CN103957668B - The manufacture method of circuit board - Google Patents
The manufacture method of circuit board Download PDFInfo
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- CN103957668B CN103957668B CN201410188585.4A CN201410188585A CN103957668B CN 103957668 B CN103957668 B CN 103957668B CN 201410188585 A CN201410188585 A CN 201410188585A CN 103957668 B CN103957668 B CN 103957668B
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Abstract
The present invention discloses the manufacture method of a kind of circuit board, comprise the steps: to provide cover plate, corresponding with the plated through-hole on circuit board on cover plate offer the second through hole, the circuit board surface after making cover plate be covered in plating, and the plated through-hole phase para-position of the second through hole and circuit board；The resin material good with copper face wellability is provided, makes resin be sufficiently stirred under vacuum；Making the resin after stirring be coated on lid surface, the single stroke of scraper of screen printer makes the second through hole of cover plate fill up resin, and resin is filled in plated through-hole through the second through hole, and the resin residing in lid surface is scraped back by oil return cutter；Cover the copper electroplating layer that need to retain, the figure that protection need to retain with dry film against corrosion, make copper ring at the aperture, at least one end of plated through-hole expose, use acidic etching liquid to be etched, remove the copper ring protected without dry film against corrosion, and etch desired depth.The aperture copper ring of the removable plated through-hole of the present invention, it is achieved the via insulating properties of circuit board, can effectively substitute back drill technology.
Description
Technical field
The present invention relates to circuit board production techniques field, more particularly relate to a kind of electricity realizing via insulation
Road board fabrication method.
Background technology
Printed circuit board (pcb board) is the supplier of electronic devices and components electrical connection.Pcb board plated through-hole skill
Art is one of key of Manufacturing Technology for PCB, plated through-hole refer to the top layer of pcb board and bottom it
Between hole wall on chemical reaction, one layer of thin copper is plated on the inwall in hole so that the top layer of pcb board and bottom
It is connected with each other.The radio communication product of part affixed metal structural member, for ensureing product insulating reliability,
Way the earliest is fluting processing components and parts on hardware.Refer to shown in Fig. 1, this electronic device
Including pcb board 100 and coupled hardware 200, with pcb board on hardware 200
Groove 400 is offered corresponding to the position of plated through-hole 300 in 100 surfaces connected, so that hardware 200
And it is isolated between plated through-hole 300, thus realizes the insulating properties of product.But, above-mentioned realization gold
The technology of genusization hole insulation because of hardware form of diverse, difficulty of processing and relatively costly, it is achieved extensive
Application is beset with resistance.
Along with the development of PCB process technology, consider for cost savings and simplification manufacturing process flow, terminal
Communication apparatus manufacturer uses back drill technology to realize PCB via one after another and opens without dishization design alternative metals structural member
Groove technology, ensures product insulating properties by the distance increasing hardware and hole copper (plated through-hole).
Shown in Figure 2, this electronic device includes pcb board 100 and connected hardware 200, its
In, pcb board 100 is offered through hole 500, in through hole 500, copper facing forms hole copper 600, then carries out back drill
Except partial hole copper 600, the end face removing hole copper of pcb board 100 is then made to be connected with hardware 200,
Thus increase the distance of hardware 200 and hole copper 600, and then achieve the insulating properties of product.But,
Back drill technology has many restrictions, and large-scale application exists problems.The first, back drill process matching turmeric
Surface processes, and need to use severe toxicity industrial chemicals, and medicine management and control and liquid waste processing are the most difficult；The second, back drill
Product processing Aligning degree controls to require height, and Row control is complicated, and yield rate is relatively low；3rd, machete is added
Holing in footpath, is unfavorable for highly dense wiring, limits product design and range of application.Therefore, exploitation substitutes back drill skill
The via insulation technology of art is significant.
Chinese patent literature CN 102869205 A open a kind of " pcb board plated through-hole forming method ", the party
Method by carry out in the plated through-hole 300 to the substrate 700 of pcb board clog erosion resistant 800 (seeing Fig. 3),
Being etched processing, the hole copper in plated through-hole 300 is protected by erosion resistant 800 and is not etched by the most again
Falling, the pad of plated through-hole 300 end is then etched removal.The method solves the technical problem that it is to improve to penetrate
Frequently product signal quality, so that pcb board can be used for communication and military affairs etc. and has the neck of high-frequency microwave signal demand
Territory.But, there is quality hidden danger in the method, such as, 1. filling out plated through-hole when practice
During erosion resistant, it is easily formed consent depression, it is possible to make partial hole copper also expose, not only goes during etching
Except the pad of plated through-hole end, also can etch away part hole wall copper, cause etch depth to exceed standard；2. exist
During carrying out consent, easy residue gas bubble, the easy Tibetan medicine when orifice bubble is near hole wall copper in erosion resistant
, there is the long-term hole wall copper that corrodes and cause failure risk in water；If 3. there is resin cull after pottery nog plate, etching
The residual copper in aperture the most easily occurs, causes printed board via insulating properties to lose efficacy, lack for during guarantee production zero
Fall into, after circuit board etching completes, need to carry out AOI detection (i.e. the residual copper in aperture detection), but due to electricity
Road plate would generally be placed a period of time, and the copper in plate face easily aoxidizes obfuscation, reduces copper and the contrast of substrate surface,
Cause defect to fail to report problem, therefore AOI workshop typically configures a pickling deoxidation line, removes the oxygen on copper removal surface
Change the layer contrast with enhancing copper with base material, but, circuit board is internal containing CaCO because of plug socket resin3Composition,
Pickling can make after resin wear copper, copper no color differnece residual with aperture, interference detection process in exposed hole, causes spy
Survey process vacation point is many, impact detection and repairing efficiency.Therefore, necessary prior art is improved,
To solve above-mentioned technical problem, eliminate the quality hidden danger existed.Additionally, this Technology can also substitute
Back drill Technology application is to via insulation technology field.
Summary of the invention
It is an object of the present invention to: provide the manufacture method of a kind of circuit board, it can realize circuit board
Via landless.
Further object is that: provide the manufacture method of a kind of circuit board, it can realize circuit
Insulate between via and the hardware being connected circuit board of plate.
Another object of the present invention is: provide the manufacture method of a kind of circuit board, and it can stop consent
The generation of depressed phenomenon, eliminates quality hidden danger.
The present invention further an object is that: provides the manufacture method of a kind of circuit board, and it can stop hole wall
The phenomenon of absorption bubble easy Tibetan medicine water produces, it is to avoid hole wall copper failure risk.
A further object of the present invention is: provide the manufacture method of a kind of circuit board, and it can be beneficial to realize
The residual copper in AOI detection aperture.
For reaching this purpose, the present invention by the following technical solutions:
The manufacture method of a kind of circuit board, comprises the steps:
Step S10: provide cover plate, with the electroplated plated through-hole phase being formed on circuit board on described cover plate
Corresponding offers the second through hole, and the aperture of described second through hole, more than the aperture of described plated through-hole, makes described
Cover plate is covered in the circuit board surface after plating, and the plated through-hole phase of described second through hole and described circuit board
Para-position；
Step S20: the resin material good with copper face wellability is provided, makes described resin the most abundant
Stirring；
Step S30: make the resin after stirring be coated on described lid surface, the single stroke of scraper of screen printer makes
Second through hole of described cover plate fills up resin, and described resin is filled in described plated through-hole through described second through hole,
The resin residing in described lid surface is scraped back by the oil return cutter of screen printer；
Step S40: toast described circuit board, makes the hardening of resin in described plated through-hole；
Step S50: cover the copper electroplating layer that need to retain, the figure that protection need to retain with dry film against corrosion, makes described
At the aperture, at least one end of plated through-hole, copper ring exposes, and uses acidic etching liquid to be etched, removes without against corrosion
The copper ring of dry film protection, and etch desired depth；
Wherein, described step S10 and described step S20 are without sequencing.
This method arranges cover plate on circuit boards by using, and on the cover board offers the second through hole, and this second
Through hole is corresponding with plated through-hole, is directly coated on cover plate by resin, and resin enters metal through the second through hole
Change in hole, the effect of selective resin consent can be played；By the aperture design of the second through hole is more than gold
The aperture in genusization hole, is beneficial to the aligning accuracy improving the second through hole with plated through-hole, then by scraper single row
Journey will fill up resin by the second through hole, and filling holes with resin can be avoided to cave in；Good with copper face wellability by selecting
Resin, and it is sufficiently stirred under vacuum, on the one hand reduce the hole wall absorption bubble of plated through-hole
Risk, on the other hand further improve the quality of filling holes with resin；By dry film against corrosion is covered in circuit board table
Face, carries out acid etching the most again, eliminates the copper ring without dry film protection, and etches desired depth, it is achieved
The insulating properties of via, can be used for substituting the via insulation technology that back drill technology becomes new.
As a kind of preferred version, in described step S20, the resin material provided is carried out Pre-Evaluation,
Choosing with copper face contact angle is the resin of θ, wherein, θ≤90 °, and described contact angle refers to that resin is placed in circuit
The angle that during plate surface, the tangential direction of its outline is formed with copper face.This programme is by carrying out resin material
Pre-Evaluation, can select the resin that contact angle is less, the least immersional wetting showing resin and copper face of contact angle
The strongest, immersional wetting is the strongest, and bubble is more difficult to be adsorbed in hole wall, thus avoids orifice bubble near hole wall
Easy Tibetan medicine water during copper and the risk that causes hole wall copper to lose efficacy, also help resin simultaneously and fill in plated through-hole.
As a kind of preferred version, in described step S20, described resin is carried out vacuum stirring, makes tree
The viscosity drop low at least 200Pa s of fat.Preferably, before using, described resin is carried out mechanical agitation 30min.
This programme, by resin is carried out vacuum stirring in advance, can reduce the viscosity of resin, and make gas by stirring
Bubble is under the effect of buoyancy inside fugitive liquids, and when reducing filling holes with resin further, bubble is adsorbed in the wind of hole wall
Danger.
As a kind of preferred version, described step S10 comprises the steps:
S101: be placed on backing plate by described circuit board, described backing plate is offered and the metallization of described circuit board
The first through hole that hole is corresponding, the aperture of described first through hole is more than the aperture of described plated through-hole；
By being positioned on backing plate by circuit board, and offer the first through hole corresponding to plated through-hole on backing plate,
When filling holes with resin, on the one hand the resin in plated through-hole can fall to, in the first through hole, make because of action of gravity
Resin fully flows in plated through-hole and is full of plated through-hole, improves consent quality, on the other hand, unnecessary
Resin enter into storage in the first through hole, table top will not be polluted.The aperture of the first through hole preferably greater than gold
The aperture in the aperture in genusization hole, i.e. plated through-hole is less than the aperture of the first through hole, in can making plated through-hole
Resin falls more smoothly.
S102: described cover plate is placed in the top of described circuit board, described cover plate is offered and described circuit board
Corresponding the second through hole of plated through-hole, the aperture of described second through hole more than the aperture of described plated through-hole,
It is made optionally to be covered in the surface of described circuit board by lifting described cover plate；
By on the cover board offering the second through hole corresponding to plated through-hole, cover plate is covered in the surface of circuit board,
Resin is coated on cover plate uniformly, then falls in plated through-hole at the local resin having the second through hole,
And do not have the local resin of the second through hole not fall, scraped back by oil return cutter, serve the work of selectivity consent
With, protect the integrity of circuitous pattern.
S103: regulate described backing plate and/or described cover plate so that described first through hole, described second through hole with
The central axis of the plated through-hole of described circuit board regulates to allowed band, it is achieved described first through hole, institute
State the plated through-hole phase para-position of the second through hole and described circuit board.
As a kind of preferred version, the aperture of described first through hole is more than the aperture of described plated through-hole, described
The aperture of the first through hole is more than described plated through-hole aperture in the range of 0.250mm～0.500mm；And/or,
The aperture of described second through hole is more than the aperture of described plated through-hole, and the aperture of described second through hole is more than
The aperture of described plated through-hole is in the range of 0.150mm～0.250mm.
The deflection of consideration circuit board self is 0.050mm～0.100mm, by the hole of the second through hole on cover plate
0.150mm～0.250mm is strengthened relative to the aperture of plated through-hole in footpath, can make plated through-hole and the second through hole it
Between para-position capability control in 0.076mm, improve filling holes with resin quality.
As a kind of preferred version, in described step S30, described scraper speed is 15mm/s～30mm/s,
Described scraper pressure is more than 5kg/cm2, described scraper angle is 8 °～20 °.By by scraper speed, scrape
The cutter pressure to resin, and scraper angle control effectively, and can improve filling holes with resin quality further.
As a kind of preferred version, in described step S40, the temperature being incremented by is used to enter described circuit board
Row baking.Becoming big owing to temperature raises bubble, its buoyancy also becomes big and uncured resin viscosity and diminishes,
Bubble is more easy to emerge, and therefore uses segmentation baking, and temperature is raised to high temperature by low temperature, is for guaranteeing bubble in hole
Formation of the most at high temperature emerging is caved in.
As a kind of preferred version, in described step S40, the surface of the circuit board after baking is ground
Plate step, described nog plate step uses abrasive band and non-woven fabrics to replace nog plate at least twice, abrasive belt grinding section and nothing
Spin cloth nog plate section speed to adjust to identical.Relative to traditional ceramic nog plate, it is residual easily to there is resin in pottery nog plate
Glue, is easily formed the residual copper in aperture after the etching, if the contact surface of hardware and circuit board exist protruding or
Burr, this projection or burr contact with residual copper in inserting welding resistance, then can cause the problem that insulating properties lost efficacy,
And this programme uses abrasive band and non-woven fabrics compound mode to carry out nog plate at least twice, asking of resin cull can be overcome
Topic, thus the problem avoiding the residual copper in aperture.
As a kind of preferred version, in described step S50, when circuit board is etched, with described electricity
The consent surface that road plate contacts with described cover plate is etching surface.The resin selected due to this programme and copper face
Wellability good, select consent face as etching face, can avoid hole wall dew copper and etched, cause erosion
Carve the defect that the degree of depth exceeds standard.
As a kind of preferred version, also include: step S60, after etching, described circuit board is carried out AOI spy
Survey, specifically include:
Step S601: after pickling oxide layer, circuit board is dried, drying rate be 3.0m/min～
3.5m/min；
Step S602: the circuit board after drying is carried out brown process, then carries out volcanic ash nog plate, then enter
Row AOI detects.
Need after the etching circuit board is carried out AOI detection, if carried out in the most comparatively short time
AOI detects, then do not have oxidized due to copper, can be smoothed out AOI detection operations.If circuit board is put
Carry out AOI detection after putting a period of time again, then can not be smoothed out AOI detection because of copper problem of oxidation,
Need to remove removing oxide layer by pickling process further, when carrying out pickling, due to the tree of plug in plated through-hole
Fat easily with acid reaction and be washed off so that the hole copper in plated through-hole exposes, cause the false point of detection, dry
Disturbing result of detection, this programme, by first drying the circuit board after pickling, carries out brown process the most again,
Make the copper color on circuit board produce change, then carry out volcanic ash nog plate, make circuit board surface copper color again
Secondary change (usual nog plate rear surface copper color can brighten), the color of the hole copper in plated through-hole then will not be again
Secondary change, makes surface copper and base material produce aberration with this, then carry out AOI detection and then can detect smoothly be
No there is the residual copper in aperture.
Beneficial effects of the present invention: the manufacture method of the circuit board that the present invention provides, can remove plated through-hole
Aperture copper ring, and with etch depth, it is achieved the via insulating properties of circuit board, can effectively substitute back drill
Technology, can stop consent depression, the phenomenon generation of hole wall absorption bubble easy Tibetan medicine water in implementation process,
Reduce hole wall copper failure risk, eliminate quality hidden danger；The present invention also provides for a kind of novel AOI detection
Method, can effectively detect and repair by copper residual to the aperture of plated through-hole.
Accompanying drawing explanation
Below according to drawings and Examples, the present invention is described in further detail.
Fig. 1 is a kind of pcb board assembling structural representation with hardware of prior art；
Fig. 2 is the another kind of pcb board assembling structural representation with hardware of prior art；
Fig. 3 is the structural representation of a kind of pcb board of prior art；
Fig. 4 is the schematic diagram of step S10 in the method for manufacturing circuit board described in embodiments of the invention；
Fig. 5 is the schematic diagram that in the method for manufacturing circuit board described in embodiments of the invention, step S50 covers dry film；
Fig. 6 is the principle of step S50 acid etching in the method for manufacturing circuit board described in embodiments of the invention
Figure；
Fig. 7 is that in the method for manufacturing circuit board described in the embodiment of the present invention, step S20 resin is former with copper face infiltration
Reason figure.
In figure:
100, pcb board；200, hardware；300, plated through-hole；400, groove；500, through hole
600, hole copper；700, substrate；800, erosion resistant；
1, cover plate；11, the second through hole；2, circuit board；21, plated through-hole；22, copper ring；23, copper
Face；3, backing plate；31, the first through hole；4, dry film；5, resin.
Detailed description of the invention
Further illustrate technical scheme below in conjunction with the accompanying drawings and by detailed description of the invention.
Embodiments of the invention provide the manufacture method of a kind of circuit board, comprise the steps:
Step S10: provide cover plate, with the electroplated plated through-hole phase being formed on circuit board on described cover plate
Corresponding offers the second through hole, and the aperture of described second through hole, more than the aperture of described plated through-hole, makes described
Cover plate is covered in the circuit board surface after plating, and the plated through-hole phase of described second through hole and described circuit board
Para-position；
Step S20: the resin material good with copper face wellability is provided, makes described resin the most abundant
Stirring；
Step S30: make the resin after stirring be coated on described lid surface, the single stroke of scraper of screen printer makes
Second through hole of described cover plate fills up resin, and described resin is filled in described plated through-hole through described second through hole,
The resin residing in described lid surface is scraped back by the oil return cutter of screen printer；
Step S40: toast described circuit board, makes the hardening of resin in described plated through-hole；
Step S50: cover the copper electroplating layer that need to retain, the figure that protection need to retain with dry film against corrosion, makes described
At the aperture, at least one end of plated through-hole, copper orifice ring exposes, and uses acidic etching liquid to be etched, removes nonreactive
The copper ring of erosion dry film protection, and etch desired depth；
Step S60, carries out AOI detection to described circuit board after etching.
Wherein, step S10 specifically includes following steps (shown in Figure 4):
S101: be placed on backing plate 3 by circuit board 2, backing plate 3 is offered the plated through-hole 21 with circuit board 2
The first corresponding through hole 31, the aperture of the first through hole 31 is more than the aperture of plated through-hole 21；In this enforcement
In example, the thickness of slab≤2.500mm of circuit board 2, face copper thickness 40 μm～60 μm, the aperture of plated through-hole takes
0.150mm～0.350mm, the aperture of the first through hole 31 is more than the aperture 0.350mm of plated through-hole 21；
S102: cover plate 1 is placed in the top of circuit board 2, cover plate 1 is offered and the metallization of circuit board 2
The second through hole 11 that hole 21 is corresponding, the aperture of the second through hole 11, more than the aperture of plated through-hole 21, is passed through
Lifting cover plate 1 makes it optionally be covered in the surface of circuit board 2；In the present embodiment, by solid for cover plate 1
On screen frame, being used for supporting cover plate 1, cover plate 1 uses aluminium sheet, and the advantage with light weight can do slabbing,
Thinner thickness, on the one hand can play filling holes with resin positioning action, i.e. only for the plated through-hole of circuit board 2
Position carry out selective resin consent, on the other hand, laminar aluminium flake can also make resin fall into rapidly
In plated through-hole, consent efficiency can be improved.The aperture of second through hole 11 of the present embodiment is more than plated through-hole
The aperture 0.200mm of 21.
S103: regulation backing plate 3 and/or cover plate 1, so that first through hole the 31, second through hole 11 and circuit board
The central axis regulation of plated through-hole 21 in allowed band, it is achieved first through hole the 31, second through hole 11
Plated through-hole 21 phase para-position with circuit board.In the present embodiment, first backing plate 3 is placed on table top, so
By the para-position parts of screen printer, circuit board is positioned on backing plate 3 afterwards, makes the central axis of the first through hole 31
With the central axes of plated through-hole 21, error is in the range of regulation allows；Then cover plate 1 is placed in
The top of circuit board 2, is covered in the upper surface of circuit board 2 by making cover plate 1 decline, passes through screen printer
Para-position parts fine setting cover plate 1 position, make the central axis of the second through hole 11 and the center of plated through-hole 21
Dead in line, error is in the range of regulation allows.Then by the pressing component of screen printer by backing plate 3, electricity
Road plate 2 and cover plate 1 compress, and wait for filling holes with resin.Can improve by the way the first through hole 31,
Second through hole 11 and plated through-hole 21 aligning accuracy of circuit board.
Step S20 specifically includes following steps:
S201: the resin material provided is carried out Pre-Evaluation, and choosing with copper face contact angle is the resin of θ, its
In, θ≤90 °, contact angle refers to the tangential direction of its outline and copper face shape when resin is placed in circuit board surface
The angle become.Contact angle θ directly can be measured by crystalline phase microscope, it is also possible to is calculated by formula.
Shown in Figure 7, resin 5 is positioned on the copper face 23 of circuit board 2, resin 5 enters into plated through-hole
In, the distance between extreme higher position, top and the copper face 23 of the resin 5 of indwelling on copper face 23 is a, copper face
Angle between tangent line and the copper face 23 of the bottom margin of the resin 5 of indwelling on 23 is contact angle θ, copper face
The bottom Breadth Maximum of the resin 5 of indwelling on 23 is b, by formula θ=tan-1(4ab)/(b2-4a2)
Can calculate contact angle, the resin of the present embodiment and copper face contact angle θ are 25 °.The least explanation of contact angle θ
Resin 5 is more flat on copper face 23, i.e. enters the resin in plated through-hole more, residues in the tree on copper face
Fat is few, shows that this resin is good with the immersional wetting of copper face, can be beneficial to consent work.
S202: described resin is carried out vacuum stirring, makes the viscosity drop low at least 200Pa s of resin.Yu Ben
In embodiment, before using, described resin is carried out mechanical vacuum stirring 30min, make the viscosity of resin reduce by 250
Pa·s。
In step S30, by filling holes with resin process conditions and the control of parameter, it is further ensured that filling holes with resin
Quality.Specifically include flatness of scraping glue and plate surface pressure uniformity, scraper pressure, frictioning feeding speed, scrape
The aspects such as nose angle degree.For flatness of scraping glue and the control of plate surface pressure uniformity, table top height can be regulated
Walk, to improve its flatness；Scraper speed being controlled in 15mm/s～30mm/s, scraper pressure controls
At 5kg/cm2Above, preferably 8kg/cm2, scraper angle controls between 8 °～20 °, it addition, scraper
Only carrying out single stroke during consent, i.e. one cutter fills up resin, it is to avoid scraper sweeping action is easily generated lacking of bubble
Fall into, by above-mentioned design, may further ensure that filling holes with resin quality.
Step S40 specifically includes following steps:
Step S401: be positioned in baking oven by circuit board, drying-plate process is divided into three phases, and the first stage dries
Plate temperature is 55 °～65 °, and the drying-plate time is 25min～35min；Second stage drying-plate temperature be 75 °～
85 °, the drying-plate time is 25min～35min；Phase III drying-plate temperature is 115 °～125 °, during drying-plate
Between be 55min～65min.By stage by stage and the roasting mode of temperature increment can aid in the quick of resin
Hardening, it is also possible to avoid the high-temperature baking when resin is uncured easily to make bubble emerge and the problem that forms depression.
Step S402: the surface of the circuit board after baking is carried out nog plate step, and described nog plate step uses sand
Band and non-woven fabrics replace nog plate at least twice, and abrasive belt grinding section adjusts to identical with non-woven fabrics nog plate section speed.
In the present embodiment, abrasive belt grinding section and non-woven fabrics nog plate section speed all control at 1.5m/min～2.5m/min.
Step S50 specifically includes following steps: as it is shown in figure 5, be first covered in circuit board 2 with dry film 4
The first end of plated through-hole 21, the second end does not covers dry film 4, and dry film 4 has corrosion stability, then to electricity
Road plate 2 carries out acid etching, and the concrete employing film compensates 0.041mm～0.051mm, etching speed
2.0m/min～3.0m/min, as shown in Figure 6, owing to dry film 4 is covered in the second end of plated through-hole 21
Outside copper ring 22, when acid etching, copper ring 22 does not has etched, and the first end of plated through-hole 21
Copper ring 22 is owing to being not covered with dry film 4, etched when acid etching, and hole wall copper is also partially etched,
Etch depth controls more than 20 μm, it is achieved that the insulating properties of the first end of plated through-hole 21, certainly, and this
Skilled person be easier it is envisioned that, it is also possible to the copper ring at the two ends of plated through-hole is all etched away,
And control the etch depth of hole wall copper, thus realize the two ends insulating properties of plated through-hole.
Step S60 specifically includes following steps:
Step S601: after pickling oxide layer, circuit board is dried, drying rate be 3.0m/min～
3.5m/min；
Step S602: the circuit board after drying is carried out brown process, then carries out volcanic ash nog plate, then enter
Row AOI detects.
Describe the know-why of the present invention above in association with specific embodiment, these describe and are intended merely to explain this
The principle of invention, it is impossible to be construed to limiting the scope of the invention by any way.Based on explaining herein,
Those skilled in the art need not to pay performing creative labour and can associate other of the present invention and be embodied as
Mode, within these modes fall within protection scope of the present invention.
Claims (10)
1. the manufacture method of a circuit board, it is characterised in that comprise the steps:
Step S10: provide cover plate, with the electroplated plated through-hole phase being formed on circuit board on described cover plate
Corresponding offers the second through hole, and the aperture of described second through hole, more than the aperture of described plated through-hole, makes described
Cover plate is covered in the circuit board surface after plating, and the plated through-hole phase of described second through hole and described circuit board
Para-position；
Step S20: the resin material good with copper face wellability is provided, makes described resin the most abundant
Stirring；
Step S30: make the resin after stirring be coated on described lid surface, the single stroke of scraper of screen printer makes
Second through hole of described cover plate fills up resin, and described resin is filled in described plated through-hole through described second through hole,
The resin residing in described lid surface is scraped back by the oil return cutter of screen printer；
Step S40: toast described circuit board, makes the hardening of resin in described plated through-hole；
Step S50: cover the copper electroplating layer that need to retain, the figure that protection need to retain with dry film against corrosion, makes described
At the aperture, at least one end of plated through-hole, copper ring exposes, and uses acidic etching liquid to be etched, removes without against corrosion
The copper ring of dry film protection, and etch desired depth；
Wherein, described step S10 and described step S20 are without sequencing.
The manufacture method of circuit board the most according to claim 1, it is characterised in that in described step S20
In, the resin material provided is carried out Pre-Evaluation, choosing with copper face contact angle is the resin of θ, wherein, θ
≤90°；
Described contact angle refers to the folder that when resin is placed in circuit board surface, the tangential direction of its outline is formed with copper face
Angle.
The manufacture method of circuit board the most according to claim 2, it is characterised in that in described step S20
In, described resin is carried out vacuum stirring, makes the viscosity drop low at least 200Pa s of resin.
The manufacture method of circuit board the most according to claim 1, it is characterised in that described step S10
Comprise the steps:
S101: be placed on backing plate by described circuit board, described backing plate is offered and the metallization of described circuit board
The first through hole that hole is corresponding, the aperture of described first through hole is more than the aperture of described plated through-hole；
S102: described cover plate is placed in the top of described circuit board, described cover plate is offered and described circuit board
Corresponding the second through hole of plated through-hole, the aperture of described second through hole more than the aperture of described plated through-hole,
It is made optionally to be covered in the surface of described circuit board by lifting described cover plate；
S103: regulate described backing plate and/or described cover plate so that described first through hole, described second through hole with
The central axis of the plated through-hole of described circuit board regulates to allowed band, it is achieved described first through hole, institute
State the plated through-hole phase para-position of the second through hole and described circuit board.
The manufacture method of circuit board the most according to claim 4, it is characterised in that described first through hole
Aperture be more than described plated through-hole aperture more than the aperture of described plated through-hole, the aperture of described first through hole
In the range of 0.250mm～0.500mm；And/or,
The aperture of described second through hole is more than the aperture of described plated through-hole, and the aperture of described second through hole is more than
The aperture of described plated through-hole is in the range of 0.150mm～0.250mm.
The manufacture method of circuit board the most according to claim 5, it is characterised in that in described step S30
In, described scraper speed is 15mm/s～30mm/s, and described scraper pressure is more than 5kg/cm2Nose angle is scraped described in,
Degree is 8 °～20 °.
The manufacture method of circuit board the most according to claim 1, it is characterised in that in described step S40
In, use the temperature being incremented by toast described circuit board.
The manufacture method of circuit board the most according to claim 1, it is characterised in that in described step S40
In, the surface of the circuit board after baking is carried out nog plate step, described nog plate step uses abrasive band and non-woven fabrics
Alternately nog plate is at least twice, and abrasive belt grinding section adjusts to identical with non-woven fabrics nog plate section speed.
The manufacture method of circuit board the most according to claim 1, it is characterised in that in described step S50
In, when circuit board is etched, with consent surface that described circuit board contacts with described cover plate for etching
Surface.
10. according to the manufacture method of the circuit board described in any one of claim 1 to 9, it is characterised in that
Also include: step S60, after etching, described circuit board carried out AOI detection, specifically include:
Step S601: after pickling oxide layer, circuit board is dried, drying rate be 3.0m/min～
3.5m/min；
Step S602: the circuit board after drying is carried out brown process, then carries out volcanic ash nog plate, then enter
Row AOI detects.
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| CN201410188585.4A CN103957668B (en) | 2014-05-06 | 2014-05-06 | The manufacture method of circuit board |
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| CN201410188585.4A CN103957668B (en) | 2014-05-06 | 2014-05-06 | The manufacture method of circuit board |
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| CN103957668A CN103957668A (en) | 2014-07-30 |
| CN103957668B true CN103957668B (en) | 2016-10-05 |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109275268A (en) * | 2018-11-14 | 2019-01-25 | 江门崇达电路技术有限公司 | A kind of PCB back drill production method being less than 0.15mm for medium thickness |
| CN109413860A (en) * | 2018-11-21 | 2019-03-01 | 广东世运电路科技股份有限公司 | The method that a kind of pair of board metal hole is etched |
| CN112512213A (en) * | 2019-09-16 | 2021-03-16 | 深南电路股份有限公司 | Circuit board manufacturing method and circuit board |
| CN110611997A (en) * | 2019-09-18 | 2019-12-24 | 江苏博敏电子有限公司 | Processing method of copper-plated hole of printed circuit board |
| CN110996522B (en) * | 2019-12-20 | 2021-08-24 | 珠海斗门超毅实业有限公司 | Circuit board manufacturing method and circuit board |
| CN111050479A (en) * | 2019-12-30 | 2020-04-21 | 惠州市永隆电路有限公司 | Method for processing plug hole of hard circuit board with thickness of more than 3.0mm |
| CN111295052B (en) * | 2020-03-25 | 2021-06-01 | 深圳捷飞高电路有限公司 | Blind hole filling process and grinding device for high-density interconnected printed circuit board |
| CN114126257B (en) * | 2020-08-27 | 2024-03-22 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1210363A (en) * | 1997-08-28 | 1999-03-10 | 华通电脑股份有限公司 | Method for automatically welding package of ball array integrated circuit by coil belt |
| CN1937891A (en) * | 2005-09-19 | 2007-03-28 | 金像电子股份有限公司 | Circuit board non-porous ring circuit manufacturing method |
| CN101039549A (en) * | 2006-03-17 | 2007-09-19 | 日本特殊陶业株式会社 | Manufacturing method of wiring substrate and mask used for printing |
| CN102869205A (en) * | 2011-07-06 | 2013-01-09 | 深南电路有限公司 | Method for shaping printed circuit board (PCB) plated-through hole |
-
2014
- 2014-05-06 CN CN201410188585.4A patent/CN103957668B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1210363A (en) * | 1997-08-28 | 1999-03-10 | 华通电脑股份有限公司 | Method for automatically welding package of ball array integrated circuit by coil belt |
| CN1937891A (en) * | 2005-09-19 | 2007-03-28 | 金像电子股份有限公司 | Circuit board non-porous ring circuit manufacturing method |
| CN101039549A (en) * | 2006-03-17 | 2007-09-19 | 日本特殊陶业株式会社 | Manufacturing method of wiring substrate and mask used for printing |
| CN102869205A (en) * | 2011-07-06 | 2013-01-09 | 深南电路有限公司 | Method for shaping printed circuit board (PCB) plated-through hole |
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Address after: 523039, Guangdong, Dongcheng District province (the same sand) science and Technology Industrial Park, No. 33, vibration road, Dongguan Patentee after: Shengyi electronic Limited by Share Ltd Address before: 523039, Guangdong, Dongcheng District province (the same sand) science and Technology Industrial Park, No. 33, vibration road, Dongguan Patentee before: Dongguan Shengyi Electronics Ltd. |