KR20160099870A

KR20160099870A - Flexible flat cable

Info

Publication number: KR20160099870A
Application number: KR1020150022102A
Authority: KR
Inventors: 염향우
Original assignee: 한성전자 주식회사
Priority date: 2015-02-13
Filing date: 2015-02-13
Publication date: 2016-08-23

Abstract

A method of manufacturing an FFC cable and a circuit film according to the present invention includes a laminating step of laminating an aluminum foil on one side or both sides of an insulating film, a printing step of printing an alkaline ink on the surface of the laminated aluminum foil in a predetermined pattern, A step of etching the exposed portion of the aluminum foil sheet on which the alkaline ink is not printed under a predetermined condition, and a step of removing the printed surface of the alkaline ink by washing with a basic solution, And a cleaning step of forming only the pattern.

Description

FFC CABLE AND CIRCUIT FILM MANUFACTURING METHOD

The present invention relates to an FFC cable and a method for manufacturing a circuit film, and more particularly, to a method of manufacturing a circuit or an impedance pattern by ink printing and cleaning process, The present invention relates to an FFC cable and a circuit film manufacturing method capable of reducing the defects of a conductor and ensuring reliability of a product.

2. Description of the Related Art [0002] In general, electronic devices such as notebook computers are miniaturized in size and thinner in thickness, so that the sizes of various electronic components assembled therein are also downsized.

Accordingly, FFC cables (Flexible Flat Cables) for electrically connecting the printed circuit board and the electronic components are also becoming smaller.

The FFC cable is electrically connected to the printed circuit board and the electronic components by the FFC cable.

However, in the conventional method of forming a conductor by the square rolling method, problems such as lifting of the conductor, failure of the internal pressure, plating defects, and the like may occur, so that it is difficult to secure the reliability of the product. In order to match the impedance of the conventional FFC cable, the method of attaching the completed impedance film on the upper surface of the FFC cable requires a lot of time and manufacturing cost, and the productivity is not good.

A prior art related to the present invention is Korean Patent Laid-Open No. 10-2007-0038025 (April 09, 2007), which discloses a flexible flat cable.

It is an object of the present invention to provide a method of forming a circuit or an impedance pattern through ink printing and cleaning process so that a conductor can be formed variously and rapidly at a low manufacturing cost, thereby improving productivity, And a method of manufacturing the circuit film.

Here, in the printing step, it is preferable to print the alkaline ink in the form of a circuit pattern or a cable conductor.

Preferably, the method further comprises a film adhering step for adhering an insulating film to the surface of the aluminum thin plate pattern after the cleaning step.

The method may further include a punch punching step of cutting a portion of the insulating film before the attaching operation in the film attaching step to form a connection portion so that the aluminum thin plate pattern is exposed to the outside.

The method may further include a cutting step of cutting a portion of the connecting portion after the perforation punching step to form the connecting portion to a predetermined length, and a connector attaching step of attaching the connector to the connecting portion.

In addition, in the lapping step, it is preferable to use copper, silver, copper and silver alloy in addition to the aluminum thin plate.

After the cleaning step, an insulating ink is printed on the surface of the aluminum foil pattern by a screen printing method, and the aluminum foil pattern is printed so that a portion connected to the connector and a portion requiring soldering can be connected or contacted And a printing pattern printing step of forming a non-exposed portion.

Meanwhile, the method for manufacturing an FFC cable and a circuit film according to the present invention includes a printing step of printing an impedance pattern with water-soluble ink on one surface or both surfaces of an insulating film, a deposition step of totally depositing aluminum on the water- A cleaning step of removing the water-soluble ink printed surface and the aluminum deposited thereon through cleaning to form only the aluminum pattern from which the water-soluble ink printed surface has been removed; and a coating step of coating or laminating the insulating resin on the aluminum pattern- The method comprising the steps of:

Here, in the deposition step, it is preferable to use copper, silver, copper and silver alloy in addition to the aluminum.

Further, in the deposition step It is preferable that the aluminum is deposited by any one of vacuum deposition, electrolytic plating and electroless plating.

In the printing step, it is preferable that the water-soluble ink is printed in a diamond shape spaced apart from each other.

According to another aspect of the present invention, there is provided a method of manufacturing an FFC cable and a circuit film, including the steps of: printing an impedance pattern on a surface of an insulating film with water-soluble ink; depositing aluminum on the water- A cleaning step of removing the water-soluble ink printed surface and the aluminum foil deposited thereon through cleaning to form only the aluminum pattern from which the water-soluble ink printed surface has been removed; and a step of coating or laminating an insulating resin on the aluminum pattern- A printing step of printing an alkaline ink on the surface of the laminated aluminum foil in a predetermined pattern, and a step of printing the alkaline ink on the surface of the laminated aluminum foil in a predetermined pattern, An exposed portion of the aluminum foil sheet not printed And a cleaning step of removing only the alkaline ink printing surface by washing with a basic solution and forming only the aluminum thin plate pattern from which the alkaline ink printing surface has been removed .

The present invention is characterized in that a printed circuit is printed on a surface to which aluminum or copper is adhered and coated on one side or both sides of an insulating film to corrode an unprinted portion, It is possible to form the conductor variously and rapidly at a low manufacturing cost, thereby improving the productivity. Further, it is possible to reduce the defects such as dimensional accuracy and lifting of the conductor, Effect.

1 is a block diagram showing each step of a method of manufacturing an FFC cable and a circuit film according to a first embodiment of the present invention.
FIG. 2 is a view for showing the laminating step in the FFC cable and the method for producing a circuit film according to the first embodiment of the present invention.
3 is a view showing a printing step in a method of manufacturing an FFC cable and a circuit film according to the first embodiment of the present invention.
4 is a view showing a cleaning step in the FFC cable and the method for manufacturing a circuit film according to the first embodiment of the present invention.
5 is a view showing a step of attaching a film in the FFC cable and the method for manufacturing a circuit film according to the first embodiment of the present invention.
6 and 6A are views showing a punching step in the FFC cable and the circuit film manufacturing method according to the first embodiment of the present invention.
7 is a block diagram showing each step of a method of manufacturing an FFC cable and a circuit film according to a second embodiment of the present invention.
8 is a view showing a printing step in a method of manufacturing an FFC cable and a circuit film according to a second embodiment of the present invention.
9 is a view showing a deposition step in the FFC cable and the circuit film production method according to the second embodiment of the present invention.
10 is a view illustrating a cleaning step in an FFC cable and a circuit film manufacturing method according to a second embodiment of the present invention.
11 is a view showing a coating step in the FFC cable and the method for producing a circuit film according to the second embodiment of the present invention.
12 is a block diagram showing each step of a method of manufacturing an FFC cable and a circuit film according to a third embodiment of the present invention.
FIG. 13 is a block diagram showing an FFC cable manufactured through a method of manufacturing an FFC cable and a circuit film according to a third embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving it will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings.

The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.

FIG. 1 is a block diagram showing each step of a method of manufacturing an FFC cable and a circuit film according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view illustrating a method of manufacturing an FFC cable and a circuit film according to a first embodiment of the present invention. FIG. 7 is a view for showing the lapping step. FIG.

FIG. 3 is a view showing a printing step in the method of manufacturing an FFC cable and a circuit film according to the first embodiment of the present invention. FIG. 4 is a view showing a method of manufacturing the FFC cable and the circuit film according to the first embodiment of the present invention And FIG.

6 and 6A are views showing an FFC cable and a circuit film according to the first embodiment of the present invention. FIG. 7 is a view for showing the perforation punching step in the film production method.

The method for manufacturing an FFC cable and a circuit film according to the first embodiment of the present invention is for forming a circuit pattern on one surface or both surfaces of an insulating film 100.

1 to 6A, a method of manufacturing an FFC cable and a circuit film according to a first embodiment of the present invention includes a laminating step S100, a printing step S200, a corrosion step S300, A step S400, and a film attaching step S500.

In the lining step S100, the conductive aluminum foil 200 for forming a conductor is joined to one surface of the insulating film 100 as shown in FIG.

Here, the insulating film 100 and the insulating film 400 to be described later may be made of PET (polyethylene phthalate) or PI (polyimide) material, but the material of the insulating film 100 and 400 may be variously selected. It is possible.

In addition, the insulating film 100 may be formed to a thickness of 10 to 200 탆 in the lapping step S100, but the thickness of the insulating film 100 may be variously applied as needed.

In addition, the aluminum foil 200 in the lining step S100 may be laminated to a thickness of 10 to 200 탆, but the thickness of the aluminum foil 200 may be variously applied as needed.

In addition, the aluminum foil 200 may be laminated by a dry lamination method in the lining step S100.

The aluminum foil 200 has an advantage that the cost of the raw material per unit volume is about ten times lower than that of copper and the melting point is low.

Of course, in the lining step S100, copper, silver, copper and silver alloy may be used in addition to the aluminum foil 200. [

Next, in the printing step S200, the alkaline ink 300 is printed in the predetermined pattern on the surface of the thin aluminum sheet 200 laminated in the lining step S100 as shown in Fig.

Here, in the printing step S200, the alkaline ink 300 may be printed on the surface of the aluminum foil 200 using a gravure printing method.

In the printing step S200, the alkaline ink 300 may be formed to a thickness of 1 탆 to 5.0 탆, but the thickness of the alkaline ink 300 may be variously applied as needed.

The printing step S200 can rapidly form various patterns (free line width, curved shape, etc.) as compared with the conventional method of attaching a conductor, dramatically improve productivity of a product, , Defective pressure resistance, plating failure, and the like can be prevented.

Next, the corrosion step (S300) corrodes the exposed portions of the thin aluminum plate (200) on which the alkaline ink (300) is not printed under a predetermined condition, so that a circuit is formed only on the printed portion.

Next, the cleaning step S400 removes the printing surface of the alkaline ink 300 by washing with a basic solution as shown in FIG.

At the same time, the cleaning step S400 forms only the aluminum foil 200 pattern on which the printing surface of the alkaline ink 300 is removed.

Finally, the film attaching step S500 attaches another insulating film 400 to the surface of the aluminum foil 200 as shown in FIG.

The insulating film 400 may be attached to the PET film by PET paste, and the insulating film 400 may have black and other color.

For this purpose, the insulating film 400 may be formed to have a thickness of 2.5 to 100 탆 in the PET film containing the black ink.

6 and 6A, a portion 400a of the insulating film 400 is cut through the perforation punching step S600 of the insulating film 400 to form the connecting portion 500, .

The connecting portion 500 is formed such that the pattern of the aluminum foil 200 on the perforated portion is exposed to the outside in the film attaching step.

In the perforated punching step S600, a portion of the insulating film 400 is cut to a predetermined width as shown in FIGS. 6 and 6A, and the connecting portion 500 is formed so that the pattern of the aluminum thin plate 200 is exposed to the outside.

In the cutting step, the connection part 500 is cut in the lateral direction by using a cutting device (not shown) to form the connection part 500 with a predetermined length.

Here, after the cutting step, a connector coupling step (not shown) may be further included to connect the coupling member (not shown) to the connection part 500.

As described above, the FFC cable manufactured using the FFC cable and the circuit film manufacturing method according to the present invention can be manufactured by using the insulation film 100, the aluminum foil 200 pattern and another insulation film 400 layer .

6A is another embodiment in addition to the method of adhering the insulating film 400 to the surface of the aluminum thin plate pattern. The aluminum thin plate 200 is formed by roll-to-roll or flat- When printing the ink 400B and printing, a printing pattern is formed by printing, forming an exposed portion 400C that is not printed so that a portion connected to the connector in the pattern or a portion requiring soldering can be connected or contacted.

FIG. 7 is a block diagram showing each step of a method of manufacturing an FFC cable and a circuit film according to a second embodiment of the present invention, and FIG. 8 is a view illustrating a method of manufacturing a FFC cable and a circuit film according to a second embodiment of the present invention. And FIG.

9 is a view showing a deposition step in an FFC cable and a circuit film manufacturing method according to a second embodiment of the present invention. FIG. 10 is a view showing a FFC cable and a circuit film manufacturing method according to a second embodiment of the present invention And FIG.

11 is a view showing a coating step in the FFC cable and the circuit film production method according to the second embodiment of the present invention.

As shown in FIGS. 7 to 11, the method for manufacturing an FFC cable and a circuit film according to the second embodiment of the present invention is for forming an impedance pattern on one or both surfaces of an insulating film 100.

As shown in FIGS. 7 to 11, the FFC cable and the circuit film manufacturing method according to the second embodiment of the present invention includes a printing step S100-1, a deposition step S200-1, a cleaning step S300 -1), and a coating step (S400-1).

First, the printing step (S100-1) prints an impedance pattern on the one side or both sides of the insulating film 100 with the water-soluble ink 700 as shown in FIG.

At this time, the water-soluble ink 700 in the printing step S100-1 may be printed in a diamond shape or the like spaced apart from each other.

Next, in the deposition step S200-1, the aluminum 600 is entirely deposited on the printing surface of the water-soluble ink 700 printed in the printing step S100-1 as shown in FIG.

In addition, in the deposition step S200-1, one of copper, silver, copper and silver alloy may be used in addition to the aluminum 600. [

Next, in the cleaning step S300-1, the printed surface of the water-soluble ink 700 and the aluminum deposited thereon are removed by washing with water as shown in FIG. 10, so that only the unprinted portion of the water- 200) pattern is formed.

That is, in the cleaning step (S300-1), the water-soluble ink 700 is removed by washing with water, so that an aluminum pattern is left only in a portion where the water-soluble ink 700 is not printed.

Finally, in the coating step (S400-1), the insulating resin 100 is coated or laminated on the aluminum pattern forming surface as shown in FIG. 11 to form an insulating layer of the impedance pattern portion.

FIG. 12 is a block diagram showing steps of a method of manufacturing an FFC cable and a circuit film according to a third embodiment of the present invention, and FIG. 13 is a view illustrating a method of manufacturing an FFC cable and a circuit film according to a third embodiment of the present invention. FIG. 2 is a block diagram showing an FFC cable manufactured through the method of FIG.

12 and 13, the FFC cable and the circuit film manufacturing method according to the first embodiment of the present invention includes a printing step S100-1, a deposition step S200-1, a cleaning step S300 -1, the coating step S400-1, the lining step S500-1, the printing step S600-1, the etching step S700-1, the cleaning step S800-1, And a film attaching step (S900-1).

First, in the lining step S100, the conductive aluminum foil 200 is joined to one surface of the insulating film 100 as shown in FIG.

Here, the insulating film 100 may be made of PET (polyethylene phthalate) or PI (polyimide), but the material of the insulating film 100 may be variously selected.

In addition, in the lining step S100, the aluminum foil 200 may be laminated to a thickness of 10 to 200 탆, but the thickness of the aluminum foil 200 may be variously applied as needed.

The aluminum foil 200 has an advantage that the cost of the raw material per unit volume is about ten times lower than that of copper (Cu), and the melting point is low.

Next, in the printing step (S200), the alkaline ink (300) is printed on the surface of the laminated aluminum sheet (200) in the laminating step (S100) in the set pattern.

Next, the corrosion step (S300) corrodes the exposed portion of the thin aluminum plate (200) from which the alkaline ink (300) is not printed, under a predetermined condition.

Next, in the cleaning step S400, the printing surface of the alkaline ink 300 is removed by washing with the basic solution, and only the aluminum thin plate 200 pattern on which the printing surface of the alkaline ink 300 is removed is formed.

Finally, in the film attaching step S500, the insulating film 400 is attached to the surface of the aluminum foil 200. [

The insulating film 400 may be coated with a polyethylene (PE) material or a PET or PI material. The insulating film 400 may have a black color and other color.

In addition, the insulating film 400 may be punched (step S600) before the film attaching step S500 so that the pattern of the aluminum thin plate 200 on the punched area is exposed to the outside in the film attaching step S500 Thereby forming a connecting portion 500.

In the perforated punching step S600, a portion of the insulating film 400 is cut to a predetermined width to form a connecting portion 500 so that the pattern of the aluminum foil 200 is exposed to the outside.

On the other hand, after the cleaning step S400, an insulating ink is printed on the surface of the aluminum thin plate pattern by a screen printing method, and the aluminum thin plate pattern is printed (printed) so that a portion connected to the connector and a portion (Not shown) that forms an exposed portion that is not exposed to the outside of the apparatus.

More specifically, the printing pattern printing step prints an insulating ink on the aluminum thin plate 200 by a roll-to-roll method or a screen printing method in a planar manner.

The print pattern printing step forms and prints a print pattern that forms an exposed portion that is not printed so that a portion to be connected to the connector or a portion to be soldered in the pattern at the time of printing may be connected or contacted.

Here, after the cutting step, the connector may further include a connector coupling step (not shown) for coupling the coupling member to the connection part 500.

First, in the printing step (S100-1), an impedance pattern is printed on one side or both sides of the insulating film (100) with the water-soluble ink (700).

At this time, in the printing step S100-1, the water-soluble ink 700 can be printed in a diamond shape spaced apart from each other.

Next, in the deposition step S200-1, the aluminum 600 is entirely deposited on the printing surface of the water-soluble ink 700 printed in the printing step S100-1.

Next, in the cleaning step S300-1, the printed surface of the water-soluble ink 700 and the aluminum deposited thereon are removed through washing with water, thereby forming only the aluminum pattern from which the water-soluble ink 700 is removed.

Finally, in the coating step (S400-1), the insulating resin 100 is coated or laminated on the aluminum pattern forming surface to form an insulating layer of the impedance pattern portion.

As described above, the FFC cable manufactured by using the FFC cable and the circuit film manufacturing method according to the present invention has a structure in which the aluminum foil 200 pattern and the circuit pattern made of the insulating film 400 are formed on one surface of the insulating film 100, .

On the other hand, an impedance pattern made of aluminum and insulating resin 800 is formed on the other surface of the insulating film 100.

The insulating resin 800 may be made of PET (polyethylene phthalate) or PI (polyimide), but the material of the insulating resin 800 can be variously selected.

As a result, by forming an aluminum circuit pattern through the printing method of the water-soluble and alkaline ink 300 (700), it is possible to quickly and variously form the conductor by the printing method, thereby reducing the manufacturing cost and improving the productivity And the reliability of the product can be ensured because there is no faulty lifting of the conductor.

Although the embodiments of the FFC cable and the circuit film manufacturing method of the present invention have been described above, it is apparent that various modifications may be made without departing from the scope of the present invention.

Therefore, the scope of the present invention should not be construed as being limited to the embodiments described, but should be determined by the scope of claims of the patent as well as the claims of the patent registration described later.

That is, it should be understood that the above-described embodiments are illustrative and non-restrictive in all aspects and that the scope of the present invention is defined by the appended claims rather than the detailed description, Ranges and equivalents thereof are to be construed as being included within the scope of the present invention.

100: Insulation film 200: Aluminum foil
300: Alkaline ink 400: Insulation film
500: connection part 600: aluminum
700: water-soluble ink 800: insulating resin

Claims

A laminating step of laminating an aluminum foil on one side or both sides of the insulating film;
A printing step of printing an alkaline ink on the surface of the laminated aluminum foil in a predetermined pattern;
An eroding step of eroding an exposed portion of the thin aluminum plate on which the alkaline ink is not printed, under a predetermined condition; And
And removing the printed surface of the alkaline ink by washing with a basic solution and forming only the aluminum thin plate pattern from which the alkaline ink printed surface has been removed.

The method according to claim 1,
In the printing step,
Wherein the alkaline ink is printed in a circuit pattern form or a cable conductor form.

The method according to claim 1,
After the washing step,
And attaching an insulating film to the surface of the aluminum thin plate pattern.

The method of claim 3,
In the film adhering step,
Further comprising a perforation punching step of cutting a portion of the insulating film to form a connection portion so that the aluminum foil pattern is exposed to the outside before an attaching operation.

The method of claim 4,
After the perforation punching step,
A cutting step of cutting a part of the connecting portion to form the connecting portion with a predetermined length,
Further comprising a connector engaging step of engaging a connector to the connecting portion.

The method according to claim 1,
In the lapping step,
Wherein the copper foil is made of copper, silver, copper and silver alloy in addition to the aluminum foil.

The method according to claim 1,
After the washing step,
Wherein the aluminum foil pattern is printed with an insulating ink on the surface of the aluminum foil pattern by a screen printing method and the exposed portion is printed on the aluminum foil pattern to form an unprinted exposed portion so that a portion connected to the connector and a portion requiring soldering can be connected or contacted. Further comprising the steps of: (a) forming a first insulating film on a surface of the FFC cable;

A printing step of printing an impedance pattern with water-soluble ink on one side or both sides of the insulating film;
A deposition step of entirely depositing aluminum on the water-soluble ink printed surface;
A cleaning step of removing the water-soluble ink print surface and the aluminum deposited on the water-soluble ink print surface by washing with water to form only the aluminum pattern from which the water-soluble ink print surface is removed; And
And a coating step of coating or laminating an insulating resin on the aluminum pattern forming surface.

The method of claim 8,
In the deposition step,
Wherein a copper, a silver, and a copper and a silver alloy are used in addition to the aluminum.

The method of claim 8,
In the deposition step,
Wherein the aluminum is deposited by any one of vacuum deposition, electrolytic plating and electroless plating.

The method of claim 8,
In the printing step,
Characterized in that the water-soluble ink is printed in a diamond shape spaced apart from each other.

A printing step of printing an impedance pattern with water-soluble ink on one surface of the insulating film;
A deposition step of entirely depositing aluminum on the water-soluble ink printed surface;
A cleaning step of removing the water-soluble ink printed surface and the aluminum foil deposited thereon through washing with water to form only the aluminum pattern from which the water-soluble ink printed surface has been removed;
A coating step of coating or laminating an insulating resin on the aluminum pattern formation surface;
A lapping step of laminating an aluminum foil on the other surface of the insulating film opposite to the aluminum pattern formation surface;
A printing step of printing an alkaline ink on the surface of the laminated aluminum foil in a predetermined pattern;
An eroding step of eroding an exposed portion of the thin aluminum plate on which the alkaline ink is not printed, under a predetermined condition; And
And removing the printed surface of the alkaline ink by washing with a basic solution and forming only the aluminum thin plate pattern from which the alkaline ink printed surface has been removed.