CN102869205B - Pcb board plated through-hole forming method - Google Patents
Pcb board plated through-hole forming method Download PDFInfo
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- CN102869205B CN102869205B CN201110187912.0A CN201110187912A CN102869205B CN 102869205 B CN102869205 B CN 102869205B CN 201110187912 A CN201110187912 A CN 201110187912A CN 102869205 B CN102869205 B CN 102869205B
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Abstract
The present invention relates to a kind of pcb board plated through-hole forming method, comprising: plating step, the substrate being drilled with through hole is electroplated, obtain plated through-hole; Consent step, the full erosion resistant of filling in the plated through-hole not needing reservation pad; Showing methods step, processes line pattern on end copper, and the pad retained that do not need of copper at the bottom of non-circuit and plated through-hole is exposed; Etching step, adopts acidic etching liquid to etch, copper at the bottom of the non-circuit of ablation, clogs copper at the bottom of the pad having at least one stomidium mouth of the plated through-hole of erosion resistant place to expose also by ablation, and obtains the plated through-hole of at least one stomidium mouth landless at plated through-hole. The present invention breaks traditions the limitation of design and processes, one end of shaping plated through-hole even the aperture landless at two ends, moreover it can be used to the hole in step is realized landless, is applicable to batch machining and stable. Gained pcb board product can effectively improve radio frequency product signal quality, extensively can have the field of high-frequency microwave signal demand for communication and military etc.
Description
Technical field
The present invention relates to pcb board preparing technical field, specifically relate to pcb board plated through-hole forming method.
Background technology
In existing circuit card preparation technology, usually there is the technique in two kinds of processing metal holes: the first covers hole technique, comprise " ... → plating → showing methods → acid etching → inspection →... ... " etc. step; 2nd kind is graphic plating technique, comprise " ... → plating → showing methods → graphic plating → alkali etching → inspection →... ... " etc. step. When hole technique is covered in employing, it is cover through hole by dry film, avoids etching liquid to enter in plated through-hole, therefore all can leave the weld-ring having at least 4.5mil on plated through-hole two sides, otherwise can break by sealing of hole; And when adopting figure galvanic process, due to figure contraposition and proportional error, it is very difficult to realize pad circle and hole wall copper circle etc. big, and all can leave the pad circle of 2mil on plated through-hole two sides. As shown in Figure 1, in figure, pad 4 is all left at the two ends of the plated through-hole 3 on substrate 1 to the structure of the plated through-hole that existing technological forming goes out.
Under normal conditions, product also needs pad 4 and realizes being connected with outer-layer circuit, realize skin to walk line passing hole copper and be connected with internal layer, this needs the aperture of circuit to leave pad circle (that is: exceeding copper facing hole circle), ensureing that outer layer signal passing hole copper is connected with the reliable of internal layer, this is also the effect manufacturing PCB.
But, remain pad (residual pad refer to that on pad circle, area is greater than the part of hole wall copper circle) like this and some specialty products signal performance can be made a big impact, as pad shielding effect can cause to high-frequency signal reflection problems etc. Therefore, in high-frequency microwave signal application, indivedual hole or device aperture excessively connect without the need to skin, it is desired to landless, to prevent pad radio frequency signal performance makes a big impact, avoid pad to the shielding of signal and reflection problems. But, existing plated through-hole processing technology can not accomplish complete landless, that is: copper circle in aperture is consistent with copper facing hole.And for realizing landless, often adopt manual blade to repair removing method, its inefficiency, be not suitable for batch production, and after repairing, outward appearance is also more ugly, it is also possible to hole wall copper loss can be caused to hinder.
Summary of the invention
Technical problem to be solved by this invention is, it is provided that a kind of pcb board plated through-hole forming method, does not have the plated through-hole of pad to mold at least at one end aperture place.
For solving the problems of the technologies described above, the present invention adopts following technical scheme: a kind of pcb board plated through-hole forming method, comprises the steps:
Plating step, electroplates the substrate being drilled with through hole, and the through-hole wall on substrate surface and substrate forms copper at the bottom of one layer simultaneously, obtains plated through-hole;
Consent step, the full erosion resistant of filling in the plated through-hole not needing reservation pad;
Showing methods step, covers on substrate except plated through-hole and without the need to the region except the aperture of pad with dry film, reprocesses out line pattern, and the pad retained that do not need of copper at the bottom of non-circuit and plated through-hole is exposed;
Etching step, adopts acidic etching liquid to etch, copper at the bottom of the non-circuit of ablation, clogs copper at the bottom of the pad having at least one stomidium mouth of the plated through-hole of erosion resistant place to expose also by ablation, and obtains the plated through-hole of at least one stomidium mouth landless at plated through-hole.
Further, also carry out evening step out between consent step and showing methods step, make the erosion resistant surfacing in aperture, plated through-hole two ends.
Further, after acidic etching steps, also carry out the erosion resistant step that fades away, take off except the erosion resistant in plated through-hole.
Further, described erosion resistant is welding resistance paint.
Further, copper at the bottom of the pad at aperture place, described plated through-hole two ends is all by ablation.
On the other hand, the present invention also provides a kind of pcb board plated through-hole forming method, comprises the steps:
Plating, layers of copper at the bottom of the formation of substrate top layer, obtains plated through-hole;
Showing methods step, covers copper copper face at the bottom of the non-circuit needing ablation and aperture without the need to retaining plated through-hole and the welding disking area thereof of pad, reprocesses out circuitous pattern with dry film;
Graphic plating step, adds thick copper layer on the copper face of the circuit exposed and forms circuit copper, and plate protective layer outside circuit copper;
Consent step, the full erosion resistant of filling in the plated through-hole not needing reservation pad;
Etching step, adopts alkaline etching liquid to etch, copper at the bottom of the non-circuit of ablation, clogs copper at the bottom of the pad having at least one stomidium mouth of the plated through-hole of erosion resistant place to expose also by ablation, and obtains the plated through-hole of at least one stomidium mouth landless at plated through-hole.
Further, also carry out evening step out between consent step and etching step, make the erosion resistant surfacing in aperture, plated through-hole two ends.
The useful effect of the present invention is as follows: the limitation that the method for the present invention breaks traditions and designs with complete processing, the one end of the plated through-hole formed out even the aperture landless at two ends, and can also be used for the hole in step is realized landless, it is applicable to batch machining and stablizes. The pcb board product of gained can effectively improve radio frequency product signal quality, reduces the impact that other factors causes. The inventive method extensively can have the pcb board of high-frequency microwave signal demand for the preparation of fields such as communication and military affairs.
Accompanying drawing explanation
Fig. 1 is the structural representation of existing technological forming plated through-hole out.
Fig. 2 is that the pcb board plated through-hole filling that the inventive method obtains has erosion resistant and the schematic diagram of one side landless.
Fig. 3 is the schematic diagram of the pcb board plated through-hole one side landless that the inventive method obtains.
Fig. 4 is that the pcb board plated through-hole filling that the inventive method obtains has erosion resistant and the schematic diagram of two-sided landless.
Fig. 5 is the schematic diagram of the two-sided landless of pcb board plated through-hole that the inventive method obtains.
Fig. 6 is the schematic diagram of the obtained pcb board plated through-hole one side landless of the embodiment of the present invention 3.
Fig. 7 is the schematic diagram of the obtained two-sided landless of pcb board plated through-hole of the embodiment of the present invention 3.
Embodiment
Below by specific embodiment, also with reference to accompanying drawing, the present invention will be described in more detail. It is appreciated that the embodiment of the following stated be only for illustration of instead of restriction the present invention.
Embodiment 1
The present embodiment of the present invention provides a kind of pcb board plated through-hole forming method, and the method combines to cover hole technique to realize the shaping of plated through-hole, comprises the steps:
Plating step, electroplates the substrate 1 being drilled with through hole, and the through-hole wall on substrate 1 surface and substrate 1 forms copper 2 at the bottom of one layer simultaneously, obtains plated through-hole 3;
Consent step, the full erosion resistant 5 of filling in the plated through-hole not needing reservation pad, described erosion resistant 4 is a kind of material having mobility and viscosity, can dry or solidify and be not easy to come off, can corrode by etching resistant liquid, to protect the layers of copper 2 covered, erosion resistant preferably adopts welding resistance to paint;
Showing methods step, covers on substrate 1 except plated through-hole and without the need to the region except the aperture of pad with dry film, reprocesses out line pattern, and the pad 4 retained that do not need of copper at the bottom of non-circuit and plated through-hole 3 is exposed;
Etching step, adopts acidic etching liquid to etch, copper at the bottom of the non-circuit of ablation, clogs copper at the bottom of the pad having at least one stomidium mouth of the plated through-hole of erosion resistant place to expose also by ablation, and obtains the plated through-hole of at least one stomidium mouth landless at plated through-hole.
Further, the present invention can also optionally carry out following steps:
Even step out, carry out between consent step and showing methods step, make the erosion resistant surfacing in aperture, plated through-hole two ends, be beneficial to carry out follow-up showing methods step.
Fade away erosion resistant step, carries out after acidic etching steps, to take off except the erosion resistant in plated through-hole. Some are needed to the plated through-hole installing plug-in unit in hole, it is necessary to take off except the erosion resistant in hole, as depicted in figs. 3 and 5; And for not needing the plated through-hole installing plug-in unit, this erosion resistant 4 also can not fade away, it is used as consent and uses, as shown in Figures 2 and 4.
In the specific implementation, copper at the bottom of the pad at aperture place, described plated through-hole two ends can all by ablation, as shown in Figure 5, it is possible to according to copper at the bottom of the pad at aperture, one end, product needed ablation metal hole place, as shown in Figure 3.
Above method is that plating step wherein, showing methods step, etching step all do not have essential distinction with the existing corresponding steps covered in the technique of hole, seldom repeat at this in conjunction with existing hole technique of covering to realize the shaping of plated through-hole. This covers hole technique, by in showing methods step, cover on substrate 1 except plated through-hole and without the need to the region except the aperture of pad with dry film, reprocess out line pattern, the pad 4 retained that do not need of copper at the bottom of non-circuit and plated through-hole 3 is exposed, thus in follow-up etching step, the copper in landless region, aperture is etched away, ensure hole wall copper circle and pad circle etc. greatly, overcome existing cover plated through-hole two sides in the technique of hole all can leave have at least that the weld-ring of 4.5mil causes affect radiofrequency signal performance, pad to problems such as the shielding of signal and reflections.
Embodiment 2
In the present embodiment, the present invention also provides a kind of pcb board plated through-hole forming method, the method be in conjunction with figure electroplating technology to realize the shaping of plated through-hole, comprise the steps:
Plating, layers of copper 2 at the bottom of substrate 1 top layer formation, obtains plated through-hole 3;
Showing methods step, covers copper copper face at the bottom of the non-circuit needing ablation and aperture without the need to retaining through hole and the welding disking area thereof of pad, reprocesses out circuitous pattern with dry film;
Graphic plating step, adds thick copper layer on the copper face of the circuit exposed and forms circuit copper, and plate protective layer outside circuit copper;
Consent step, the full erosion resistant of filling in the plated through-hole not needing reservation pad;
Etching step, adopts alkaline etching liquid to etch, copper at the bottom of the non-circuit of ablation, clogs copper at the bottom of the pad having at least one stomidium mouth of the plated through-hole of erosion resistant place to expose also by ablation, and obtains the plated through-hole of at least one stomidium mouth landless at plated through-hole.
Further, the present invention can also optionally carry out following steps:
Even step out, carry out between consent step and etching step, make the erosion resistant surfacing in aperture, plated through-hole two ends.
Fade away erosion resistant step, carries out after an etching step, to take off except the erosion resistant in plated through-hole. Some are needed to the plated through-hole installing plug-in unit in hole, it is necessary to take off except the erosion resistant in hole, and for not needing the plated through-hole installing plug-in unit, this erosion resistant then also can not fade away, and is used as consent and uses.
Equally, in the present embodiment, it is possible to copper at the bottom of the pad at aperture place, plated through-hole one end described in an ablation, it is possible to copper at the bottom of the pad at two ends, ablation metal hole, respectively as depicted in figs. 3 and 5.
This figure galvanic process, by in showing methods step, copper copper face at the bottom of the non-circuit needing ablation and aperture is covered without the need to retaining through hole and the welding disking area thereof of pad with dry film, reprocess out circuitous pattern, the copper face of the circuit exposed adds thick copper layer and forms circuit copper, and plate protective layer outside circuit copper, then by follow-up etching step, the copper of aperture without the need to welding disking area is etched away, ensure that hole wall copper circle and pad circle etc. are big, overcome in existing figure galvanic process due to figure contraposition and proportional error, it is difficult to realize pad circle and hole wall copper circle etc. big, and the pad circle that all can leave 2mil on plated through-hole two sides causes affects radiofrequency signal performance, pad is to problems such as the shielding of signal and reflections.
Embodiment 3
In above two embodiments, its through hole is all the situation of the complete through hole being through to another side from pcb board side. And in the present embodiment, it is then on pcb board, be provided with groove, the bottom land of groove be provided with through hole go forward side by side row metalization process and form plated through-hole, and equally also can adopt the technical scheme of above two embodiments for this plated through-hole being positioned at groove bottom land and obtain the plated through-hole of aperture, the one or both ends landless at plated through-hole, its structural representation is respectively as shown in FIG. 6 and 7, wherein Fig. 6 is one end landless, and Fig. 7 is two ends landless.
The present invention by not needing the full resist ink of plated through-hole filling of pad at least one end, then described plated through-hole is not covered by the dry film in the showing methods step covering hole technique and aperture needs the region of landless, or covered by the dry film in the showing methods step of figure galvanic process and to need the copper face of etching and this plated through-hole and aperture to need landless region, realize the object removed in aperture in follow-up etching step without the need to the copper of pad, the limitation that the method breaks traditions and designs with complete processing, the one end of the plated through-hole formed out even the aperture landless at two ends, and the hole in step is realized landless by further can also being used for, it is applicable to batch machining and stablizes.The pcb board product of gained can effectively improve radio frequency product signal quality, reduces the impact that other factors causes. The inventive method extensively can have the pcb board of high-frequency microwave signal demand for the preparation of fields such as such as communications.
Claims (10)
1. a pcb board plated through-hole forming method, it is characterised in that, comprise the steps:
Plating step, electroplates the substrate being drilled with through hole, and the through-hole wall on substrate surface and substrate forms copper at the bottom of one layer simultaneously, obtains plated through-hole;
Consent step, the full erosion resistant of filling in the plated through-hole not needing reservation pad;
Showing methods step, covers on substrate except plated through-hole and without the need to the region except the aperture of pad with dry film, reprocesses out line pattern, and the pad retained that do not need of copper at the bottom of non-circuit and plated through-hole is exposed;
Etching step, adopts acidic etching liquid to etch, copper at the bottom of the non-circuit of ablation, clogs copper at the bottom of the pad having at least one stomidium mouth of the plated through-hole of erosion resistant place to expose also by ablation, and obtains the plated through-hole of at least one stomidium mouth landless at plated through-hole.
2. pcb board plated through-hole forming method as claimed in claim 1, it is characterised in that, also carry out evening step out between consent step and showing methods step, make the erosion resistant surfacing in aperture, plated through-hole two ends.
3. pcb board plated through-hole forming method as claimed in claim 1, it is characterised in that, after acidic etching steps, also carry out the erosion resistant step that fades away, take off except the erosion resistant in plated through-hole.
4. pcb board plated through-hole forming method as claimed in claim 1, it is characterised in that, described erosion resistant is welding resistance paint.
5. pcb board plated through-hole forming method as claimed in claim 1, it is characterised in that, at the bottom of the pad at aperture place, described plated through-hole two ends, copper is all by ablation.
6. a pcb board plated through-hole forming method, it is characterised in that, comprise the steps:
Plating, layers of copper at the bottom of the formation of substrate top layer, obtains plated through-hole;
Showing methods step, covers copper copper face at the bottom of the non-circuit needing ablation and aperture without the need to retaining through hole and the welding disking area thereof of pad, reprocesses out circuitous pattern with dry film;
Graphic plating step, adds thick copper layer on the copper face of the circuit exposed and forms circuit copper, and plate protective layer outside circuit copper;
Consent step, the full erosion resistant of filling in the plated through-hole not needing reservation pad;
Etching step, adopts alkaline etching liquid to etch, copper at the bottom of the non-circuit of ablation, clogs copper at the bottom of the pad having at least one stomidium mouth of the plated through-hole of erosion resistant place to expose also by ablation, and obtains the plated through-hole of at least one stomidium mouth landless at plated through-hole.
7. pcb board plated through-hole forming method as claimed in claim 6, it is characterised in that, also carry out evening step out between consent step and etching step, make the erosion resistant surfacing in aperture, plated through-hole two ends.
8. pcb board plated through-hole forming method as claimed in claim 6, it is characterised in that, after alkali etching step, also carry out the erosion resistant step that fades away, take off except the erosion resistant in plated through-hole.
9. pcb board plated through-hole forming method as claimed in claim 6, it is characterised in that, described erosion resistant is welding resistance paint.
10. pcb board plated through-hole forming method as claimed in claim 6, it is characterised in that, at the bottom of the pad at aperture place, described plated through-hole two ends, copper is all by ablation.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110187912.0A CN102869205B (en) | 2011-07-06 | 2011-07-06 | Pcb board plated through-hole forming method |
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| CN201110187912.0A CN102869205B (en) | 2011-07-06 | 2011-07-06 | Pcb board plated through-hole forming method |
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| CN102869205B true CN102869205B (en) | 2016-06-15 |
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| CN103369868B (en) * | 2013-07-10 | 2016-03-30 | 华为技术有限公司 | A kind of manufacture method of pcb board and pcb board |
| CN104640380B (en) * | 2013-11-13 | 2018-07-24 | 北大方正集团有限公司 | A kind of non-heavy copper hole with orifice ring and print circuit plates making method |
| CN103957668B (en) * | 2014-05-06 | 2016-10-05 | 东莞生益电子有限公司 | The manufacture method of circuit board |
| CN103945651A (en) * | 2014-05-06 | 2014-07-23 | 东莞生益电子有限公司 | Circuit board manufacturing method |
| CN104519669A (en) * | 2014-12-18 | 2015-04-15 | 深圳市五株科技股份有限公司 | Method for replacing backdrill copper removal process |
| CN104883822B (en) * | 2015-06-12 | 2017-12-26 | 西安大为印制电路板厂 | It is a kind of to produce that high density is two-sided and the method for multilayer printed circuit board |
| CN107681037A (en) * | 2017-09-14 | 2018-02-09 | 苏州晶台光电有限公司 | A kind of method for packing of the close display LED light source component of achievable superelevation |
| CN109843000A (en) * | 2019-03-26 | 2019-06-04 | 新华三技术有限公司 | The preparation method and pcb board of pcb board |
| CN110265305B (en) * | 2019-05-17 | 2024-04-12 | 珠海市万州光电科技有限公司 | Patch type infrared bracket, production process thereof and infrared receiving head |
| CN112165794A (en) * | 2020-09-28 | 2021-01-01 | 高德(苏州)电子有限公司 | Method for removing PTH hole ring of multilayer board by etching technology |
| CN114071883A (en) * | 2021-11-09 | 2022-02-18 | 深圳市百柔新材料技术有限公司 | Wet film process for etching large hole cover of PCB (printed circuit board) and PCB processing method |
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| CN1937891A (en) * | 2005-09-19 | 2007-03-28 | 金像电子股份有限公司 | Circuit board non-porous ring circuit manufacturing method |
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| CN1926930B (en) * | 2004-03-03 | 2011-06-15 | 新光电气工业株式会社 | Circuit board manufacturing method and circuit board |
| US7875809B2 (en) * | 2007-06-21 | 2011-01-25 | Kinsus Interconnect Technology Corp. | Method of fabricating board having high density core layer and structure thereof |
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| CN1937891A (en) * | 2005-09-19 | 2007-03-28 | 金像电子股份有限公司 | Circuit board non-porous ring circuit manufacturing method |
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Address after: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
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