CN105682364B - The processing method of stepped groove based on copper foil choked flow - Google Patents
The processing method of stepped groove based on copper foil choked flow Download PDFInfo
- Publication number
- CN105682364B CN105682364B CN201610141776.4A CN201610141776A CN105682364B CN 105682364 B CN105682364 B CN 105682364B CN 201610141776 A CN201610141776 A CN 201610141776A CN 105682364 B CN105682364 B CN 105682364B
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- China
- Prior art keywords
- stepped groove
- core plate
- choked flow
- straight slot
- copper foil
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
Abstract
The invention discloses a kind of processing methods of the stepped groove based on copper foil choked flow, include the following steps：Prepare at least two core plates and adhesive linkage；The corresponding position of core plate and adhesive linkage for needing to open up stepped groove is opened up into straight slot respectively；The copper foil that the core plate that stepped groove need not be opened up is corresponded to the straight slot position etches and is slightly less than the choked flow figure of the straight slot size；The core plate and adhesive linkage are pressed, the core plate for opening up straight slot bonds together with etching the core plate of choked flow figure, forms stepped groove.The processing method of the stepped groove based on copper foil choked flow uses copper foil flow-retarding technique, solves the problems such as pressing interfacial voids, gummosis of the existing technology excessively influence ladder slot space；The technique for having evaded radium-shine processing blind slot solves ladder trench bottom layering caused by radium-shine high temperature influences, blistering risk；Adhesive layer thickness is stablized, and solves the problems, such as that depth consistency is poor, makes depth consistency that can meet customer need；Cost is reduced, improves production efficiency.
Description
Technical field
The present invention relates to a kind of ladder groove processing method more particularly to a kind of processing sides of the stepped groove based on copper foil choked flow
Method.
Background technology
Wiring board assembles and assembling often needs to locally produce stepped groove in pcb board, to meet modular assembly volume
Diminution and wiring density raising or meet the realizations of certain specific functions.Existing stage slot production method mainly has
Four kinds, the first is controlled depth milling slot technology, but it is excessively high to milling equipment required precision, milling equipment, milling cutter and plant maintenance
Expense is all very high；Production efficiency is low, milling equipment per axis once can only a piece of plank of milling, and every plank production cycle
It is all very long；Deep-controlled ability is poor, is influenced greatly by table top flatness, plate thickness uniformity.Second is no choked flow Low-
Flow PP press technology, but gummosis amount is difficult to control, if over flood, can influence ladder slot space, interference client assembling and influence
Voice signal consistency；If gummosis is very few, cavity can be formed at pressing interface, there are security risks.The third, no choked flow
Low-flow PP pressings+radium-shine clear slot technology, but such technique high processing costs, the high temperature generated when radium-shine can influence ladder
The binding force of trench bottom metal layer and base material, rear processing procedure can be layered there are operatic tunes bottom, blistering risk.4th kind is elastic cushion block
Flow-retarding technique, this technique are that suitable elastic cushion block is filled out in slot for choked flow, but the technique be not suitable for small groove body or
The printed board processing of many stepped grooves.
Invention content
In order to overcome drawbacks described above, the present invention provides a kind of processing methods of the stepped groove based on copper foil choked flow, solve
The depth consistency that occurs during ladder groove processing in the prior art is poor, slot bottom gummosis is uneven, small groove body or multiple-grooved printed board add
Work technique is complicated, low production efficiency, it is of high cost the problems such as.
The present invention in order to solve its technical problem used by technical solution be：
A kind of processing method of the stepped groove based on copper foil choked flow, includes the following steps：
1. prepare at least two core plates and adhesive linkage；
2. the corresponding position of core plate and adhesive linkage for needing to open up stepped groove is opened up into straight slot respectively；
3. the copper foil that the core plate that need not open up stepped groove is corresponded to the straight slot position etches that be slightly less than the straight slot big
Small choked flow figure；
4. the core plate and adhesive linkage are pressed, the core plate for opening up the core plate and etching choked flow figure of straight slot is bonded in one
It rises, forms stepped groove.
As a further improvement on the present invention, the straight slot size opened up on the adhesive linkage is more than what is opened up on the core plate
Straight slot size.
As a further improvement on the present invention, the straight slot size opened up on the adhesive linkage is equal to what is opened up on the core plate
Straight slot size.
As a further improvement on the present invention, the consistency of thickness of the thickness of the choked flow figure and the adhesive linkage.
The beneficial effects of the invention are as follows：
1. using copper foil flow-retarding technique, solve pressing interfacial voids of the existing technology, gummosis excessively influences ladder
The problems such as slot space.
2. having evaded the technique of radium-shine processing blind slot, solve ladder trench bottom layering caused by radium-shine high temperature influences, rise
Steep risk.
3. adhesive layer thickness is stablized, solve the problems, such as that depth consistency is poor, make depth consistency that can meet customer need.
4. reducing cost, production efficiency is improved.
5. the technique is suitable for the ladder groove processing of various sizes, especially in the processing of small groove body and multiple-grooved printed board
Possess clear superiority.
Description of the drawings
Fig. 1 is laminated pre-structure schematic diagram for the embodiment of the present invention 1；
Structure diagram after Fig. 2 is laminated for the embodiment of the present invention 1；
Fig. 3 is laminated pre-structure schematic diagram for the embodiment of the present invention 2；
Structure diagram after Fig. 4 is laminated for the embodiment of the present invention 2；
Fig. 5 is laminated pre-structure schematic diagram for the embodiment of the present invention 3；
Structure diagram after Fig. 6 is laminated for the embodiment of the present invention 3.
With reference to attached drawing, make the following instructions：
1 --- needing to open up the core plate 2 of stepped groove --- adhesive linkage
3 --- without opening up the core plate 4 of stepped groove --- choked flow copper foil
5 --- straight slot
Specific embodiment
It with reference to attached drawing, elaborates to the present invention, but protection scope of the present invention is not limited to following embodiments, i.e., in every case
The simple equivalent changes and modifications made with scope of the present invention patent and description are all still belonged to patent of the present invention and contained
Within the scope of lid.
Embodiment 1：
Refering to Fig. 1-2, a kind of processing method of the stepped groove based on copper foil choked flow, include the following steps：
1. prepare two core plates and adhesive linkage；
2. the corresponding position of core plate 1 and adhesive linkage 2 for needing to open up stepped groove is opened up into straight slot 5 respectively；
3. the copper foil that the core plate 3 that need not open up stepped groove is corresponded to 5 position of straight slot etches and is slightly less than the straight slot
The choked flow figure 4 of size；
4. the core plate and adhesive linkage are pressed, the core plate for opening up the core plate and etching choked flow figure of straight slot is bonded in one
It rises, forms stepped groove.
Wherein, the straight slot size opened up on the adhesive linkage is greater than or equal to the straight slot size opened up on the core plate；Institute
State the thickness of choked flow figure and the consistency of thickness of the adhesive linkage.
Embodiment 2：
Refering to Fig. 3-4, a kind of processing method of the stepped groove based on copper foil choked flow, include the following steps：
1. prepare three core plates and two adhesive linkages；
2. core plate 1 and the corresponding position of two adhesive linkages 2 that one of them needs to open up stepped groove are opened up respectively logical
Slot 5；
3. by two core plates that need not open up stepped groove 3 correspond to 5 position of straight slot copper foil etch be slightly less than it is described
The choked flow figure 4 of straight slot size；
4. the core plate and adhesive linkage are pressed, the core plate for opening up the core plate and etching choked flow figure of straight slot is bonded in one
It rises, forms stepped groove.
Wherein, the straight slot size opened up on the adhesive linkage is greater than or equal to the straight slot size opened up on the core plate；Institute
State the thickness of choked flow figure and the consistency of thickness of the adhesive linkage.
Embodiment 3：
Refering to Fig. 5-6, a kind of processing method of the stepped groove based on copper foil choked flow includes the following steps：
1. prepare three core plates and two adhesive linkages；
2. it is logical the corresponding position of core plate 1 and two adhesive linkages 2 for opening up stepped groove to be needed to open up respectively two of which
Slot 5；
3. by a core plate that need not open up stepped groove 3 correspond to 5 position of straight slot copper foil etch be slightly less than it is described
The choked flow figure 4 of straight slot size；
4. the core plate and adhesive linkage are pressed, the core plate for opening up the core plate and etching choked flow figure of straight slot is bonded in one
It rises, forms stepped groove.
Wherein, the straight slot size opened up on the adhesive linkage is greater than or equal to the straight slot size opened up on the core plate；Institute
State the thickness of choked flow figure and the consistency of thickness of the adhesive linkage.
Claims (3)
1. a kind of processing method of the stepped groove based on copper foil choked flow, which is characterized in that include the following steps：
1. prepare at least two core plates and adhesive linkage；
2. the corresponding position of core plate and adhesive linkage for needing to open up stepped groove is opened up into straight slot respectively；
3. the copper foil that the core plate that need not open up stepped groove is corresponded to the straight slot position etches and is slightly less than the straight slot size
Choked flow figure；
4. the core plate and adhesive linkage are pressed, the core plate for opening up straight slot bonds together with etching the core plate of choked flow figure, shape
Into stepped groove；
Wherein：The thickness of the choked flow figure and the consistency of thickness of the adhesive linkage.
2. the processing method of the stepped groove according to claim 1 based on copper foil choked flow, it is characterised in that：The adhesive linkage
On the straight slot size that opens up be more than the straight slot size opened up on the core plate.
3. the processing method of the stepped groove according to claim 1 based on copper foil choked flow, it is characterised in that：The adhesive linkage
On the straight slot size that opens up be equal to the straight slot size opened up on the core plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610141776.4A CN105682364B (en) | 2016-03-14 | 2016-03-14 | The processing method of stepped groove based on copper foil choked flow |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610141776.4A CN105682364B (en) | 2016-03-14 | 2016-03-14 | The processing method of stepped groove based on copper foil choked flow |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105682364A CN105682364A (en) | 2016-06-15 |
| CN105682364B true CN105682364B (en) | 2018-07-03 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610141776.4A Active CN105682364B (en) | 2016-03-14 | 2016-03-14 | The processing method of stepped groove based on copper foil choked flow |
Country Status (1)
| Country | Link |
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| CN (1) | CN105682364B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102523688A (en) * | 2011-12-06 | 2012-06-27 | 东莞生益电子有限公司 | Method for manufacturing PCB (Printed Circuit Board) with stepped grooves |
| CN102523692A (en) * | 2011-12-30 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Stepped circuit board manufacturing process |
| CN102523684A (en) * | 2011-12-02 | 2012-06-27 | 东莞生益电子有限公司 | Manufacture method for printed circuit board (PCB) with step groove |
| CN102769996A (en) * | 2012-08-03 | 2012-11-07 | 广州杰赛科技股份有限公司 | Machining method of printed circuit board (PCB) of step blind slot |
| CN102933042A (en) * | 2012-10-17 | 2013-02-13 | 无锡江南计算技术研究所 | Anti-gluing method for flexible board in groove region of rigid-flexible board |
| CN103258933A (en) * | 2012-04-09 | 2013-08-21 | 东莞市久祥电子有限公司 | Method for preventing glue overflowing in packaging process of wafer-type light-emitting diode (LED) circuit board through copper plating |
| CN203661421U (en) * | 2013-11-27 | 2014-06-18 | 广州兴森快捷电路科技有限公司 | Circuit board bonding structure with small size thin blind slot |
| CN104254206A (en) * | 2013-06-28 | 2014-12-31 | 深南电路有限公司 | Machining method of circuit board with step grooves |
-
2016
- 2016-03-14 CN CN201610141776.4A patent/CN105682364B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102523684A (en) * | 2011-12-02 | 2012-06-27 | 东莞生益电子有限公司 | Manufacture method for printed circuit board (PCB) with step groove |
| CN102523688A (en) * | 2011-12-06 | 2012-06-27 | 东莞生益电子有限公司 | Method for manufacturing PCB (Printed Circuit Board) with stepped grooves |
| CN102523692A (en) * | 2011-12-30 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Stepped circuit board manufacturing process |
| CN103258933A (en) * | 2012-04-09 | 2013-08-21 | 东莞市久祥电子有限公司 | Method for preventing glue overflowing in packaging process of wafer-type light-emitting diode (LED) circuit board through copper plating |
| CN102769996A (en) * | 2012-08-03 | 2012-11-07 | 广州杰赛科技股份有限公司 | Machining method of printed circuit board (PCB) of step blind slot |
| CN102933042A (en) * | 2012-10-17 | 2013-02-13 | 无锡江南计算技术研究所 | Anti-gluing method for flexible board in groove region of rigid-flexible board |
| CN104254206A (en) * | 2013-06-28 | 2014-12-31 | 深南电路有限公司 | Machining method of circuit board with step grooves |
| CN203661421U (en) * | 2013-11-27 | 2014-06-18 | 广州兴森快捷电路科技有限公司 | Circuit board bonding structure with small size thin blind slot |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105682364A (en) | 2016-06-15 |
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