CN101742820A - Productive technology of flexible printed circuit board - Google Patents
Productive technology of flexible printed circuit board Download PDFInfo
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- CN101742820A CN101742820A CN200810072133A CN200810072133A CN101742820A CN 101742820 A CN101742820 A CN 101742820A CN 200810072133 A CN200810072133 A CN 200810072133A CN 200810072133 A CN200810072133 A CN 200810072133A CN 101742820 A CN101742820 A CN 101742820A
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- adhesive tape
- faced adhesive
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Abstract
The invention discloses a productive technology of a flexible printed circuit board, comprising the following steps: (1) cutting pure copper 1, pure copper 3, a double faced adhesive tape cover layer and a single faced adhesive tape cover layer; (2) drilling out registration holes on pure copper 1 and pure copper 3, punching the single faced adhesive tape cover layer and the double faced adhesive tape cover layer to leave an opening; (3) assembling pure copper 1 on one side of the double faced adhesive tape cover layer; (4) assembling pure copper 3 on the other side of the double faced adhesive tape cover layer; (5) drilling pure copper 1 and pure copper 3 to form a through hole; (6) plating copper on the surface of a semi-finished printed circuit board; (7) etching copper at the openings of the bending area reserved by pure copper 3 and the conductive area corresponding to the double faced adhesive tape cover layer to manufacture required circuits; (8) respectively assembling the two single faced adhesive tape cover layers corresponding to the outer surfaces of pure copper 1 and pure copper 3; (9) coating noble metal at the reserved opening position of the single faced adhesive tape cover layer; and (10) punching to manufacture the appearance of products. The method has low manufacturing cost, simple process, high working efficiency and good cost and quality.
Description
Technical field
The present invention relates to a kind of production technology of flexible PCB.
Background technology
At present, along with the development of the concentration of productionization with device miniaturization, more electronic equipment adopts integrated circuit to make, integrated circuit is that all electronic devices and components are laid on the circuit board that a slice completes in advance, and raising along with the quality of production, circuit board also slowly develops into flexible material by rigid nature, is a kind of technological process of making flexible PCB commonly used as shown in Figure 1, below each procedure is elaborated.
With reference to shown in Figure 2, be the production process schematic diagram of existing production technology, mainly comprise the steps:
(1) blanking: all raw material is cut by required specification;
(2) fine copper boring: on fine copper 10, get out registration holes; Coverlay 20 is die-cut: single face glue coverlay 20 is carried out die-cut, and reserve opening, so that the bottom surface conducting; Copper-clad plate boring: in single face glue copper-clad plate 30, get out registration holes, use for follow-up contraposition; Pure glue is die-cut: pure glue-line is carried out die-cut, and reserve conducting region and bending zone; Coverlay is die-cut: when die-cut single face glue coverlay 70, also to reserve opening, so that the surface is applied, and the protection conductor layer;
(3) lamination solidifies: the one side assembling that fine copper 10 corresponding coverlays 20 is coated with glue; Cross and mould: pure glue 40 and single face glue copper-clad plate 30 are fitted together, and prepreg 50 is set between the two carries out consolidation;
(4) surface treatment: utilize chemistry or physical method that the disilicide layer on fine copper 10 surfaces is disposed, to improve the adhesion of follow-up surface-coated; Die-cut: as the pure glue that fits together 40 and single face glue copper-clad plate 30 to be carried out die-cut, and reserved opening,, and make bending zone 80 be convenient to bending so that the bottom surface conducting forms conducting region 901;
(5) lamination solidifies: will post single face glue copper-clad plate 30 assemblings of the fine copper and the good pure glue 40 of the back of the body of coverlay 20, and carry out consolidation under the viscosity of pure glue 40;
(6) boring: get out and connect the through hole 902 of copper layer up and down, form semi-finished product sectional view as shown in Figure 3 and Figure 4;
(7) paste the anti-plate adhesive tape: paste one deck anti-plate adhesive tape (not shown) on the surface of copper-clad plate 30 of single face glue and fine copper 10, the conducting region of protection bending zone 80 and bottom can be by on not heavy when sinking copper, specifically, bubble because the coverlay 20 at regional 80 places of bending is attacked by the alkali lye in the heavy copper process easily, therefore need at regional 80 Continuous pressing device for stereo-pattern of bending; In addition,, and combine badly with original material in the heavy copper facing of stepped portions, very easily produce burr, make troubles for the subsequent production process, so also need paste the anti-plate adhesive tape at conducting region 901 places because conducting region 901 places also have coverlay 20 exposed;
(8) heavy copper facing: at the copper coating of through hole 902, but make the copper layer conducting of pure copper layer and single face glue copper-clad plate 30, and the anti-plate adhesive tape of pasting is torn formation circuit board sectional view as shown in Figure 5;
(9) circuit is made: produce required circuit on the circuit board that obtains through above-mentioned steps;
(10) lamination solidifies: two coverlays 70 are coated with the corresponding respectively single face glue of the one side copper-clad plate 30 of glue and the outer surface of fine copper 10 is assembled, to play insulating effect, can prevent also that simultaneously the Copper Foil on top layer from oxidation taking place when contacting with air;
(11) surface-coated: noble metal on exposed copper conductor surface-coated, both prevented oxidizedly, also can have the favorable conductive effect;
(12) profile: produce required product design by mode such as die-cut;
(13) check: detect defective products;
(14) packing: the product through being up to the standards is packed.
With reference to Figure 6 and Figure 7, it is sectional view through the made flexible PCB of above-mentioned steps, in present production technology, be to adopt four kinds of main manufacturing materials of conduct such as fine copper 10, single face glue copper-clad plate 30, prepreg 50 and single face glue coverlay 20, make flexible PCB through 14 road production processes, it has following some deficiency:
(a) in step (7), for fear of when the heavy copper to bending the influence of zone 80 and bottom conducting region 901, need be at surperficial hand paste one deck anti-plate adhesive tape of copper-clad plate 30 of single face glue and fine copper 10, because half-finished very thin thickness, therefore need very careful, and guaranteeing that adhesive tape and half-finished surface fit tightly, production efficiency is low;
(b) after the heavy copper step of step (8) is finished, also need the anti-plate adhesive tape is torn,, cause the distortion of wiring board when tearing easily, influence product quality because adhesive tape has stronger viscosity.
In view of above-mentioned analysis, the inventor furthers investigate at the production technology of present flexible PCB, and this case produces thus.
Summary of the invention
Main purpose of the present invention is to provide a kind of production technology of flexible PCB, and its cost of manufacture is low, and operation is simple, high efficiency, good quality cost.
In order to reach above-mentioned purpose, solution of the present invention is:
A kind of production technology of flexible PCB comprises the steps: that (1) cuts fine copper one, one fine copper, three, one a double faced adhesive tape coverlay and two single face glue coverlays by specification; (2) on fine copper one and fine copper three, get out registration holes respectively; Two single face glue coverlays are carried out die-cut, reserve opening; The double faced adhesive tape coverlay is carried out die-cut, reserve registration holes and as the opening of conducting region; (3), be assembled in the one side of double faced adhesive tape coverlay with the registration holes of the corresponding double faced adhesive tape coverlay of the registration holes of fine copper one; (4) with the registration holes of the corresponding double faced adhesive tape coverlay of the registration holes of fine copper three, be assembled in the another side of double faced adhesive tape coverlay, lamination solidifies; (5) fine copper after will assembling is holed with fine copper three, forms through hole; (6) the heavy copper facing in surface of the semi-finished product circuit plate that forms in abovementioned steps; (7) the bending zone that fine copper three is reserved and the copper of corresponding double faced adhesive tape coverlay conducting region opening part etch away, and produce required circuit on the circuit board that obtains; (8) outer surface that two single face glue coverlays is coated with the corresponding respectively fine copper one, three of one side of glue is assembled; (9) in the reservation aperture position noble metal-coating of single face glue coverlay; (10) die-cutly produce required product design.
After adopting such scheme, the present invention uses the double faced adhesive tape coverlay, can save the use of the prepreg in the traditional handicraft, reduce manufacturing cost, and reduce production process, also need not the step of hand paste anti-plate adhesive tape in the traditional handicraft, increase work efficiency, end product quality is higher.
Description of drawings
Fig. 1 is a kind of process flow diagram of traditional handicraft;
Fig. 2 is a kind of production process schematic diagram of traditional handicraft;
Fig. 3 is the no via regions sectional view before the heavy copper in the traditional handicraft;
Fig. 4 has a via regions sectional view before the heavy copper in the traditional handicraft;
Fig. 5 has a via regions sectional view behind the heavy copper in the traditional handicraft;
Fig. 6 is that the finished product according to traditional handicraft does not have the via regions sectional view;
Fig. 7 is that the finished product according to traditional handicraft has the via regions sectional view;
Fig. 8 is a process flow diagram of the present invention;
Fig. 9 is a production process schematic diagram of the present invention;
Figure 10 is the no via regions sectional view before the heavy copper of the present invention;
Figure 11 has a via regions sectional view before the heavy copper of the present invention;
Figure 12 has a via regions sectional view behind the heavy copper of the present invention;
Figure 13 does not have the via regions sectional view according to finished product of the present invention;
Figure 14 has the via regions sectional view according to finished product of the present invention.
Embodiment
Below in conjunction with drawings and the specific embodiments the present invention is elaborated.
With shown in Figure 9, is the flow chart of the production technology of a kind of flexible PCB of the present invention with reference to figure 8, comprises the steps:
(1) blanking: fine copper 1, two single face glue coverlays 7, a double faced adhesive tape coverlay 2 and fine copper 33 are cut by required specification;
(2) fine copper boring: on fine copper 1 and fine copper 33, get out registration holes, use for follow-up contraposition; Coverlay is die-cut: in the present embodiment, coverlay is selected double faced adhesive tape coverlay 2 and single face glue coverlay 7 respectively for use, at first carry out die-cut to double faced adhesive tape coverlay 2, and reserve registration holes, with corresponding, also on double faced adhesive tape coverlay 2, offer the opening that is reserved as conducting region 92 in addition with the registration holes of fine copper 1, fine copper 33, also to carry out die-cut to single face glue coverlay 7, and reserve opening, and so that the surface is applied, the protection conductor layer;
(3) cross and to mould: the registration holes that the corresponding coverlay 2 of registration holes that fine copper 1 is reserved reserves is assembled in the one side of double faced adhesive tape coverlay 2;
(4) lamination solidifies: the registration holes of the corresponding coverlay 2 of registration holes that fine copper 3 is reserved is assembled in the another side that coverlay 2 is coated with glue, and carries out consolidation;
(5) boring: fine copper 1, fine copper 33 and double faced adhesive tape coverlay 2 after the assembling are holed, thereby form through hole 91, can be with reference to Figure 10 and shown in Figure 11;
(6) heavy copper facing: the heavy copper facing in surface of the semi-finished product circuit plate that forms in abovementioned steps, copper can evenly cover the sidewall surfaces of through hole 91, makes up and down two-layer fine copper 1 electrically conduct via through hole 91 with fine copper 33, sees shown in Figure 12; Because fine copper 1 and fine copper do not carry out opening 33 this moments, therefore in electroplating process, coverlay 2 can be coated on inside, and it is effectively protected, and avoid the alkali lye in the electroplating process that it is caused damage;
(7) circuit is made: the copper at reservation conducting region 92 places etches away on bending zone 8 that will reserve as Figure 10 and fine copper 33 shown in Figure 11 and the corresponding coverlay 2, and on the circuit board that obtains, produce required circuit, because the consistency of thickness of fine copper 1 and fine copper 33, therefore in the manufacturing process of circuit, can simultaneously the Copper Foil that bends zone 8 and conducting region 92 place's correspondences be etched away;
(8) lamination solidifies: with two single face glue coverlays 7 be coated with the corresponding respectively fine copper 1 of one side of glue, the outer surface of fine copper 33 is assembled, and to play insulating effect, can prevent also that simultaneously the Copper Foil on top layer from oxidation taking place when contacting with air;
(9) surface-coated: at the reservation aperture position of single face glue coverlay 7, can expose has copper conductor, and noble metal on exposed copper conductor surface-coated had both prevented oxidizedly, also can have the favorable conductive effect;
(10) profile: produce required product design by mode such as die-cut;
(11) check: detect defective products;
(12) packing: the product through being up to the standards is packed.
With reference to Figure 13 and shown in Figure 14, be the sectional view that adopts the made flexible PCB of said method, the present invention has following some improvement as can be known:
(a) the present invention only adopts fine copper 1 and fine copper 33, double faced adhesive tape coverlay 2 and 7 three kinds of main materials of single face glue coverlay in manufacturing process, need not to use this material of prepreg, saves cost of manufacture;
(b) because the present invention has used double faced adhesive tape coverlay 2 in process of production, therefore 14 road technologies in the traditional processing technology are reduced to 12 roads, only need to carry out the operation that twice lamination solidifies, reduce the number of times that lamination solidifies, help to reduce the deflection of circuit board, improve the quality of products;
(c) the present invention at first will not need copper-plated zone to use fine copper 1 and fine copper 33 to cover, after finishing heavy copper facing step, just the copper layer is etched away, therefore in the copper facing process, alkali lye can not cause damage to the coverlay 2 of inside, exempt the step of hand paste anti-plate adhesive tape, the circuit board that not only can avoid causing when tearing adhesive tape is out of shape, and reduces the possibility that plate face gauffer produces, also, can enhance productivity greatly owing to reduce manual step.
Above embodiment only for explanation technological thought of the present invention, can not limit protection scope of the present invention with this, every technological thought that proposes according to the present invention, and any change of being done on the technical scheme basis all falls within the protection range of the present invention.
Claims (1)
1. the production technology of a flexible PCB is characterized in that comprising the steps:
(1) fine copper one, one fine copper, three, one a double faced adhesive tape coverlay and two single face glue coverlays are cut by specification;
(2) on fine copper one and fine copper three, get out registration holes respectively; Two single face glue coverlays are carried out die-cut, reserve opening; The double faced adhesive tape coverlay is carried out die-cut, reserve registration holes and as the opening of conducting region;
(3), be assembled in the one side of double faced adhesive tape coverlay with the registration holes of the corresponding double faced adhesive tape coverlay of the registration holes of fine copper one;
(4) with the registration holes of the corresponding double faced adhesive tape coverlay of the registration holes of fine copper three, be assembled in the another side of double faced adhesive tape coverlay, lamination solidifies;
(5) fine copper after will assembling is holed with fine copper three, forms through hole;
(6) the heavy copper facing in surface of the semi-finished product circuit plate that forms in abovementioned steps;
(7) the bending zone that fine copper three is reserved and the copper of corresponding double faced adhesive tape coverlay conducting region opening part etch away, and produce required circuit on the circuit board that obtains;
(8) outer surface that two single face glue coverlays is coated with the corresponding respectively fine copper one, three of one side of glue is assembled;
(9) in the reservation aperture position noble metal-coating of single face glue coverlay;
(10) die-cutly produce required product design.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100721334A CN101742820B (en) | 2008-11-12 | 2008-11-12 | Productive technology of flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100721334A CN101742820B (en) | 2008-11-12 | 2008-11-12 | Productive technology of flexible printed circuit board |
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| Publication Number | Publication Date |
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| CN101742820A true CN101742820A (en) | 2010-06-16 |
| CN101742820B CN101742820B (en) | 2011-10-12 |
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| CN2008100721334A Active CN101742820B (en) | 2008-11-12 | 2008-11-12 | Productive technology of flexible printed circuit board |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101917824A (en) * | 2010-08-26 | 2010-12-15 | 厦门弘信电子科技有限公司 | Manufacture method of single-sided flexible circuit board |
| CN101969745A (en) * | 2010-10-20 | 2011-02-09 | 厦门弘信电子科技有限公司 | Manufacturing method of flexible printed circuit board post-procedures |
| CN102159041A (en) * | 2011-03-15 | 2011-08-17 | 珠海元盛电子科技股份有限公司 | Method for once pressure-forming of inner and outer layers of multi-layer flexible circuit board |
| CN102625581A (en) * | 2012-03-14 | 2012-08-01 | 华为终端有限公司 | Flexible circuit board and manufacturing method thereof |
| CN103540270A (en) * | 2013-10-16 | 2014-01-29 | 镇江华印电路板有限公司 | Preparation method of adhesive tapes provided with hand-tore release paper strips |
| CN105072815A (en) * | 2015-07-07 | 2015-11-18 | 安徽中大印制电路有限公司 | Manufacturing process of flexible circuit board |
| CN107645824A (en) * | 2016-07-22 | 2018-01-30 | Lg伊诺特有限公司 | Flexible PCB, chip on film module and the electronic equipment including flexible PCB |
| CN110248480A (en) * | 2019-06-26 | 2019-09-17 | 苏州市华扬电子股份有限公司 | A kind of production method of flexible circuit board |
| CN110809360A (en) * | 2019-07-22 | 2020-02-18 | 新余市木林森线路板有限公司 | Double-sided flexible circuit board and manufacturing method thereof |
| CN110933846A (en) * | 2019-11-29 | 2020-03-27 | 盐城维信电子有限公司 | Manufacturing method for back-to-back process of coiled material flexible circuit board |
| CN113894867A (en) * | 2021-09-30 | 2022-01-07 | 苏州市腾鑫精密材料科技有限公司 | Adhesive tape sticking method for flexible circuit board covering film |
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| JP4574288B2 (en) * | 2004-04-09 | 2010-11-04 | 大日本印刷株式会社 | Manufacturing method of rigid-flexible substrate |
| CN101090606A (en) * | 2006-06-13 | 2007-12-19 | 华通电脑股份有限公司 | Manufacturing method of circuit board |
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Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101917824A (en) * | 2010-08-26 | 2010-12-15 | 厦门弘信电子科技有限公司 | Manufacture method of single-sided flexible circuit board |
| CN101969745A (en) * | 2010-10-20 | 2011-02-09 | 厦门弘信电子科技有限公司 | Manufacturing method of flexible printed circuit board post-procedures |
| CN102159041A (en) * | 2011-03-15 | 2011-08-17 | 珠海元盛电子科技股份有限公司 | Method for once pressure-forming of inner and outer layers of multi-layer flexible circuit board |
| CN102625581A (en) * | 2012-03-14 | 2012-08-01 | 华为终端有限公司 | Flexible circuit board and manufacturing method thereof |
| CN102625581B (en) * | 2012-03-14 | 2014-11-05 | 华为终端有限公司 | Flexible circuit board and manufacturing method thereof |
| CN103540270A (en) * | 2013-10-16 | 2014-01-29 | 镇江华印电路板有限公司 | Preparation method of adhesive tapes provided with hand-tore release paper strips |
| CN105072815B (en) * | 2015-07-07 | 2018-05-08 | 安徽中大印制电路有限公司 | A kind of production technology of flexible PCB |
| CN105072815A (en) * | 2015-07-07 | 2015-11-18 | 安徽中大印制电路有限公司 | Manufacturing process of flexible circuit board |
| CN107645824A (en) * | 2016-07-22 | 2018-01-30 | Lg伊诺特有限公司 | Flexible PCB, chip on film module and the electronic equipment including flexible PCB |
| CN107645824B (en) * | 2016-07-22 | 2022-07-01 | Lg伊诺特有限公司 | Flexible circuit board, chip on film module and electronic device including flexible circuit board |
| US11395403B2 (en) | 2016-07-22 | 2022-07-19 | Lg Innotek Co., Ltd. | Flexible circuit board, COF module and electronic device including the same |
| US11622444B2 (en) | 2016-07-22 | 2023-04-04 | Lg Innotek Co., Ltd. | Flexible circuit board, COF module and electronic device including the same |
| US11800639B2 (en) | 2016-07-22 | 2023-10-24 | Lg Innotek Co., Ltd. | Flexible circuit board, COF module and electronic device including the same |
| CN110248480A (en) * | 2019-06-26 | 2019-09-17 | 苏州市华扬电子股份有限公司 | A kind of production method of flexible circuit board |
| CN110809360A (en) * | 2019-07-22 | 2020-02-18 | 新余市木林森线路板有限公司 | Double-sided flexible circuit board and manufacturing method thereof |
| CN110933846A (en) * | 2019-11-29 | 2020-03-27 | 盐城维信电子有限公司 | Manufacturing method for back-to-back process of coiled material flexible circuit board |
| CN113894867A (en) * | 2021-09-30 | 2022-01-07 | 苏州市腾鑫精密材料科技有限公司 | Adhesive tape sticking method for flexible circuit board covering film |
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| CN101742820B (en) | 2011-10-12 |
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Address after: 361100, No. 19, No. 2, No. 1, Xiang Hai Road, Xiamen torch hi tech Zone (Xiangan) Industrial Zone, Fujian Province Patentee after: Xiamen Hongxin Electronic Technology Co., Ltd. Address before: 361009. Xuan building, Pioneer Park, torch hi tech Zone, Fujian, Xiamen 627 Patentee before: Xiamen Hongxin Electron Technology Co., Ltd. |
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Address after: 361000 2nd floor, No.19, Xianghai Road, industrial zone (Xiang'an), torch high tech Zone, Xiamen City, Fujian Province Patentee after: Xiamen Hongxin Electronic Technology Group Co.,Ltd. Address before: 361100, No. 19, No. 1, building No. 2, Xiang Hai Road, Xiamen torch hi tech Zone (Xiangan) Industrial Zone, Fujian Province Patentee before: XIAMEN HONGXIN ELECTRON-TECH Co.,Ltd. |