Any conductive material may be used as long as it is a metal or a metal having high conductivity. Preferably, silver (Ag) having the highest conductivity among metals is used.

Finally, as shown in FIG. 2F, the film 200 is removed (S500). As described above, when the film 200 is removed, the conductive material E remains only in the pattern 210 formed on the film 200 by the laser L to form the metal thin film 300, 300 constitute the antenna 300. [

As described above, those skilled in the art will understand that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

100: Panel
200: film
210: pattern
300: antenna (metal thin film)
400: High-pressure injection nozzle
L: Laser
E: Conductive material

Claims

A first step of preparing a panel to form an antenna;
A second step of attaching a film to an antenna forming portion of the panel;
A third step of etching the film using a laser to form a pattern of the antenna;
A fourth step of forming a metal thin film by spraying a conductive material forming the antenna on the film on which the pattern is formed; And
A fifth step of removing the film;
/ RTI >

The method according to claim 1,
Wherein the pattern is formed in a shape corresponding to a frequency characteristic of the terminal communication portable device in the third step.

The method according to claim 1,
Wherein the third step etches the panel together with the film to a predetermined depth.

The method according to claim 1,
Wherein the fourth step is a high-pressure spray nozzle.

The method according to claim 1,
Wherein the fourth step forms the thin metal film by spraying the conductive material to a thickness corresponding to a frequency characteristic of the terminal communication portable device.

The method according to claim 1,
Wherein the conductive material is formed to have a width equal to or smaller than a width of the pattern.

The method according to claim 1,
Wherein the conductive material is silver.