US20150111047A1 - Chemical plating product and method forming thereof - Google Patents

Chemical plating product and method forming thereof Download PDF

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Publication number
US20150111047A1
US20150111047A1 US14/337,083 US201414337083A US2015111047A1 US 20150111047 A1 US20150111047 A1 US 20150111047A1 US 201414337083 A US201414337083 A US 201414337083A US 2015111047 A1 US2015111047 A1 US 2015111047A1
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Prior art keywords
chemical
plating
product
nickel
insulating member
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US14/337,083
Inventor
Chun-Yi Chang
Wei-Hao Su
Chin-Wang Lee
Cheng-Lung Chen
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Foxconn Interconnect Technology Ltd
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Foxconn Interconnect Technology Ltd
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Assigned to HON HAI PRECISION INDUSTRY CO., LTD. reassignment HON HAI PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHANG, CHUN-YI, CHEN, CHENG-LUNG, LEE, CHIN-WANG, SU, WEI-HAO
Assigned to FOXCONN INTERCONNECT TECHNOLOGY LIMITED reassignment FOXCONN INTERCONNECT TECHNOLOGY LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HON HAI PRECISION INDUSTRY CO., LTD.
Publication of US20150111047A1 publication Critical patent/US20150111047A1/en
Abandoned legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Definitions

  • the present invention relates to chemical plating product and method forming thereof, and more particularly to chemical plating product and method forming thereof using on electrical products.
  • the wireless member is an antenna assembled on the electrical products for transmitting and receiving signals. There are some methods to assemble the antenna. In the original, a punch formed three-dimensional antenna is positioned on an insulating housing through nuts. Then a three-dimensional antenna is formed on an insulating housing by laser engraving method.
  • Laser engraving method is using high strengthen focusing laser light to oxidation material on the focusing point to process product.
  • This method is disclosed by Chinese patent 02127135.6 which issued on Jan. 28, 204, which disclose a laser carving electroplating method on a plastic surface, which includes: selecting a plastic material with transmission property, coating whole back surface of said plastic material with transmissive anti-plating printing ink, coating front surface of said plastic material with metal film to make pretreatment, laser carving said front surface coated with metal film to form required pattern.
  • this method for forming antenna needs a laser carving machine, which adds the cost.
  • the traditional laser engraving coating technology need special plastic member adding with intermetallic compound, and then using laser carving technology to form metal core on the surface of the plastic member, and then coating metal on the surface of the plastic member to control the required coating pattern or scope.
  • This technology has the disadvantages as following: need special plastic member adding with intermetallic compound which adds the cost; need laser carving machine which adds the cost.
  • an object of the present invention is to provide a chemical plating method which can control the scope of the plated pattern.
  • a chemical plating product formed by chemical method comprises an insulating member and a metal coating covering the insulative housing, the metal coating including a pre-plating scope formed by a coating catalyst and a chemical copper layer covering the pre-plating scope.
  • FIG. 1 is an isometric view of an insulating member according to the present invention
  • FIG. 2 is an isometric view of the insulating member after coating as shown in FIG. 1 ;
  • FIG. 3 is an isometric view of the semi-product of the chemical plating product according to the present invention.
  • FIGS. 1 to 3 illustrate a method for forming a chemical plating product, includes: (a). provide an insulating member 1 ; (b). put the insulating member 1 into chemical solution to make it being chemical demoulded, and then make the surface of the insulating member 1 coarse; (c). plate the insulating member 1 to confirm the pre-plating scope 2 by coating catalyst, in this embodiment, the pre-plating scope 2 is configured with “+” shape; (d). chemical plating copper 3 on the pre-plating scope 2 to form semi-product. (e). form planar shaped organic nanopalladium metal conductive layer on the pre-plating scope 2 on the basis of step (c). (f).
  • step (c) stereo shaped nanopalladium metal conductive layer on the pre-plating scope 2 on the basis of step (c).
  • step (g) chemical plating copper, nickel and gold on the basis of step (d) to form product successively.
  • step (h) electro plating copper, nickel and gold on the basis of step of (d) to form product successively.
  • step (i). electro plating copper and nickel on the basis of step (d).
  • the chemical plating product comprises an insulating member 1 and a metal coating covering the insulating member 1 , the metal coating includes a pre-plating scope 2 formed by a coating catalyst and a chemical copper layer 3 covering the pre-plating scope 2 . And make at least the pre-plating scope 2 of the insulating member 1 coarse.
  • the chemical plating product includes a planar shaped organic nanopalladium metal conductive layer on the pre-plating scope 2 or a stereo shaped nanopalladium metal conductive layer on the pre-plating scope 2 .
  • electro plating nickel and gold on the chemical copper layer In the first embodiment of the invention, chemical plating nickel and gold on the chemical copper layer. In the second embodiment of the invention, electro plating copper, nickel and gold on the chemical copper layer, due to electro plating nickel can prevent oxidation. In the third embodiment of the invention, electro plating copper, nickel and black nickel on the chemical copper layer, due to electro plating black nickel can add radio frequency of the product. In the fourth embodiment of the invention, electro plating copper, nickel and gold on the chemical copper layer to add the soldering feature.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The invention discloses a chemical plating product and method forming thereof, the chemical plating product includes an insulating member (1) and a metal coating covering the insulating member (1), the metal coating includes a pre-plating scope (2) formed by a coating catalyst and a chemical copper layer (3) covering the pre-plating scope (2).

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to chemical plating product and method forming thereof, and more particularly to chemical plating product and method forming thereof using on electrical products.
  • 2. Description of Related Art
  • Electrical products use wireless member for communication and using internet. The wireless member is an antenna assembled on the electrical products for transmitting and receiving signals. There are some methods to assemble the antenna. In the original, a punch formed three-dimensional antenna is positioned on an insulating housing through nuts. Then a three-dimensional antenna is formed on an insulating housing by laser engraving method.
  • Laser engraving method is using high strengthen focusing laser light to oxidation material on the focusing point to process product. This method is disclosed by Chinese patent 02127135.6 which issued on Jan. 28, 204, which disclose a laser carving electroplating method on a plastic surface, which includes: selecting a plastic material with transmission property, coating whole back surface of said plastic material with transmissive anti-plating printing ink, coating front surface of said plastic material with metal film to make pretreatment, laser carving said front surface coated with metal film to form required pattern. However, this method for forming antenna needs a laser carving machine, which adds the cost.
  • In addition, the traditional laser engraving coating technology need special plastic member adding with intermetallic compound, and then using laser carving technology to form metal core on the surface of the plastic member, and then coating metal on the surface of the plastic member to control the required coating pattern or scope. This technology has the disadvantages as following: need special plastic member adding with intermetallic compound which adds the cost; need laser carving machine which adds the cost.
  • Hence, it is desirable to provide an improved method for forming product to overcome the aforementioned disadvantages.
    • SUMMARY OF THE INVENTION
  • Accordingly, an object of the present invention is to provide a chemical plating method which can control the scope of the plated pattern.
  • According to one aspect of the present invention, a chemical plating product formed by chemical method, comprises an insulating member and a metal coating covering the insulative housing, the metal coating including a pre-plating scope formed by a coating catalyst and a chemical copper layer covering the pre-plating scope.
  • Other objects, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an isometric view of an insulating member according to the present invention;
  • FIG. 2 is an isometric view of the insulating member after coating as shown in FIG. 1; and
  • FIG. 3 is an isometric view of the semi-product of the chemical plating product according to the present invention.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • Reference will now be made to the drawings to describe the present invention in detail.
  • FIGS. 1 to 3 illustrate a method for forming a chemical plating product, includes: (a). provide an insulating member 1; (b). put the insulating member 1 into chemical solution to make it being chemical demoulded, and then make the surface of the insulating member 1 coarse; (c). plate the insulating member 1 to confirm the pre-plating scope 2 by coating catalyst, in this embodiment, the pre-plating scope 2 is configured with “+” shape; (d). chemical plating copper 3 on the pre-plating scope 2 to form semi-product. (e). form planar shaped organic nanopalladium metal conductive layer on the pre-plating scope 2 on the basis of step (c). (f). form stereo shaped nanopalladium metal conductive layer on the pre-plating scope 2 on the basis of step (c). (g). chemical plating copper, nickel and gold on the basis of step (d) to form product successively. (h). electro plating copper, nickel and gold on the basis of step of (d) to form product successively. (i). electro plating copper and nickel on the basis of step (d). (j). electro plating black nickel on the basis of step (i). (k). electro plating gold on the basis of step (i). Wherein make the surface of the insulating member 1 coarse to increase the bonding force between the coating metal layer and the insulating member 1. Wherein during the step of (g) to step of (k), due to the other scope of the insulating member 1 preclude the pre-plating scope 2 will not be plating with metal layer, thus can control the coating scope in the following steps. This method in this invention needs no laser carving machine to confirm the pre-plating scope 2, which reduce the cost.
  • Referring to FIGS. 1 to 3, the chemical plating product comprises an insulating member 1 and a metal coating covering the insulating member 1, the metal coating includes a pre-plating scope 2 formed by a coating catalyst and a chemical copper layer 3 covering the pre-plating scope 2. And make at least the pre-plating scope 2 of the insulating member 1 coarse.
  • The chemical plating product includes a planar shaped organic nanopalladium metal conductive layer on the pre-plating scope 2 or a stereo shaped nanopalladium metal conductive layer on the pre-plating scope 2.
  • In the first embodiment of the invention, chemical plating nickel and gold on the chemical copper layer. In the second embodiment of the invention, electro plating copper, nickel and gold on the chemical copper layer, due to electro plating nickel can prevent oxidation. In the third embodiment of the invention, electro plating copper, nickel and black nickel on the chemical copper layer, due to electro plating black nickel can add radio frequency of the product. In the fourth embodiment of the invention, electro plating copper, nickel and gold on the chemical copper layer to add the soldering feature.
  • While the preferred embodiments in accordance with the present invention has been shown and described, equivalent modifications and changes known to persons skilled in the art according to the spirit of the present invention are considered within the scope of the present invention as defined in the appended claims.

Claims (17)

What is claimed is:
1. A chemical plating product formed by chemical method, comprising:
an insulating member; and
a metal coating covering the insulative housing, the metal coating including a pre-plating scope formed by a coating catalyst and a chemical copper layer covering the pre-plating scope.
2. The chemical plating product as claimed in claim 1, wherein at least the pre-plating scope of the insulating member is chemical demoulded and is made coarse.
3. The chemical plating product as claimed in claim 2, wherein chemical plating nickel and gold on the chemical copper layer.
4. The chemical plating product as claimed in claim 2, wherein electro plating copper, nickel and gold on the chemical copper layer.
5. The chemical plating product as claimed in claim 2, wherein electro plating copper and nickel on the chemical copper layer.
6. The chemical plating product as claimed in claim 5, wherein electro plating black nickel on the electro plating nickel.
7. The chemical plating product as claimed in claim 1, wherein the coating catalyst is a planar shaped organic nanopalladium metal conductive layer.
8. The chemical plating product as claimed in claim 1, wherein the coating catalyst is a stereo shaped nanopalladium metal conductive layer.
9. A method for forming a chemical plating product, including:
(a). providing an insulating member;
(b). putting the insulating member into chemical solution to make it being chemical demoulded, and then make the surface of the insulating member coarse;
(c). plating the insulating member to confirm the pre-plating scope by coating catalyst;
(d). chemical-plating copper on the pre-plating scope.
10. The method for forming a chemical plating product as claimed in claim 9, wherein the coating catalyst in step (c) is a planar shaped organic nanopalladium metal conductive layer.
11. The method for forming a chemical plating product as claimed in claim 9, wherein the coating catalyst in step (c) is a stereo shaped nanopalladium metal conductive layer.
12. The method for forming a chemical plating product as claimed in claim 10, wherein chemical plating copper, nickel and gold on the basis of step (d).
13. The method for forming a chemical plating product as claimed in claim 10, wherein electro plating copper and nickel on the basis of step (d).
14. The method for forming a chemical plating product as claimed in claim 13, wherein electro plating black nickel on the electro plating nickel layer.
15. The method for forming a chemical plating product as claimed in claim 13, wherein electro plating gold the electro plating nickel layer.
16. A chemical plating product comprising:
an insulating member;
a coarse surface formed on the insulating member;
a catalyst layer coated upon a selected area of the coarse surface; and
a chemical copper layer covering the catalyst layer and no chemical copper layer is formed on other non-selected area of the coarse surface.
17. The chemical plating product as claimed in claim 16, further including a layers of gold, nickel and copper on the chemical copper layer.
US14/337,083 2013-10-22 2014-07-21 Chemical plating product and method forming thereof Abandoned US20150111047A1 (en)

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Citations (6)

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Publication number Priority date Publication date Assignee Title
US7291380B2 (en) * 2004-07-09 2007-11-06 Hewlett-Packard Development Company, L.P. Laser enhanced plating for forming wiring patterns
US20090000951A1 (en) * 2006-01-27 2009-01-01 Tetsuo Yumoto Method for Forming Electroconductive Circuit
US20100047458A1 (en) * 2005-12-06 2010-02-25 Ebara-Udylite Co., Ltd. Palladium complex and catalyst-imparting treatment solution using the same
US20100140100A1 (en) * 2008-12-08 2010-06-10 Samsung Electro-Mechanics Co., Ltd. Manufacturing method of printed circuit board
US20110079803A1 (en) * 2009-10-06 2011-04-07 Chiang Cheng-Feng Carrying Structure of Semiconductor
US20130180773A1 (en) * 2012-01-18 2013-07-18 Cheng-Feng CHIANG Circuit substrate structure and manufacturing method thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7291380B2 (en) * 2004-07-09 2007-11-06 Hewlett-Packard Development Company, L.P. Laser enhanced plating for forming wiring patterns
US20100047458A1 (en) * 2005-12-06 2010-02-25 Ebara-Udylite Co., Ltd. Palladium complex and catalyst-imparting treatment solution using the same
US20090000951A1 (en) * 2006-01-27 2009-01-01 Tetsuo Yumoto Method for Forming Electroconductive Circuit
US20100140100A1 (en) * 2008-12-08 2010-06-10 Samsung Electro-Mechanics Co., Ltd. Manufacturing method of printed circuit board
US20110079803A1 (en) * 2009-10-06 2011-04-07 Chiang Cheng-Feng Carrying Structure of Semiconductor
US20130180773A1 (en) * 2012-01-18 2013-07-18 Cheng-Feng CHIANG Circuit substrate structure and manufacturing method thereof

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