CN102523684A - Manufacture method for printed circuit board (PCB) with step groove - Google Patents
Manufacture method for printed circuit board (PCB) with step groove Download PDFInfo
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- CN102523684A CN102523684A CN2011103962584A CN201110396258A CN102523684A CN 102523684 A CN102523684 A CN 102523684A CN 2011103962584 A CN2011103962584 A CN 2011103962584A CN 201110396258 A CN201110396258 A CN 201110396258A CN 102523684 A CN102523684 A CN 102523684A
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Abstract
The invention relates to a manufacture method for a printed circuit board (PCB) with a step groove, which includes the following steps that: 1 a prepreg, an upper outer-layer core plate, an inner-layer core plate and a lower outer-layer core plate are provided, and a through groove is arranged correspondingly, wherein inner-layer patterns of the upper outer-layer core plate, the inner-layer core plate and the lower outer-layer core plate are manufactured; 2 the upper outer-layer core plate, the prepreg, the inner-layer core plate and the lower outer-layer core plate are stacked together according to a preset stacking sequence; 3 a gasket is filled in the through groove and comprises a body portion and a protruding edge portion, the size of the protruding edge portion is larger than that of the through groove, and the protruding edge portion is arranged on the upper surface of the upper outer-layer core plate; 4 a buffer layer is placed on the upper surface of the upper outer-layer core plate, and a through hole is arranged on the buffer layer at the position corresponding to the protruding edge portion; 5 fuse lamination is conducted under high temperature and high pressure; and 6 the buffer layer is removed, the filled gasket is taken out, and the step groove is formed. The manufacture method adopts the gasket with the protruding edge portion to conduct buffering and glue blocking during lamination, and stable control of glue flowing on the edge of the step groove can be achieved.
Description
Technical field
The present invention relates to printed circuit board and make the field, relate in particular to a kind of manufacture method of pcb board of tool step trough.
Background technology
Wiring board assembling and assembling need be produced step trough in the pcb board part often, satisfying the raising with wiring density of dwindling of modularization assembling volume, and the realization of satisfying specific function.
When the bigger step trough of manufactured size, can adopt earlier central layer and prepreg are slotted, fill buffering resistance glue material then and carry out pressing plate.But, adopt the existing buffering resistance glue material of filling when making step trough, must use during lamination and not flow or the prepreg of low fluidity, guarantee the stable control of step trough edge gummosis, in case fluid stopping glue is to plate face and bottom land, therefore, the scope of application is narrower.In addition, prepreg cost not mobile or low fluidity is high, is difficult to satisfy welding and the reliability requirement that electron trade improves constantly.
Summary of the invention
Therefore, the object of the present invention is to provide a kind of manufacture method of pcb board of tool step trough, the pad of employing flanged pin portion cushions when lamination and hinders glue, can realize the stable control of step trough edge gummosis.
For realizing above-mentioned purpose, the present invention provides a kind of manufacture method of pcb board of tool step trough, may further comprise the steps:
Step 1: the outer central layer of upside, core material and the outer central layer of downside that prepreg are provided and have made interior layer pattern, prepreg, the outer central layer of upside and core material are offered groove respectively at the correspondence position that desire forms step trough;
Step 2: the outer central layer of upside, prepreg, core material and the outer central layer of downside are stacked together according to predetermined laminated layer sequence;
Step 3: joint sheet in the groove of the outer central layer of upside, prepreg and core material; Said pad comprises the flange part of being located at the body in the said groove and being positioned at the body outer end, and the size of said flange part is greater than the size of said groove and be located at the upper surface of the outer central layer of said upside;
Step 4: the upper surface at the outer central layer of upside is placed resilient coating, and the thickness of said resilient coating equates with the thickness of said flange part, and the position of corresponding said flange part is provided with through hole to accommodate said flange part on the said resilient coating;
Step 5: under HTHP, carry out the fusion lamination;
Step 6: remove resilient coating after lamination is accomplished and take out the pad of filling, form step trough.
Wherein, in the said step 1, the step trough that the size of the groove of being offered on outer central layer of upside and the core material and desire form measure-alike, the size of the groove of being offered on the prepreg is greater than the size of the step trough of desire formation.
Wherein, said prepreg adopts the FR-4 prepreg.
Wherein, said pad is the silica gel sheet.
Wherein, the thickness of the flange part of said pad is 0.1-0.2mm.
Wherein, in the said step 4, resilient coating comprises aluminium flake and mould release membrance, and said mould release membrance is between aluminium flake and the outer central layer of upside.
Beneficial effect of the present invention: the manufacture method of the pcb board of tool step trough of the present invention; Pad through adopting flanged pin portion cushions when lamination and hinders glue; Can realize the stable control of step trough edge gummosis; The groove top and the bottom land that reach step trough do not have resin residue, and the sidewall resin of step trough is filled effect of sufficient.And, can further improve the reliability of lamination gummosis through on the outer central layer of upside, thickness and the resilient coating that flange part thickness equates being set.In addition, adopt manufacture method of the present invention, prepreg can select for use common FR-4 prepreg to carry out pressing plate, and cost is lower.
For further setting forth technological means and the effect that the present invention takes for the predetermined purpose of realization; See also following about detailed description of the present invention and accompanying drawing; Believe the object of the invention, characteristic and characteristics; Should obtain thus going deep into and concrete understanding, yet accompanying drawing only provides reference and explanation usefulness, is not to be used for the present invention is limited.
Description of drawings
Below in conjunction with accompanying drawing, describe in detail through specific embodiments of the invention, will make technical scheme of the present invention and other beneficial effects obvious.
In the accompanying drawing,
Fig. 1 is the flow chart of the manufacture method of the pcb board of tool step trough of the present invention.
When Fig. 2 makes step trough for the manufacture method of the pcb board of employing tool step trough of the present invention, the cross-sectional view of each preparatory phase pcb board.
Embodiment
Like Fig. 1 and shown in Figure 2, the manufacture method of the pcb board of tool step trough of the present invention comprises the steps;
Step 1: the outer central layer 11 of upside, core material 12 and the outer central layer 13 of downside that prepreg 10 are provided and have made interior layer pattern, prepreg 10, the outer central layer 11 of upside and core material 12 are offered groove 101,111,121 respectively at the correspondence position that desire forms step trough 16;
Step 2: the outer central layer 11 of upside, prepreg 10, core material 12 and the outer central layer 13 of downside are stacked together according to predetermined laminated layer sequence;
Step 3: joint sheet 14 in the groove 101,111,121 of the outer central layer 11 of upside, prepreg 10 and core material 12; Said pad 14 comprises the flange part 142 of being located at the body 141 in the said groove 101,111,121 and being positioned at body 141 outer ends; The size of said flange part 142 is greater than the size of said groove 101,111,121 and be located at the upper surface of the outer central layer 11 of said upside; Wherein, Said pad 14 is processed by the material of tool buffering effect, and preferably, said pad 14 is the silica gel sheet;
Step 4: the upper surface at the outer central layer 11 of upside is placed resilient coating 15; The thickness of said resilient coating 15 equates with the thickness of said flange part 142; And the position of corresponding said flange part 142 is provided with through hole 151 to accommodate said flange part 142 on the said resilient coating 15; Preferably, resilient coating 15 comprises aluminium flake 151 and mould release membrance 152, and said mould release membrance 152 is between aluminium flake 151 and the outer central layer 11 of upside; Offer through hole 151 on the resilient coating 15 and accommodate flange part 142, can guarantee that whole cover layer is smooth;
Step 5: under HTHP, carry out the fusion lamination;
Step 6: remove resilient coating 15 after lamination is accomplished and take out the pad 14 of filling, form step trough 16.
The thickness of the flange part 142 of said pad 14 is 0.1-0.2mm.
In the said step 1, the step trough 16 that the size of the groove of being offered on outer central layer 11 of upside and the core material 12 111,121 and desire form measure-alike, the size of the groove of being offered on the prepreg 10 101 is greater than the size of the step trough 16 of desire formation.
Owing to adopt the pad 14 of flanged pin portion 142 when lamination, to cushion and hinder glue; This flange part 142 can be sealed the groove 111 of the outer central layer 11 of upside fully; For the prepreg of various fluidities, all can realize the stable control of step trough 16 edge gummosis, therefore; Prepreg 10 can adopt the FR-4 prepreg of good fluidity, to satisfy each reliability requirement of welding that electron trade improves constantly.
In the manufacture method of the pcb board of above-mentioned tool step trough; Pad through adopting flanged pin portion cushions when lamination and hinders glue; Can realize the stable control of step trough edge gummosis, the groove top and the bottom land that reach step trough do not have resin residue, and the sidewall resin of step trough is filled effect of sufficient.And, can further improve the reliability of lamination gummosis through on the outer central layer of upside, thickness and the resilient coating that flange part thickness equates being set.In addition, adopt manufacture method of the present invention, prepreg can select for use common FR-4 prepreg to carry out pressing plate, and cost is lower.
The above; For the person of ordinary skill of the art; Can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection range of accompanying Claim of the present invention.
Claims (6)
1. the manufacture method of the pcb board of a tool step trough is characterized in that, may further comprise the steps:
Step 1: the outer central layer of upside, core material and the outer central layer of downside that prepreg are provided and have made interior layer pattern, prepreg, the outer central layer of upside and core material are offered groove respectively at the correspondence position that desire forms step trough;
Step 2: the outer central layer of upside, prepreg, core material and the outer central layer of downside are stacked together according to predetermined laminated layer sequence;
Step 3: joint sheet in the groove of the outer central layer of upside, prepreg and core material; Said pad comprises the flange part of being located at the body in the said groove and being positioned at the body outer end, and the size of said flange part is greater than the size of said groove and be located at the upper surface of the outer central layer of said upside;
Step 4: the upper surface at the outer central layer of upside is placed resilient coating, and the thickness of said resilient coating equates with the thickness of said flange part, and the position of corresponding said flange part is provided with through hole to accommodate said flange part on the said resilient coating;
Step 5: under HTHP, carry out the fusion lamination;
Step 6: remove resilient coating after lamination is accomplished and take out the pad of filling, form step trough.
2. the manufacture method of the pcb board of tool step trough as claimed in claim 1; It is characterized in that; In the said step 1; The step trough that the size of the groove of being offered on outer central layer of upside and the core material and desire form measure-alike, the size of the groove of being offered on the prepreg is greater than the size of the step trough of desire formation.
3. the manufacture method of the pcb board of tool step trough as claimed in claim 1 is characterized in that, said prepreg adopts the FR-4 prepreg.
4. the manufacture method of the pcb board of tool step trough as claimed in claim 1 is characterized in that, said pad is the silica gel sheet.
5. the manufacture method of the pcb board of tool step trough as claimed in claim 1 is characterized in that, the thickness of the flange part of said pad is 0.1-0.2mm.
6. the manufacture method of the pcb board of tool step trough as claimed in claim 1 is characterized in that, in the said step 4, resilient coating comprises aluminium flake and mould release membrance, and said mould release membrance is between aluminium flake and the outer central layer of upside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110396258.4A CN102523684B (en) | 2011-12-02 | 2011-12-02 | Manufacture method for printed circuit board (PCB) with step groove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201110396258.4A CN102523684B (en) | 2011-12-02 | 2011-12-02 | Manufacture method for printed circuit board (PCB) with step groove |
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| CN102523684A true CN102523684A (en) | 2012-06-27 |
| CN102523684B CN102523684B (en) | 2014-03-05 |
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Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102523688A (en) * | 2011-12-06 | 2012-06-27 | 东莞生益电子有限公司 | Method for manufacturing PCB (Printed Circuit Board) with stepped grooves |
| CN102769996A (en) * | 2012-08-03 | 2012-11-07 | 广州杰赛科技股份有限公司 | Machining method of printed circuit board (PCB) of step blind slot |
| CN102928563A (en) * | 2012-11-08 | 2013-02-13 | 广东生益科技股份有限公司 | Method for assessing filling performance of different prepregs |
| CN103068171A (en) * | 2012-12-24 | 2013-04-24 | 东莞生益电子有限公司 | Radio frequency printed circuit board (PCB) production process |
| CN104105344A (en) * | 2013-04-12 | 2014-10-15 | 北大方正集团有限公司 | Method for protecting step slot, metal plating method for substrate of circuit board and circuit board |
| CN104735912A (en) * | 2015-03-10 | 2015-06-24 | 广州杰赛科技股份有限公司 | Step plate manufacturing method |
| CN105163526A (en) * | 2015-08-21 | 2015-12-16 | 深圳崇达多层线路板有限公司 | Manufacturing method of stepped grooves, and printed circuit board comprising stepped grooves |
| CN105307399A (en) * | 2015-10-23 | 2016-02-03 | 深圳市强达电路有限公司 | Processing method for small, thin and pure ceramic circuit board |
| CN105407646A (en) * | 2015-12-11 | 2016-03-16 | 深圳崇达多层线路板有限公司 | Process for improving residual copper of stepped groove |
| CN105451468A (en) * | 2014-08-29 | 2016-03-30 | 深南电路有限公司 | Method of manufacturing a circuit board |
| CN105682364A (en) * | 2016-03-14 | 2016-06-15 | 江苏普诺威电子股份有限公司 | Copper foil choke-based processing method for stepped slot |
| CN106252494A (en) * | 2016-08-22 | 2016-12-21 | 景旺电子科技(龙川)有限公司 | A kind of improve minute surface COB plate pressing and overflow the effective ways of glue |
| CN106255349A (en) * | 2016-08-16 | 2016-12-21 | 生益电子股份有限公司 | The manufacture method of a kind of PCB and PCB |
| CN107231764A (en) * | 2017-06-28 | 2017-10-03 | 深圳崇达多层线路板有限公司 | A kind of preparation method for the ladder wiring board for improving step platform precision |
| CN107734858A (en) * | 2017-11-20 | 2018-02-23 | 生益电子股份有限公司 | A kind of PCB manufacture method and PCB |
| CN108811375A (en) * | 2018-06-26 | 2018-11-13 | 中国电子科技集团公司第二十九研究所 | A kind of processing of multi-layer PCB blind slot gasket and fill method |
| CN110351964A (en) * | 2019-07-05 | 2019-10-18 | 信泰电子（西安）有限公司 | Groove PCB circuit board processing technology |
| CN113194638A (en) * | 2021-03-22 | 2021-07-30 | 山东英信计算机技术有限公司 | Manufacturing method and system of PCB with efficient heat dissipation and PCB |
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Cited By (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102523688A (en) * | 2011-12-06 | 2012-06-27 | 东莞生益电子有限公司 | Method for manufacturing PCB (Printed Circuit Board) with stepped grooves |
| CN102523688B (en) * | 2011-12-06 | 2013-12-25 | 东莞生益电子有限公司 | Method for manufacturing PCB (Printed Circuit Board) with stepped grooves |
| CN102769996B (en) * | 2012-08-03 | 2015-03-18 | 广州杰赛科技股份有限公司 | Machining method of printed circuit board (PCB) of step blind slot |
| CN102769996A (en) * | 2012-08-03 | 2012-11-07 | 广州杰赛科技股份有限公司 | Machining method of printed circuit board (PCB) of step blind slot |
| CN102928563A (en) * | 2012-11-08 | 2013-02-13 | 广东生益科技股份有限公司 | Method for assessing filling performance of different prepregs |
| CN102928563B (en) * | 2012-11-08 | 2016-04-06 | 广东生益科技股份有限公司 | Assess the method for different prepreg filling perforation |
| CN103068171B (en) * | 2012-12-24 | 2015-07-22 | 东莞生益电子有限公司 | Radio frequency printed circuit board (PCB) production process |
| CN103068171A (en) * | 2012-12-24 | 2013-04-24 | 东莞生益电子有限公司 | Radio frequency printed circuit board (PCB) production process |
| CN104105344A (en) * | 2013-04-12 | 2014-10-15 | 北大方正集团有限公司 | Method for protecting step slot, metal plating method for substrate of circuit board and circuit board |
| CN104105344B (en) * | 2013-04-12 | 2017-05-17 | 北大方正集团有限公司 | Method for protecting step slot, metal plating method for substrate of circuit board and circuit board |
| CN105451468A (en) * | 2014-08-29 | 2016-03-30 | 深南电路有限公司 | Method of manufacturing a circuit board |
| CN104735912A (en) * | 2015-03-10 | 2015-06-24 | 广州杰赛科技股份有限公司 | Step plate manufacturing method |
| CN104735912B (en) * | 2015-03-10 | 2018-07-06 | 广州杰赛科技股份有限公司 | A kind of production method of stepped plate |
| CN105163526A (en) * | 2015-08-21 | 2015-12-16 | 深圳崇达多层线路板有限公司 | Manufacturing method of stepped grooves, and printed circuit board comprising stepped grooves |
| CN105163526B (en) * | 2015-08-21 | 2017-12-26 | 深圳崇达多层线路板有限公司 | A kind of preparation method of step trough and the printed circuit board comprising step trough |
| CN105307399B (en) * | 2015-10-23 | 2017-11-28 | 深圳市强达电路有限公司 | A kind of processing method of small size, thin pure ceramic circuit-board |
| CN105307399A (en) * | 2015-10-23 | 2016-02-03 | 深圳市强达电路有限公司 | Processing method for small, thin and pure ceramic circuit board |
| CN105407646A (en) * | 2015-12-11 | 2016-03-16 | 深圳崇达多层线路板有限公司 | Process for improving residual copper of stepped groove |
| CN105407646B (en) * | 2015-12-11 | 2018-06-12 | 深圳崇达多层线路板有限公司 | A kind of technique for improving the residual copper of stepped groove |
| CN105682364A (en) * | 2016-03-14 | 2016-06-15 | 江苏普诺威电子股份有限公司 | Copper foil choke-based processing method for stepped slot |
| CN105682364B (en) * | 2016-03-14 | 2018-07-03 | 江苏普诺威电子股份有限公司 | The processing method of stepped groove based on copper foil choked flow |
| CN106255349A (en) * | 2016-08-16 | 2016-12-21 | 生益电子股份有限公司 | The manufacture method of a kind of PCB and PCB |
| CN106252494A (en) * | 2016-08-22 | 2016-12-21 | 景旺电子科技(龙川)有限公司 | A kind of improve minute surface COB plate pressing and overflow the effective ways of glue |
| CN107231764A (en) * | 2017-06-28 | 2017-10-03 | 深圳崇达多层线路板有限公司 | A kind of preparation method for the ladder wiring board for improving step platform precision |
| CN107734858A (en) * | 2017-11-20 | 2018-02-23 | 生益电子股份有限公司 | A kind of PCB manufacture method and PCB |
| CN108811375A (en) * | 2018-06-26 | 2018-11-13 | 中国电子科技集团公司第二十九研究所 | A kind of processing of multi-layer PCB blind slot gasket and fill method |
| CN108811375B (en) * | 2018-06-26 | 2020-08-14 | 中国电子科技集团公司第二十九研究所 | Multilayer PCB blind groove gasket processing and filling method |
| CN110351964A (en) * | 2019-07-05 | 2019-10-18 | 信泰电子（西安）有限公司 | Groove PCB circuit board processing technology |
| CN113194638A (en) * | 2021-03-22 | 2021-07-30 | 山东英信计算机技术有限公司 | Manufacturing method and system of PCB with efficient heat dissipation and PCB |
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Address after: 523127 Dongcheng District City, Guangdong province (with sand) science and Technology Industrial Park Road, No. 33 vibration with the number of Patentee after: Shengyi electronic Limited by Share Ltd Address before: 523000 Dongcheng District (Dongguan) science and Technology Industrial Park, Guangdong, China Patentee before: Dongguan Shengyi Electronics Ltd. |