CN104105344B - Method for protecting step slot, metal plating method for substrate of circuit board and circuit board - Google Patents
Method for protecting step slot, metal plating method for substrate of circuit board and circuit board Download PDFInfo
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- CN104105344B CN104105344B CN201310127891.2A CN201310127891A CN104105344B CN 104105344 B CN104105344 B CN 104105344B CN 201310127891 A CN201310127891 A CN 201310127891A CN 104105344 B CN104105344 B CN 104105344B
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- Prior art keywords
- step trough
- circuit board
- removing dampness
- film
- protection
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention provides a method for protecting a step slot, a metal plating method for a substrate of a circuit board and a circuit board. The method for protecting the step slot comprises the following steps: carrying out surface treatment on the substrate of the circuit board; carrying out selected wet film coating treatment on the step slot, and filling selected wet film into the step slot to a preset position; carrying out metallic coating on a board of the substrate of the circuit board and the selected wet film; and carrying out pattern transfer treatment on the board, preparing a circuit and removing metal plated on the selected wet film Inside the step slot. Through the above method, the selected wet film can form a protective layer in a specific area so as to strengthen binding force with a copper surface and guarantee that the pattern of the undersurface of the step slot and the circuit during the follow-up manufacturing process are not influenced. The manufacturing cost is low. Waste formed by follow-up film removal can be effectively minimized. The method is beneficial to environmental protection. Meanwhile, the case that height of the step slot influences pressed film quality is avoided, and reject ratio is minimized.
Description
Technical field
The present invention relates to printed circuit board (PCB) manufacture field, in particular to it is a kind of protection step trough method, one
Plant the method for plating metal and a kind of circuit board of circuit board substrate.
Background technology
With the continuous development of electronic technology, various electronic products are progressively sent out to multi-functional, low energy consumption, easily portable direction
Exhibition；It is less and less as the volume requirement of the wiring board of main composition part in order to reduce the purpose of small product size, manufacture
Enterprise is stretched into some electronic devices in plate using step-wise manner in addition to being increased wiring by dense wire, reduces piece
Afterwards the method for integral thickness is gradually formed.This product design can form the step trough in the recessed plate in wiring board subregion,
But to manufacturing process bigger challenge, traditional operating type can be brought to be difficult to meet its production in actual production process
Require.Make the difficult point mainly anti-welding steps ladder groove after step trough opens a window position copper face and route protection, outer graphics transfer
Ink printing, exposure and word production etc..
The defect that correlation technique is present：Traditional press dry film or wet film production procedure length, high cost, the difference in height of step trough
It is easily damaged after being covered using dry film, it is impossible to the figure being effectively protected in step trough, and the windowing of internal layer step trough
Anti-welding making Jing subsequent production flow processs are easily caused and darken, and affect wiring board performance and outward appearance.
The content of the invention
For solve above-mentioned technical problem or at least one, the invention provides it is a kind of protection step trough method, can
Protect figure and cabling in step trough not to be affected by successive process during circuit board substrate plating metal, reduce product not
It is good.
In view of this, the invention provides it is a kind of protection step trough method, including：
Step 101, is surface-treated to the circuit board substrate；
Step 102, carries out selecting removing dampness film coating process to the step trough, and fills the choosingization into the step trough
Wet film is to precalculated position；
Step 104, the plate face and described choosing on the circuit board substrate plate metal on removing dampness film；
Step 105, to the plate face figure transfer processing is carried out, and is made circuit and is removed the choosingization in the step trough
The metal plated on wet film.
In the technical scheme, select removing dampness film targetedly can form protective layer in specific region, strengthen and copper face
Adhesion, it is ensured that the figure and circuit of ladder groove bottom is unaffected in successive process, its low manufacture cost, production procedure
It is short, the garbage that follow-up striping is formed is effectively reduced, be conducive to the protection to environment, while avoiding the difference in height because of step trough
And press mold quality is affected, reduce bad.
Present invention also offers a kind of method for plating metal of circuit board substrate, using the protection described in above-mentioned technical proposal
The method of step trough is with the step trough on protection circuit boards supporting substrates.
The method for plating metal of the circuit board substrate that the present invention is provided, selects the removing dampness film can targetedly in step trough
Specific region forms protective layer, increases the adhesion with copper face, it is ensured that the figure and line of ladder groove bottom in successive process
Road is unaffected, its low manufacture cost, is effectively reduced the garbage that follow-up striping is formed, and is conducive to the protection to environment, together
When avoid affecting press mold quality because of the difference in height of step trough, reduce it is bad, improve conforming product rate, increase product output.
Present invention also offers a kind of circuit board, the guarantor being provided with the circuit board described in above-mentioned technical proposal
The step trough that the method for shield step trough is protected.
The circuit board that the present invention is provided, selects the specific region that removing dampness film can targetedly in step trough to form protection
Layer, does not damage step trough, and the quality of circuit board is significantly improved, and can improve product market share, increases the performance of enterprises.
Description of the drawings
Fig. 1 is the schematic top plan view of circuit board substrate according to an embodiment of the invention；
Fig. 2 is the A-A sectional views of embodiment illustrated in fig. 1；
Fig. 3 is the structural representation that removing dampness film is completely selected in embodiment illustrated in fig. 2 filling；
Fig. 4 is the structural representation after embodiment illustrated in fig. 3 plating metal；
Fig. 5 is that embodiment illustrated in fig. 4 etches away to select the structural representation after metal is plated on removing dampness film；
Fig. 6 is that the structural representation after removing dampness film is selected in embodiment illustrated in fig. 5 removal；
Fig. 7 is the flow chart of the method for one embodiment of the invention protection step trough；
Fig. 8 is the flow chart of the method for another embodiment of the present invention protection step trough.
Wherein, the corresponding relation in Fig. 1 to Fig. 6 between reference and component names is：
The cabling 3 of 1 circuit board substrate, 11 plate face, 12 metal level, 2 step trough 21 selects carburetion ink protection wet film.
Specific embodiment
It is below in conjunction with the accompanying drawings and concrete real in order to be more clearly understood that the above objects, features and advantages of the present invention
Apply mode to be further described in detail the present invention.It should be noted that in the case where not conflicting, the enforcement of the application
Feature in example and embodiment can be mutually combined.
Many details are elaborated in the following description in order to fully understand the present invention, but, the present invention may be used also
Implemented with being different from mode described here using other, therefore, protection scope of the present invention does not receive following public tool
The restriction of body embodiment.
The method of the protection step trough that the present invention is provided, as shown in Figures 1 to 7, including：
Step 101, is surface-treated to circuit board substrate 1；
Step 102, carries out selecting removing dampness film coating process to step trough 2, and filling selects removing dampness film to predetermined into step trough 2
Position；
Step 104, the plate face 11 on circuit board substrate 1 plate metal on removing dampness film with selecting；
Step 105, to plate face 11 figure transfer processing is carried out, and is made circuit and is removed in step trough 2 and selects institute on removing dampness film
The metal of plating.
In the technical scheme, select removing dampness film targetedly can form protective layer in specific region, strengthen and copper face
Adhesion, it is ensured that the figure and circuit of ladder groove bottom is unaffected in successive process, its low manufacture cost, production procedure
It is short, the garbage that follow-up striping is formed is effectively reduced, be conducive to the protection to environment, while avoiding the difference in height because of step trough
And press mold quality is affected, reduce bad.
Surface treatment is to carry out oil removing, cleaning etc. to plate face 11.
Label 12 is the metal level 12 after plating metal.
Preferably, as shown in Figures 3 to 5, in a step 102, removing dampness film is selected to select carburetion ink protection wet film 3, pre-determined bit
It is set to the position of the full step trough 2 of filling.
Preferably, as shown in figure 3, in a step 102, step trough 2 is carried out using wire mark mode select carburetion ink protection wet
The coating process of film 3, and fill full step trough 2；Wire mark mode is：Using scraper and half tone carburetion ink protection wet film 3 will be selected to be applied to
In step trough 2.
By selecting the full step trough of removing dampness film filling, it is ensured that the figure and circuit of ladder groove bottom does not receive shadow in successive process
Ring, it is to avoid press mold quality is affected because of the difference in height of step trough, reduce product fraction defective；Step trough is carried out using wire mark mode
Coating process, coating is uniform, filling is enriched, and increases the adhesion with copper face, further ensures the ladder in successive process
The figure and circuit of groove bottom is unaffected.
Certainly, also optional coating process in other ways, these are the design philosophy for departing from the present invention, come under this
The protection domain of patent.
Preferably, as shown in Fig. 3 to Fig. 5, Fig. 8, between step 102 and step 104, also include：Step 103, hardening
Select removing dampness film.
Removing dampness film is selected in hardening, removes the moisture in step trough, it is ensured that select the filling of removing dampness film to enrich, do not flow in step trough；
Meanwhile, removing dampness film not cracky is selected after hardening, further step trough is protected during plate face carries out plating metal.
Preferably, as shown in Figure 6 and Figure 8, after step 105, also include：Step 106, removes the choosing in step trough 2
Removing dampness film.
Remove in step trough and select removing dampness film, make circuit board.
Preferably, as shown in Figure 1 and Figure 2, in a step 101, the surface treatment of plate face 11 is at the surface before anti-welding printing
Reason.
From the surface treatment before anti-welding printing, technical maturity, low cost, and surface processing efficiency are high, can effectively remove
Oil stain in plate face, clears up plate face, reduces the fraction defective of product.
Preferably, as shown in Figures 3 to 5, in step 103, hardened by way of pre-baked and/or baking and select removing dampness
Film.
Requirement pre-baked and that baking is to equipment is low, and low to the Job Operations requirement of employee, it is possible to decrease produces, be manufactured into
This, thrifty enterprise's spending.
Certainly also removing dampness film is selected in optional hardening in other ways, such as shady dry, is the design philosophy for departing from the present invention, should
Belong to the protection domain of this patent.
Preferably, at step 104, plate face 11 carries out through hole and/or blind hole plating metal.
Through hole, blind hole plate the technical maturity of alloying technology, and the fraction defective for plating product after metal is low, it is possible to decrease enterprise is manufactured into
Originally, the performance of enterprises is improved.
Certainly it is also optional to carry out plating metal in other ways, the design philosophy for departing from the present invention is, this patent should be belonged to
Protection domain.
Preferably, in step 105, figure transfer processing includes plate face process, press mold, exposure, development and etching.
It is the method technical maturity, with short production cycle, made by plate face clear patterns, good conductivity can effectively improve enterprise
Benefit.
Preferably, the metal for being plated includes any one in copper, aluminum, silver, platinum, stannum or nickel or its combination, step trough 2
Bottom surface has cabling 21.
The good conductivity of above-mentioned material, low cost, made by product energy consumption it is low, and environmentally safe；Tool in step trough
There is cabling, select removing dampness film to protect to the cabling in step trough, prevent the cabling in successive process impacted.
Present invention also offers a kind of method for plating metal of circuit board substrate, using the protection described in any of the above-described embodiment
The method of step trough is with the step trough 2 on protection circuit boards supporting substrates 1.
The method for plating metal of the circuit board substrate that the present invention is provided, selects the removing dampness film can targetedly in step trough
Specific region forms protective layer, increases the adhesion with copper face, it is ensured that the figure and line of ladder groove bottom in successive process
Road is unaffected, its low manufacture cost, is effectively reduced the garbage that follow-up striping is formed, and is conducive to the protection to environment, together
When avoid affecting press mold quality because of the difference in height of step trough, reduce it is bad.
Preferably, select in removing dampness film containing the defoamer of 2%-3% Ingredients Weights.
In the defoamer for selecting addition certain ingredients in removing dampness film, the bubble produced in coating process is effectively reduced, is protected
Card coating is uniform, it is compact between each coating to make, and further step trough is protected.
Preferably, select removing dampness film to be coated before processing and stir this and select removing dampness film 1-5 minutes, the choosing is stood after the completion of stirring
Removing dampness film 20-30 minutes.
Removing dampness film is selected to selecting removing dampness film to carry out pre- stirring, and standing this, it is ensured that select removing dampness coating solution mix homogeneously；Precipitation
The impurity in removing dampness film is selected, to improve coating quality, and then ensures that the removing dampness film that selects of coating in step trough clogs full whole ladder
Groove.
Present invention also offers a kind of circuit board, the guarantor being provided with the circuit board described in any of the above-described embodiment
The step trough 2 that the method for shield step trough is protected.
The circuit board that the present invention is provided, selects the specific region that removing dampness film can targetedly in step trough to form protection
Layer, does not damage step trough, and the quality of circuit board is significantly improved, and can improve product market share, increases the performance of enterprises.
Preferably, the bottom surface of the step trough 2 has cabling 2.
The bottom surface of step trough has cabling, selects removing dampness film to protect to the cabling in step trough, prevents from subsequently making
Cabling is impacted in journey.
Preferably, it is coated with metal in the plate face 11 of the circuit board.
The plate face of circuit board is coated with metal, and circuit board can pass through plated metal and enter horizontal electrical signal biography with other electronic components
Pass, it is ensured that signal is smoothly transmitted, and then expand the range of application of circuit board.
Preferably, the metal for being plated includes any one in copper, aluminum, silver, platinum, stannum or nickel or its combination.
The good conductivity of above-mentioned material, low cost, made by product energy consumption it is low, and environmentally safe.
In sum, the method for the protection step trough that the present invention is provided, selects the removing dampness film can targetedly in step trough
Interior specific region forms protective layer, increases the adhesion with copper face, and not cracky after selecting removing dampness film to harden, it is ensured that rear
The figure and circuit of ladder groove bottom are unaffected in continuous processing procedure, and its low manufacture cost, production procedure is short, are effectively reduced follow-up
The garbage that striping is formed, is conducive to the protection to environment, while avoiding affecting press mold quality because of the difference in height of step trough, subtracts
It is few bad.
The preferred embodiments of the present invention are the foregoing is only, the present invention is not limited to, for the skill of this area
For art personnel, the present invention can have various modifications and variations.It is all within the spirit and principles in the present invention, made any repair
Change, equivalent, improvement etc., should be included within the scope of the present invention.
Claims (12)
1. it is a kind of protection step trough method, it is characterised in that include：
Step 101, is surface-treated to circuit board substrate (1)；
Step 102, carries out selecting removing dampness film coating process, and the filling choosing into the step trough (2) to the step trough (2)
Removing dampness film is to precalculated position；
Step 104, the plate face (11) and described choosing on the circuit board substrate (1) plate metal on removing dampness film；
Step 105, to the plate face (11) figure transfer processing is carried out, and is made circuit and is removed described in the step trough (2)
Select the metal plated on removing dampness film；
Wherein, the step trough (2) is arranged in the circuit board substrate (1)；
In a step 102, it is described to select removing dampness film to select carburetion ink protection wet film (3), the precalculated position to be the full rank of filling
The position of terraced groove (2)；
Also include：Step 106, remove in the step trough (2) described selects removing dampness film；
The bottom surface of the step trough (2) has cabling (21).
2. it is according to claim 1 protection step trough method, it is characterised in that in a step 102, using wire mark mode
The step trough (2) is carried out it is described select carburetion ink protection wet film (3) coating process, and fill the full step trough (2)；
The wire mark mode is：Carburetion ink protection wet film (3) is selected to be applied to the step trough (2) by described using scraper and half tone
It is interior.
3. it is according to claim 1 protection step trough method, it is characterised in that between step 102 and step 104,
Also include：Step 103, hardening is described to select removing dampness film.
4. it is according to any one of claim 1 to 3 protection step trough method, it is characterised in that in a step 101,
The surface treatment of the plate face (11) is the surface treatment before anti-welding printing.
5. it is according to claim 3 protection step trough method, it is characterised in that in step 103, by it is pre-baked and/
Or the mode of baking is hardened and described selects removing dampness film.
6. it is according to claim 1 protection step trough method, it is characterised in that at step 104, the plate face (11)
Carry out through hole and/or blind hole plating metal.
7. the method for protection step trough according to claim 1, it is characterised in that in step 105, figure transfer
Process includes plate face process, press mold, exposure, development and etching.
8. it is according to claim 1 protection step trough method, it is characterised in that the metal for being plated include copper, aluminum, silver,
Any one in platinum, stannum or nickel or its combination.
9. a kind of method for plating metal of circuit board substrate, it is characterised in that using as any one of claim 1 to 8
The method of protection step trough is with the step trough (2) on protection circuit boards supporting substrates (1).
10. the method for plating metal of circuit board substrate according to claim 9, it is characterised in that described choosing contains in removing dampness film
There is the defoamer of 2%-3% Ingredients Weights.
The method for plating metal of 11. circuit board substrates according to claim 10, it is characterised in that described to select removing dampness film to carry out
Stir before coating process this it is described select removing dampness film 1-5 minutes, this is stood after the completion of stirring and described selects removing dampness film 20-30 minutes.
12. a kind of circuit boards, it is characterised in that be provided with as any one of claim 1 to 8 on the circuit board
Protection step trough the step trough (2) protected of method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310127891.2A CN104105344B (en) | 2013-04-12 | 2013-04-12 | Method for protecting step slot, metal plating method for substrate of circuit board and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310127891.2A CN104105344B (en) | 2013-04-12 | 2013-04-12 | Method for protecting step slot, metal plating method for substrate of circuit board and circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104105344A CN104105344A (en) | 2014-10-15 |
| CN104105344B true CN104105344B (en) | 2017-05-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310127891.2A Active CN104105344B (en) | 2013-04-12 | 2013-04-12 | Method for protecting step slot, metal plating method for substrate of circuit board and circuit board |
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| CN (1) | CN104105344B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110891377A (en) * | 2018-09-11 | 2020-03-17 | 健鼎（无锡）电子有限公司 | Circuit board and method for manufacturing the same |
| CN111491464A (en) * | 2019-01-29 | 2020-08-04 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of PCB with convex welding plate |
| CN110691476B (en) * | 2019-08-27 | 2021-05-04 | 东莞康源电子有限公司 | Cavity opening processing method for protecting PCB inner layer circuit by adopting wet film |
| CN112492767B (en) * | 2021-01-18 | 2021-04-20 | 四川英创力电子科技股份有限公司 | PCB (printed circuit board) with step groove and processing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102523684A (en) * | 2011-12-02 | 2012-06-27 | 东莞生益电子有限公司 | Manufacture method for printed circuit board (PCB) with step groove |
| CN102523688A (en) * | 2011-12-06 | 2012-06-27 | 东莞生益电子有限公司 | Method for manufacturing PCB (Printed Circuit Board) with stepped grooves |
| CN202310279U (en) * | 2011-10-17 | 2012-07-04 | 广州杰赛科技股份有限公司 | Graphical printed board at bottom of dual-step ladder groove |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100997185B1 (en) * | 2008-09-17 | 2010-11-29 | 삼성전기주식회사 | METHOD FOR TREATING SURFACE OF SUBSTRATE RESIN and SUBSTRATE RESIN TREATED THEREBY |
-
2013
- 2013-04-12 CN CN201310127891.2A patent/CN104105344B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202310279U (en) * | 2011-10-17 | 2012-07-04 | 广州杰赛科技股份有限公司 | Graphical printed board at bottom of dual-step ladder groove |
| CN102523684A (en) * | 2011-12-02 | 2012-06-27 | 东莞生益电子有限公司 | Manufacture method for printed circuit board (PCB) with step groove |
| CN102523688A (en) * | 2011-12-06 | 2012-06-27 | 东莞生益电子有限公司 | Method for manufacturing PCB (Printed Circuit Board) with stepped grooves |
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| CN104105344A (en) | 2014-10-15 |
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Effective date of registration: 20220620 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. |
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